CN107220196A - A kind of built-in high-end storage card for supporting Tri Mode - Google Patents

A kind of built-in high-end storage card for supporting Tri Mode Download PDF

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CN107220196A
CN107220196A CN201710393257.1A CN201710393257A CN107220196A CN 107220196 A CN107220196 A CN 107220196A CN 201710393257 A CN201710393257 A CN 201710393257A CN 107220196 A CN107220196 A CN 107220196A
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built
connectors
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pcie
connector
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杨明涛
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Zhengzhou Yunhai Information Technology Co Ltd
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/14Handling requests for interconnection or transfer
    • G06F13/16Handling requests for interconnection or transfer for access to memory bus
    • G06F13/1668Details of memory controller
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/07Responding to the occurrence of a fault, e.g. fault tolerance
    • G06F11/14Error detection or correction of the data by redundancy in operations
    • G06F11/1402Saving, restoring, recovering or retrying
    • G06F11/1415Saving, restoring, recovering or retrying at system level
    • G06F11/1441Resetting or repowering
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F13/00Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
    • G06F13/38Information transfer, e.g. on bus
    • G06F13/42Bus transfer protocol, e.g. handshake; Synchronisation
    • G06F13/4282Bus transfer protocol, e.g. handshake; Synchronisation on a serial bus, e.g. I2C bus, SPI bus

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Abstract

本发明公开了一种支持Tri‑Mode的内置高端存储卡,它包括PCB板以及设置在PCB板上的Raid控制器、DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元和供电单元,所述的Raid控制器分别与DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元和供电单元连接,所述内置式连接器接口连接有内置式连接器,所述内置式连接器与磁盘连接。本发明通过一张PCIE板卡实现了SAS/SATA/NVME磁盘的混合部署,节省了主板PCIE开销,减小了机箱布线复杂度,降低了系统成本。

The invention discloses a built-in high-end memory card supporting Tri-Mode, which includes a PCB board and a Raid controller arranged on the PCB board, a DDR4 cache array, a PCIE host interface, a built-in connector interface, a Firmware storage unit, a data Protection and super capacitor interface unit, clock unit and power supply unit, described Raid controller is respectively connected with DDR4 cache array, PCIE host interface, built-in connector interface, Firmware storage unit, data protection and super capacitor interface unit, clock unit and The power supply unit is connected, the built-in connector interface is connected with a built-in connector, and the built-in connector is connected with the disk. The invention realizes the hybrid deployment of SAS/SATA/NVME disks through a PCIE board, saves the PCIE overhead of the motherboard, reduces the wiring complexity of the chassis, and reduces the system cost.

Description

一种支持Tri-Mode的内置高端存储卡A built-in high-end memory card that supports Tri-Mode

技术领域technical field

本发明涉及一种支持Tri-Mode的内置高端存储卡,具体地是一种采用支持Tri-Mode(三模,SAS/SATA/PCIE或SAS/SATA/NVME)的8端口内置式存储卡,其支持高端Raid级Raid0/1/5/6/10/50/60,有1GB-8GB多种DDR缓存规格,属于服务器存储技术领域。The present invention relates to a built-in high-end memory card supporting Tri-Mode, specifically an 8-port built-in memory card supporting Tri-Mode (three modes, SAS/SATA/PCIE or SAS/SATA/NVME), which It supports high-end Raid level Raid0/1/5/6/10/50/60, and has various DDR cache specifications from 1GB to 8GB, which belongs to the field of server storage technology.

背景技术Background technique

随着云计算技术和大数据应用的发展,市场对服务器的功能要求越来越综合。既要求其搭配的传统SAS、SATA机械磁盘实现容量增加,也要求使用SSD特别是NVME SSD来实现高性能低延迟的应用。因此,混合部署SAS/SATA/NVME磁盘的服务器系统,市场需求越来越广泛。With the development of cloud computing technology and big data applications, the market's functional requirements for servers are becoming more and more comprehensive. It is required to increase the capacity of traditional SAS and SATA mechanical disks, and to use SSDs, especially NVME SSDs, to achieve high-performance and low-latency applications. Therefore, the market demand for server systems with mixed deployment of SAS/SATA/NVME disks is becoming more and more extensive.

实现服务器SAS/SATA/NVME磁盘混合部署的传统方案,通常必须使用两种板卡,一种是支持SAS/SATA盘的存储卡,另一种是支持NVME盘的PCIE Redriver/Retimer卡或PCIESwitch卡。这种方案占用主板PCIE插槽多(至少2个),占用服务器空间大,实现成本高,而且功能上不支持NVME盘的Raid(Redundant Array of Independent Disks,即独立磁盘冗余阵列)功能,无法实现NVME盘的数据冗余保护,存在较多弊端。The traditional solution to realize the hybrid deployment of server SAS/SATA/NVME disks usually requires two boards, one is a memory card that supports SAS/SATA disks, and the other is a PCIE Redriver/Retimer card or PCIESwitch card that supports NVME disks . This solution occupies many PCIE slots (at least 2) on the motherboard, takes up a large amount of space on the server, and has high implementation costs. It also does not support the Raid (Redundant Array of Independent Disks) function of the NVME disk, and cannot There are many disadvantages in realizing the data redundancy protection of NVME disks.

因此,为解决传统方案的弊端,更好的满足市场需求,亟需采用新技术开发一种新型板卡使只占用一个PCIE槽即可实现SAS/SATA/NVME磁盘混合部署,且支持NVME盘的Raid功能。Therefore, in order to solve the disadvantages of the traditional solution and better meet the market demand, it is urgent to use new technology to develop a new type of card so that only one PCIE slot can be used to realize the hybrid deployment of SAS/SATA/NVME disks, and support the NVME disks. Raid function.

发明内容Contents of the invention

针对现有技术的不足,本发明提供了一种支持Tri-Mode的内置高端存储卡,其能够通过一张PCIE板卡实现SAS/SATA/NVME磁盘的混合部署,节省主板PCIE开销,减小机箱布线复杂度,降低系统成本。Aiming at the deficiencies of the prior art, the present invention provides a built-in high-end memory card that supports Tri-Mode, which can realize the mixed deployment of SAS/SATA/NVME disks through a PCIE board card, save the PCIE overhead of the motherboard, and reduce the chassis Wiring complexity reduces system cost.

本发明解决其技术问题采取的技术方案是:一种支持Tri-Mode的内置高端存储卡,其特征是,包括PCB板以及设置在PCB板上的Raid控制器、DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元和供电单元,所述的Raid控制器分别与DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元和供电单元连接,所述内置式连接器接口连接有内置式连接器,所述内置式连接器与磁盘连接。The technical scheme that the present invention solves its technical problem is: a kind of built-in high-end memory card that supports Tri-Mode, it is characterized in that, comprise PCB board and be arranged on the Raid controller on PCB board, DDR4 cache array, PCIE host interface, Built-in connector interface, Firmware storage unit, data protection and supercapacitor interface unit, clock unit and power supply unit, described Raid controller is respectively connected with DDR4 cache array, PCIE host interface, built-in connector interface, Firmware storage unit, The data protection and supercapacitor interface unit, the clock unit and the power supply unit are connected, the built-in connector interface is connected with a built-in connector, and the built-in connector is connected with the disk.

优选地,所述内置式连接器接口有多个,多个内置式连接器接口分别连相同或不同的内置式连接器。Preferably, there are multiple built-in connector interfaces, and the multiple built-in connector interfaces are respectively connected to the same or different built-in connectors.

优选地,所述内置式连接器包括MinisasHD连接器、OCUlink连接器和Slimilne连接器中的一种或多种。Preferably, the built-in connectors include one or more of MinisasHD connectors, OCUlink connectors and Slimilne connectors.

优选地,所述内置式连接器接口设置在PCB板的右侧边沿、上侧边沿或板卡内侧处。Preferably, the built-in connector interface is arranged on the right side edge, the upper side edge of the PCB board or the inner side of the board.

优选地,所述Raid控制器支持的Firmware固件模式为MR模式。Preferably, the firmware mode supported by the Raid controller is MR mode.

优选地,所述内置式连接器包括但不限于1x4连接器和1x8连接器。Preferably, the built-in connectors include but not limited to 1x4 connectors and 1x8 connectors.

优选地,所述内置式连接器通过SAS Expander扩展卡或PCIE Switch扩展卡与磁盘连接。Preferably, the built-in connector is connected to the disk through a SAS Expander expansion card or a PCIE Switch expansion card.

优选地,所述磁盘包括SAS磁盘、SATA磁盘和NVME磁盘中的一种或多种。Preferably, the disks include one or more of SAS disks, SATA disks and NVME disks.

优选地,所述内置式连接器包括弯角连接器和/或直角连接器。Preferably, the built-in connectors include angled connectors and/or right-angled connectors.

优选地,所述Raid控制器采用ROC芯片SAS3508,所述PCIE主机接口采用PCIE x8的标准金手指接口,所述Firmware保存单元采用SPI总线接口的Flash电路模块,所述数据保护及超级电容接口单元采用与DDR4缓存容量匹配对应的NAND FLASH电路模块,所述时钟单元采用时钟振荡芯片,所述供电单元采用将12V、3.3V的输入电压转换为1.8V、1.2V输出电压的电源芯片。Preferably, the Raid controller adopts the ROC chip SAS3508, the PCIE host interface adopts the standard golden finger interface of PCIE x8, the Firmware storage unit adopts the Flash circuit module of the SPI bus interface, and the data protection and supercapacitor interface unit The NAND FLASH circuit module corresponding to the DDR4 cache capacity matching is adopted, the clock unit adopts a clock oscillation chip, and the power supply unit adopts a power supply chip that converts the input voltage of 12V and 3.3V into the output voltage of 1.8V and 1.2V.

本发明的有益效果是:The beneficial effects of the present invention are:

本发明的板卡硬件组成核心是Raid控制器,周围连接DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元、供电单元等模块,构成了支持Tri-Mode(三模,SAS/SATA/PCIE或SAS/SATA/NVME)的8端口内置式存储卡,支持高端Raid级Raid0/1/5/6/10/50/60,有1GB-8GB多种DDR缓存规格。The board hardware composition core of the present invention is a Raid controller, which is connected with modules such as DDR4 cache array, PCIE host interface, built-in connector interface, Firmware storage unit, data protection and supercapacitor interface unit, clock unit, power supply unit, etc. In addition to support Tri-Mode (three-mode, SAS/SATA/PCIE or SAS/SATA/NVME) 8-port built-in memory card, support high-end Raid level Raid0/1/5/6/10/50/60, with 1GB- 8GB various DDR cache specifications.

与传统方法比,本发明通过一张PCIE板卡实现SAS/SATA/NVME磁盘的混合部署,节省主板PCIE开销,减小机箱布线复杂度,降低系统成本;而且完全通过存储卡硬件实现NVME磁盘的Raid5/6/50/60等高端硬Raid功能,实现NVME盘的数据冗余保护;此外,Raid控制器SAS3508采用新一代的28nm半导体工艺制程,使板卡功耗大幅降低。Compared with the traditional method, the present invention realizes the hybrid deployment of SAS/SATA/NVME disks through a PCIE board, saves the PCIE overhead of the main board, reduces the complexity of chassis wiring, and reduces system costs; and realizes the storage of NVME disks entirely through memory card hardware. Raid5/6/50/60 and other high-end hard Raid functions realize data redundancy protection of NVME disks; in addition, the Raid controller SAS3508 adopts a new generation of 28nm semiconductor process, which greatly reduces the power consumption of the board.

与现有技术相比,本发明具有以下特点:Compared with the prior art, the present invention has the following characteristics:

1)存储卡使用SAS3508控制器,所支持的Firmware固件模式,是MR(MegaRaid)模式,该模式支持对SAS/SATA/NVME等3种磁盘实现RAID0/1/5/6/10/50/60等Raid算法;可实现SAS/SATA盘直连支持8个盘,通过Expander级联至多支持240个;直连NVME盘时支持2个x4带宽、4个x2带宽盘,通过PCIE Switch扩展时支持16个x4带宽盘。1) The memory card uses the SAS3508 controller, and the supported firmware mode is MR (MegaRaid) mode, which supports RAID0/1/5/6/10/50/60 for three types of disks such as SAS/SATA/NVME Etc. Raid algorithm; SAS/SATA disk can be directly connected to support 8 disks, and cascaded through Expander to support up to 240 disks; when directly connected to NVME disks, it supports 2 x4 bandwidth disks and 4 x2 bandwidth disks, and supports 16 disks when expanded through PCIE Switch x4 bandwidth disk.

2)所支持DDR4缓存阵列,主频2133MHz,包括1GB-8GB多种容量规格。2) The supported DDR4 cache array, the main frequency is 2133MHz, including various capacity specifications from 1GB to 8GB.

3)存储卡尺寸结构是符合《PCIE卡电气规范》中的Low profile cards(半高半长型)尺寸规格。3) The size and structure of the memory card conform to the Low profile cards (half-height and half-length) size specifications in the "PCIE Card Electrical Specification".

4)所使用的连接器是可用于SAS/SATA/PCIE高速信号传输的各种类型的内置MinisasHD、OCUlink、Slimilne连接器,比如1x4、1x8类型,比如弯角、直角类型。4) The connectors used are various types of built-in MinisasHD, OCUlink, and Slimilne connectors that can be used for SAS/SATA/PCIE high-speed signal transmission, such as 1x4, 1x8 types, such as angled, right-angled types.

5)存储卡用于服务器、存储等系统内部使用,所使用连接器在PCB上的摆放位置,包括放在PCB板右侧边沿、上侧边沿、板卡内侧等三类使用情况。5) The memory card is used inside the server, storage and other systems. The placement of the used connector on the PCB includes three types of usage, including the right edge of the PCB, the upper edge, and the inside of the board.

附图说明Description of drawings

图1为的结构示意图;Fig. 1 is the schematic diagram of the structure;

图2(a)至图2(c)为本发明内置式连接器不同摆放位置的示意图;Figure 2(a) to Figure 2(c) are schematic diagrams of different placement positions of the built-in connector of the present invention;

图3为本发明全部使用NVME盘直连应用实例;Figure 3 is an application example of direct connection of all NVME disks used in the present invention;

图4为本发明全部使用SAS/SATA盘直连应用实例;Fig. 4 is the direct connection application example of using all SAS/SATA disks in the present invention;

图5为本发明混合使用SAS/SATA/NVME盘直连应用实例;Fig. 5 is an application example of direct connection of mixed SAS/SATA/NVME disks in the present invention;

图6为本发明使用PCIE Switch及SAS expander扩展应用实例;Fig. 6 uses PCIE Switch and SAS expander expansion application example for the present invention;

图中,1、存储卡,2、供电单元,3、DDR4缓存阵列,4、数据保护及超级电容接口单元,5、Raid控制器,6、内置式连接器接口,7、时钟单元,8、Firmware保存单元,9、PCIE主机接口。In the figure, 1. memory card, 2. power supply unit, 3. DDR4 cache array, 4. data protection and supercapacitor interface unit, 5. Raid controller, 6. built-in connector interface, 7. clock unit, 8. Firmware storage unit, 9. PCIE host interface.

具体实施方式detailed description

为能清楚说明本方案的技术特点,下面通过具体实施方式并结合其附图对本发明进行详细阐述。下文的公开提供了许多不同的实施例或例子用来实现本发明的不同结构。为了简化本发明的公开,下文中对特定例子的部件和设置进行描述。此外,本发明可以在不同例子中重复参考数字和/或字母。这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施例和/或设置之间的关系。应当注意,在附图中所图示的部件不一定按比例绘制。本发明省略了对公知组件和处理技术及工艺的描述以避免不必要地限制本发明。In order to clearly illustrate the technical characteristics of the present solution, the present invention will be described in detail below through specific embodiments and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the present invention.

如图1至图6所示,本发明的一种支持Tri-Mode的内置高端存储卡,它包括PCB板1以及设置在PCB板上的Raid控制器5、DDR4缓存阵列3、PCIE主机接口9、内置式连接器接口6、Firmware保存单元8、数据保护及超级电容接口单元4、时钟单元7和供电单元2,所述的Raid控制器分别与DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元和供电单元连接,所述内置式连接器接口连接有内置式连接器,所述内置式连接器与磁盘连接。As shown in Figures 1 to 6, a built-in high-end memory card supporting Tri-Mode of the present invention includes a PCB board 1 and a Raid controller 5, a DDR4 cache array 3, and a PCIE host interface 9 arranged on the PCB board , built-in connector interface 6, Firmware storage unit 8, data protection and supercapacitor interface unit 4, clock unit 7 and power supply unit 2, described Raid controller is respectively connected with DDR4 cache array, PCIE host interface, built-in connector The interface, the Firmware storage unit, the data protection and supercapacitor interface unit, the clock unit and the power supply unit are connected, and the built-in connector interface is connected with a built-in connector, and the built-in connector is connected with the disk.

优选地,所述内置式连接器接口有多个,多个内置式连接器接口分别连相同或不同的内置式连接器。如图2(a)至图2(c)所示,在本具体实施方式中仅列举了两个内置式连接器接口,所述内置式连接器接口设置在PCB板的右侧边沿、上侧边沿或板卡内侧处。Preferably, there are multiple built-in connector interfaces, and the multiple built-in connector interfaces are respectively connected to the same or different built-in connectors. As shown in Figure 2 (a) to Figure 2 (c), only two built-in connector interfaces are listed in this specific embodiment, and the built-in connector interfaces are arranged on the right side edge and the upper side of the PCB board. edge or on the inside of the board.

优选地,所述内置式连接器包括MinisasHD连接器、OCUlink连接器和Slimilne连接器中的一种或多种,所述内置式连接器包括但不限于1x4连接器和1x8连接器,所述内置式连接器包括弯角连接器和/或直角连接器。Preferably, the built-in connectors include one or more of MinisasHD connectors, OCUlink connectors and Slimilne connectors, the built-in connectors include but not limited to 1x4 connectors and 1x8 connectors, and the built-in Connectors include angled connectors and/or right-angled connectors.

优选地,所述内置式连接器除了采用直连方式与磁盘连接外,还可以通过SASExpander扩展卡或PCIE Switch扩展卡与磁盘连接。Preferably, the built-in connector can be connected to the disk through a SASExpander expansion card or a PCIE Switch expansion card in addition to being directly connected to the disk.

优选地,所述磁盘包括SAS磁盘、SATA磁盘和NVME磁盘中的一种或多种。Preferably, the disks include one or more of SAS disks, SATA disks and NVME disks.

优选地,所述Raid控制器采用ROC芯片SAS3508,所述PCIE主机接口采用PCIE x8的标准金手指接口,所述Firmware保存单元采用SPI总线接口的Flash电路模块,所述数据保护及超级电容接口单元采用与DDR4缓存容量匹配对应的NAND FLASH电路模块,所述时钟单元采用时钟振荡芯片,所述供电单元采用将12V、3.3V的输入电压转换为1.8V、1.2V输出电压的电源芯片。Preferably, the Raid controller adopts the ROC chip SAS3508, the PCIE host interface adopts the standard golden finger interface of PCIE x8, the Firmware storage unit adopts the Flash circuit module of the SPI bus interface, and the data protection and supercapacitor interface unit The NAND FLASH circuit module corresponding to the DDR4 cache capacity matching is adopted, the clock unit adopts a clock oscillation chip, and the power supply unit adopts a power supply chip that converts the input voltage of 12V and 3.3V into the output voltage of 1.8V and 1.2V.

针对需求,本发明提出了一种支持Tri-Mode(三模,SAS/SATA/PCIE或SAS/SATA/NVME)新技术的8端口内置式高端存储卡,通过一张PCIE板卡实现SAS/SATA/NVME磁盘的混合部署。该板卡硬件组成核心是Raid控制器,周围连接DDR4缓存阵列、PCIE主机接口、内置式连接器接口、Firmware保存单元、数据保护及超级电容接口单元、时钟单元、供电单元等模块。In response to the demand, the present invention proposes an 8-port built-in high-end memory card that supports Tri-Mode (three-mode, SAS/SATA/PCIE or SAS/SATA/NVME) new technology, and realizes SAS/SATA through a PCIE board /Hybrid deployment of NVME disks. The core of the board hardware is the Raid controller, which is connected with DDR4 cache array, PCIE host interface, built-in connector interface, Firmware storage unit, data protection and supercapacitor interface unit, clock unit, power supply unit and other modules.

其中,所述Raid控制器为Broadcom公司新一代28nm制程的ROC芯片SAS3508,带有8个SAS/SATA/PCIE x1Lane接口、PCIE3.0x8接口、DDR4接口。Wherein, the Raid controller is a new-generation 28nm process ROC chip SAS3508 of Broadcom, with 8 SAS/SATA/PCIE x1Lane interfaces, PCIE3.0x8 interfaces, and DDR4 interfaces.

所述DDR4缓存阵列,是主频2133MHz、总容量有1GB-8GB多种规格的多个DDR4缓存颗粒,带有ECC校验颗粒,用于缓存主机端发出的准备写入磁盘的数据和缓存Raid控制算法的快速运算数据。The DDR4 cache array is a plurality of DDR4 cache granules with a main frequency of 2133MHz and a total capacity of 1GB-8GB, with ECC check granules, which are used to cache the data sent by the host to be written to the disk and to cache Raid Fast operation data for control algorithms.

所述PCIE主机接口,是PCIE Gen3,x8的标准金手指接口,传输速率是8Gbps,带宽x8;用于连接服务器主板等主机设备。The PCIE host interface is a standard golden finger interface of PCIE Gen3, x8, with a transmission rate of 8Gbps and a bandwidth of x8; it is used to connect host devices such as server motherboards.

所述内置式连接器接口,是指采用内置式MiniSASHD、OCUlink、Slimline接口形态的高速连接器,具体会涉及SFF8643、SFF8612、SFF8654等接口规范,端口数8个。用于在服务器机箱内部直连或通过Expander、Switch等扩展连接SAS/SATA/NVME磁盘。The built-in connector interface refers to a high-speed connector in the form of built-in MiniSASHD, OCUlink, and Slimline interfaces, specifically involving interface specifications such as SFF8643, SFF8612, and SFF8654, with 8 ports. It is used to directly connect to SAS/SATA/NVME disks inside the server chassis or through Expander, Switch and other extensions.

所述Firmware保存单元,是指采用SPI总线接口的Flash电路模块,用于保存存储卡工作所需要的Firmware固件程序、记录工作日志等。The Firmware storage unit refers to the Flash circuit module using the SPI bus interface, which is used to store the Firmware firmware program required for the work of the memory card, record the work log, and the like.

所述数据保护及超级电容接口单元,是指与DDR4缓存容量匹配对应的NAND FLASH电路模块,该模块有超级电容接口;装配超级电容后,可实现当服务器系统意外掉电发生时,卡上Raid控制器将DDR4缓存中的数据写入Nand Flash中实现长期保存,待系统供电恢复后,再将此数据读回。从而实现数据保护,不丢失。The data protection and supercapacitor interface unit refers to the NAND FLASH circuit module corresponding to the DDR4 cache capacity matching, which has a supercapacitor interface; after the supercapacitor is assembled, it can be realized that when the server system is unexpectedly powered off, Raid on the card The controller writes the data in the DDR4 cache into the Nand Flash for long-term storage, and reads the data back after the system power supply is restored. In order to achieve data protection, no loss.

所述时钟单元,指为Raid控制器SAS3508内部SAS unit、DDR unit、PCIE unit等所需的时钟电路,可通过时钟振荡芯片产生。The clock unit refers to the clock circuit required by the SAS unit, DDR unit, PCIE unit, etc. inside the Raid controller SAS3508, which can be generated by a clock oscillation chip.

所述供电单元,指为板卡芯片工作提供电源输出的电路,通过电源芯片将12V、3.3输入电压转换为1.8V、1.2V等输出电压。The power supply unit refers to a circuit that provides power output for the operation of the board chip, and converts 12V and 3.3 input voltages into output voltages such as 1.8V and 1.2V through the power chip.

该存储卡所支持的Firmware固件模式,是MR(MegaRaid)模式,该模式支持Tri-Mode技术,对SAS/SATA/NVME等3种模式磁盘实现RAID0/1/5/6/10/50/60等Raid算法;DDR4缓存阵列,是2133MHz主频,包括1GB-8GB多种容量规格;所使用的连接器是可用于SAS/SATA/PCIE信号传输的各种类型的内置MinisasHD、OCUlink、Slimilne连接器,在PCB上的摆放位置,包括放在PCB板右侧边沿、上侧边沿、板卡内侧等三类使用情况,如图2(a)至图2(c)所示。The firmware mode supported by the memory card is MR (MegaRaid) mode, which supports Tri-Mode technology and realizes RAID0/1/5/6/10/50/60 for SAS/SATA/NVME disks in three modes Raid algorithm; DDR4 cache array, 2133MHz main frequency, including 1GB-8GB various capacity specifications; the connectors used are various types of built-in MinisasHD, OCUlink, Slimilne connectors that can be used for SAS/SATA/PCIE signal transmission , the placement position on the PCB includes three types of use, including the right edge of the PCB, the upper edge, and the inner side of the board, as shown in Figure 2(a) to Figure 2(c).

本发明通过一张PCIE板卡实现SAS/SATA/NVME磁盘的混合部署,节省主板PCIE开销,减小机箱布线复杂度,降低系统成本;而且完全通过存储卡硬件实现NVME磁盘的Raid5/6/50/60等硬Raid功能,实现NVME盘的数据冗余保护。此外,SAS3508采用新一代的28nm半导体工艺制程,使板卡功耗大幅降低。The present invention realizes the mixed deployment of SAS/SATA/NVME disks through a PCIE board, saves the PCIE overhead of the motherboard, reduces the complexity of chassis wiring, and reduces system costs; and realizes Raid5/6/50 of NVME disks entirely through memory card hardware /60 and other hard Raid functions to realize data redundancy protection of NVME disks. In addition, SAS3508 adopts a new generation of 28nm semiconductor process, which greatly reduces the power consumption of the board.

图3、图4、图5和图6为本发明的几种典型具体实施例。下面具体以图5作为实例进行介绍其实施方式。Fig. 3, Fig. 4, Fig. 5 and Fig. 6 are several typical specific embodiments of the present invention. The following specifically introduces the implementation manner by taking FIG. 5 as an example.

在装配机箱时,将PCIE接口9插入服务器主板的PCIE槽中,通过内置式连接器接口6用线缆与服务器的SAS/SATA/NVME磁盘阵列相连。数据保护及超级电容接口单元4连接超级电容模块。DDR4缓存阵列3通过Data/Command/Address/Control等总线连接Raid控制器5。When assembling the chassis, the PCIE interface 9 is inserted into the PCIE slot of the server motherboard, and the built-in connector interface 6 is connected to the SAS/SATA/NVME disk array of the server with a cable. The data protection and supercapacitor interface unit 4 is connected to the supercapacitor module. The DDR4 cache array 3 is connected to the Raid controller 5 through buses such as Data/Command/Address/Control.

服务器通过存储卡板卡1,对与内置式连接器接口6相连的磁盘阵列做Raid算法,比如Raid5,RAID 6,RAID 10,RAID 50或RAID 60。The server performs a Raid algorithm on the disk array connected to the built-in connector interface 6 through the memory card board 1, such as Raid5, RAID 6, RAID 10, RAID 50 or RAID 60.

服务器正常工作时,会将数据写入存储卡。此时,存储卡先将数据保存至DDR4缓存阵列3中。因磁盘阵列中磁盘较多,存储卡会将数据逐一写入硬盘,DDR4缓存阵列3缓存容量越大,写入磁盘数据的次数越少,读写性能越高。During normal operation of the server, data is written to the memory card. At this time, the memory card first saves the data in the DDR4 cache array 3 . Because there are many disks in the disk array, the memory card will write data to the hard disk one by one. The larger the cache capacity of the DDR4 cache array 3, the fewer times the data is written to the disk, and the higher the read and write performance.

服务器正常工作时,会将硬盘数据读出,暂存于DDR4缓存阵列3中,待服务器空闲时上传。When the server is working normally, the hard disk data will be read out, temporarily stored in the DDR4 cache array 3, and uploaded when the server is idle.

如果服务器出现意外断电,存储卡会启用超级电容保护功能,将DDR4缓存阵列3中的数据写入数据保护及超级电容接口单元4中的NAND Flash模块,Flash保存数据不会丢失,待供电恢复后,再将数据迁移会存储卡DDR4缓存阵列3中,重新开始读写硬盘。If the server unexpectedly loses power, the memory card will enable the supercapacitor protection function, and write the data in the DDR4 cache array 3 into the data protection and the NAND Flash module in the supercapacitor interface unit 4. The data stored in the Flash will not be lost until the power supply is restored. Afterwards, the data is migrated to the DDR4 cache array 3 of the memory card, and the hard disk is read and written again.

此外,本发明的应用范围不局限于说明书中描述的特定实施例的工艺、机构、制造、物质组成、手段、方法及步骤。从本发明的公开内容,作为本领域的普通技术人员将容易地理解,对于目前已存在或者以后即将开发出的工艺、机构、制造、物质组成、手段、方法或步骤,其中它们执行与本发明描述的对应实施例大体相同的功能或者获得大体相同的结果,依照本发明可以对它们进行应用。因此,本发明所附权利要求旨在将这些工艺、机构、制造、物质组成、手段、方法或步骤包含在其保护范围内。In addition, the scope of application of the present invention is not limited to the process, mechanism, manufacture, material composition, means, method and steps of the specific embodiments described in the specification. From the disclosure of the present invention, those of ordinary skill in the art will easily understand that for the processes, mechanisms, manufacturing, material compositions, means, methods or steps that currently exist or will be developed in the future, they are implemented in accordance with the present invention Corresponding embodiments described which function substantially the same or achieve substantially the same results may be applied in accordance with the present invention. Therefore, the appended claims of the present invention are intended to include these processes, mechanisms, manufacture, material compositions, means, methods or steps within their protection scope.

Claims (10)

1. a kind of built-in high-end storage card for supporting Tri-Mode, it is characterized in that, including pcb board and be arranged on pcb board Raid controllers, DDR4 array caches, PCIE HPIs, purpose built connectors interface, Firmware storage units, data are protected Shield and super capacitor interface unit, clock unit and power supply unit, described Raid controllers respectively with DDR4 array caches, PCIE HPIs, purpose built connectors interface, Firmware storage units, data protection and super capacitor interface unit, when Clock unit and power supply unit connection, the purpose built connectors interface are connected with purpose built connectors, the purpose built connectors It is connected with disk.
2. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in Connector interface has multiple, and multiple purpose built connectors interfaces connect identical or different purpose built connectors respectively.
3. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in Connector includes the one or more in MinisasHD connectors, OCUlink connectors and Slimilne connectors.
4. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in At connector interface is arranged on the inside of the right edge of pcb board, upper side edge edge or board.
5. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, the Raid controls The Firmware firmware modes that device processed is supported are MR patterns.
6. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in Connector includes but is not limited to 1x4 connectors and 1x8 connectors.
7. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in Connector is connected by SAS Expander expansion cards or PCIE Switch expansion cards with disk.
8. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, the disk bag Include the one or more in SAS disks, SATA disks and NVME disks.
9. a kind of built-in high-end storage card for supporting Tri-Mode according to claim 1, it is characterized in that, it is described built-in Connector includes right-angle connector and/or rigging-angle connector.
10. a kind of according to claim 1 to 9 any one support Tri-Mode built in high-end storage card, its feature It is that the Raid controllers use ROC chips SAS3508, the PCIE HPIs are connect using PCIE x8 standard golden finger Mouthful, the Firmware storage units use the Flash circuit modules of spi bus interface, the data protection and super capacitor Interface unit uses NAND FLASH circuit modules corresponding with the matching of DDR4 buffer memory capacity, and the clock unit is shaken using clock Chip is swung, said supply unit uses the power supply chip that 12V, 3.3V input voltage are converted to 1.8V, 1.2V output voltage.
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