CN107464773A - A kind of silicon chip batch image positioning apparatus - Google Patents
A kind of silicon chip batch image positioning apparatus Download PDFInfo
- Publication number
- CN107464773A CN107464773A CN201710719074.4A CN201710719074A CN107464773A CN 107464773 A CN107464773 A CN 107464773A CN 201710719074 A CN201710719074 A CN 201710719074A CN 107464773 A CN107464773 A CN 107464773A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 74
- 239000010703 silicon Substances 0.000 title claims abstract description 74
- 238000012546 transfer Methods 0.000 claims abstract description 82
- 230000007723 transport mechanism Effects 0.000 claims abstract description 34
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 230000005540 biological transmission Effects 0.000 claims description 78
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of silicon chip batch image positioning apparatus, including：In the horizontal plane along the transverse axis X feeding stations set gradually and discharge station；And the transfer station between feeding station and discharge station, wherein, transport mechanism is symmetrically provided with feeding station and discharge station, transfer station is provided with transfer mechanism, transport mechanism on feeding station is relative with the transport mechanism in discharge station to be connect and connects, and region shared by transfer mechanism partially overlaps with region shared by two groups of transport mechanisms.According to the present invention, it is while silicon chip bulk transfer efficiency is improved, additionally it is possible to silicon chip image positioning work is completed in transmitting procedure, positioning time is greatly shortened, improves location efficiency.
Description
Technical field
The present invention relates to non-standard automatic field, more particularly to a kind of silicon chip batch image positioning apparatus.
Background technology
With the development of science and technology automatic technology is more and more applied in all trades and professions, automatic business processing technology exists
Also it is used widely in the process treatment process of silicon chip of solar cell, specifically, silicon chip of solar cell is in multiple processing
Technique needs in transfer process to concentrate pending silicon chip the positioning of batch image back and forth, occurs to reduce in process treatment process
Error and improve processing quality, batch transmit silicon chip during, because silicon chip quantity is more, weight is big, usually pass
The problems such as efficiency is low, transmission is short of power is sent, and then reduces silicon chip image location efficiency, in view of this, is necessary out in fact
Send out silicon chip batch image positioning apparatus a kind of, to solve the above problems.
The content of the invention
For the shortcomings of the prior art, it is an object of the invention to provide a kind of positioning of silicon chip batch image to fill
Put, it is while silicon chip bulk transfer efficiency is improved, additionally it is possible to silicon chip image positioning work is completed in transmitting procedure, significantly
Shorten positioning time, improve location efficiency.
In order to realize above-mentioned purpose and other advantages according to the present invention, there is provided a kind of silicon chip batch image positioning dress
Put, including：
In the horizontal plane along the transverse axis X feeding stations set gradually and discharge station；And
Transfer station between feeding station and discharge station,
Wherein, transport mechanism being symmetrically provided with feeding station and discharge station, transfer station is provided with transfer mechanism, on
Expect that the transport mechanism on station is relative with the transport mechanism in discharge station to connect and connect, region shared by transfer mechanism and two groups of biographies
Region shared by mechanism is sent to partially overlap.
Preferably, transport mechanism includes：Transmit framework and the transfer assembly for transmitting silicon chip carrier.
Preferably, transmission framework includes：
The left transmission post being oppositely arranged and right transmission post；And
The preceding transmission post being oppositely arranged and rear transmission post,
Wherein, preceding transmission post, afterwards left transmission post, transmission post and right transmission post surround connect into transmission framework successively.
Preferably, transfer assembly includes：
The left conveyer belt and right conveyer belt being respectively arranged on left transmission post and right transmission post；And
For driving the motor of left conveyer belt and right conveyer belt Synchronous Transmission.
Preferably, left transmission post is with being respectively provided with the outside of right transmission post and transmitting the liter of framework selectivity lifting
Come down to a lower group part.
Preferably, the place plane of transmission post transmits the place plane of post, left transmission post and right transmission post less than before afterwards
Exported with the transmission formed positioned at transport mechanism end.
Preferably, the outside of left transmission post and right transmission post is evenly arranged with several along the direction of transfer of transfer assembly
The left and right sides of position-limited wheel, position-limited wheel and silicon chip carrier keeps being in rolling contact.
Preferably, left transmission post is provided with direction of transfer of the right outside for transmitting post along transfer assembly successively compartment of terrain and passed
Send front position sensor, transfer front position sensor, transfer terminal position sensor and transmission terminal position sensing
Device.
Preferably, transfer mechanism includes：
Fixed frame；And
For carrying the transfer framework of silicon chip carrier, it is located on fixed frame,
Wherein, transfer framework reciprocably from the front end of fixed frame be slid onto end so as to by silicon chip carrier from feeding work
Gone in transport mechanism at position in the transport mechanism at discharge station, the lower section of transfer framework is provided with light filling component, light filling group
The surface of part is provided with the camera for being used for silicon chip image positioning.
Preferably, light filling component is located near the stage casing of fixed frame, wherein, when transfer framework is located at fixed frame
During front end, light filling component is placed exactly in the end for turning framework；When transfer framework is located at the end of fixed frame, light filling component is just
It is good to be located at the front end for turning framework.
Compared with prior art, its advantage is the present invention：
It is while silicon chip bulk transfer efficiency is improved, additionally it is possible to silicon chip image positioning work is completed in transmitting procedure
Make, greatly shorten positioning time, improve location efficiency.
Brief description of the drawings
Fig. 1 is the stereogram according to silicon chip batch image positioning apparatus of the present invention；
Fig. 2 is according to the biography in silicon chip batch image positioning apparatus of the present invention at feeding station and at discharge station
Send the stereogram of mechanism；
Fig. 3 is the stereogram according to transfer mechanism in silicon chip batch image positioning apparatus of the present invention；
Fig. 4 is to be in vertical at feeding station according to silicon chip carrier in silicon chip batch image positioning apparatus of the present invention
Body figure；
Fig. 5 is from feeding work according to silicon chip carrier in silicon chip batch image positioning apparatus of the present invention by transfer mechanism
Stereogram during bit transition to discharge station；
Fig. 6 is to be in vertical at discharge station according to silicon chip carrier in silicon chip batch image positioning apparatus of the present invention
Body figure.
Embodiment
The present invention is described in further detail below in conjunction with the accompanying drawings, foregoing end other objects of the invention, feature, side
Face and advantage will be apparent, to make those skilled in the art to implement according to this with reference to specification word.In the accompanying drawings,
For clarity, shape and size can be amplified, and will be indicated in all figures using identical reference identical
Or similar part.In the description, such as " front portion ", " rear portion ", " top ", " bottom ", " top " and " bottom " and its spread out
The relative terms of new word should be interpreted to refer to then as described in or such as the orientation shown in the accompanying drawing to come into question.This
A little relative terms are for convenience and are generally not intended as the specific orientation of needs.It is related to the art of attachment, connection etc.
Language (for example, " connection " and " attachment ") refers to the pass that these structures are fixed or are attached directly or indirectly to one another by intermediate structure
System and movable or rigidly attached or relation, unless otherwise clearly stating.
Reference picture 1 and Fig. 2, silicon chip batch image positioning apparatus include：Transport mechanism 1 and transfer mechanism, 2, wherein, it is horizontal
Feeding station A1 and discharge station A2 and the transfer station A3 between two stations are sequentially provided with along transverse axis X on face, on
Transport mechanism 1 is symmetrically provided with material station A1 and discharge station A2, transfer station A3 is provided with transfer mechanism 2, feeding station
Transport mechanism 1 on A1 is relative with the transport mechanism 1 on discharge station A2 to be connect and connects, region shared by transfer mechanism 2 with two groups
Region shared by transport mechanism 1 partially overlaps.
Reference picture 2 and Fig. 4, transport mechanism 1 include：Transmit framework 11 and the transfer assembly for transmitting silicon chip carrier 3
12。
Further, transmission framework 11 includes：
The left transmission post 112 being oppositely arranged and right transmission post 114；And
The preceding transmission post 111 being oppositely arranged and rear transmission post (113),
Wherein, preceding post (111), left transmission post 112, rear transmission post 113 and the right transmission post 114 of transmitting surround connect successively
Into transmission framework 21.
Reference picture 2, transfer assembly 12 include：
The left conveyer belt 121 and right conveyer belt 122 being respectively arranged on left transmission post 112 and right transmission post 114；And
For driving the motor 123 of left conveyer belt 121 and the right Synchronous Transmission of conveyer belt 122.In preferable embodiment party
In formula, the clutch end of motor 123 is drivingly connected with power transmission pole (124), the both ends of power transmission pole (124)
It is connected respectively with left conveyer belt 121 and right conveyer belt 122.Because silicon chip carrier 3 has certain weight, it is mounted with thereon
The silicon chip 31 of 20~50, the deadweight of silicon chip carrier 3 plus silicon chip 31 weight, by its in transport mechanism 1 it is steady fast
Speed transmission needs to use the larger heavy-duty motor of power, heavy-duty motor price costly, moreover, in transfer assembly 12
Feed belt causes its flexibility too low also due to size is long, in prolonged transmit process, easily causes silicon chip carrier 3
Bottom frequently contacted with transmission framework 11, so as to cause to damage to the even silicon chip 31 of silicon chip carrier 3, and by by two groups of transmission
The docking of mechanism 1 gets up to use, and can substantially reduce the length of single feed belt, so as to improve the rigidity of feed belt, pass through
Two groups of transfer assemblies 12 are used cooperatively so that are only needed low-power machine to fulfil assignment demand, reduced equipment cost, carry
High transmission efficiency.
Further, the outside of left transmission post 112 and right transmission post 114 is respectively provided with the selectivity of transmission framework 11
The lifting assembly 13 of lifting.
Referring again to Fig. 2, the rear place plane for transmitting post 113 is less than preceding transmission post 111, left transmission post 112 and right transmission
The place plane of post 114 is located at the transmission outlet of the end of transport mechanism 1 to form, so that working as silicon chip carrier 3 from feeding work
Transport mechanism 1 on the A1 of position will not be by the interference of rear transmission post 113 when being sent to the transport mechanism 1 on discharge station A2.
Further, left transmission post 112 is uniformly arranged with direction of transfer of the right outside for transmitting post 114 along transfer assembly 12
There are several position-limited wheels 14, the left and right sides holding of position-limited wheel 14 and silicon chip carrier 3 is in rolling contact.
Referring again to Fig. 2, the direction of transfer of left transmission post 112 and the right outside for transmitting post 114 along transfer assembly 12 is successively
Compartment of terrain be provided with transmission front position sensor 15, transfer front position sensor 16, transfer terminal position sensor 17 and
Transmit terminal position sensor 18.
Although the rigidity for solving feed belt by the way of two groups of transport mechanisms 1 connect relatively is low and transmits power not
The problems such as sufficient, but there is the problem of local dynamic effect deficiency in the joint of two groups of transport mechanisms 1, this, which just needs to use, to incite somebody to action
Silicon chip carrier 3 relays from feeding station A1 smooth transfers to discharge station A2 and resumes dynamic transfer mechanism.
Reference picture 1 and Fig. 3, transfer mechanism 2 include：Fixed frame 21, transfer framework 22 and light filling component 24, wherein, in
Turn framework 22 to be used to carry silicon chip carrier 3, on fixed frame 21, the lower section of transfer framework 22 is provided with light filling component for it
24, the surface of light filling component 24 is provided with the camera for being used for silicon chip image positioning, and transfer framework 22 is reciprocably from fixed frame
21 front end is slid onto end, and is slid onto end during this from the front end of fixed frame 21 in transfer framework 22, camera
Image positioning can be carried out to the silicon chip carried on silicon chip carrier 3 successively by being cooperated with light filling component 24.Preferably implementing
In mode, light filling component 24 is near the stage casing of fixed frame 21.
Further, fixed frame 21 includes：
The left fixed column 212 being oppositely arranged and right fixed column 214；And
The preceding fixed column 211 being oppositely arranged and rear fixed column 213,
Wherein, preceding fixed column 211, left fixed column 212, rear fixed column 213 and right fixed column 214 successively around connecting and
Into fixed frame 21.
Reference picture 3, left fixed column 212 is parallel with right fixed column 214 and is arranged at intervals to be formed between the two
Turn passage, left rail 2121 and right guide rail 2141, transfer framework 22 have been respectively and fixedly connected with left fixed column 212 and right fixed column 214
It is slidably matched with left rail 2121 and right guide rail 2141.
Further, transfer drive component 23 is provided with fixed frame 21, transfer framework 22 is in transfer drive component 23
Driving is lower can be along left rail 2121 and right guide rail 2141 toward polyslip.
Reference picture 3, transfer framework 22 include：
The left rotary column 222 being oppositely arranged and rotary column 224 in the right side；And
The preceding middle rotary column 221 being oppositely arranged and rear fixed column 223,
Wherein, rotary column 224 forms around connecting successively in preceding middle rotary column 221, left rotary column 222, rear middle rotary column 223, the right side
Transfer framework 22, rotary column 224 is slidably matched with left rail 2121 and right guide rail 2141 respectively in left rotary column 222 and the right side.
Further, the front end of transfer framework 22 and rear end have been respectively and fixedly connected with several limited blocks 2211 and have clamped lifting air
Cylinder 25, clamping lift cylinder 25 can be for linear motion with respect to front limited block 2211 in the horizontal plane and risen in perpendicular
Drop motion, when silicon chip carrier 3 is conveyed into transfer framework 22, clamps lift cylinder 25 and be raised above and to limited block 2211
Side applies clamping force, with the collective effect of limited block 221 by the clamping and positioning of silicon chip carrier 3, when silicon chip carrier 3 is by transfer frame
When body 22 is slid onto end from the front end of fixed frame 21, clamps after lift cylinder 25 unclamps silicon chip carrier 3 and drop to transfer
Below the place plane of framework 22, in order to which silicon chip carrier 3 is transferred out from transfer framework 22.
Reference picture 3, Fig. 4, Fig. 5 and Fig. 6, during work, when transfer framework 22 is located at the front end of fixed frame 21, light filling
Component 24 is placed exactly in the end for turning framework 22；When transfer framework 22 is located at the end of fixed frame 21, light filling component 24 is just
It is good to be located at the front end for turning framework 22, so that silicon chip carrier 3 is sent to by transfer framework 22 from from the front end of fixed frame 21
During end, camera cooperates with light filling component 24 and just completes all silicon chip image positioning operations, so as to ensure image
On the premise of positioning operation, it can further reduce the floor space of equipment, simultaneously because the front end of fixed frame 21 is positioned at upper
Expect in station A1, the end of fixed frame 21 is located in discharge station A2, when silicon chip carrier 3 by transfer framework 22 from from fixed frame
When the front end of body 21 is sent to end, namely completes and be transferred to down silicon chip carrier 3 from the transport mechanism 1 at feeding station A1
Expect in the transport mechanism 1 at station A2, avoid silicon chip carrier 3 be transferred into two groups of transport mechanisms 1 joint be short of power,
It is driven the problem of unstable.
Number of devices and treatment scale described herein are the explanations for simplifying the present invention.To the present invention application,
Modifications and variations will be readily apparent to persons skilled in the art.
Although embodiment of the present invention is disclosed as above, it is not limited in listed fortune in specification and embodiment
With it can be applied to various suitable the field of the invention completely, can be easily real for those skilled in the art
Now other modification, therefore under the universal limited without departing substantially from claim and equivalency range, the present invention is not limited to
Specific details and shown here as the legend with description.
Claims (10)
- A kind of 1. silicon chip batch image positioning apparatus, it is characterised in that including：The feeding station (A1) and discharge station (A2) set gradually in the horizontal plane along transverse axis X；AndTransfer station (A3) between feeding station (A1) and discharge station (A2),Wherein, transport mechanism (1) is symmetrically provided with feeding station (A1) and discharge station (A2), transfer station (A3) is provided with Transfer mechanism (2), transport mechanism (1) on feeding station (A1) with the transport mechanism (1) in discharge station (A2) it is relative connect and Connection, region shared by transfer mechanism (2) partially overlaps with region shared by two groups of transport mechanisms (1).
- 2. silicon chip batch image positioning apparatus as claimed in claim 1, it is characterised in that transport mechanism (1) includes：Transmit frame Body (11) and the transfer assembly (12) for transmitting silicon chip carrier (3).
- 3. silicon chip batch image positioning apparatus as claimed in claim 2, it is characterised in that transmission framework (11) includes：The left transmission post (112) being oppositely arranged and right transmission post (114)；AndThe preceding transmission post (111) being oppositely arranged and rear transmission post (113),Wherein, preceding transmission post (111), afterwards left transmission post (112), transmission post (113) and right transmission post (114) are successively around phase Connect into transmission framework (21).
- 4. silicon chip batch image positioning apparatus as claimed in claim 3, it is characterised in that transfer assembly (12) includes：The left conveyer belt (121) and right conveyer belt (122) being respectively arranged on left transmission post (112) and right transmission post (114)；With AndFor driving the motor (123) of left conveyer belt (121) and right conveyer belt (122) Synchronous Transmission.
- 5. silicon chip batch image positioning apparatus as claimed in claim 3, it is characterised in that left transmission post (112) and right transmission The lifting assembly (13) of framework (11) selective lifting will be transmitted by being respectively provided with the outside of post (114).
- 6. silicon chip batch image positioning apparatus as claimed in claim 3, it is characterised in that put down at the place for transmitting post (113) afterwards Face is located at transport mechanism less than the place plane of preceding transmission post (111), left transmission post (112) and right transmission post (114) to form (1) the transmission outlet of end.
- 7. silicon chip batch image positioning apparatus as claimed in claim 3, it is characterised in that left transmission post (112) and right transmission Direction of transfer of the outside of post (114) along transfer assembly (12) is evenly arranged with several position-limited wheels (14), position-limited wheel (14) with The left and right sides of silicon chip carrier (3) keeps being in rolling contact.
- 8. silicon chip batch image positioning apparatus as claimed in claim 3, it is characterised in that left transmission post (112) and right transmission Direction of transfer of the outside of post (114) along transfer assembly (12) successively compartment of terrain be provided with transmission front position sensor (15), in Turn front position sensor (16), transfer terminal position sensor (17) and transmission terminal position sensor (18).
- 9. silicon chip batch image positioning apparatus as claimed in claim 1, it is characterised in that transfer mechanism (2) includes：Fixed frame (21)；AndFor carrying the transfer framework (22) of silicon chip carrier (3), it is located on fixed frame (21), wherein, transfer framework (22) end reciprocably is slid onto so that by silicon chip carrier (3) from feeding station (A1) from the front end of fixed frame (21) Gone in transport mechanism (1) in the transport mechanism (1) at discharge station (A2) place, the lower section of transfer framework (22) is provided with light filling component (24), the surface of light filling component (24) is provided with the camera for being used for silicon chip image positioning.
- 10. silicon chip batch image positioning apparatus as claimed in claim 9, it is characterised in that light filling component (24) is located at fixation Near the stage casing of framework (21), wherein, when transfer framework (22) is located at the front end of fixed frame (21), light filling component (24) is just It is good to be located at the end for turning framework (22)；When transfer framework (22) is located at the end of fixed frame (21), light filling component (24) is just It is good to be located at the front end for turning framework (22).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710719074.4A CN107464773A (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip batch image positioning apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710719074.4A CN107464773A (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip batch image positioning apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN107464773A true CN107464773A (en) | 2017-12-12 |
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ID=60549107
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710719074.4A Pending CN107464773A (en) | 2017-08-21 | 2017-08-21 | A kind of silicon chip batch image positioning apparatus |
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| CN (1) | CN107464773A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111483757A (en) * | 2020-05-25 | 2020-08-04 | 广东鑫光智能系统有限公司 | Fine positioning device and fine positioning method of flat-panel television |
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|---|---|---|---|---|
| CN102126630A (en) * | 2010-12-29 | 2011-07-20 | 常州亿晶光电科技有限公司 | Silicon chip image positioning and correcting device of full-automatic printer |
| CN202582687U (en) * | 2012-04-10 | 2012-12-05 | 百力达太阳能股份有限公司 | Calculating instrument for calculating quantity of work-in-process solar silicon wafers |
| CN204823231U (en) * | 2015-07-10 | 2015-12-02 | 上海微松工业自动化有限公司 | Set up a machine people's automatic feeding equipment |
| CN207303061U (en) * | 2017-08-21 | 2018-05-01 | 罗博特科智能科技股份有限公司 | A kind of silicon chip batch image positioning apparatus |
-
2017
- 2017-08-21 CN CN201710719074.4A patent/CN107464773A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102126630A (en) * | 2010-12-29 | 2011-07-20 | 常州亿晶光电科技有限公司 | Silicon chip image positioning and correcting device of full-automatic printer |
| CN202582687U (en) * | 2012-04-10 | 2012-12-05 | 百力达太阳能股份有限公司 | Calculating instrument for calculating quantity of work-in-process solar silicon wafers |
| CN204823231U (en) * | 2015-07-10 | 2015-12-02 | 上海微松工业自动化有限公司 | Set up a machine people's automatic feeding equipment |
| CN207303061U (en) * | 2017-08-21 | 2018-05-01 | 罗博特科智能科技股份有限公司 | A kind of silicon chip batch image positioning apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111483757A (en) * | 2020-05-25 | 2020-08-04 | 广东鑫光智能系统有限公司 | Fine positioning device and fine positioning method of flat-panel television |
| CN111483757B (en) * | 2020-05-25 | 2020-12-04 | 广东鑫光智能系统有限公司 | Fine positioning device and fine positioning method of flat-panel television |
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Application publication date: 20171212 |
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