CN107107108B - 超声换能器匹配层及其制造方法 - Google Patents
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Abstract
本发明公开了一种厚度由限定的单分散颗粒单层来限定的声学匹配层。该层包括嵌入单分散颗粒的聚合物基体。单分散颗粒可涂覆有参与限定该层声阻抗的固体材料。聚合物基体可含有参与限定该层声阻抗的更小固体颗粒。本发明还提供制造方法。
Description
技术领域
本发明涉及超声换能器(ultrasound transducers)的声学匹配层(acousticmatching layers)的设计和制造方法,其用于简化和有效制造该层,以及改善该层的热导率。
背景技术
电流超声换能器阵列(current ultrasound transducer arrays)的电声换能(electro-acoustic transduction)是基于以下之一:
聚合物和铁电陶瓷材料(ferroelectric ceramic materials)的复合材料,以及
基底材料(例如Si)的表面上的振动膜,其中机电耦合为电容性的(cmut)或通过压电材料层(pmut)。
为了塑造电声换能的带宽,使用在声频带中心处具有~四分之一波长(λ/4)厚度的和特定的声阻抗(acoustic impedance)的声学层。该特定的声阻抗通过将各种类型的固体颗粒(例如W、Al、陶瓷、玻璃等)混入聚合物树脂中来获得,而该限定的层厚度通常通过研磨该层来获得。为了获得正确的厚度,在获得所需厚度之前,需要中断研磨数次以测量厚度。该方法耗时而昂贵,而本发明提供了一种用于更简单地制造具有限定声阻抗和厚度的匹配层的解决方案。
发明内容
发明人已经意识到期望改进包含具有颗粒的聚合物基体的复合聚合物材料的制造方法以获得预定厚度和声阻抗的复合材料。在此提供了本发明的概述。该概述形式简短但并不代表限制本发明,本发明在其最宽泛的方面由所附的权利要求书所限定。
根据本发明,匹配层的厚度由单分散聚合物颗粒单层来限定。将该颗粒混入至可含有其他更小颗粒以限定声阻抗的聚合物树脂中。在固化之前和固化过程中将该混合物在两个共形表面(conformal surfaces)之间压制以便在所述共形表面之间得到单分散聚合物颗粒单层,从而限定层的最终厚度。在固化后,得到了含有颗粒的聚合物层,其中其厚度由单分散聚合物颗粒单层限定,而形状由所述共形表面的形状限定。所述共形表面通常可在一个或两个维度上是平面的或弯曲的,以适应超声阵列的形状。
根据本发明,所述单分散聚合物颗粒还可由参与限定复合层声阻抗的固体材料的表层所覆盖。还可使用金属表层(例如Ag、Au、Al或Cu)来使匹配层导电和导热,例如使用匹配层进行电接地和屏蔽以及改善换能器阵列的冷却。通过使得金属层涂覆电绝缘层可获得电绝缘但提高的热导性,或使得整个层由具有高热导性的电绝缘材料(例如AlN、BeO)制成。
附图说明
图1说明了限定声学匹配层的厚度的单分散聚合物颗粒单层以及使用参与限定匹配层的声阻抗的更小颗粒。
图2说明了导热的单分散球,其包括覆盖有导热层的聚合物核心。
图3示出了复合材料的声阻抗相对于覆盖单分散聚合物颗粒的表面的Ag的体积填充(volume fill)的变化。
图4示出了一个或多个声学匹配层的制造方法,其中层厚度由单分散颗粒单层限定。
具体实施方式
根据一种实施方式,提供一种超声换能器阵列探针,其设置为层状结构,包括至少一个换能器阵列元件层以及至少一个安装成与换能器元件层声学接触(acousticcontact)的其他层。该其它层为复合材料层,其含有聚合物基质和限定了所述其他层的厚度的单分散颗粒单层。
本发明的一个示例性实施方式示于图1中,其中100表示复合声学匹配层,其由位于聚合物树脂102中的单分散颗粒101单层构成。聚合物树脂还可含有固体材料的更小颗粒103以限定该层的声阻抗。
可制备尺寸分布在限定平均值附近的约2~200μm范围内的聚合物颗粒,并且此类聚合物颗粒是市售可得的,例如可购自Dow Chemical Company。例如可用美国专利4,336,173和美国专利4,459,378中所记载的方法来制备直径在2-200μm范围内的单分散聚合物颗粒,并且此类聚合物颗粒是市售可得的,例如可购自Conpart AS。这些颗粒可由原料的特征体声阻抗(characteristic bulk acoustic impedance)通常在1.5-3.5 106kg/m2s范围内的聚合物制成。聚合物颗粒例如可由苯乙烯制成,例如与二乙烯基苯交联的苯乙烯。用于本发明的其他苯乙烯单体包括甲基苯乙烯和乙烯基甲苯。可使用苯乙烯单体的混合物。另一种选择是由丙烯酸酯、甲基丙烯酸酯、丙烯酸、甲基丙烯酸、丙烯腈、甲基丙烯腈、氯乙烯、乙酸乙烯酯和丙酸乙烯酯所制备的颗粒。还可使用任意这些单体的混合物,并任选地与上述苯乙烯单体一起。所有单体均可与二乙烯基苯或二丙烯酸单体如乙二醇-二丙烯酸酯交联。某些颗粒可能需要用碱处理以使酯基团水解而能够交联。优选使用交联剂并因此形成交联颗粒。
根据本发明的一种实施方式,所述聚合物颗粒涂覆于更硬的材料(stiffermaterials)的表层,以控制可用于限定该层的声阻抗的颗粒的总刚度(stiffness)。该表层可为高电导率(>10MS/m)和热导率(>50W/mK)的材料,例如金属如Ag(63,429)、Cu(58,401)、Au(45,318)、Al(35,237)、Mg(23,156)、Ni(14,91),或电绝缘材料AlN(非常低,285)、BeO(非常低,330),其中括号内的数字为以MS/m和W/mK为单位的材料的电导率和热导率。电半导体Si具有149W/mK的高热导率,同时对于未掺杂的Si具有非常低的电导率。这些层将影响匹配层的总的电导率或热导率。导电匹配层可用于换能器阵列的电接地和屏蔽目的,而热导匹配层可用于改善换能器组件的冷却。因此金属表面层可用于这两者。
通过增加涂层表层的厚度,可将球体的体积刚度(bulk stiffness)增加到聚合物核心的体积刚度之上,这取决于涂层材料的类型和表层的厚度。这可用于增加匹配层的声阻抗。为了降低颗粒的刚度,聚合物核心可制成多孔的,孔隙率为~5-75%,其中孔隙率的增加将降低匹配层的声阻抗。还可制备尺寸低至~200nm的颗粒并涂覆有金属和电绝缘的导热材料。
具有金属表层和电绝缘层的组合的单分散颗粒的实例为图2中所示的200,其中201表示单分散聚合物核心,202表示金属表层,而203表示电绝缘材料的外表层。
更小颗粒103用于调节匹配层的声阻抗。这些颗粒非常小,以至于其可在单分散颗粒101层之间空间存在,而又不介入限定层厚度。颗粒103可为任意形状,并且不必是单分散的,但单分散形式对于限定尺寸来说是引人关注的制造方法,当然对于这些颗粒来说也是引人关注的制造方法。
图3中的301表示匹配层的声阻抗随着由钨(W)制成的平均直径为~2μm的颗粒103的密度的变化。单分散颗粒为由聚合物树脂中的苯乙烯聚合物制成的直径30μm的球。向单分散颗粒101引入Ag表层,使层的声阻抗提高到曲线302。
图4示出弯曲阵列的匹配层400的制造过程的图示。图4a中示出两个具有共形表面403和404的两个固体压缩模具(solid compression dies)401和402。在该具体实施方式中,将还可含有更小颗粒103的在双组分聚合物树脂中的单分散颗粒的混合物405的一部分置于下压缩模具402上。然后将压缩模具401和402由箭头406所示压在一起至图4b中所示的位置,以使混合物405在表面403和404之间挤开,从而使得单分散颗粒101单层在共形表面403和404之间限定最终匹配层400的厚度。在聚合物树脂固化后打开压缩模具401和402,然后提供了具有限定厚度和声阻抗的自含型匹配层400(self contained matching layer400),其可胶合至换能器阵列。使用弯曲的超声阵列作为压缩模具401能够将匹配层直接胶合至阵列上。
如图4c所示,使用带有附加的第一匹配层408的弯曲的超声阵列407作为压缩模具401的部分能够将第二匹配层409直接胶合至弯曲的阵列407上的第一匹配层408上。还可使用相同的方法将新匹配层胶合至现有匹配层上,其中例如结构407和408为一种或多种现有匹配层。很明显,也可将现有匹配层连接到压缩模具402上以便在相反方向上构建匹配层结构,并且换能器阵列407的背衬结构(backing structure)也可包括在压缩模具401中。
图4a-c示出弯曲阵列的匹配层的制造示例,其中本领域技术人员清楚的是,通过调整表面403和404可制造任何形式的匹配层。由于匹配层很薄,还可制造平面层,其可通过折弯图4b中所制造的匹配层400来适应各种弯曲阵列。
还方便的是,根据已知的使树脂固化的方法,通过选择补救措施如加热、振动等来提高树脂的固化速率。
在匹配层的制造过程中,可能难以控制单分散颗粒101之间的横向距离(lateraldistance)。为了在该距离将匹配层的声学功能的敏感度降低至准确而恒定,有利的是制备聚合物树脂102和更小颗粒103的混合物,从而使该混合物的声阻抗与涂覆的单分散颗粒的声阻抗相同。
因此,虽然已经示出并描述和指出了应用于其优选实施方式的本发明的基本的新颖的特征,但应当理解的是,在偏离本发明的精神下,本领域技术人员可做出所示装置的形式和细节以及其操作中的各种省略、替换和变化。
还明确的是,以基本相同的方式执行基本上相同的功能来实现相同的结果的那些元件和/或方法步骤的所有组合均在本发明的范围内。此外,应当认识到,与本发明的任何公开形式或实施方式相结合所示和/或所描述的结构和/或元件和/或方法步骤可以任何其他公开的或描述的或建议的形式或实施方式纳入作为设计选项的一般问题。因此,目的是仅如所附的权利要求书的范围所示受到限制。
Claims (7)
1.一种制造超声换能器阵列的声学匹配层的方法,其中,由具有聚合物核心的单分散颗粒单层限定匹配层的厚度;
其中,将所述单分散颗粒混入聚合物胶树脂中,并且将该混合物的样品在共形表面之间压制,以使样品挤开,从而在所述共形表面之间形成单分散颗粒单层,并且胶树脂的固化提供了具有限定厚度和阻抗的匹配层;
所述单分散颗粒还可由参与限定匹配层声阻抗的固体材料的表层所覆盖。
2.根据权利要求1所述的声学匹配层的制造方法,其中,所述共形表面之一包括以下中的至少一种:i)超声阵列,以及ii)至少一个现有声学匹配层。
3.根据权利要求1或2所述的声学匹配层的制造方法,其中,使用固体材料表层来限定所述单分散颗粒的弹性刚度。
4.根据权利要求3所述的声学匹配层的制造方法,其中,所述表层包括以下中的至少一种或两种均包括:i)导电层,以及ii)导热但电绝缘的材料。
5.根据权利要求1所述的声学匹配层的制造方法,其中,还将除所述单分散颗粒之外的颗粒混入所述胶树脂中,其中该其他颗粒相对于所述单分散颗粒来说非常小以至于其对限定所述匹配层的厚度的影响可以忽略不计,同时参与限定所述匹配层的声阻抗。
6.根据权利要求5所述的声学匹配层的制造方法,其中,选择混入至所述胶树脂中的所述其他颗粒的类型和密度以使得混合物的声阻抗接近于所述单分散颗粒的声阻抗,从而使得复合匹配层的声阻抗对相邻的单分散颗粒之间的横向距离具有低敏感度。
7.根据权利要求1所述的声学匹配层的制造方法,其中,通过以下至少一种来增加树脂的固化速率:i)加热,以及ii)振动。
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US4686409A (en) * | 1984-08-16 | 1987-08-11 | Siemens Aktiengesellschaft | Porous adaptation layer in an ultrasonic applicator |
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