CN107134324B - Full-automatic wire rod rubber coating device - Google Patents
Full-automatic wire rod rubber coating device Download PDFInfo
- Publication number
- CN107134324B CN107134324B CN201710481356.5A CN201710481356A CN107134324B CN 107134324 B CN107134324 B CN 107134324B CN 201710481356 A CN201710481356 A CN 201710481356A CN 107134324 B CN107134324 B CN 107134324B
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- CN
- China
- Prior art keywords
- tape
- adhesive tape
- wrapping
- adhesive
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000010073 coating (rubber) Methods 0.000 title claims abstract description 25
- 239000002390 adhesive tape Substances 0.000 claims abstract description 144
- 238000003825 pressing Methods 0.000 claims abstract description 42
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 238000010618 wire wrap Methods 0.000 claims abstract description 16
- 230000005540 biological transmission Effects 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 description 24
- 238000004026 adhesive bonding Methods 0.000 description 4
- 238000010030 laminating Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 241000252254 Catostomidae Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/08—Insulating conductors or cables by winding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/08—Insulating conductors or cables by winding
- H01B13/0858—Details of winding apparatus; Auxiliary devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The utility model provides a full-automatic wire rod rubber coating device includes: the adhesive tape clamping structure comprises a plurality of upper adhesive tape clamping plates and a plurality of adhesive tape pressing strips formed on the upper adhesive tape clamping plates, and the adhesive tape is bonded on the upper adhesive tape clamping plates. All the adhesive tape structures comprise a vacuum chuck and an adhesive tape cutter. And the wire is fixed in the excess wire clamp structure. And a rubber belt wrapping structure which comprises a rubber wrapping part and a rubber wrapping roller connected with the rubber wrapping part. When the full-automatic wire wrapping device works, the adhesive tape is bonded on the adhesive tape pressing strip, the adhesive tape clamping structure drives the adhesive tape to protrude out of the vacuum chuck, the adhesive tape cutter cuts the adhesive tape, the residual wire clamp structure moves the wire on the adhesive surface of the cut adhesive tape, the adhesive tape with the wire bonded on the wire is transferred into the wrapping part by the adhesive tape clamping structure, and the wrapping roller rotates, so that the full-automatic wire wrapping is realized.
Description
Technical Field
The invention relates to the field of wire encapsulation, in particular to a full-automatic wire encapsulation device.
Background
The mode of enhancing insulation is adopted to prevent the wire pins from being damaged due to the reasons of tin burning, wire pulling and the like, and high-temperature sleeves are penetrated outside the wires or the pins are manually pasted with high-temperature insulating adhesive tapes. The existing working mode of casing threading adopts a semi-automatic working mode, after a casing is mechanically cut, a wire passes through the casing, two sleeves at two ends of a copper wire are separated in a manual auxiliary mode, the first wire is wound, and after the winding is finished, the tail wire is manually twisted. However, the sleeve pipe of the method can slide on the copper wire, the position can change, uncertain factors exist, full automation cannot be completely realized, a large amount of manual assistance is needed, the size of the sleeve pipe penetrating mechanism is large, the sleeve pipe penetrating mechanism can be operated by a single person and a single shaft, and the yield of the single person is low. The pure manual adhesive tape wrapping has the problems of poor product consistency, poor appearance, loose adhesive coating and the like.
Disclosure of Invention
In view of this, the present invention provides a full-automatic wire wrapping apparatus capable of solving the above technical problems.
The utility model provides a full-automatic wire rod rubber coating device, this full-automatic wire rod rubber coating device includes: an adhesive tape sandwiched structure comprising a plurality of upper adhesive tape sandwiched plates and a plurality of adhesive tape pressing strips formed on the upper adhesive tape sandwiched plates; the adhesive tape is bonded on the upper adhesive tape clamping plate; all the adhesive tape cutting structures comprise vacuum suckers and adhesive tape cutters; the excess wire clamp structure comprises a plurality of excess wire clamp head structures, and the wire is fixed in the plurality of excess wire clamp head structures; and a wrapping tape structure; the rubber coating belt structure comprises a rubber coating part and a rubber coating roller connected with the rubber coating part; when the full-automatic wire wrapping device works, the adhesive tape is flatly laid on the upper surface of the vacuum chuck and is bonded on the adhesive tape pressing strip, the adhesive tape clamping structure drives the adhesive tape to enable the adhesive tape to protrude out of the vacuum chuck, the adhesive tape cutter cuts the adhesive tape, meanwhile, the residual wire clamp structure moves the wire on the adhesive surface of the cut adhesive tape, the adhesive tape clamping structure transfers the adhesive tape bonded with the wire into the wrapping part of the wrapping tape structure, and the wrapping roller rotates, so that wrapping of the full-automatic wire is achieved.
Further, the full-automatic wire material rubber coating device further comprises a transmission structure, and the rubber coating structure is connected with the transmission structure.
Further, this doubling tape structure still includes a doubling band board upper plate, a doubling band board hypoplastron and a plurality of lower doubling band board, this doubling band board upper plate and this doubling band board hypoplastron all fix on this drive mechanism, a plurality of this go up the doubling band board all fix on this doubling band board upper plate, a plurality of this lower doubling band board all fix on this doubling band board hypoplastron, one should go up the doubling band board and one should be relative down the doubling band board, every should press the sticky tape to fix on every this go up the doubling band board and towards every this lower doubling band board.
Furthermore, the full-automatic wire encapsulation device also comprises a rubber belt fixing structure, wherein the rubber belt fixing structure comprises a bearing substrate and a plurality of rubber belt supporting shafts fixed on the bearing substrate, and the rubber belt is formed on the rubber belt supporting shafts and can rotate relative to the rubber belt supporting shafts; the tape cutting structure is fixed on the bearing substrate.
Furthermore, the adhesive tape cutting structure also comprises an adhesive tape cutting shaft, an adhesive tape cutting shaft sleeve, an adhesive tape pressing upper plate and an adhesive tape pressing thimble; one end of the rubber belt cutting shaft penetrates through the bearing substrate and is connected with the transmission structure, and the other end of the rubber belt cutting shaft is accommodated in the rubber belt cutting shaft sleeve; the rubber belt cutting shaft sleeve is fixed on the bearing substrate, and the rubber belt cutting shaft moves up and down in the rubber belt cutting shaft sleeve under the driving of the transmission structure; the vacuum chuck is fixed on the rubber belt cutting shaft sleeve, and one end of the rubber belt pressing upper plate is accommodated in the rubber belt cutting shaft sleeve and can move in the rubber belt cutting shaft sleeve; the upper plate of the adhesive tape pressing is provided with an accommodating hole which penetrates through the upper plate of the adhesive tape pressing, and the adhesive tape pressing needle is accommodated in the accommodating hole; the adhesive tape cutter is fixed at one end part of the upper plate of the adhesive tape pressing machine.
Furthermore, the adhesive tape cutting structure also comprises an adhesive passing roller shaft and an adhesive passing roller, wherein the adhesive passing roller shaft is fixed on the adhesive tape cutting shaft sleeve, and the adhesive passing roller is formed on the adhesive passing roller shaft and can rotate relative to the adhesive passing roller shaft.
Furthermore, a gap is formed at one end, close to the adhesive tape cutting shaft sleeve, of the vacuum chuck, the lower adhesive tape clamping plate and the upper adhesive tape clamping plate are located in the gap, the upper surface of the vacuum chuck is flush with the upper surface of the lower adhesive tape clamping plate, and the adhesive tape is flatly laid on the upper surface of the vacuum chuck and the upper surface of the lower adhesive tape clamping plate.
Furthermore, a first accommodating groove is formed at one end of the vacuum sucker, which is far away from the adhesive tape cutting shaft sleeve, and the first accommodating groove is opposite to the adhesive tape cutter.
Further, a plurality of microstructures are formed on the adhesive tape strip, and the plurality of microstructures deviate from the upper adhesive tape clamping plate.
Furthermore, a second accommodating groove is formed in the adhesive covering portion and used for accommodating the adhesive tape bonded with the wire.
The full-automatic wire wrapping device provided by the invention has the advantages that the adhesive tape clamping structure, the adhesive tape cutting structure, the excess wire clamp structure, the adhesive tape wrapping structure and the transmission structure are matched with each other, and 1) the full-automatic wire wrapping can be realized; 2) Because a full-automatic wire material rubber coating device comprises a plurality of upper rubber belt clamping plates, a plurality of rubber belt pressing strips, a plurality of vacuum suckers, a plurality of rubber belt cutters and a plurality of remaining wire chuck structures, the rubber coating operation of a plurality of wire materials can be carried out at one time, and the yield is high; 3) Because the encapsulation of the wire rod is uniformly completed in the encapsulation containing groove (second containing groove) of the encapsulation belt structure by the rotation of the encapsulation roller, the consistency of the product is good, the appearance is attractive, and the encapsulation is compact.
Drawings
Fig. 1 is a schematic perspective view of a full-automatic wire material adhesive coating device provided by the invention.
Fig. 2 is a partially exploded schematic view of the fully automatic wire coating device shown in fig. 1.
Fig. 3 is a perspective view of a tape clamping structure of the full-automatic wire coating device shown in fig. 1.
Fig. 4 is an enlarged view of the adhesive tape strip shown in fig. 3.
Fig. 5 is a perspective view illustrating a structure of a tape cutting structure of the full-automatic wire taping device shown in fig. 1.
Fig. 6 is an enlarged view of the vacuum chuck shown in fig. 4.
Fig. 7 is an enlarged view of a taping structure of the full-automatic wire taping device shown in fig. 1.
Description of the main elements
Full-automatic wire encapsulation device 100
Adhesive tape fixing structure 10
Adhesive tape supporting shaft 12
Adhesive tape clamping mechanism 20
Laminated tape board upper board 22
First mounting part 221
Laminated tape board lower board 23
Second mounting part 231
Upper adhesive tape clamping plate 24
First fixing part 241
Connecting part 242
Lower laminated adhesive tape plate 25
Supporting part 252
Adhesive tape cutting sleeve 32
Shaft housing 321
Convex portion 322
First receiving groove 332
Accommodated part 342
Receiving hole 341
Adhesive tape pressing thimble 35
Excess line clamp structure 40
Excess wire clamp structure 41
Tape covered structure 50
Rubber-covered part 51
The second housing groove 511
Encapsulated roller 52
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Unless the context clearly dictates otherwise, the elements and components of the present invention may be present in either single or in multiple forms and are not limited thereto. Although the steps in the present invention are shown and described using reference numbers, the order of the steps is not limited to any order, and the order of steps may be modified unless otherwise indicated or unless the order of steps or performance of certain steps requires otherwise.
Referring to fig. 1 to 7, the present invention provides a full-automatic wire wrapping apparatus 100, wherein the full-automatic wire wrapping apparatus 100 is used for wrapping a wire 300 on a tape 200.
The full-automatic wire wrapping device 100 comprises a tape fixing structure 10, a tape clamping structure 20, a tape cutting structure 30, a surplus tape clamping structure 40, a wrapping tape structure 50 and a transmission structure 60.
The tape fixing structure 10 includes a supporting substrate 11 and a plurality of tape supporting shafts 12 fixed on the supporting substrate 11, wherein the tape 200 is formed on the tape supporting shafts 12 and can rotate relative to the tape supporting shafts 12.
The tape clamping mechanism 20 includes a tape clamping plate upper plate 22, a tape clamping plate lower plate 23, a plurality of upper tape clamping plates 24, a plurality of lower tape clamping plates 25, and a plurality of tape pressing strips 26.
Wherein, the upper plate 22 of the doubling tape plate is fixed on the transmission mechanism 60. Specifically, the upper plate 22 is in the form of a long plate, and a plurality of first mounting portions 221 are formed on the upper plate 22.
Wherein, the lower plate 23 of the laminated tape board is fixed on the transmission mechanism 60. Specifically, the lower plate 23 of the tape carrier is in the shape of a long strip, a plurality of second mounting portions 231 are formed on the lower plate 23 of the tape carrier, and the second mounting portions 231 are respectively opposite to the first mounting portions 221.
Wherein one end of one of the upper adhesive tape clamping plates 24 is fixed on one of the first mounting parts 221. Specifically, each of the upper adhesive tape clamping plates 24 is shaped like a "Z", and each of the upper adhesive tape clamping plates 24 includes a first fixing portion 241, a connecting portion 242, and a second fixing portion 243. One end of the first fixing portion 241 is fixed on the first mounting portion 221, the connecting portion 242 vertically connects the other end of the first fixing portion 241 and the second fixing portion 243, and the second fixing portion 243 is parallel to the first fixing portion 241.
One end of one of the lower adhesive tape clamping plates 25 is fixed to one of the second mounting parts 231. Specifically, each of the lower tape clamping plates 25 includes a third fixing portion 251 and a supporting portion 252 vertically connected to the third fixing portion 251. One end of each of the third fixing portions 251 remote from the supporting portion 252 is fixed to each of the second mounting portions 231. Each of the supporting portions 252 is parallel to and faces the second fixing portion 243.
Wherein each of the adhesive tape strips 26 is fixed to the second fixing portion 243 of each of the upper adhesive tape sandwiching plates 24. The adhesive tape strip 26 has a plurality of microstructures 261 formed thereon. Wherein, the plurality of microstructures 261 faces away from the second fixing portion 243.
In the embodiment, the microstructure 261 is a saw-tooth structure for reducing the contact area between the adhesive tape strip 26 and the tape 200, so that the adhesion force between the tape 200 and the adhesive tape strip 26 is smaller than the adhesion force between the tape 200 and the wires 300, so that the tape 200 is separated from the adhesive tape strip 26 to prepare for the subsequent encapsulation.
In other embodiments, the microstructure 261 can also adopt other structures as long as the adhesive force between the tape 200 and the tape presser bar 26 is ensured to be smaller than the adhesive force between the tape 200 and the wire 300.
The dicing tape structure 30 is fixed on the carrier substrate 11.
Specifically, the tape cutting structure 30 includes a tape cutting shaft 31, a tape cutting sleeve 32, a vacuum suction cup 33, a tape pressing upper plate 34, a tape pressing thimble 35, a tape cutter 36, a gluing roller shaft 37 and a gluing roller 38.
One end of the tape cutting shaft 31 passes through the carrier substrate 11 and is connected to the transmission structure 60, and the other end is accommodated in the tape cutting sleeve 32.
In the present embodiment, the tape cutting shaft 31 is a rectangular shaft.
The tape cutting hub 32 is fixed to the carrier substrate 11. Specifically, the slit tape sleeve 32 includes a shaft receiving portion 321 and two protrusions 322 formed at both ends of the shaft receiving portion 321. The tape cutting shaft 31 moves up and down in the shaft receiving portion 321 by the driving of the driving mechanism 60.
The vacuum chuck 33 is fixed to the end of the tape cutting hub 32 remote from the carrier substrate 11. A notch 331 is formed at an end of the vacuum chuck 33 close to the tape cutting sleeve 32, and a first receiving groove 332 is formed at an end of the vacuum chuck 33 far from the tape cutting sleeve 32. The first receiving groove 332 faces the tape cutter 36 to form a fulcrum when the tape cutter 36 cuts the tape 200, so that the tape 200 is not seriously deformed or cut continuously due to the stress applied to the tape 200 when the tape cutter 36 cuts the tape 200.
Wherein, the lower adhesive tape clamping plate 25 and the upper adhesive tape clamping plate 24 are located in the gap 331. The upper surface of the vacuum chuck 33 is flush with the upper surface of the lower adhesive tape clamping plate 25.
The tape pressing upper plate 34 includes a received portion 342, and the received portion 342 is received in the shaft receiving portion 321 and is movable in the shaft receiving portion 32.
A receiving hole 341 penetrating through the upper tape pressing plate 34 is formed on the upper tape pressing plate 34 at a position close to the first receiving groove 332, and the tape pressing pin 35 is received in the receiving hole 341. The tape pressing needle 35 presses the tape 200 when the tape cutter 36 cuts the tape 200, preventing the tape 200 from slipping when cutting the tape. After the tape 200 is cut, the tape pressing thimble 35 is released, and the tape 200 is stuck on the tape pressing thimble 35 and cannot be separated because the sticking surface of the tape 200 is upward, so as to solve the problem that the tape 200 is taken away by the tape pressing thimble 35, the tape 200 is sucked under the vacuum suction cup 33 by vacuum, and when the suction force of the vacuum suction cup 33 is greater than the bonding force between the tape 200 and the tape pressing thimble 35, the tape pressing thimble 35 is normally separated from the tape 200.
The tape cutter 36 is fixed to an end of the upper platen 34. The tape cutter 36 can move in the first receiving groove 332 when cutting the tape 200.
The gluing roller shaft 37 is fixed on a convex portion 322 of the tape cutting sleeve 32 far from the carrier substrate 11.
The laminating roller 38 is formed on the laminating roller shaft 37 and can rotate relative to the laminating roller shaft 37.
The surplus thread clamp structure 40 includes a surplus thread clamp structure 41, and the wire 300 is fixed in the surplus thread clamp structure 41.
The encapsulation belt structure 50 includes an encapsulation portion 51 and an encapsulation roller 52 connected to the encapsulation portion 51.
In the present embodiment, the wrapping roller 52 is disposed inside the wrapping portion 51. The encapsulation portion 51 is formed with a second receiving groove 511, and the second receiving groove 511 is used for receiving the adhesive tape bonded with the wire 300. The rubber coating roller 51 can drive the rubber coating part 51 to rotate, so that rubber coating is realized.
In this embodiment, the second receiving groove 511 is V-shaped.
The transmission structure 60 is used for driving the tape clamping mechanism 20 to move, so as to tear the tape 200 to a certain length or transfer the cut tape with the wire 300 bonded thereto into the second receiving slot 511 of the encapsulation structure 50.
The transmission structure 60 can adopt single-cylinder power transmission, double-cylinder combined transmission, motor transmission and screw rod transmission, and is matched with a slide rail to realize multipoint accurate stop.
When the full-automatic wire wrapping device 100 works, one end of the adhesive tape 200 fixed on the adhesive tape supporting shaft 12 passes through the adhesive passing roller 38, and is flatly laid on the upper surface of the vacuum chuck 33 and the upper surface of the lower adhesive tape clamping plate 25, and the adhesive surface of the adhesive tape 200 is bonded on the adhesive tape pressing strip 26, the adhesive tape clamping mechanism 20 is moved through the transmission structure 60, so that the adhesive tape protrudes out of the vacuum chuck 33 by a certain length (the length is the length of the adhesive tape to be cut), the adhesive tape pressing upper plate 34 is covered, the adhesive tape pressing thimble 35 is pressed on the adhesive tape 200, and the adhesive tape cutter 36 cuts the adhesive tape 200. Then, the vacuum chuck 23 performs vacuum suction to the tape 200, so that the tape pressing thimble 35 is separated from the tape 200. Meanwhile, the wire 300 is moved and placed on the sticky surface of the cut adhesive tape 200 through the remaining wire clamp structure 40 to be bonded on the adhesive tape 200, the transmission structure 50 drives the tape clamping mechanism 20, the tape clamping mechanism 20 transfers the cut adhesive tape 200 bonded with the wire 300 into the second accommodating groove 511 of the tape wrapping structure 50, and the tape wrapping roller rotates, so that full-automatic wire wrapping is realized.
The full-automatic wire encapsulation device 100 provided by the invention has the advantages that the adhesive tape clamping structure 20, the adhesive tape cutting structure 30, the surplus wire clamp structure 40, the encapsulation tape structure 50 and the transmission structure 60 are matched with each other, and 1) full-automatic wire encapsulation can be realized; 2) Because the number of the tape clamping structures 20, the tape cutting structures 30 and the surplus wire clamp structures 40 matched with the tape clamping structures is multiple, the tape-coating operation of multiple wires can be carried out at one time, and the yield is high; 3) Because the encapsulation of the wire is finished by the rotation of the encapsulation roller in the encapsulation containing groove (the second containing groove) of the encapsulation belt structure 50, the consistency of the product is good, the appearance is beautiful, and the encapsulation is compact.
Claims (10)
1. The utility model provides a full-automatic wire rod rubber coating device which characterized in that, this full-automatic wire rod rubber coating device includes: an adhesive tape sandwiched structure, an adhesive tape all-in-one structure, a remaining line clip structure and a covering adhesive tape structure; the adhesive tape clamping structure comprises a plurality of upper adhesive tape clamping plates and a plurality of adhesive tape pressing strips, wherein the adhesive tape pressing strips are formed on the upper adhesive tape clamping plates, and adhesive tapes are bonded on the upper adhesive tape clamping plates; the adhesive tape cutting structure comprises a plurality of adhesive tape cutters; the excess wire clamp structure comprises a plurality of excess wire clamp head structures, and wires are fixed in the excess wire clamp head structures; the rubber coating belt structure comprises a rubber coating part and a rubber coating roller connected with the rubber coating part; when the full-automatic wire wrapping device works, the adhesive tape is bonded on the adhesive tape pressing strip, the adhesive tape clamping structure drives the adhesive tape to protrude out of the adhesive tape cutting structure, the adhesive tape cutter cuts the adhesive tape, meanwhile, the residual wire clamp structure moves the wire on the adhesive surface of the cut adhesive tape, the adhesive tape with the wire bonded on the adhesive tape is transferred into the wrapping part of the wrapping tape clamping structure by the adhesive tape clamping structure, the wrapping roller rotates, full-automatic wire wrapping is achieved, and the bonding force between the adhesive tape and the adhesive tape pressing strip is smaller than the bonding force between the adhesive tape and the wire.
2. The automatic wire coating device according to claim 1, further comprising a transmission structure, wherein the adhesive tape clamping structure is connected to the transmission structure.
3. The automatic wire-wrapping device of claim 2, wherein the tape-wrapping structure further comprises an upper tape-wrapping plate, a lower tape-wrapping plate and a plurality of lower tape-wrapping plates, the upper tape-wrapping plate and the lower tape-wrapping plate are fixed on the transmission structure, the upper tape-wrapping plates are fixed on the upper tape-wrapping plate, the lower tape-wrapping plates are fixed on the lower tape-wrapping plate, one upper tape-wrapping plate is opposite to one lower tape-wrapping plate, and each tape-wrapping strip is fixed on each upper tape-wrapping plate and faces each lower tape-wrapping plate.
4. The fully automatic wire wrapping apparatus according to claim 3, further comprising a tape fixing structure, the tape fixing structure comprising a supporting base plate and a plurality of tape supporting shafts fixed on the supporting base plate, the tape being formed on the tape supporting shafts and being rotatable with respect to the tape supporting shafts, the tape cutting structure being fixed on the supporting base plate.
5. The full-automatic wire rubber coating device of claim 4, wherein the adhesive tape cutting structure further comprises a vacuum chuck, an adhesive tape cutting shaft sleeve, an adhesive tape pressing upper plate and an adhesive tape pressing thimble; one end of the rubber belt cutting shaft penetrates through the bearing substrate and is connected with the transmission structure, and the other end of the rubber belt cutting shaft is accommodated in the rubber belt cutting shaft sleeve; the tape cutting shaft sleeve is fixed on the bearing substrate, and the tape cutting shaft moves up and down in the tape cutting shaft sleeve under the driving of the transmission structure; the vacuum chuck is fixed on the rubber belt cutting shaft sleeve, the rubber belt pressing upper plate comprises an accommodated part, and the accommodated part is accommodated in the rubber belt cutting shaft sleeve and can move in the rubber belt cutting shaft sleeve; the upper plate of the adhesive tape pressing is provided with an accommodating hole which penetrates through the upper plate of the adhesive tape pressing, and the adhesive tape pressing needle is accommodated in the accommodating hole; the adhesive tape cutter is fixed at one end part of the upper plate of the adhesive tape pressing machine.
6. The fully automatic wire material coating device according to claim 5, wherein the adhesive cutting belt structure further comprises an adhesive roller shaft and an adhesive roller, the adhesive roller shaft is fixed on the adhesive cutting belt shaft sleeve, and the adhesive roller is formed on the adhesive roller shaft and can rotate relative to the adhesive roller shaft.
7. The automatic wire material wrapping device according to claim 5, wherein an end of the vacuum chuck near the tape cutting sleeve is formed with a recess, the lower tape clamping plate and the upper tape clamping plate are located in the recess, an upper surface of the vacuum chuck is flush with an upper surface of the lower tape clamping plate, and the tape is laid on the upper surface of the vacuum chuck and the upper surface of the lower tape clamping plate.
8. The fully automatic wire rubber coating device according to claim 5, wherein a first receiving groove is formed at an end of the vacuum chuck away from the tape cutting shaft sleeve, and the first receiving groove faces the tape cutting blade.
9. The full-automatic wire rubber coating device of claim 1, wherein a plurality of microstructures are formed on the rubber press belt strip, and the plurality of microstructures are deviated from the upper rubber belt clamping plate.
10. The fully automatic wire wrapping device according to claim 1, wherein a second receiving groove is formed in the wrapping portion for receiving the adhesive tape to which the wire is bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710481356.5A CN107134324B (en) | 2017-06-22 | 2017-06-22 | Full-automatic wire rod rubber coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710481356.5A CN107134324B (en) | 2017-06-22 | 2017-06-22 | Full-automatic wire rod rubber coating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107134324A CN107134324A (en) | 2017-09-05 |
| CN107134324B true CN107134324B (en) | 2022-11-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710481356.5A Active CN107134324B (en) | 2017-06-22 | 2017-06-22 | Full-automatic wire rod rubber coating device |
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| CN (1) | CN107134324B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109767878B (en) * | 2019-03-22 | 2020-05-22 | 广州华润电子有限公司 | Twisted wire rubber coating equipment |
| CN110444343B (en) * | 2019-08-28 | 2024-05-31 | 诸暨中澳自动化设备有限公司 | Automatic adhesive tape fixed-point binding equipment and binding method thereof |
| CN111863357B (en) * | 2020-07-22 | 2021-11-12 | 江苏苏阳电工机械有限公司 | Coating layer winding equipment for cable |
| CN114203367B (en) * | 2021-12-23 | 2023-05-16 | 无锡易泽智装工业技术有限公司 | Busbar winding mechanism |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06211411A (en) * | 1993-01-19 | 1994-08-02 | Masaru Kogyo Kk | Tape sticking machine |
| CN102610384A (en) * | 2012-04-13 | 2012-07-25 | 深圳市泰顺友电机电有限公司 | Rubber coating mechanism of high-speed automatic coil winding machine |
| CN103050277A (en) * | 2013-01-17 | 2013-04-17 | 深圳博美柯自动化设备有限公司 | Automatic rubber coating mechanism |
| CN104361991A (en) * | 2014-11-17 | 2015-02-18 | 厦门米特自动化设备有限公司 | Coil encapsulating machine |
| CN207217190U (en) * | 2017-06-22 | 2018-04-10 | 深圳市泰顺友电机电有限公司 | Full-automatic wire rod gluing device |
-
2017
- 2017-06-22 CN CN201710481356.5A patent/CN107134324B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06211411A (en) * | 1993-01-19 | 1994-08-02 | Masaru Kogyo Kk | Tape sticking machine |
| CN102610384A (en) * | 2012-04-13 | 2012-07-25 | 深圳市泰顺友电机电有限公司 | Rubber coating mechanism of high-speed automatic coil winding machine |
| CN103050277A (en) * | 2013-01-17 | 2013-04-17 | 深圳博美柯自动化设备有限公司 | Automatic rubber coating mechanism |
| CN104361991A (en) * | 2014-11-17 | 2015-02-18 | 厦门米特自动化设备有限公司 | Coil encapsulating machine |
| CN207217190U (en) * | 2017-06-22 | 2018-04-10 | 深圳市泰顺友电机电有限公司 | Full-automatic wire rod gluing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107134324A (en) | 2017-09-05 |
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