CN107042593A - 一种超大尺寸硅片的切割方法 - Google Patents
一种超大尺寸硅片的切割方法 Download PDFInfo
- Publication number
- CN107042593A CN107042593A CN201710391594.7A CN201710391594A CN107042593A CN 107042593 A CN107042593 A CN 107042593A CN 201710391594 A CN201710391594 A CN 201710391594A CN 107042593 A CN107042593 A CN 107042593A
- Authority
- CN
- China
- Prior art keywords
- cutting
- steel wire
- silicon ingot
- ingot
- guide roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 64
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 64
- 239000010703 silicon Substances 0.000 title claims abstract description 64
- 238000005520 cutting process Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 20
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 37
- 239000010959 steel Substances 0.000 claims abstract description 37
- 239000002002 slurry Substances 0.000 claims abstract description 18
- 238000012545 processing Methods 0.000 claims abstract description 4
- 238000007493 shaping process Methods 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 3
- 238000009412 basement excavation Methods 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000003801 milling Methods 0.000 claims description 5
- 238000000227 grinding Methods 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000002224 dissection Methods 0.000 abstract 1
- 239000011449 brick Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010687 lubricating oil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
- B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710391594.7A CN107042593B (zh) | 2017-05-27 | 2017-05-27 | 一种超大尺寸硅片的切割方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710391594.7A CN107042593B (zh) | 2017-05-27 | 2017-05-27 | 一种超大尺寸硅片的切割方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107042593A true CN107042593A (zh) | 2017-08-15 |
| CN107042593B CN107042593B (zh) | 2019-03-22 |
Family
ID=59546250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710391594.7A Active CN107042593B (zh) | 2017-05-27 | 2017-05-27 | 一种超大尺寸硅片的切割方法 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107042593B (zh) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108162214A (zh) * | 2017-12-21 | 2018-06-15 | 英利能源（中国）有限公司 | 一种金钢线硅片切割方法 |
| CN110370442A (zh) * | 2019-08-08 | 2019-10-25 | 张志磊 | 一种均匀出料且具有回收再利用功能的碳化硅投料装置 |
| CN110802754A (zh) * | 2019-09-29 | 2020-02-18 | 扬州荣德新能源科技有限公司 | 一种铸造单晶可调式导轮切割方法 |
| CN113843904A (zh) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | 太阳能硅片的切割方法、设备及存储介质 |
| CN116901273A (zh) * | 2023-07-21 | 2023-10-20 | 无锡斯达新能源科技股份有限公司 | 一种菱形硅芯切割装置及硅芯切割机 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10147634B4 (de) * | 2001-09-27 | 2004-07-08 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| CN201552683U (zh) * | 2009-11-10 | 2010-08-18 | 高佳太阳能股份有限公司 | 硅棒的多线切割装置 |
| CN201913714U (zh) * | 2010-12-06 | 2011-08-03 | 浙江芯能光伏科技有限公司 | 一种适用于大直径超薄硅片切割的切割机切割线网系统 |
| CN105965708A (zh) * | 2016-07-01 | 2016-09-28 | 河南鸿昌电子有限公司 | 一种半导体晶粒的切割方法和切割装置 |
| CN105965707A (zh) * | 2016-06-29 | 2016-09-28 | 周维宁 | 可实现2.5d加工的多线切割机及切割工艺 |
| CN106738391A (zh) * | 2017-01-09 | 2017-05-31 | 上海日进机床有限公司 | 切割导轮及其开槽方法、开槽机、多线切割设备 |
-
2017
- 2017-05-27 CN CN201710391594.7A patent/CN107042593B/zh active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10147634B4 (de) * | 2001-09-27 | 2004-07-08 | Siltronic Ag | Verfahren zur Herstellung einer Halbleiterscheibe |
| CN201552683U (zh) * | 2009-11-10 | 2010-08-18 | 高佳太阳能股份有限公司 | 硅棒的多线切割装置 |
| CN201913714U (zh) * | 2010-12-06 | 2011-08-03 | 浙江芯能光伏科技有限公司 | 一种适用于大直径超薄硅片切割的切割机切割线网系统 |
| CN105965707A (zh) * | 2016-06-29 | 2016-09-28 | 周维宁 | 可实现2.5d加工的多线切割机及切割工艺 |
| CN105965708A (zh) * | 2016-07-01 | 2016-09-28 | 河南鸿昌电子有限公司 | 一种半导体晶粒的切割方法和切割装置 |
| CN106738391A (zh) * | 2017-01-09 | 2017-05-31 | 上海日进机床有限公司 | 切割导轮及其开槽方法、开槽机、多线切割设备 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108162214A (zh) * | 2017-12-21 | 2018-06-15 | 英利能源（中国）有限公司 | 一种金钢线硅片切割方法 |
| CN110370442A (zh) * | 2019-08-08 | 2019-10-25 | 张志磊 | 一种均匀出料且具有回收再利用功能的碳化硅投料装置 |
| CN110802754A (zh) * | 2019-09-29 | 2020-02-18 | 扬州荣德新能源科技有限公司 | 一种铸造单晶可调式导轮切割方法 |
| CN113843904A (zh) * | 2020-06-28 | 2021-12-28 | 银川隆基光伏科技有限公司 | 太阳能硅片的切割方法、设备及存储介质 |
| CN116901273A (zh) * | 2023-07-21 | 2023-10-20 | 无锡斯达新能源科技股份有限公司 | 一种菱形硅芯切割装置及硅芯切割机 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107042593B (zh) | 2019-03-22 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Cutting method for oversized silicon wafers Effective date of registration: 20191113 Granted publication date: 20190322 Pledgee: China Everbright Bank Limited by Share Ltd. Nanjing branch Pledgor: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. Registration number: Y2019320000279 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210127 Granted publication date: 20190322 Pledgee: China Everbright Bank Limited by Share Ltd. Nanjing branch Pledgor: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. Registration number: Y2019320000279 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20210210 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A cutting method of super large silicon wafer Effective date of registration: 20211125 Granted publication date: 20190322 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2021980013231 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20221031 Granted publication date: 20190322 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2021980013231 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A cutting method for super large silicon wafer Effective date of registration: 20221130 Granted publication date: 20190322 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2022980024342 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230317 Granted publication date: 20190322 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: Jiangsu Meike Solar Energy Technology Co.,Ltd. Registration number: Y2022980024342 |