CN107369872B - 改进型陶瓷耦合器的加工方法 - Google Patents
改进型陶瓷耦合器的加工方法 Download PDFInfo
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- CN107369872B CN107369872B CN201611070257.XA CN201611070257A CN107369872B CN 107369872 B CN107369872 B CN 107369872B CN 201611070257 A CN201611070257 A CN 201611070257A CN 107369872 B CN107369872 B CN 107369872B
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- shell
- coupler
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- ceramic
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- 239000000919 ceramic Substances 0.000 title claims abstract description 39
- 238000003672 processing method Methods 0.000 title claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 13
- 239000000853 adhesive Substances 0.000 claims abstract description 11
- 230000001070 adhesive effect Effects 0.000 claims abstract description 11
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000005476 soldering Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 7
- 239000013464 silicone adhesive Substances 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims abstract description 3
- 238000012545 processing Methods 0.000 claims description 8
- -1 polytetrafluoroethylene Polymers 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims 4
- 238000007906 compression Methods 0.000 claims 4
- 230000008569 process Effects 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 238000004382 potting Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 18
- 230000005540 biological transmission Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/12—Coupling devices having more than two ports
- H01P5/16—Conjugate devices, i.e. devices having at least one port decoupled from one other port
- H01P5/18—Conjugate devices, i.e. devices having at least one port decoupled from one other port consisting of two coupled guides, e.g. directional couplers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Products (AREA)
Abstract
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Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611070257.XA CN107369872B (zh) | 2016-11-28 | 2016-11-28 | 改进型陶瓷耦合器的加工方法 |
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CN201611070257.XA CN107369872B (zh) | 2016-11-28 | 2016-11-28 | 改进型陶瓷耦合器的加工方法 |
Publications (2)
Publication Number | Publication Date |
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CN107369872A CN107369872A (zh) | 2017-11-21 |
CN107369872B true CN107369872B (zh) | 2021-09-17 |
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CN201611070257.XA Active CN107369872B (zh) | 2016-11-28 | 2016-11-28 | 改进型陶瓷耦合器的加工方法 |
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CN (1) | CN107369872B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110256096A (zh) * | 2019-06-13 | 2019-09-20 | 安徽华东光电技术研究所有限公司 | 多个陶瓷基板与壳体回流焊接的工艺方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103962772A (zh) * | 2013-02-04 | 2014-08-06 | 西安永电电气有限责任公司 | 一种igbt一次焊接工装及其装配方法 |
CN104232009A (zh) * | 2014-09-19 | 2014-12-24 | 中科院广州化学有限公司南雄材料生产基地 | 一种乙烯基mq树脂改性有机硅封装胶及制备方法和应用 |
CN204515029U (zh) * | 2014-11-07 | 2015-07-29 | 北京北广科技股份有限公司 | 3dB耦合电缆测试装置 |
CN205129122U (zh) * | 2015-11-24 | 2016-04-06 | 北京北广科技股份有限公司 | 一种陶瓷滤波板焊接工装 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104125722B (zh) * | 2014-08-12 | 2017-08-29 | 上海航天电子通讯设备研究所 | 微波基板与壳体的焊接工艺及其焊接机构 |
CN204156064U (zh) * | 2014-10-23 | 2015-02-11 | 成都必控科技股份有限公司 | 具有螺纹电磁密封结构的滤波器 |
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2016
- 2016-11-28 CN CN201611070257.XA patent/CN107369872B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103962772A (zh) * | 2013-02-04 | 2014-08-06 | 西安永电电气有限责任公司 | 一种igbt一次焊接工装及其装配方法 |
CN104232009A (zh) * | 2014-09-19 | 2014-12-24 | 中科院广州化学有限公司南雄材料生产基地 | 一种乙烯基mq树脂改性有机硅封装胶及制备方法和应用 |
CN204515029U (zh) * | 2014-11-07 | 2015-07-29 | 北京北广科技股份有限公司 | 3dB耦合电缆测试装置 |
CN205129122U (zh) * | 2015-11-24 | 2016-04-06 | 北京北广科技股份有限公司 | 一种陶瓷滤波板焊接工装 |
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Effective date of registration: 20200422 Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Daxing District Applicant after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 101312 No. 26, A District, Tianzhu Road, Tianzhu Airport Industrial Zone, Beijing, Shunyi District Applicant before: Beijing BBEF Science & Technology Co.,Ltd. |
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Effective date of registration: 20240718 Address after: 100176 4s01, 4th floor, building 1, No.8 courtyard, Wenchang Avenue, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Huacheng Electronics Co.,Ltd. Country or region after: China Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Wenchang Road 8 Patentee before: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Country or region before: China |