CN107363430A - A kind of solder of low silver-colored phosphorous copper - Google Patents

A kind of solder of low silver-colored phosphorous copper Download PDF

Info

Publication number
CN107363430A
CN107363430A CN201710634129.1A CN201710634129A CN107363430A CN 107363430 A CN107363430 A CN 107363430A CN 201710634129 A CN201710634129 A CN 201710634129A CN 107363430 A CN107363430 A CN 107363430A
Authority
CN
China
Prior art keywords
solder
silver
phosphorous copper
low silver
raw material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710634129.1A
Other languages
Chinese (zh)
Inventor
曹立兵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Huazhong Welding Material Manufacturing Co Ltd
Original Assignee
Anhui Huazhong Welding Material Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Huazhong Welding Material Manufacturing Co Ltd filed Critical Anhui Huazhong Welding Material Manufacturing Co Ltd
Priority to CN201710634129.1A priority Critical patent/CN107363430A/en
Publication of CN107363430A publication Critical patent/CN107363430A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent

Abstract

The present invention relates to a kind of solder of low silver-colored phosphorous copper, is calculated according to mass percent number, including following raw material is made：Ag:15~35%, P：20~40%, Cu：20~45%, Mn：5~15%, Ni：0.5~5%, B：5~15%.The invention reduces the Ag contents of solder, increase P the and Cu contents in solder, then produced according to quantitative proportioning, production efficiency is high, raw material input error reduces, the production cost of solder is not only reduced, retains the advantages of silver-base solder soldering is not likely to produce gap, while add mobility, make soldered fitting that there is preferable intensity and electric conductivity, solder wetting power is greatly improved, improves intensity and toughness, reduces fusing point.

Description

A kind of solder of low silver-colored phosphorous copper
Technical field
The present invention relates to a kind of solder, is specifically related to a kind of solder of low silver-colored phosphorous copper.
Background technology
Silver-base solder has the advantages of fusing point is low, and good fluidity, shaping surface is attractive in appearance, and joint is firm, and P-Cu Brazing Materials have There is good fluidity, cheap, the characteristics of processing performance is excellent.The P-Cu Brazing Materials of argentiferous, its function admirable, cost is cheap, just Promoted in good.And the silver of different proportion, phosphorus, the proportioning of copper, end properties is influenceed very big, ratio standard is wide in range, makes Into low production efficiency, input is also easy to produce error.
The content of the invention
The technical problem to be solved in the present invention is to overcome prior art solder performance to play imperfect defect, there is provided a kind of The solder of low silver-colored phosphorous copper.
In order to solve the above technical problems, the present invention provides following technical scheme：A kind of solder of low silver-colored phosphorous copper, according to matter Measure percentage number to calculate, including following raw material is made：Ag:15~35%, P：20~40%, Cu：20~45%, Mn：5~ 15%, Ni：0.5~5%, B：5~15%.
Further, calculated according to mass percent number：Ag:16%, P：35%, Cu：30%, Mn：7%, Ni：3%, B： 9%.
The present invention has an advantageous effect in that compared with prior art：A kind of solder of low silver-colored phosphorous copper, reduces solder Ag contents, increase P the and Cu contents in solder, then produced according to quantitative proportioning, production efficiency is high, and raw material input error subtracts It is small, the production cost of solder is not only reduced, retains the advantages of silver-base solder soldering is not likely to produce gap, while add flowing Property, make soldered fitting that there is preferable intensity and electric conductivity, greatly improve solder wetting power, improve intensity and toughness, drop Low melting point.
Embodiment
Embodiment 1
The Ag contents of solder are reduced, increases P the and Cu contents in solder, is then produced according to quantitative proportioning, production efficiency Height, raw material input error reduce, and not only reduce the production cost of solder, retain silver-base solder soldering and be not likely to produce the excellent of gap Point, while mobility is added, make soldered fitting that there is preferable intensity and electric conductivity, greatly improve solder wetting power, Intensity and toughness are improved, reduces fusing point.The foregoing is merely illustrative of the preferred embodiments of the present invention, not limiting this hair It is bright, all any modification, equivalent and improvement made within the spirit and principles of the invention etc., it should be included in the present invention Protection domain within.

Claims (2)

  1. A kind of 1. solder of low silver-colored phosphorous copper, it is characterised in that：Calculated according to mass percent number, including following raw material is made： Ag:15~35%, P：20~40%, Cu：20~45%, Mn：5~15%, Ni：0.5~5%, B：5~15%.
  2. 2. the solder of a kind of low silver-colored phosphorous copper according to claim 1, it is characterised in that according to mass percent number meter Calculate：Ag:16%, P：35%, Cu：30%, Mn：7%, Ni：3%, B：9%.
CN201710634129.1A 2017-07-29 2017-07-29 A kind of solder of low silver-colored phosphorous copper Pending CN107363430A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710634129.1A CN107363430A (en) 2017-07-29 2017-07-29 A kind of solder of low silver-colored phosphorous copper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710634129.1A CN107363430A (en) 2017-07-29 2017-07-29 A kind of solder of low silver-colored phosphorous copper

Publications (1)

Publication Number Publication Date
CN107363430A true CN107363430A (en) 2017-11-21

Family

ID=60307869

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710634129.1A Pending CN107363430A (en) 2017-07-29 2017-07-29 A kind of solder of low silver-colored phosphorous copper

Country Status (1)

Country Link
CN (1) CN107363430A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296671A (en) * 2018-01-28 2018-07-20 温州宏丰电工合金股份有限公司 A kind of compound silver solder paste and preparation method thereof
CN109262160A (en) * 2018-11-23 2019-01-25 深圳市唯特偶新材料股份有限公司 A kind of novel electron welding material
CN109759746A (en) * 2019-03-05 2019-05-17 郑州机械研究所有限公司 A kind of strong corrosion resistant stainless steel Baogang grounded screen aluminothermy welding powder

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1184016A (en) * 1997-12-12 1998-06-10 北京有色金属研究总院 High-temp solder alloy powder for welding stain-less steel container and its preparation process
CN1799761A (en) * 2006-01-24 2006-07-12 徐振五 Lead-free solder
CN101693325A (en) * 2009-10-14 2010-04-14 郑州机械研究所 High-toughness cadmium-free silver solder and preparation method thereof
CN102284805A (en) * 2011-07-25 2011-12-21 浙江信和焊材制造有限公司 Preparation method of copper phosphorus-based alloy solder
CN104907728A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Environment-friendly coated copper brazing filler metal
CN104907724A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Reed-type environment-friendly coated silver brazing filler metal ring
WO2016055430A1 (en) * 2014-10-08 2016-04-14 Swep International Ab A brazing material for brazing articles of austenitic stainless steel and method therefore

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1184016A (en) * 1997-12-12 1998-06-10 北京有色金属研究总院 High-temp solder alloy powder for welding stain-less steel container and its preparation process
CN1799761A (en) * 2006-01-24 2006-07-12 徐振五 Lead-free solder
CN101693325A (en) * 2009-10-14 2010-04-14 郑州机械研究所 High-toughness cadmium-free silver solder and preparation method thereof
CN102284805A (en) * 2011-07-25 2011-12-21 浙江信和焊材制造有限公司 Preparation method of copper phosphorus-based alloy solder
WO2016055430A1 (en) * 2014-10-08 2016-04-14 Swep International Ab A brazing material for brazing articles of austenitic stainless steel and method therefore
CN104907728A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Environment-friendly coated copper brazing filler metal
CN104907724A (en) * 2015-05-25 2015-09-16 郑州机械研究所 Reed-type environment-friendly coated silver brazing filler metal ring

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108296671A (en) * 2018-01-28 2018-07-20 温州宏丰电工合金股份有限公司 A kind of compound silver solder paste and preparation method thereof
CN109262160A (en) * 2018-11-23 2019-01-25 深圳市唯特偶新材料股份有限公司 A kind of novel electron welding material
CN109759746A (en) * 2019-03-05 2019-05-17 郑州机械研究所有限公司 A kind of strong corrosion resistant stainless steel Baogang grounded screen aluminothermy welding powder
CN109759746B (en) * 2019-03-05 2021-07-02 郑州机械研究所有限公司 High-corrosion-resistance aluminum hot welding powder for stainless steel ladle grounding grid

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Application publication date: 20171121