CN107446521A - 一种成膜导电胶 - Google Patents
一种成膜导电胶 Download PDFInfo
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- CN107446521A CN107446521A CN201710524643.XA CN201710524643A CN107446521A CN 107446521 A CN107446521 A CN 107446521A CN 201710524643 A CN201710524643 A CN 201710524643A CN 107446521 A CN107446521 A CN 107446521A
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- 239000000853 adhesive Substances 0.000 title abstract description 13
- 230000001070 adhesive effect Effects 0.000 title abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 230000032683 aging Effects 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 239000002313 adhesive film Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 239000006245 Carbon black Super-P Substances 0.000 description 5
- 239000011231 conductive filler Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- -1 aluminium silver oxide Chemical compound 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
Abstract
本发明涉及一种成膜导电胶。本发明属于导电胶技术领域。一种成膜导电胶,其特点是:成膜导电胶原料组分和质量份数为导电碳黑0.5‑1.5份;石墨烯0‑1份,801胶97.5‑99.5份。本发明成膜导电胶具有导电,固化后胶膜软,粘接强度好,特别适合易碎的多孔电极与金属间粘接,耐候,耐老化;在常温下固化,不需要加热,操作方便;导电胶稳定性好等优点。
Description
技术领域
本发明属于导电胶技术领域,特别是涉及一种成膜导电胶。
背景技术
导电胶是一种固化或干燥后具有一定导电性能的胶黏剂,它通常以基体树脂和导电填料即导电粒子为主要成分,通过基体树脂的粘接作用把导电粒子结合在一起,形成导电通路,实现被粘结材料的导电连接。
目前,市面上所售的导电胶按基体主要分为环氧类,硅酮类和聚合物类。其中环氧类和聚合物类导电胶固化后形成胶膜较坚硬,不适用于易碎的多孔电极的粘接。硅酮类固化后形成的胶膜较软,但存在粘接强度较差等技术问题。
发明内容
本发明为解决公知技术中存在的技术问题而提供一种成膜导电胶。
本发明的目的是提供一种具有导电,固化后胶膜软,粘接强度好,特别适合易碎的多孔电极与金属间粘接,耐候,耐老化;在常温下固化,不需要加热,操作方便;导电胶稳定性好等特点的成膜导电胶。
本发明解决了现有导电胶在多孔电极粘接上的不足,提供一种固化后胶膜软,粘接强度好的导电胶,降低多孔电极和集流体间电阻。
本发明导电胶的构成原料和重量配比为:导电碳黑(Super-P)0.5-1.5份;石墨烯0-1份,801胶97.5-99.5份。导电碳黑(Super-P)、石墨烯和801胶为市售;
本发明导电胶用在铝氧化银电池的多孔氧化银电极和镀银铜箔粘接中,具有较好的粘接强度和导电性。将由本发明的导电胶替代市售的导电胶,所得产品的性能优于原产品。
本发明成膜导电胶所采取的技术方案是:
一种成膜导电胶,其特点是:成膜导电胶原料组分和质量份数为导电碳黑0.5-1.5份;石墨烯0-1份,801胶97.5-99.5份。
本发明成膜导电胶还可以采用如下技术方案:
所述的成膜导电胶,其特点是:导电碳黑为Super P或Super S。
本发明具有的优点和积极效果是:
成膜导电胶由于采用了本发明全新的技术方案,与现有技术相比,采用本发明导电胶与市售导电胶是相比具有以下明显特点:
1、本发明具有导电,固化后胶膜软,粘接强度好,特别适合易碎的多孔电极与金属间粘接,耐候,耐老化;
2、本发明为单组份,不需要混合,在常温下固化,不需要加热,操作方便;
3、本发明导电胶的稳定性好。
附图说明
图1是不同导电填料含量的导电胶的剥离强度。
图中,1、0%导电填料剥离强度曲线,2、0.5%导电填料剥离强度曲线,3、1.5%导电填料剥离强度曲线,4、2.5%导电填料剥离强度曲线。
具体实施方式
为能进一步了解本发明的发明内容、特点及功效,兹例举以下实施例,并配合附图详细说明如下:
参阅附图1。
实施例1
一种成膜导电胶,成膜导电胶原料组分和质量份数为:导电碳黑(Super-P)1.5份;石墨烯0份,801胶98.5份。
实施例2
一种成膜导电胶,成膜导电胶原料组分和质量份数为:导电碳黑(Super-P)1份;石墨烯1份,801胶98份。
实施例3
一种成膜导电胶,成膜导电胶原料组分和质量份数为:导电碳黑(Super-P)1.5份;石墨烯1份,801胶97.5份。
本实施例制备的成膜导电胶具有导电,固化后胶膜软,粘接强度好,特别适合易碎的多孔电极与金属间粘接,耐候,耐老化;在常温下固化,不需要加热,操作方便;导电胶稳定性好等积极效果。
Claims (2)
1.一种成膜导电胶,其特征是:成膜导电胶原料组分和质量份数为导电碳黑0.5-1.5份;石墨烯0-1份,801胶97.5-99.5份。
2.根据权利要求1所述的成膜导电胶,其特征是:导电碳黑为Super P或Super S。
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1087926A (zh) * | 1993-12-31 | 1994-06-15 | 清华大学 | 石墨-高分子导电粘接剂及其制备方法 |
CN102254584A (zh) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | 基于石墨烯填料的通用电子浆料 |
CN106653397A (zh) * | 2016-12-18 | 2017-05-10 | 安徽凯普卢森新能源科技股份有限公司 | 一种低内阻、高比能石墨烯基纽扣式超级电容器的制备方法 |
-
2017
- 2017-06-30 CN CN201710524643.XA patent/CN107446521A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1087926A (zh) * | 1993-12-31 | 1994-06-15 | 清华大学 | 石墨-高分子导电粘接剂及其制备方法 |
CN102254584A (zh) * | 2011-05-12 | 2011-11-23 | 中国科学院宁波材料技术与工程研究所 | 基于石墨烯填料的通用电子浆料 |
CN106653397A (zh) * | 2016-12-18 | 2017-05-10 | 安徽凯普卢森新能源科技股份有限公司 | 一种低内阻、高比能石墨烯基纽扣式超级电容器的制备方法 |
Non-Patent Citations (2)
Title |
---|
王春阳: "《建筑材料》", 31 August 2002, 高等教育出版社 * |
赵择卿等: "《高分子材料导电和抗静电技术及应用》", 31 May 2006, 中国纺织出版社 * |
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Application publication date: 20171208 |