CN107146677A - High frequency high voltage transformer - Google Patents
High frequency high voltage transformer Download PDFInfo
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- CN107146677A CN107146677A CN201710550568.4A CN201710550568A CN107146677A CN 107146677 A CN107146677 A CN 107146677A CN 201710550568 A CN201710550568 A CN 201710550568A CN 107146677 A CN107146677 A CN 107146677A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
- H01F3/14—Constrictions; Gaps, e.g. air-gaps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F19/00—Fixed transformers or mutual inductances of the signal type
- H01F19/04—Transformers or mutual inductances suitable for handling frequencies considerably beyond the audio range
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/323—Insulation between winding turns, between winding layers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Multimedia (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The present invention provides a kind of high frequency high voltage transformer.The transformer include upper U-shaped magnetic core, under PCB (printed circuit board (PCB)) plate for from top to bottom setting gradually of U-shaped magnetic core, the first air gap gasket, interstice pad, primary coil and multilayer；Primary coil is wound on the first magnetic core post；The center of multi-layer PCB board is both provided with through hole；The second magnetic core post passes through the through hole that multi-layer PCB board includes；The secondary windings around the through hole set thereon is printed with each layer pcb board respectively；The tail head for the secondary windings printed on each layer pcb board is electrically connected with the starting for secondary windings printed on adjacent next layer pcb board, to form secondary coil；The air gap is formed between the every two layers adjacent pcb board.The present invention can solve that insulation uniformity between winding is bad and the inconsistent bottleneck of winding layer insulation；The performance of high frequency high voltage transformer has been given play to simultaneously.
Description
Technical Field
The invention relates to the technical field of high-frequency transformers, in particular to a high-frequency high-voltage transformer.
Background
At present, high-frequency high-voltage transformers are mostly of a winding type structure, a primary coil is mostly formed by winding a copper foil or an excitation wire, and a secondary coil is mostly formed by winding superfine wires in a layered mode or in grooves in a winding mode. Therefore, the consistency of insulation between windings and between winding layers cannot be guaranteed, and the high-frequency high-voltage transformer has a large volume and overlarge parameters such as leakage inductance and parasitic capacitance, so that the performance of the high-frequency high-voltage transformer cannot be fully exerted.
Disclosure of Invention
The invention mainly aims to provide a high-frequency high-voltage planar transformer to solve the problems that in the prior art, the consistency between windings is poor, the insulation between the windings is inconsistent, and the size of the conventional high-frequency high-voltage transformer is large, so that parameters such as leakage inductance and parasitic capacitance are too large, and the performance of the high-frequency high-voltage transformer cannot be fully exerted.
In order to achieve the above object, the present invention provides a high frequency and high voltage transformer, which is characterized in that the transformer comprises an upper U-shaped magnetic core, a lower U-shaped magnetic core, a first air gap gasket, a second air gap gasket, a primary coil and a plurality of layers of PCB boards sequentially arranged from top to bottom;
the upper U-shaped magnetic core comprises a first upper arm, a second upper arm and an upper connecting part, and the upper connecting part is integrally formed between the first upper arm and the second upper arm;
the lower U-shaped magnetic core comprises a first lower arm, a second lower arm and a lower connecting part, and the lower connecting part is integrally formed between the first lower arm and the second lower arm;
the first upper arm and the first lower arm are opposite to each other, and the second upper arm and the second lower arm are opposite to each other;
the first upper arm and the first lower arm are separated by the first air gap spacer, and the second upper arm and the second lower arm are separated by the second air gap spacer;
the first upper arm and the first lower arm form a first magnetic core column, and the second upper arm and the second lower arm form a second magnetic core column;
the primary coil is wound on the first magnetic core column;
the center of the multilayer PCB is provided with a through hole; the second core leg penetrates through a through hole included in the multilayer PCB;
secondary windings wound around through holes arranged on the PCB are respectively printed on each layer of PCB;
the tail end of the secondary winding printed on each layer of the PCB is electrically connected with the start end of the secondary winding printed on the next adjacent layer of the PCB so as to form a secondary coil;
and an air gap is formed between every two adjacent layers of the PCB boards.
In practice, the upper U-shaped core and the lower U-shaped core are ferrite cores.
In practice, the first and second air gap shims are both made of a non-magnetic insulating material.
During implementation, the secondary windings printed on the odd layers of the PCB are arranged from inside to outside around the corresponding through holes, and the secondary windings printed on the even layers of the PCB are arranged from outside to inside around the corresponding through holes; or,
the even layers of the secondary windings printed on the PCB are arranged from inside to outside around the corresponding through holes, and the odd layers of the secondary windings printed on the PCB are arranged from outside to inside around the corresponding through holes.
In practice, every two adjacent layers of the PCB boards are separated by the spacer columns, so that an air gap is formed between every two adjacent layers of the PCB boards.
In practice, the spacer posts are made of a non-conductive insulating material.
In implementation, the high-frequency high-voltage transformer is characterized by further comprising N layers of first insulating layers and M layers of second insulating layers; n and M are both positive integers;
the first insulating layer is arranged between the primary coil and the first magnetic core column;
the second insulating layer is arranged around the side of the primary coil, which faces away from the first insulating layer.
In practice, both N and M are greater than or equal to 10.
In practice, the primary coil comprises a 5-turn winding made of 40 strands of 0.1 mm wire.
Compared with the prior art, the high-frequency high-voltage transformer adopts a novel planar PCB (printed circuit Board) transformer technology, and can effectively solve the bottleneck that the insulation consistency between windings is poor and the insulation between the windings is inconsistent; meanwhile, the laminated series structure of the PCB enables the coupling among the windings to be better, greatly reduces parameters such as parasitic inductance and parasitic capacitance and the like, and can exert the performance of the high-frequency high-voltage transformer to the maximum extent; the volume of the high-frequency high-voltage transformer can be further reduced.
Drawings
Fig. 1 is a side view of an embodiment of a high frequency, high voltage transformer according to the present invention;
fig. 2 is a top view of this embodiment of the high frequency high voltage planar transformer of the present invention;
fig. 3 is a schematic structural diagram of the high-frequency high-voltage planar transformer according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The high-frequency high-voltage planar transformer comprises an upper U-shaped magnetic core, a lower U-shaped magnetic core, a first air gap gasket, a second air gap gasket, a primary coil and a plurality of layers of PCB boards which are sequentially arranged from top to bottom;
the upper U-shaped magnetic core comprises a first upper arm, a second upper arm and an upper connecting part, and the upper connecting part is integrally formed between the first upper arm and the second upper arm;
the lower U-shaped magnetic core comprises a first lower arm, a second lower arm and a lower connecting part, and the lower connecting part is integrally formed between the first lower arm and the second lower arm;
the first upper arm and the first lower arm are opposite to each other, and the second upper arm and the second lower arm are opposite to each other;
the first upper arm and the first lower arm are separated by the first air gap spacer, and the second upper arm and the second lower arm are separated by the second air gap spacer;
the first upper arm and the first lower arm form a first magnetic core column, and the second upper arm and the second lower arm form a second magnetic core column;
the primary coil is wound on the first magnetic core column;
the center of the multilayer PCB is provided with a through hole; the second core leg penetrates through a through hole included in the multilayer PCB;
secondary windings wound around through holes arranged on the PCB are respectively printed on each layer of PCB;
the tail end of the secondary winding printed on each layer of the PCB is electrically connected with the start end of the secondary winding printed on the next adjacent layer of the PCB so as to form a secondary coil;
and an air gap is formed between every two adjacent layers of the PCB boards.
In actual operation, the start of the secondary winding printed on the top PCB and the end of the secondary winding printed on the bottom PCB are two ends of the secondary coil included in the high-frequency high-voltage transformer according to the embodiment of the invention.
The high-frequency high-voltage transformer provided by the embodiment of the invention adopts a novel planar Printed Circuit Board (PCB) transformer technology, and the high-frequency high-voltage transformer designed by the technology can effectively solve the bottleneck that the insulation consistency between windings is poor and the insulation between the windings is inconsistent; meanwhile, the laminated series structure of the PCB enables the coupling among the windings to be better, greatly reduces parameters such as parasitic inductance and parasitic capacitance and the like, and can exert the performance of the high-frequency high-voltage transformer to the maximum extent; the volume of the high-frequency high-voltage transformer can be further reduced.
And the novel planar PCB transformer technology can realize the function of compatibility, the combination of structures with various different winding proportion relations and various magnetic circuit shapes and magnetic circuit air gaps can exert the performance of the high-frequency high-voltage transformer to the maximum extent.
Specifically, the upper U-shaped core and the lower U-shaped core may both be ferrite cores.
In practice, the first air gap spacer and the second air gap spacer are both made of non-magnetic insulating material to form a magnetic air gap between the two U-shaped magnetic cores.
According to a specific embodiment, the secondary windings printed on the odd layers of the PCB may be arranged from inside to outside around the corresponding through holes, and the secondary windings printed on the even layers of the PCB may be arranged from outside to inside around the corresponding through holes; that is, the start of the secondary winding printed on the odd-numbered layer of the PCB is close to the through hole on the layer of the PCB, the tail of the secondary winding printed on the odd-numbered layer of the PCB is further from the through hole, the tail of the secondary winding printed on the even-numbered layer of the PCB is close to the through hole on the layer of the PCB, and the start of the secondary winding printed on the even-numbered layer of the PCB is further from the through hole, so that the distance between the tail of the secondary winding printed on each layer of the PCB and the start of the secondary winding printed on the next adjacent layer of the PCB is relatively short, and the connection is relatively convenient.
According to another specific embodiment, the even-numbered layers of secondary windings printed on the PCB are arranged from inside to outside around the corresponding through holes, and the odd-numbered layers of secondary windings printed on the PCB are arranged from outside to inside around the corresponding through holes. That is, the tail of the secondary winding printed on the odd-numbered layer of the PCB is close to the through hole on the layer of the PCB, the start of the secondary winding printed on the odd-numbered layer of the PCB is further from the through hole, the start of the secondary winding printed on the even-numbered layer of the PCB is close to the through hole on the layer of the PCB, and the tail of the secondary winding printed on the even-numbered layer of the PCB is further from the through hole, so that the distance between the tail of the secondary winding printed on each layer of the PCB and the start of the secondary winding printed on the next adjacent layer of the PCB is relatively short, and the mutual connection is relatively convenient.
In actual operation, every two adjacent layers of the PCB boards are separated by the spacer columns, so that an air gap is formed between every two adjacent layers of the PCB boards.
In particular, the spacer posts may be made of a non-conductive insulating material.
In practical operation, the high-frequency high-voltage transformer according to the embodiment of the invention further comprises N layers of first insulating layers and M layers of second insulating layers so as to ensure the insulation of the primary coil; n and M are both positive integers;
the first insulating layer is arranged between the primary coil and the first magnetic core column;
the second insulating layer is arranged around the side of the primary coil, which faces away from the first insulating layer.
That is, in the high-frequency high-voltage transformer according to the embodiment of the present invention, the first insulating layer is disposed around the first core leg, the second insulating layer is also disposed around the first core leg, the first insulating layer is closer to the first core leg, the second insulating layer is farther from the first core leg, and the primary coil is disposed between the first insulating layer and the second insulating layer.
In a specific embodiment, the first insulating layer is a multilayer, and the second insulating layer is a multilayer. Each of the first insulating layers may have a thickness of 0.3mm to 0.8mm, and each of the second insulating layers may have a thickness of 0.3mm to 0.8 mm.
Preferably, both N and M are greater than or equal to 10, so that the primary coil has good insulation.
In practical applications, the primary coil may include 5 windings made of 40 strands of 0.1 mm conducting wires, and the structure of the primary coil is only used as an example and is not limited, and the structure of the primary coil may be determined according to practical situations.
The high-frequency high-voltage transformer according to the invention is described below with reference to a specific embodiment.
As shown in fig. 1 (fig. 1 is a side view of an embodiment of the high-frequency high-voltage planar transformer according to the present invention), fig. 2 (fig. 2 is a top view of the embodiment of the high-frequency high-voltage planar transformer according to the present invention), and fig. 3 (fig. 3 is a schematic structural view of the embodiment of the high-frequency high-voltage planar transformer according to the present invention), an embodiment of the high-frequency high-voltage planar transformer according to the present invention includes an upper U-shaped magnetic core 11, a lower U-shaped magnetic core 12, a first air gap pad 13, a second air gap pad (not shown in fig. 1, 2, and 3), a primary coil 14, and 10 first insulating layers 15 (in actual operation, the thickness of each first insulating layer 15 may be about 0.5mm, and since the thickness of each first insulating layer is small, 10 layers are not drawn in fig. 1 and 2, and are used for illustration only), 10 second insulating layers 16 (in actual operation, the thickness of each second insulating layer 16 may be about 0.5mm (millimeter), and since the thickness of each second insulating layer is smaller, 10 layers are not drawn in fig. 1 and 2 and are only used for illustration), and 14 layers of PCB boards sequentially arranged from top to bottom;
the upper U-shaped magnetic core comprises a first upper arm, a second upper arm and an upper connecting part, and the upper connecting part is integrally formed between the first upper arm and the second upper arm;
the lower U-shaped magnetic core comprises a first lower arm, a second lower arm and a lower connecting part, and the lower connecting part is integrally formed between the first lower arm and the second lower arm;
the first upper arm and the first lower arm are opposite to each other, and the second upper arm and the second lower arm are opposite to each other;
the first upper arm and the first lower arm are separated by the first air gap gasket 13, and the second upper arm and the second lower arm are separated by a second air gap gasket (not shown in fig. 1, 2 and 3); the first air gap spacer 13 and the second air gap spacer are both made of a non-magnetic insulating material;
the first upper arm and the first lower arm form a first magnetic core column, and the second upper arm and the second lower arm form a second magnetic core column;
the primary coil 14 is wound on the first core limb;
the first insulating layer 15 is disposed between the primary coil 14 and the first core leg;
the second insulating layer 16 is arranged around the side of the primary winding 14 facing away from the first insulating layer 15; that is, the primary coil 14 is disposed between the first insulating layer 15 and the second insulating layer 16 (in fig. 3, only the second insulating layer 16 farthest from the first core leg is shown);
the center of the multilayer PCB is provided with a through hole; the second core legs pass through holes respectively included in the 14 layers of PCB boards;
secondary windings wound around through holes arranged on the PCB are respectively printed on each layer of PCB;
the tail end of the secondary winding printed on each layer of the PCB is electrically connected with the start end of the secondary winding printed on the next adjacent layer of the PCB so as to form a secondary coil;
every two adjacent layers of the PCB boards are separated through spacer columns, so that an air gap is formed between every two adjacent layers of the PCB boards; the spacer posts are made of a non-conductive insulating material.
In this particular embodiment, the primary coil may comprise a 5-turn winding of 40 strands of 0.1 mm wire.
In fig. 1 and 3, the PCB designated as PCB1, PCB2, PCB3, PCB4, PCB5, PCB6, PCB7, PCB8, PCB9, PCB10, PCB11, PCB12, PCB13, and PCB14 are a first layer PCB, a second layer PCB, a third layer PCB, a fourth layer PCB, a fifth layer PCB, a sixth layer PCB, a seventh layer PCB, an eighth layer PCB, a ninth layer PCB, a tenth layer PCB, a twelfth layer PCB, a thirteenth layer PCB, and a fourteenth layer PCB, respectively;
in fig. 3, denoted as G1, G2, G3, G4, G5, G6, G7, G8, G9, G10, G11, G12, G13 are respectively a first spacer column, a second spacer column, a third spacer column, a fourth spacer column, a fifth spacer column, a sixth spacer column, a seventh spacer column, an eighth spacer column, a ninth spacer column, a tenth spacer column, an eleventh spacer column, a twelfth spacer column, a thirteenth spacer column (the above spacer columns are not shown in fig. 1); for example, as shown in fig. 1, 3, an air gap 10 is formed between the PCB2 and the PCB 3;
in a specific embodiment of the high-frequency high-voltage planar transformer according to the present invention, the secondary windings printed on the odd layers of the PCB boards (i.e., PCB1, PCB3, PCB5, PCB7, PCB9, PCB11, and PCB13) are disposed from inside to outside around the corresponding through holes, and the secondary windings printed on the even layers of the PCB boards (i.e., PCB2, PCB4, PCB6, PCB8, PCB10, PCB12, and PCB14) are disposed from outside to inside around the corresponding through holes;
the tail of the secondary winding printed on PCB1 is electrically connected to the start of the secondary winding printed on PCB2, the tail of the secondary winding printed on PCB2 is electrically connected to the start of the secondary winding printed on PCB3, the tail of the secondary winding printed on PCB3 is electrically connected to the start of the secondary winding printed on PCB4, the tail of the secondary winding printed on PCB4 is electrically connected to the start of the secondary winding printed on PCB5, the tail of the secondary winding printed on PCB5 is electrically connected to the start of the secondary winding printed on PCB6, the tail of the secondary winding printed on PCB6 is electrically connected to the start of the secondary winding printed on PCB7, the tail of the secondary winding printed on PCB7 is electrically connected to the start of the secondary winding printed on PCB8, the tail of the secondary winding printed on PCB8 is electrically connected to the start of the secondary winding printed on PCB9, the tail of the secondary winding printed on PCB9 is electrically connected to the start of the secondary winding printed on PCB10, the tail of the secondary winding printed on PCB10 is electrically connected to the start of the secondary winding printed on PCB11, the tail of the secondary winding printed on PCB11 is electrically connected to the start of the secondary winding printed on PCB12, the tail of the secondary winding printed on PCB12 is electrically connected to the start of the secondary winding printed on PCB13, and the tail of the secondary winding printed on PCB13 is electrically connected to the start of the secondary winding printed on PCB14 to form a secondary coil;
PCB1 and PCB2 are separated by G1 such that an air gap is formed between PCB1 and PCB 2; PCB2 and PCB3 are separated by G2 such that an air gap is formed between PCB2 and PCB 3; PCB3 and PCB4 are separated by G3 such that an air gap is formed between PCB3 and PCB 4; PCB4 and PCB5 are separated by G4 such that an air gap is formed between PCB4 and PCB 5; PCB5 and PCB6 are separated by G5 such that an air gap is formed between PCB5 and PCB 6; PCB6 and PCB7 are separated by G6 such that an air gap is formed between PCB6 and PCB 7; PCB7 and PCB8 are separated by G7 such that an air gap is formed between PCB7 and PCB 8; PCB8 and PCB9 are separated by G8 such that an air gap is formed between PCB8 and PCB 9; PCB9 and PCB10 are separated by G9 such that an air gap is formed between PCB9 and PCB 10; PCB10 and PCB11 are separated by G10 such that an air gap is formed between PCB10 and PCB 11; PCB11 and PCB12 are separated by G11 such that an air gap is formed between PCB11 and PCB 12; PCB12 and PCB13 are separated by G12 such that an air gap is formed between PCB12 and PCB 3; PCB13 and PCB14 are separated by G13 so that an air gap is formed between PCB13 and PCB 4.
In the specific embodiment of the high-frequency high-voltage planar transformer shown in fig. 1, 2 and 3, the size of each spacer column can be fixed to ensure that the air gap between two adjacent layers of PCB boards is more stable, grooves can be formed in the first layer of PCB board and the fourteenth layer of PCB board, and the grooves are fixed through the metal snap springs, so that the stability and firmness of the secondary coil are better.
While the foregoing is directed to the preferred embodiment of the present invention, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (9)
1. A high-frequency high-voltage transformer is characterized by comprising an upper U-shaped magnetic core, a lower U-shaped magnetic core, a first air gap gasket, a second air gap gasket, a primary coil and a plurality of layers of PCB boards which are sequentially arranged from top to bottom;
the upper U-shaped magnetic core comprises a first upper arm, a second upper arm and an upper connecting part, and the upper connecting part is integrally formed between the first upper arm and the second upper arm;
the lower U-shaped magnetic core comprises a first lower arm, a second lower arm and a lower connecting part, and the lower connecting part is integrally formed between the first lower arm and the second lower arm;
the first upper arm and the first lower arm are opposite to each other, and the second upper arm and the second lower arm are opposite to each other;
the first upper arm and the first lower arm are separated by the first air gap spacer, and the second upper arm and the second lower arm are separated by the second air gap spacer;
the first upper arm and the first lower arm form a first magnetic core column, and the second upper arm and the second lower arm form a second magnetic core column;
the primary coil is wound on the first magnetic core column;
the center of the multilayer PCB is provided with a through hole; the second core leg penetrates through a through hole included in the multilayer PCB;
secondary windings wound around through holes arranged on the PCB are respectively printed on each layer of PCB;
the tail end of the secondary winding printed on each layer of the PCB is electrically connected with the start end of the secondary winding printed on the next adjacent layer of the PCB so as to form a secondary coil;
and an air gap is formed between every two adjacent layers of the PCB boards.
2. The high frequency, high voltage transformer according to claim 1, wherein said upper U-shaped core and said lower U-shaped core are ferrite cores.
3. The high frequency, high voltage transformer of claim 1, wherein the first and second air-gap shims are both made of a non-magnetic insulating material.
4. The high frequency high voltage transformer according to claim 1, wherein the secondary windings printed on the PCB of odd number layers are disposed from inside to outside around the corresponding through-holes, and the secondary windings printed on the PCB of even number layers are disposed from outside to inside around the corresponding through-holes; or,
the even layers of the secondary windings printed on the PCB are arranged from inside to outside around the corresponding through holes, and the odd layers of the secondary windings printed on the PCB are arranged from outside to inside around the corresponding through holes.
5. The high frequency, high voltage transformer according to claim 1, wherein each two adjacent layers of said PCB boards are separated by spacer columns such that an air gap is formed between each two adjacent layers of said PCB boards.
6. The high frequency, high voltage transformer according to claim 5, wherein said spacer posts are made of a non-conductive insulating material.
7. The high frequency high voltage transformer according to any one of claims 1 to 6, further comprising N layers of the first insulating layer and M layers of the second insulating layer; n and M are both positive integers;
the first insulating layer is arranged between the primary coil and the first magnetic core column;
the second insulating layer is arranged around the side of the primary coil, which faces away from the first insulating layer.
8. The high frequency, high voltage transformer according to claim 7, wherein both N and M are greater than or equal to 10.
9. The high frequency, high voltage transformer according to claim 7, wherein said primary winding comprises a 5-turn winding of 40 strands of 0.1 mm wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710550568.4A CN107146677A (en) | 2017-07-07 | 2017-07-07 | High frequency high voltage transformer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710550568.4A CN107146677A (en) | 2017-07-07 | 2017-07-07 | High frequency high voltage transformer |
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| Publication Number | Publication Date |
|---|---|
| CN107146677A true CN107146677A (en) | 2017-09-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710550568.4A Pending CN107146677A (en) | 2017-07-07 | 2017-07-07 | High frequency high voltage transformer |
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| CN (1) | CN107146677A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109411183A (en) * | 2018-12-12 | 2019-03-01 | 深圳飞骧科技有限公司 | Double-spiral structure transformer and radio-frequency power amplifier |
| CN115662754A (en) * | 2022-12-06 | 2023-01-31 | 眉山博雅新材料股份有限公司 | High-frequency power supply and transformer applied to same |
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| CN2358535Y (en) * | 1998-09-13 | 2000-01-12 | 深圳市利泰电子有限公司 | Electronic transformer without framework coil |
| CN2450760Y (en) * | 2000-10-30 | 2001-09-26 | 林秀芹 | Structure of current-limiting transformer |
| JP2006049786A (en) * | 2004-08-06 | 2006-02-16 | Pulse Electronic Engineering Co Ltd | High-frequency high voltage transformer |
| CN1910709A (en) * | 2003-12-03 | 2007-02-07 | 南岸大学企业有限公司 | Dsl modem and transformer |
| CN2932590Y (en) * | 2006-03-22 | 2007-08-08 | 中山市华星电源科技有限公司 | Transformer with a novel structure |
| CN202996559U (en) * | 2012-02-23 | 2013-06-12 | 丁明 | Large-power high-frequency high-pressure switch transformer |
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| US4305056A (en) * | 1978-11-29 | 1981-12-08 | Hitachi, Ltd. | Transformer with gapped core |
| CN2358535Y (en) * | 1998-09-13 | 2000-01-12 | 深圳市利泰电子有限公司 | Electronic transformer without framework coil |
| CN2450760Y (en) * | 2000-10-30 | 2001-09-26 | 林秀芹 | Structure of current-limiting transformer |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109411183A (en) * | 2018-12-12 | 2019-03-01 | 深圳飞骧科技有限公司 | Double-spiral structure transformer and radio-frequency power amplifier |
| CN115662754A (en) * | 2022-12-06 | 2023-01-31 | 眉山博雅新材料股份有限公司 | High-frequency power supply and transformer applied to same |
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Application publication date: 20170908 |
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