CN106950590A - A kind of micron dimension conversion target assembly measured for electron beam emittance - Google Patents
A kind of micron dimension conversion target assembly measured for electron beam emittance Download PDFInfo
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- CN106950590A CN106950590A CN201710316119.3A CN201710316119A CN106950590A CN 106950590 A CN106950590 A CN 106950590A CN 201710316119 A CN201710316119 A CN 201710316119A CN 106950590 A CN106950590 A CN 106950590A
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- ring seat
- lower ring
- electron beam
- conversion target
- target assembly
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/29—Measurement performed on radiation beams, e.g. position or section of the beam; Measurement of spatial distribution of radiation
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Particle Accelerators (AREA)
- Measurement Of Radiation (AREA)
Abstract
The invention discloses a kind of micron dimension conversion target assembly measured for electron beam emittance, including a lower ring seat, the upper surface of lower ring seat has been recessed an annular recess along its axis, also include a upper ring seat matched with lower ring seat, the lower surface of upper ring seat is provided with the bulge loop that downwardly projecting and with lower ring seat annular recess matches, after the annular recess of the lower ring seat of bulge loop insertion of upper ring seat, the film being laid in lower ring seat is expanded to form minute surface.Instant invention overcomes quartzy lamina dimensions it is small, be not easy to cleaning, shortcoming that is easily damaged, installing inconvenience, easy to use, easy to maintenance, low cost purpose is reached, and there is same high measurement accuracy in the range of the various bores of 30~200mm of diameter, relative to quartzy thin slice the bore of adaptation can only be substantially increased for 50 60mm diameters.
Description
Technical field
The present invention relates to electron beam emittance field of measuring technique, and in particular to a kind of to be used for what electron beam emittance was measured
Micron dimension changes target assembly.
Background technology
Electron beam emittance e measurement technology in accelerator field is a kind of important test in accelerator development process
Technology, can obtain the performance state of electron beam, this has for the debugging of accelerator by the measurement to electron beam emittance
And its important meaning.In the e measurement technology of emittance, there are a kind of e measurement technology based on Cerenkov radiation principle, but this
Plant e measurement technology and require thin, the preferably up to micron dimension, and require that conversion target plane reaches minute surface of conversion target thickness extremely
Effect, otherwise, will bring the even false measurement result of great error to measurement.
Although certain thickness thin slice can be obtained by being ground to similar materials such as quartz, and also there is minute surface
Effect, but it is extremely difficult to be ground the quartzy thin slice of 0.1mm thickness at present, and have that size is small, be not easy to clear
Wash, the shortcoming of easily damaged (installing inconvenience), more major problem is that reaching that the quartzy thin slice of 0.1mm thickness still can't be
Measurement request is met in performance, it is necessary to which thinner thin slice, has been difficult to be further continued for toward thinner journey using the method for quartz grinding
Degree to have gone on and obtain the thickness needed, it is necessary to find the conversion target material and supporting construction of a kind of new structure type to reach
The thin slice target of degree.
The content of the invention
It is an object of the invention to provide a kind of micron dimension conversion target assembly measured for electron beam emittance, solve
Quartzy sheet thickness, which is less than after 0.1mm, in the prior art is difficult to while performance is unsatisfactory for asking for electron beam emittance measurement
Topic, reaches satisfaction using while having effect easy to use, easy to maintenance.
The present invention is achieved through the following technical solutions：
A kind of micron dimension conversion target assembly measured for electron beam emittance, including a lower ring seat, lower ring seat
Upper surface has been recessed an annular recess along its axis, also including a upper ring seat matched with lower ring seat, upper ring seat
Lower surface be provided with the bulge loop that downwardly projecting and with lower ring seat annular recess matches, the lower ring seat of bulge loop insertion of upper ring seat
Annular recess after, the film being laid in lower ring seat is expanded to form minute surface.The present invention using the upper ring seat that is mutually matched and
Lower ring seat, annular groove is provided with lower ring seat, and film is laid in lower ring seat, and the bulge loop of upper ring seat is entirely pushed into
In annular recess, during promotion, the effect of bulge loop make it that film is stretched extension, forms minute surface, the cooperation of lower ring seat sum
With preferable compressibility, thickness can be only had 0.9~2 micron of thang-kng, the good film of ductility and extend and reach minute surface
Effect, to realize that the micron dimension measured for electron beam emittance changes target assembly, overcomes that quartzy lamina dimensions are small, inconvenience
In the shortcoming of cleaning, easily breakage, installation inconvenience, easy to use, easy to maintenance, low cost purpose has been reached, and straight
There is same high measurement accuracy in the range of the various bores of 30~200mm of footpath, relative to quartzy thin slice can only 50-60mm diameters and
Speech, substantially increases the bore of adaptation.
An annular seal pocket is provided with the inside of ring seat bulge loop on described, a side is provided with the annular seal pocket
Face extends sealing ring.Further, in the drawing process of film, due to the direct effect of bulge loop and film, it is likely to result in
Unbalance stress and the problem of damage film, after multiple experiment and theory analysis, by being set on the inside of upper ring seat bulge loop
An annular seal pocket is equipped with, the mode of a sideways expansion sealing ring is provided with the annular seal pocket, film is free
It is laid in lower ring seat, the bulge loop of upper ring seat uniformly, is flatly pressed into the annular groove of lower ring seat, side during being pressed into
The groove inner wall friction of ring under sealing ring and swelling device is extended, film is extended to the plane of mirror effect, by with one
The sideways expansion sealing ring of fixed elasticity acted on film, it is to avoid damage of the film under very stiff and demanding extended state.
Axial direction of the end face along lower ring seat on the inside of the lower ring seat annular recess has been recessed top groove, recessed at top
Holding sealing ring is installed in groove.
Compression sealing ring is installed in the annular recess of the lower ring seat.
Further, by being provided with holding sealing ring in top groove, being provided with the annular recess of lower ring seat
Compress the sealing ring at sealing ring, two to fix film compression so that film everywhere deflecting in drawing process has one
Compression is protected and sealed to sealing ring, makes the smooth fastening of micron dimension conversion target, meets electron beam emittance measurement.
The bar-shaped trough of ring seat bottom under extending downwardly and entering is provided with described compression sealing ring, in bar-shaped trough
Bottom is provided through the screw of lower ring seat.By setting bar-shaped trough in lower ring seat bottom, bar-shaped trough is upwardly extended through compression
Sealing ring, screw is set in bar shaped trench bottom, it is necessary to be fixed using screw after upper ring seat is connected with the matching of lower ring seat,
By setting bar-shaped trough, it is easy to the operation of screw to connect, is provided for the operating space of spaciousness, improves the fixed effect of assembling
Rate.
On the annular recess lateral wall of the lower ring seat, multiple steam vents are provided with.By setting multiple steam vents,
In assembling process, pushing for bulge loop will necessarily compress the space of annular groove, and the gas after compression is arranged by the steam vent of setting
Go out, compressed air can be avoided to stretch the reaction paved to film, be conducive to improving the mirror effect of film.
A connection pedestal is additionally provided with the outside of the lower ring seat.Further, by setting a connection pedestal,
It is easy to the subsequent installation of whole conversion target, is easy to it to change, adds practicality.
The present invention compared with prior art, has the following advantages and advantages：
1st, a kind of micron dimension conversion target assembly measured for electron beam emittance of the present invention, upper using what is be mutually matched
Ring seat and lower ring seat, are provided with annular groove in lower ring seat, film are laid in lower ring seat, and the bulge loop of upper ring seat is smooth
In ground push-in annular recess, during promotion, the effect of bulge loop make it that film is stretched extensions, forms minute surface, lower ring seat with
Cooperation there is preferable compressibility, thickness can be only had 0.9~2 micron of thang-kng, the good film of ductility and extend and reach
To mirror effect, to realize that the micron dimension measured for electron beam emittance changes target assembly, quartzy lamina dimensions are overcome
It is small, be not easy to cleaning, shortcoming that is easily damaged, installing inconvenience, reached easy to use, easy to maintenance, low cost purpose, and
And there is same high measurement accuracy in the range of the various bores of 30~200mm of diameter, can only 50-60mm relative to quartzy thin slice
For diameter, the bore of adaptation is substantially increased；
2nd, a kind of micron dimension conversion target assembly measured for electron beam emittance of the present invention, by upper ring seat bulge loop
Inner side be provided with an annular seal pocket, the mode of a sideways expansion sealing ring is provided with the annular seal pocket, will be thin
Film is freely laid in lower ring seat, and the bulge loop of upper ring seat uniformly, is flatly pressed into the annular groove of lower ring seat, was pressed into
In journey under sideways expansion sealing ring and swelling device ring groove inner wall friction, film is extended to the plane of mirror effect, lead to
Cross the sideways expansion sealing ring with certain elasticity to act on film, it is to avoid damage of the film under very stiff and demanding extended state
It is bad；
3rd, a kind of micron dimension conversion target assembly measured for electron beam emittance of the present invention, by lower ring seat bottom
Bar-shaped trough is set, and bar-shaped trough is upwardly extended through sealing ring is compressed, and screw is set in bar shaped trench bottom, when upper ring seat and lower ring seat
, it is necessary to be fixed using screw after matching connection, by setting bar-shaped trough, it is easy to the operation of screw to connect, is provided for
Spacious operating space, improves the fixed efficiency of assembling.
Brief description of the drawings
Accompanying drawing described herein is used for providing further understanding the embodiment of the present invention, constitutes one of the application
Point, do not constitute the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is the semi-cutaway of assembling schematic diagram of the present invention.
Mark and corresponding parts title in accompanying drawing：
Ring seat under the upper ring seats of 1-, 2-, 3- compression sealing rings, 4- holding sealing rings, 5- sideways expansion sealing rings, 6- films,
7- bar-shaped troughs, 8- steam vents, 9- connection pedestals.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, the present invention is made with reference to embodiment
Further to describe in detail, exemplary embodiment and its explanation of the invention is only used for explaining the present invention, is not intended as to this
The restriction of invention.
Embodiment
As shown in figure 1, a kind of micron dimension conversion target assembly measured for electron beam emittance of the present invention, including one
Lower ring seat 2, lower ring seat 2 is with reeded loop configuration, the external diameter 92.2mm of groove, internal diameter 73.9mm, depth 9mm, lower ring seat 2
Annular recess bottom be placed with compression sealing ring 3, the half slot that Radius 2mm is arranged at the top of lower ring seat 2 is used for placing holding
Sealing ring 4, upper ring seat 1 is the loop configuration with bulge loop, the external diameter 92mm of bulge loop, internal diameter 75mm, depth 7mm, upper ring seat 1 it is convex
Ring internal diameter direction is provided with seal groove and is used for placing sideways expansion sealing ring 5, seal groove external diameter 79mm, width 3.2mm, the upper side of ring seat 1
The difference that face extends ring internal diameter under seal groove external diameter and swelling device is 5.1mm, is selected hereSideways expansion sealing ring
5, it is ensured that the internal diameter of ring 2 has certain frictional force under sideways expansion sealing ring 5 and swelling device, film 6 can be enable to expand such as mirror
Face, the present embodiment conversion target thickness extremely thin, preferably up to micron dimension, because Mylar films have preferable optical lens
Lightness, also has preferable plane performance after support is open and flat, there is flexible relative and preferable ductility ratio to be more suitable for needing for it
Exert a force and carry out the occasion of support exhibition；And thickness can reach a μm magnitude, the expansion effect to the angle of divergence of electron beam is smaller,
Than being more suitable for carrying out making conversion target, based on These characteristics, Mylar films 6 are used in the present embodiment device, thickness can
0.9-3 microns are selected, bar-shaped trough 7 is set in the lower bottom of ring seat 2, bar-shaped trough 7 is upwardly extended through sealing ring 3 is compressed, in bar-shaped trough
7 bottoms set screw, and after upper ring seat 1 is connected with the matching of lower ring seat 2, the operating space of spaciousness is provided for the assembling of screw,
On the annular recess lateral wall of lower ring seat 2, multiple steam vents 8 are provided with, in assembling process, pushing for bulge loop will necessarily be pressed
The space of contracting annular groove, the gas after compression is discharged by the steam vent 8 of setting, and compressed air can be avoided to stretch film
The reaction paved, is conducive to improving the mirror effect of film, a connection pedestal 9 is additionally provided with the outside of lower ring seat 2, just
In the subsequent installation of whole conversion target.
Change target assembly installation steps：First, smooth being layered on of Mylar films 6 is installed top and keeps sealing ring 4 and bottom
Portion is compressed in the lower ring seat 2 of sealing ring 3, and ensures that surrounding has more than 50mm surplus；Second step, it is close sideways expansion is installed
The bulge loop of the upper ring seat 1 of seal 5 is steady, be slowly pressed into the annular groove of lower ring seat 2, close using lower pressure and sideways expansion
It is smooth such as mirror that the frictional force of seal 5 stretches film；3rd step, when the bulge loop of upper ring seat 1 is pressed onto the bottom of the lower groove of ring seat 2,
Film is further compressed using sealing ring 3, holding sealing ring 4 is compressed, and ensures film discord extruding metal fracture；Finally, use
Screw passes through bar-shaped trough 7, and upper ring seat 1 and lower ring seat 2 are fixed.
Above-described embodiment, has been carried out further to the purpose of the present invention, technical scheme and beneficial effect
Describe in detail, should be understood that the embodiment that the foregoing is only the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modifications, equivalent substitutions and improvements done etc. all should be included
Within protection scope of the present invention.
Claims (7)
1. a kind of micron dimension conversion target assembly measured for electron beam emittance, it is characterised in that：Including a lower ring seat
(2), the upper surface of lower ring seat (2) has been recessed an annular recess along its axis, also including one and lower ring seat (2) phase
The upper ring seat (1) matched somebody with somebody, the lower surface of upper ring seat (1) is provided with what downwardly projecting and with lower ring seat (2) annular recess matched
After bulge loop, the annular recess of the lower ring seat (2) of bulge loop insertion of upper ring seat (1), the film (6) being laid in lower ring seat (2) is expanded
Open and form minute surface.
2. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 1, its feature
It is to be provided with an annular seal pocket on the inside of ring seat (1) bulge loop on described, a side is provided with the annular seal pocket
Face extension sealing ring (5).
3. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 1, its feature
It is that axial direction of the end face on the inside of lower ring seat (2) annular recess along lower ring seat (2) has been recessed top groove, on top
Holding sealing ring (4) is installed in portion's groove.
4. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 1, its feature
It is that compression sealing ring (3) is installed in the annular recess of the lower ring seat (2).
5. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 4, its feature
It is to be provided with to extend downwardly and into the bar-shaped trough (7) of lower ring seat (2) bottom on described compression sealing ring (3), in bar
The bottom of shape groove (7) is provided through the screw of lower ring seat (2).
6. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 1, its feature
It is on the annular recess lateral wall of the lower ring seat (2), to be provided with multiple steam vents (8).
7. a kind of micron dimension conversion target assembly measured for electron beam emittance according to claim 1, its feature
It is that a connection pedestal (9) is additionally provided with the outside of the lower ring seat (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710316119.3A CN106950590B (en) | 2017-05-08 | 2017-05-08 | A kind of micron dimension conversion target assembly for electron beam emittance measurement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710316119.3A CN106950590B (en) | 2017-05-08 | 2017-05-08 | A kind of micron dimension conversion target assembly for electron beam emittance measurement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106950590A true CN106950590A (en) | 2017-07-14 |
| CN106950590B CN106950590B (en) | 2019-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710316119.3A Active CN106950590B (en) | 2017-05-08 | 2017-05-08 | A kind of micron dimension conversion target assembly for electron beam emittance measurement |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114047540A (en) * | 2021-09-28 | 2022-02-15 | 西北核技术研究所 | Method and system for measuring beam density distribution of high-current pulse electron beam |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106950590B (en) | 2019-06-04 |
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