CN107134364B - Multilayer ceramic capacitor and plate for installing the multilayer ceramic capacitor - Google Patents

Multilayer ceramic capacitor and plate for installing the multilayer ceramic capacitor Download PDF

Info

Publication number
CN107134364B
CN107134364B CN201710322397.XA CN201710322397A CN107134364B CN 107134364 B CN107134364 B CN 107134364B CN 201710322397 A CN201710322397 A CN 201710322397A CN 107134364 B CN107134364 B CN 107134364B
Authority
CN
China
Prior art keywords
leading
electrode
multilayer ceramic
ceramic capacitor
external electrode
Prior art date
Application number
CN201710322397.XA
Other languages
Chinese (zh)
Other versions
CN107134364A (en
Inventor
李教光
金珍
安永圭
李炳华
Original Assignee
三星电机株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to KR10-2013-0131110 priority Critical
Priority to KR1020130131110A priority patent/KR20140038916A/en
Priority to KR10-2014-0084594 priority
Priority to KR1020140084594A priority patent/KR101514604B1/en
Application filed by 三星电机株式会社 filed Critical 三星电机株式会社
Priority to CN201410569333.6A priority patent/CN104599842B/en
Publication of CN107134364A publication Critical patent/CN107134364A/en
Application granted granted Critical
Publication of CN107134364B publication Critical patent/CN107134364B/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/301Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10636Leadless chip, e.g. chip capacitor or resistor

Abstract

Provide a kind of multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor.The multilayer ceramic capacitor includes ceramic main body, has active layer, first lead portion and the second leading part, third leading part, first external electrode and the second external electrode and third external electrode, wherein, the side for connecting first lead portion with the second leading part is formed by single curved surface, and at least side for being connected to the third leading part of the mounting surface of ceramic main body is at least partly formed by curved surface.

Description

Multilayer ceramic capacitor and plate for installing the multilayer ceramic capacitor

The application be the applying date be on October 22nd, 2014, application No. is 201410569333.6 applications for a patent for invention The divisional application of " multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor ".

Technical field

This disclosure relates to a kind of multilayer ceramic capacitor and a kind of for installing the plate of the multilayer ceramic capacitor.

Background technique

Recently, according to the trend of the micromation of electronic product and high capacitance, the demand of electronic building brick has been increased, with It is used in the electronic product with small size and high capacitance.

In the case of multilayer ceramic capacitors, when equivalent series inductance (hereinafter referred to as " ESL ") increases, electricity The performance of sub- product can deteriorate.In addition, as the electronic building brick of application has been miniaturized and has had high capacitance, multi-layer ceramics electricity The influence relative increase of increase in terms of the ESL of container to the deterioration of electronic product performance.

Specifically, according to the high-performance of integrated circuit (IC), the use of decoupling capacitor increases.Therefore, perpendicular to having 3 terminals The demand of the multilayer ceramic capacitor (MLCC) of straight multilayered structure has increased, and the multilayer with 3 terminal vertical multilayer structures is made pottery Porcelain condenser (MLCC) is also referred to as " low inductance chip capacitor (LICC) ", can by reduce the distance between external terminal with Reduce current path and reduces the inductance of capacitor.

Summary of the invention

Some embodiments in the disclosure can provide it is a kind of can significantly improve it is low in 3 terminal vertical multilayer capacitors The multilayer ceramic capacitor of ESL performance and a kind of for installing the plate of the multilayer ceramic capacitor.

According to some embodiments in the disclosure, multilayer ceramic capacitor may include: three external electrodes, be arranged in ceramics In the mounting surface of main body, to be separated from each other;And first lead portion is to third leading part, the electrode and second out of first Interior electrode extends, to be exposed to the mounting surface of ceramic main body.First lead portion at least one of third leading part draws At least side in line portion can be at least partially formed as diagonal extension.

According to the exemplary embodiment in the present disclosure, a kind of multilayer ceramic capacitor may include: ceramic main body, be included in The multiple dielectric layers stacked in the width direction of ceramic main body;Have active layer, including be arranged alternately multiple first in electrode and Electrode in two, each dielectric layer is in first between electrode and the second inner electrode;First lead portion and the second leading part, from Electrode extends to the mounting surface for being exposed to ceramic main body in one, and is set as in the direction of the length of the ceramic body each other It separates;Third leading part extends to the mounting surface for being exposed to ceramic main body from the second inner electrode, and is arranged first Between leading part and the second leading part;First external electrode and the second external electrode, be arranged in the mounting surface of ceramic main body with It is separated from one another on the length direction of ceramic main body, and it is connected respectively to first lead portion and the second leading part;And third External electrode is arranged in the mounting surface between first external electrode and the second external electrode of ceramic main body and is connected to Three leading parts, wherein be connected to a leading part of the first lead portion of the mounting surface of ceramic main body into third leading part At least side be at least partially formed as diagonal extension.

According to the exemplary embodiment in the present disclosure, a kind of multilayer ceramic capacitor may include: ceramic main body, be included in The multiple dielectric layers stacked in the width direction of ceramic main body;Have active layer, including be arranged alternately multiple first in electrode and Electrode in two, each dielectric layer is in first between electrode and the second inner electrode;First lead portion and the second leading part, from Electrode extends to the mounting surface for being exposed to ceramic main body in one, and is set as in the direction of the length of the ceramic body each other It separates;Third leading part extends to the mounting surface for being exposed to ceramic main body from the second inner electrode, and is arranged first Between leading part and the second leading part;First external electrode and the second external electrode, be arranged in the mounting surface of ceramic main body with It is separated from one another on the length direction of ceramic main body, and it is connected respectively to first lead portion and the second leading part;And third External electrode is arranged in the mounting surface between first external electrode and the second external electrode of ceramic main body and is connected to Three leading parts, wherein first lead portion and the second leading part is made to be connected to each other and be connected to the mounting surface of ceramic main body Side is formed by single curved surface, is connected at least side of the third leading part of the mounting surface of ceramic main body at least partly Ground is formed by curved surface.

According to the exemplary embodiment in the present disclosure, a kind of plate for installing multilayer ceramic capacitor may include: base Plate, first electrode pad to third electrode pad are formed on substrate;And multilayer ceramic capacitor described above, make One dispatch from foreign news agency best third external electrode is separately positioned on first electrode pad to third electrode pad.

Detailed description of the invention

By the detailed description carried out below in conjunction with the accompanying drawings, above and other aspect, the features and other advantages of the disclosure It will be more clearly understood, in the accompanying drawings:

Fig. 1 is schematically show the state being reversed according to the multilayer ceramic capacitor of the embodiment in the disclosure saturating View;

Fig. 2 is the perspective view for showing the state that the ceramic main body of the multilayer ceramic capacitor of Fig. 1 is reversed;

Fig. 3 is the decomposition perspective view that the multilayer ceramic capacitor of Fig. 1 of external electrode is therefrom omitted;

Fig. 4 is the cross-sectional view for showing the multilayer ceramic capacitor of Fig. 1;

Fig. 5 is the perspective view for schematically showing the multilayer ceramic capacitor according to another embodiment in the disclosure;

Fig. 6 is the decomposition perspective view that the multilayer ceramic capacitor of Fig. 5 of external electrode is therefrom omitted;

Fig. 7 is the cross-sectional view for showing the multilayer ceramic capacitor of Fig. 5;

Fig. 8 is the perspective view for schematically showing the multilayer ceramic capacitor according to another embodiment in the disclosure;

Fig. 9 is the perspective view for showing the ceramic main body of multilayer ceramic capacitor of Fig. 8;

Figure 10 is the decomposition perspective view that the multilayer ceramic capacitor of Fig. 8 of external electrode is therefrom omitted;

Figure 11 is the cross-sectional view for showing the multilayer ceramic capacitor of Fig. 8;

Figure 12 is the exemplary plane of the leading part in the multilayer ceramic capacitor shown according to the embodiment in the disclosure Figure;

Figure 13 is the another exemplary of the leading part in the multilayer ceramic capacitor shown according to the embodiment in the disclosure Plan view;

Figure 14 is the perspective view for showing the form that the multilayer ceramic capacitor of Fig. 8 is installed on the board;

Figure 15 is the cross-sectional view for showing the form that the multilayer ceramic capacitor of Fig. 8 is installed on the board.

Specific embodiment

Describe the exemplary embodiment of the disclosure in detail now with reference to attached drawing.

However, the disclosure can be in many different forms for example, and should not be construed as being limited to explain here The specific embodiment stated.On the contrary, thesing embodiments are provided so that this disclosure will be thorough and complete, and these embodiments The scope of the present disclosure will be fully conveyed to those skilled in the art.

In the accompanying drawings, for the sake of clarity, the shape and size of element can be exaggerated, and identical appended drawing reference will always It is used to indicate the same or similar element.

Hexahedral direction will be defined, clearly to describe the exemplary embodiment of the disclosure.L, W shown in the accompanying drawings and T refers respectively to length direction, width direction and thickness direction.Here, width direction can be with the stacking direction of stacking dielectric layer It is identical.

Multilayer ceramic capacitor

Fig. 1 is schematically show the state being reversed according to the multilayer ceramic capacitor of the embodiment in the disclosure saturating View;Fig. 2 is the perspective view for showing the state that the ceramic main body of the multilayer ceramic capacitor of Fig. 1 is reversed;Fig. 3 is therefrom to omit The decomposition perspective view of the multilayer ceramic capacitor of Fig. 1 of external electrode;Fig. 4 is the section view for showing the multilayer ceramic capacitor of Fig. 1 Figure.

It may include: ceramic main body according to the multilayer ceramic capacitor 100 of present example embodiment referring to figs. 1 to Fig. 4 110, it is stacked with multiple dielectric layers 111 in the direction of the width;There are electrode 120 and the second inner electrode in active layer, including multiple first 130;And the first external electrode 141 is to third external electrode 143.

Be considered according to the multilayer ceramic capacitor 100 of present example embodiment has 3 outer ends in total So-called 3 termination capacitor of son.

Ceramic main body 110 can have each other relative first surface S1 in a thickness direction and second surface S2, by One surface S1 and second surface S2 is connected to each other and the 5th surface S5 and the 6th surface S6 relative to each other in the direction of the width And third surface S3 and the 4th surface S4 relative to each other in the longitudinal direction.

Hereinafter, in the present exemplary embodiment, the mounting surface of multilayer ceramic capacitor 100 can be ceramic master The first surface S1 of body 110.

Ceramic main body 110 as described above can be by stacking multiple dielectric layers 111 then sintering heap in the direction of the width Folded dielectric layer 111 is formed, and the shape of ceramic main body 110 is not specifically limited, but can be as shown in the drawing Hexahedral shape out.

However, the quantity of the dielectric layer 111 of the shape and size and stacking of ceramic main body 110 is not limited to show in the accompanying drawings The situation of the present exemplary embodiment out.

In addition, the multiple dielectric layers 111 for constituting ceramic main body 110 can be in sintering state.Dielectric layer 111 adjacent to each other Can be it is integrated, to be difficult to distinguish boundary between them in the case where not using scanning electron microscope (SEM).

The ceramic main body 110 may include having active layer and coating 112 and 113, and having active layer includes as to formation capacitor Multiple interior electrodes of the contributive part of the capacitor of device, coating 112 and 113 are formed in two in the direction of the width of active layer Marginal portion is used as on a side surface.

There is active layer can be by being alternately stacked electrode 120 and the second inner electrode 130 in multiple first in the direction of the width And keeps dielectric layer 111 mediate and formed.

In this case, the thickness of dielectric layer 111 can arbitrarily change according to the capacitor design of multilayer ceramic capacitor 100 Become.For example, after the sintering, the thickness of single layer dielectric layer can be preferably 0.01 μm to 1.00 μm.However, the disclosure is unlimited In this.

In addition, dielectric layer 111 may include the ceramic powders with high dielectric constant, for example, barium titanate (BaTiO3) base Powder or strontium titanates (SrTiO3) based powders etc., but the present disclosure is not limited thereto, is as long as can obtain enough capacitors by it It can.

In addition, if necessary, it can also be by ceramic additive, organic solvent, plasticizer, adhesive, dispersing agent etc. and pottery Porcelain powder is added to dielectric layer 111 together.

In this case, the average grain diameter for being used to form the ceramic powder particle of dielectric layer 111 is not specifically limited, And it can be controlled according to the embodiment in the disclosure.For example, average grain diameter can be controlled as 400nm or smaller, still The present disclosure is not limited thereto.

Other than not including wherein interior electrode, the material and structure of coating 112 and 113 can be with dielectric layers 111 Material is identical with structure.

In addition, coating 112 and 113 can pass through the heap on the two in the direction of the width side surface for have active layer respectively Single layer dielectric layer or two or more layers dielectric layer are folded to be formed, and can be generally used for preventing 120 He of electrode in first The second inner electrode 130 is by physically or chemically stress damage.

Ceramic master can be formed in as electrode 120 in first of the electrode with opposed polarity and the second inner electrode 130 In body 110 and it is set as facing with each other and keeps dielectric layer mediate.

In this case, electrode 120 and the second inner electrode 130 can pass through intervenient dielectric layer 111 in first It is electrically insulated from each other.

Electrode 120 and the second inner electrode 130 may include capacitance part and leading part in as described above first, and capacitance part is logical Crossing interior electrode superposition is to be formed adjacent to each other, and to contribute to formation capacitor, leading part is by prolonging capacitance part partly It stretches to make the outside exposure of ceramic main body 110 and is formed.

Leading part is not specifically limited, but for example, the length of leading part can be than the interior electrode of composition capacitance part Length is short.

In addition, the thickness of electrode 120 and the second inner electrode 130 can be determined according to their purposes in first.For example, In view of the size of ceramic main body 110, the thickness of electrode and the second inner electrode be can be determined that at 0.2 μm to 1.0 μ in first The range of m, but the present disclosure is not limited thereto.

It is not specifically limited in addition, forming the material of electrode 120 and the second inner electrode 130 in first.For example, in first Precious metal material, nickel by palladium (Pd), palladium-silver (Pd-Ag) alloy etc. can be used in electrode 120 and the second inner electrode 130 (Ni) or conductive paste made of the one or more of copper (Cu) is formed.

In addition, the printing process as conductive paste, silk screen print method, gravure printing method etc. can be used, but the disclosure It is without being limited thereto.

Electrode 120 can have in the present example embodiment of the disclosure, in first divides each other in the longitudinal direction Separate and be exposed to first lead portion 121 and the second leading part 122 of the first surface S1 of ceramic main body 110, and can be with Preset distance is separated with third surface S3 and the 4th surface S4.

In addition, the second inner electrode 130 can have the first surface S1 and and first lead for being exposed to ceramic main body 110 Each of portion 121 and the second leading part 122 separate the third leading part 131 of preset distance.In addition, the second inner electrode 130 Preset distance can be separated with third surface S3 and the 4th surface S4.

In this case, the first lead portion of the first surface S1 of ceramic main body 110 is connected to third leading part 121, at least side in 122 or 131 can be at least partially formed as diagonal extension.

In addition, if it is desired, diagonal extension can replace linearity configuration to be formed with curved surface.

In the present exemplary embodiment, the capacitance part of electrode 120 in first is connected to the first of ceramic main body 110 The first lead portion 121 of surface S1 and the inside of the second leading part 122 may include that extend to the electrode 120 out of first inclined The vertical extension that diagonal extension and first surface S1 from diagonal extension towards ceramic main body 110 vertically extend Point.

In this case, if it is desired, first lead portion 121 and the second leading part 122 could be configured such that by The capacitance part of electrode 120 is connected to first lead portion 121 and the second leading part of the first surface S1 of ceramic main body 110 in first 122 outside includes extending to out of first the inclined diagonal extension of electrode 120 and from diagonal extension towards ceramics The vertical extension that the first surface S1 of main body 110 vertically extends is similar to first lead portion 121 and the second leading part 122 inside.

In addition, the capacitance part of the second inner electrode 130 to be connected to the third lead of the first surface S1 of ceramic main body 110 The side in portion 131 may include extending to from the inclined diagonal extension of the second inner electrode 130 and from diagonal extension court The vertical extension that vertically extends first surface S1 of ceramic main body 110.

In this case, if it is desired, third leading part 131 could be configured such that the second inner electrode 130 The two sides that capacitance part is connected to the third leading part 131 of the first surface S1 of ceramic main body 110 may include extending to from second The inclined diagonal extension of interior electrode 130 and first surface S1 from diagonal extension towards ceramic main body 110 are vertically The vertical extension extended is similar to side as described above.

In this case, when being formed in the perpendicular of first lead portion 121 or the second leading part 122 and third leading part 131 The area of the first spatial portion between straight extension is defined as Sa, is formed in first lead portion 121 or the second leading part 122 The area in the second space portion between the diagonal extension of third leading part 131 is defined as Sb, and Sa+Sb is defined When for St, Sa/Sb's may range from 0.383 to 12 (0.383≤Sa/Sb≤12), and Sa/St's may range from 0.277 arriving 0.923 (0.277≤Sa/St≤0.923)。

In common multilayer ceramic electronic component, external electrode be can be set on the length direction along ceramic main body each other On two opposite end surfaces.

However, in this case, when alternating current (AC) voltage is applied to external electrode, since current path is long, because This current loop will form to be bigger, and the intensity of induced magnetic field will increase, so that inductance will increase.

In order to solve this problem, according to the embodiment in the disclosure, the first external electrode 141 to third external electrode 143 can To be arranged on the first surface S1 of ceramic main body 110, to reduce current path.

In this case, due between the first external electrode 141 and the second external electrode 142 and third external electrode 143 Every relatively small, therefore it can reduce current loop, so as to reduce inductance.

The first external electrode 141 and the second external electrode 142 can be set on the first surface S1 of ceramic main body 110 with It is separated from one another on length direction, and it is connected respectively to first lead portion 121 and the second leading part 122, third external electrode 143 Can be set on the first surface S1 between the first external electrode 141 and the second external electrode 142 of ceramic main body 110 with Preset distance is separated with each of the first external electrode 141 and the second external electrode 142, and is connected to third leading part 131。

In addition, the first external electrode 141 to third external electrode 143 can be electrically connected respectively to electrode 120 and second in first The corresponding leading part of interior electrode 130, to form capacitor.In addition, if needing, the first external electrode 141 to third external electrode 143 The part of the 5th surface S5 and the 6th surface S6 of ceramic main body 110 is extended to, to form band.In this case, One leading part 121, the second leading part 122 and third leading part 131 can be separately positioned on outside the first external electrode 141, second The inside of portion's electrode 142 and third external electrode 143.For this purpose, the first external electrode 141, the second external electrode 142 and third The width of external electrode 143 can be respectively formed as than first lead portion 121, the second leading part 122 and third leading part 131 Length it is big.According to above structure, since first lead portion 121, the second leading part 122 and third leading part 131 are not made pottery The first surface S1 exposure of porcelain main body, so the first surface S1 of ceramic main body 110 can be formed as being no more than insulating layer.Together When, the first external electrode 141 as described above to third external electrode 143 can have three-decker, and may include: first to lead Electric layer 141a to third conductive layer 143a, contact respectively in electrode corresponding leading part, thus the first external electrode 141 to the Three external electrodes 143 are connected to the corresponding leading part of interior electrode;First nickel (Ni) coating 141b to third nickel coating 143b, Be formed as being covered each by the first conductive layer 141a to third conductive layer 143a;And first tin (Sn) coating 141c to third tin Coating 143c is formed as being covered each by the first nickel coating 141b to third nickel coating 143b.

First conductive layer 141a to third conductive layer 143a can by with first in electrode 120 and the second inner electrode 130 The identical conductive material of conductive material is formed, and but not limited to this.For example, the first conductive layer 141a to third conductive layer 143a can It is formed with the powder by the metal of copper (Cu), silver-colored (Ag), nickel (Ni) etc., and then application is sintered by application conductive paste Conductive paste formed, wherein conductive paste prepared by the way that glass frit is added to the metal powder.

Experimental example

It is manufactured as follows according to the invention example of the disclosure and the multilayer ceramic capacitor of comparative example.

It will include such as barium titanate (BaTiO3) slurry of powder of powder etc. is administered in carrier film, and is done to it It is dry, to prepare multiple ceramic green sheets with a thickness of 1.8 μm.

Next, the conductive paste for being used for nickel inner electrode can be administered on ceramic green sheet to form first by using silk screen Interior electrode and the second inner electrode, there is electrode the first lead portion and second for the first surface for being exposed to ceramic green sheet to draw in first Line portion, the second inner electrode, which has, to be separated with first lead portion and the second lead portion and is exposed to the first surface of ceramic green sheet Third leading part.

In this case, electrode and the second inner electrode can be formed such that first lead portion to third lead in first Portion includes electrode and the inclined diagonal extension of the second inner electrode and from diagonal extension towards ceramic main body out of first The vertical extension that vertically extends of mounting surface.

Then, about 200 ceramic green sheets are stacked, but are stacked thereon on two side surfaces also in the width direction The ceramic green sheet for not forming electrode and the second inner electrode in first, thus manufactures multi-layer body.Then, at 85 DEG C and 1000kgf/cm2Pressure under to the multi-layer body execute isostatic pressing.

Next, the ceramic multilayer body of isostatic pressing is subjected to according to the form cutting of single piece, by air gas 60 hours are maintained under atmosphere at 230 DEG C to make the piece of cutting be subjected to ungrease treatment.

It then, is 10 in partial pressure of oxygen-11Atm to 10-10Atm (be lower than Ni-NiO equilibrium oxygen partial pres-sure) so that interior electrode not by Under the reducing atmosphere of oxidation, described is sintered with about 1200 DEG C to prepare ceramic multilayer body.

After the sintering, the chip size of multilayer chip capacitor be about 1.0mm × 0.5mm (long × wide (L × W), 1005 sizes).Here, manufacturing tolerance is set in the range of ± 0.1mm (long × wide (L × W)).

Hereafter, by execute on the first surface of ceramic main body formed the first external electrode to third external electrode with respectively with The corresponding technique of the leading part of electrode and the second inner electrode completes multilayer ceramic capacitor in first, and executes for measuring Whether the test of leafing defect and test for measure equivalent series inductance (ESL) are occurred.It as a result is to show in table 1.It is right 200 test samples execute each test.

[table 1]

Here, first be formed between first lead portion or the second leading part and the vertical extension of third leading part The area of spatial portion is defined as Sa, is formed in the diagonal extension in first lead portion or the second leading part and third leading part Between the area in second space portion be defined as Sb, when first lead portion or the second leading part and third leading part have rectangle Shape be defined as So, and Sa+Sb quilt without the area of corresponding spatial portion provided by ramp extension timesharing It is defined as St.

Referring to table 1, it was determined that in sample 1 into sample 17, be formed between the vertical extension of leading part The first spatial portion area Sa and the area St of entire spatial portion ratio (Sa/St) be 0.923 or smaller, the low (45pH of ESL Or lower), and in sample 18 and sample 19, Sa/St is greater than 0.923, ESL and is greater than 45pH.

Therefore, Sa/St can be such as 0.923 or smaller.

In addition, being formed in the face of the first spatial portion between the vertical extension of leading part in sample 1 into sample 3 The ratio (Sa/Sb) of the area Sb in the second space portion between product Sa and the diagonal extension for being formed in leading part is less than 0.383, there is leafing defect.

Therefore, Sa/Sb can be 0.383 or bigger.

Modified example

Fig. 5 is the perspective view for schematically showing the multilayer ceramic capacitor according to another embodiment in the disclosure;Fig. 6 It is the decomposition perspective view that the multilayer ceramic capacitor of Fig. 5 of external electrode is therefrom omitted;Fig. 7 is the multi-layer ceramics electricity for showing Fig. 5 The cross-sectional view of container.

Here, due to the structure phase of the structure of ceramic main body 110 and the ceramic main body 110 in foregoing example embodiment Together, therefore in order to avoid repeated description, detailed description will be omitted, will be described in insulating layer 150 and structure and this Structure in disclosed foregoing example embodiment it is different first in electrode 120 and the second inner electrode 130.

Referring to Fig. 5 to Fig. 7, in the multilayer ceramic capacitor 100' according to present example embodiment, insulating layer 150 can To be arranged on the second surface S2 opposite with the mounting surface of ceramic main body 110.

Electrode 120 can have the 4th leading part 123 and the 5th leading part 124, the 4th leading part 123 and the 5th in first Leading part 124 is exposed to the second surface S2 of ceramic main body 110, is formed on the second surface S2 of ceramic main body 110 with contact Insulating layer 150.

The second inner electrode 130 can have the 6th leading part 132, and the 6th leading part 132 is arranged in 123 He of the 4th leading part Between 5th leading part 124 and it is exposed to the second surface S2 of ceramic main body 110, thus contact insulation layer 150.

Fig. 8 is the perspective view for schematically showing the multilayer ceramic capacitor according to another embodiment in the disclosure;Fig. 9 It is the perspective view for showing the ceramic main body of multilayer ceramic capacitor of Fig. 8;Figure 10 is the multilayer that Fig. 8 of external electrode is therefrom omitted The decomposition perspective view of ceramic capacitor;Figure 11 is the cross-sectional view for showing the multilayer ceramic capacitor of Fig. 8.

Here, due to the structure phase of the structure of ceramic main body 110 and the ceramic main body 110 in foregoing example embodiment Together, therefore in order to avoid repeated description, detailed description will be omitted, will be described in structure and foregoing example embodiment In different 144 to the 6th external electrode 146 and first of the 4th external electrode of structure in electrode 120 and the second inner electrode 130.

Referring to Fig. 8 to Figure 11, in the multilayer ceramic capacitor 100 according to present example embodiment " in, the 4th external electrode 144 to the 6th external electrodes 146 can be set on the second surface S2 of ceramic main body 110, with respectively with the first external electrode 141 to Third external electrode 143 is opposite.

In this case, if it is desired, 144 to the 6th external electrode 146 of the 4th external electrode can extend to ceramic main body The part of 110 the 5th surface S5 and the 6th surface S6.

4th external electrode, 144 to the 6th external electrode 146 as described above can have three-decker, and may include: 4th conductive layer 144a to the 6th conductive layer 146a contacts the corresponding leading part of interior electrode, thus the 4th external electrode 144 respectively The corresponding leading part of interior electrode is connected to the 6th external electrode 146;4th nickel (Ni) coating 144b to the 6th nickel coating 146b is formed as being covered each by the 4th conductive layer 144a to the 6th conductive layer 146a;And the 4th tin (Sn) coating 144c to Six tin coating 146c are formed as being covered each by the 4th nickel coating 144b to the 6th nickel coating 146b.

Electrode 120 can have the 4th leading part 123 and the 5th leading part 124, the 4th leading part 123 and the 5th in first Leading part 124 is exposed to the second surface S2 of ceramic main body 110, is thus connected respectively to and is formed in the of ceramic main body 110 The 4th external electrode 144 and the 5th external electrode 145 on two surface S2.

The second inner electrode 130 can have the 6th leading part 132, and the 6th leading part 132 is arranged in 123 He of the 4th leading part Between 5th leading part 124 and it is exposed to the second surface S2 of ceramic main body 110, is hereby connected to the 6th external electrode 146.

" there is the case where vertically symmetrical internal structure and external structure as described above, in multilayer ceramic capacitor 100 Under, the directionality of capacitor can be eliminated.

For example, multilayer ceramic capacitor 100 " there is vertically symmetrical structure, allow to prevent that and appear in the prior art In the case where (wherein, by multilayer ceramic capacitor 100 " mounting surface is configured to single mounting surface when being installed on the board) Directionality in terms of defect.

Therefore, because multilayer ceramic capacitor 100 " first surface S1 and second surface S2 in any one can use Make mounting surface, therefore there are following advantages: by multilayer ceramic capacitor 100 " when being installed on the board, without the concern for installation The directionality on surface.

In this case, it is connected to the 4th leading part to the 6th leading part of the second surface S2 of ceramic main body 110 123, at least side of at least one of 124 and 132 can be at least partially formed as diagonal extension.

In addition, if it is desired, diagonal extension can replace linearity configuration to be formed with curved surface.

In the present exemplary embodiment, the capacitance part of electrode 120 in first is connected to the second of ceramic main body 110 The 4th leading part 123 of surface S2 and the inside of the 5th leading part 124 may include out of first electrode 120 it is inclined inclination prolong The vertical extension that extending portion point and the second surface S2 from diagonal extension towards ceramic main body 110 vertically extend.

In this case, if it is desired, the 4th leading part 123 and the 5th leading part 124 could be configured such that by The capacitance part of electrode 120 is connected to the 4th leading part 123 and the 5th leading part of the second surface S2 of ceramic main body 110 in first 124 outside includes extending to out of first the inclined diagonal extension of electrode 120 and from diagonal extension towards ceramics The vertical extension that the second surface S2 of main body 110 vertically extends is similar to the 4th leading part 123 and the 5th leading part 124 inside.

In addition, the capacitance part of the second inner electrode 130 to be connected to the 6th lead of the second surface S2 of ceramic main body 110 The side in portion 132 may include extending to from the inclined diagonal extension of the second inner electrode 130 and from diagonal extension court The vertical extension that vertically extends second surface S2 of ceramic main body 110.

In this case, if it is desired, the 6th leading part 132 could be configured such that the second inner electrode 130 The two sides that capacitance part is connected to the 6th leading part 132 of the second surface S2 of ceramic main body 110 may include extending to from second The inclined diagonal extension of interior electrode 130 and second surface S2 from diagonal extension towards ceramic main body 110 are vertically The vertical extension extended is similar to side as described above.

In this case, when being formed in the perpendicular of the 4th leading part 123 or the 5th leading part 124 and the 6th leading part 132 The area of the first spatial portion between straight extension is defined as Sa, is formed in the 4th leading part 123 or the 5th leading part 124 The area in the second space portion between the diagonal extension of the 6th leading part 132 is defined as Sb, and Sa+Sb is defined When for St, Sa/Sb's may range from 0.383 to 12 (0.383≤Sa/Sb≤12), and Sa/St's may range from 0.277 arriving 0.923 (0.277≤Sa/St≤0.923)。

Meanwhile no matter whether leafing defect has occurred and that, according to being shown in table 1 in first lead portion to third lead The ESL value of the value of the first spatial portion and second space portion that prepare between portion can be applied equally in the 4th leading part to The value of the spatial portion prepared between six leading parts.

Figure 12 is the exemplary plane of the leading part in the multilayer ceramic capacitor shown according to the embodiment in the disclosure Figure.

Referring to Fig.1 2, it is connected to the first lead of electrode 1200 and the second inner electrode 1300 in the first of ceramic main body 110 At least side of part of the portion into the 6th leading part 1210 to 1240 and 1310 and 1320 can be only formed as by linear The diagonal extension that shape is formed.

Here, due to 141 to the 6th external electrode of electrode 1200 and the second inner electrode 1300 and the first external electrode in first 146 other formation structures are similar to the formation structure of above-mentioned component in the foregoing example embodiment of the disclosure, therefore are Avoid the repetitive description from omitting detailed description.

Figure 13 is the another exemplary of the leading part in the multilayer ceramic capacitor shown according to the embodiment in the disclosure Plan view.

Referring to Fig.1 3, in first in the case where electrode 1200', by first lead portion 1210' and the second leading part 1220' It is connected to each other and is connected to the side of the first surface S1 of ceramic main body 110 and draw the 4th leading part 1230' and the 5th The side that line portion 1240' was connected to each other and was connected to the second surface S2 of ceramic main body 110 can be respectively formed as individually Curved surface.

In addition, be connected to the second inner electrode 1300' of the mounting surface of ceramic main body 110 third leading part 1310' and The two sides of 6th leading part 1320' can be formed by curved surface.

Here, due to 141 to the 6th dispatch from foreign news agency of electrode 1200' and the second inner electrode 1300' and the first external electrode in first The basic structure of pole 146 is similar to the basic structure of above-mentioned component in the foregoing example embodiment of the disclosure, therefore In order to avoid repetitive description will omit detailed description.

For installing the plate of multilayer ceramic capacitor

Figure 14 is the perspective view for showing the form that the multilayer ceramic capacitor of Fig. 8 is installed on the board, and Figure 15 is cuing open for Figure 14 View.

4 and Figure 15 referring to Fig.1, it is according to the exemplary embodiment of the disclosure for installing the plate of multilayer ceramic capacitor 200 may include being equipped with the substrate 210 of multilayer ceramic capacitor thereon and being formed over the substrate 210 with separated from one another First electrode pad 221 is to third electrode pad 223.

In this case, multilayer ceramic capacitor can distinguish position in the first external electrode 141 to third external electrode 143 In on first electrode pad 221 to third electrode pad 223 to be electrically connected to base by solder 230 in the state of being in contact with each other Plate 210.

In Figure 15, appended drawing reference 224 indicates ground terminal, and appended drawing reference 225 indicates power supply terminal.

Meanwhile although the feelings for being equipped with the multilayer ceramic capacitor of Fig. 8 are described in an exemplary embodiment of the disclosure Condition, but the present disclosure is not limited thereto.For example, multilayer ceramic capacitor shown in Fig. 1 and Fig. 5 can be pacified with similar structure Dress onboard, is thus configured to the plate of installation multilayer ceramic capacitor.

As described above, can reduce ESL, and the spuious degree of ESL can be under according to the embodiment in the disclosure Method is stated to improve: the side of leading part being made to be at least partially formed as diagonal extension to reduce current path.

It, for those skilled in the art will be obvious although having been shown and described above exemplary embodiment , in the case where not departing from the scope of the invention defined by the claims, may be modified and changed.

Claims (6)

1. a kind of multilayer ceramic capacitor, the multilayer ceramic capacitor include:
Ceramic main body, including the multiple dielectric layers stacked in the width direction of ceramic main body;
Have active layer, including be arranged alternately multiple first in electrode and the second inner electrode, each dielectric layer electrode in first Between the second inner electrode;
First lead portion and the second leading part, electrode extends to the mounting surface for being exposed to ceramic main body out of first, and It is set as separated from one another in the direction of the length of the ceramic body;
Third leading part extends to the mounting surface for being exposed to ceramic main body from the second inner electrode, and is arranged and draws first Between line portion and the second leading part;
First external electrode and the second external electrode is arranged in the mounting surface of ceramic main body in the direction of the length of the ceramic body It is separated from one another, and it is connected respectively to first lead portion and the second leading part;And
Third external electrode, be arranged in the mounting surface between first external electrode and the second external electrode of ceramic main body and It is connected to third leading part,
Wherein, the side for connecting first lead portion with the second leading part is formed by single curved surface,
At least side for being connected to the third leading part of the mounting surface of ceramic main body is at least partly formed by curved surface.
2. multilayer ceramic capacitor as described in claim 1, wherein electrode and the second inner electrode are set as in length in first It is separated from one another with two end surfaces of ceramic main body on direction.
3. multilayer ceramic capacitor as described in claim 1, the multilayer ceramic capacitor include:
4th leading part and the 5th leading part, out of first electrode extend to be exposed to it is opposite with the mounting surface of ceramic main body Surface, and be set as separated from one another in the direction of the length of the ceramic body;
6th leading part extends to from the second inner electrode and is exposed to the surface opposite with the mounting surface of ceramic main body, and It is arranged between the 4th leading part and the 5th leading part;And
Insulating layer is arranged on the surface opposite with the mounting surface of ceramic main body.
4. multilayer ceramic capacitor as described in claim 1, wherein electrode has the 4th leading part and the 5th lead in first Portion, the 4th leading part and the 5th leading part are separated from one another in the longitudinal direction and be exposed to mounting surface with ceramic main body Opposite surface,
The second inner electrode has the 6th leading part, and the 6th leading part is exposed to the surface opposite with the mounting surface of ceramic main body simultaneously And be arranged between the 4th leading part and the 5th leading part to be separated respectively with the 4th leading part and the 5th lead portion,
Multilayer ceramic capacitor further include:
4th external electrode and the 5th external electrode are arranged on the surface opposite with the mounting surface of ceramic main body in length direction It is upper separated from one another, and it is connected respectively to the 4th leading part and the 5th leading part;And
6th external electrode, be arranged on the surface opposite with the mounting surface of ceramic main body with respectively with the 4th external electrode and the 5th External electrode separates, and is connected to the 6th leading part.
5. multilayer ceramic capacitor as claimed in claim 4, wherein the 4th leading part and the 5th leading part is made to be connected to each other simultaneously And the side for being connected to the surface opposite with the mounting surface of ceramic main body is formed by single curved surface,
At least side of 6th leading part is at least partly formed by curved surface.
6. a kind of for installing the plate of multilayer ceramic capacitor, the plate includes:
Substrate, first electrode pad to third electrode pad are formed on substrate;And
Multilayer ceramic capacitor as described in any one of claims 1 to 5 sets the first external electrode to third external electrode respectively It sets on first electrode pad to third electrode pad.
CN201710322397.XA 2013-10-31 2014-10-22 Multilayer ceramic capacitor and plate for installing the multilayer ceramic capacitor CN107134364B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR10-2013-0131110 2013-10-31
KR1020130131110A KR20140038916A (en) 2013-10-31 2013-10-31 Multi-layered ceramic capacitor and board for mounting the same
KR10-2014-0084594 2014-07-07
KR1020140084594A KR101514604B1 (en) 2013-10-31 2014-07-07 Multi-layered ceramic capacitor and board for mounting the same
CN201410569333.6A CN104599842B (en) 2013-10-31 2014-10-22 Multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410569333.6A Division CN104599842B (en) 2013-10-31 2014-10-22 Multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor

Publications (2)

Publication Number Publication Date
CN107134364A CN107134364A (en) 2017-09-05
CN107134364B true CN107134364B (en) 2019-07-30

Family

ID=50647016

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201710322397.XA CN107134364B (en) 2013-10-31 2014-10-22 Multilayer ceramic capacitor and plate for installing the multilayer ceramic capacitor
CN201410569333.6A CN104599842B (en) 2013-10-31 2014-10-22 Multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201410569333.6A CN104599842B (en) 2013-10-31 2014-10-22 Multilayer ceramic capacitor and the plate for installing the multilayer ceramic capacitor

Country Status (2)

Country Link
KR (3) KR20140038916A (en)
CN (2) CN107134364B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10109424B2 (en) 2014-04-22 2018-10-23 Industry-Academic Cooperation Foundation Yonsei University Multilayer ceramic capacitor using poling process for reduction of vibration
JP2015019079A (en) 2014-08-13 2015-01-29 株式会社村田製作所 Multilayer ceramic electronic component
JP2014241452A (en) 2014-08-13 2014-12-25 株式会社村田製作所 Laminated ceramic electronic component
JP2015019083A (en) 2014-08-13 2015-01-29 株式会社村田製作所 Multilayer capacitor and mounting structure of multilayer capacitor
JP2014220528A (en) 2014-08-13 2014-11-20 株式会社村田製作所 Multilayer capacitor
JP2014239259A (en) 2014-08-13 2014-12-18 株式会社村田製作所 Multilayer capacitor and mounting structure of multilayer capacitor
JP2014222783A (en) 2014-08-13 2014-11-27 株式会社村田製作所 Multilayer capacitor and mounting structure of multilayer capacitor
JP2015035630A (en) 2014-11-13 2015-02-19 株式会社村田製作所 Three-terminal type capacitor
JP2015065455A (en) 2014-11-13 2015-04-09 株式会社村田製作所 Three-terminal capacitor
JP2015079980A (en) 2014-12-04 2015-04-23 株式会社村田製作所 Three-terminal type capacitor
US9214282B1 (en) 2014-12-08 2015-12-15 Murata Manufacturing Co., Ltd. Three-terminal capacitor

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203736A (en) * 2000-12-28 2002-07-19 Nec Tokin Corp Method of manufacturing laminated ceramic capacitor
JP2006100646A (en) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd Laminated capacitor
JP2009021512A (en) * 2007-07-13 2009-01-29 Taiyo Yuden Co Ltd Multilayer capacitor
KR20130022825A (en) * 2011-08-26 2013-03-07 삼성전기주식회사 Multilayer ceramic capacitor
JP2013106037A (en) * 2011-11-14 2013-05-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and method for manufacturing the same
JP5319007B1 (en) * 2012-05-30 2013-10-16 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer chip electronic component, its mounting substrate and package

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6048230U (en) * 1983-09-11 1985-04-04
JP2002299152A (en) * 2001-03-29 2002-10-11 Kyocera Corp Capacitor
JP3788329B2 (en) * 2001-11-29 2006-06-21 株式会社村田製作所 Capacitor array
US6829134B2 (en) * 2002-07-09 2004-12-07 Murata Manufacturing Co., Ltd. Laminated ceramic electronic component and method for manufacturing the same
JP4864271B2 (en) * 2002-10-17 2012-02-01 株式会社村田製作所 multilayer capacitor
JP2004140211A (en) * 2002-10-18 2004-05-13 Murata Mfg Co Ltd Multilayer capacitor
KR100691145B1 (en) * 2004-12-16 2007-03-09 삼성전기주식회사 Multi-layer Chip Capacitor
KR100616687B1 (en) * 2005-06-17 2006-08-28 삼성전기주식회사 Multilayer chip capacitor
KR100920614B1 (en) * 2007-02-05 2009-10-08 삼성전기주식회사 Multilayer chip capacitor
KR101018254B1 (en) 2009-10-23 2011-03-03 삼성전기주식회사 Multilayer chip capacitor
JP5035318B2 (en) * 2009-10-23 2012-09-26 Tdk株式会社 Multilayer capacitor
KR101525645B1 (en) * 2011-09-02 2015-06-03 삼성전기주식회사 Multilayer ceramic capacitor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002203736A (en) * 2000-12-28 2002-07-19 Nec Tokin Corp Method of manufacturing laminated ceramic capacitor
JP2006100646A (en) * 2004-09-30 2006-04-13 Taiyo Yuden Co Ltd Laminated capacitor
JP2009021512A (en) * 2007-07-13 2009-01-29 Taiyo Yuden Co Ltd Multilayer capacitor
KR20130022825A (en) * 2011-08-26 2013-03-07 삼성전기주식회사 Multilayer ceramic capacitor
JP2013106037A (en) * 2011-11-14 2013-05-30 Samsung Electro-Mechanics Co Ltd Multilayer ceramic electronic component and method for manufacturing the same
JP5319007B1 (en) * 2012-05-30 2013-10-16 サムソン エレクトロ−メカニックス カンパニーリミテッド. Multilayer chip electronic component, its mounting substrate and package

Also Published As

Publication number Publication date
KR102018306B1 (en) 2019-09-05
KR20150050519A (en) 2015-05-08
CN104599842A (en) 2015-05-06
KR101514604B1 (en) 2015-04-23
CN107134364A (en) 2017-09-05
CN104599842B (en) 2017-10-31
KR20140038916A (en) 2014-03-31

Similar Documents

Publication Publication Date Title
US9648748B2 (en) Multilayer ceramic capacitor and board for mounting of the same
CN103456496B (en) Laminated chip electronic component, board for mounting the same, and packing unit thereof
JP2018088537A (en) Multilayer ceramic electronic component
JP6371365B2 (en) Multilayer ceramic capacitor
JP6103780B2 (en) Multilayer ceramic capacitor and its mounting board
US9368251B2 (en) Multilayer ceramic capacitor with conductive fullerene-filling resin layer, method for same, and mounting board with same
CN103787001B (en) Encapsulation unit
CN1832069B (en) Multi-terminal type laminated capacitor and manufacturing method thereof
KR101598289B1 (en) Multi-layered ceramic capacitor and board for mounting the same
CN1308979C (en) Laminated capacitor and manufacturing method thereof
EP2806439B1 (en) Multilayered ceramic capacitor and board for mounting the same
JP2015037187A (en) Multilayer ceramic electronic component, and mounting board and method for manufacturing the same
US10347421B2 (en) Multilayer ceramic electronic component and method of manufacturing the same
CN104103424B (en) Multilayer ceramic capacitor and its manufacture method
CN107123548B (en) Multilayer ceramic capacitor
KR101761937B1 (en) an electronic component and a manufacturing method thereof
KR101474138B1 (en) Multi-layered ceramic electronic component and method of manufacturing the same
CN104616890B (en) Multilayer ceramic electronic component and the plate for being provided with the multilayer ceramic electronic component thereon
CN104576050B (en) Multilayer ceramic electronic component and the printed circuit board (PCB) with multilayer ceramic electronic component
JP5676536B2 (en) Multilayer ceramic electronic component and manufacturing method thereof
JP2016189423A (en) Multilayer ceramic capacitor
JP6223684B2 (en) Multilayer ceramic electronic components
KR101823174B1 (en) Multi-layered ceramic capacitor and board for mounting the same
US9837215B2 (en) Multilayer ceramic capacitor and board for mounting of the same
CN104658756B (en) Multilayer ceramic electronic component and the plate for being provided with multilayer ceramic electronic component thereon

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant