CN106937513A - Heat exchange chamber and liquid cooling apparatus - Google Patents
Heat exchange chamber and liquid cooling apparatus Download PDFInfo
- Publication number
- CN106937513A CN106937513A CN201511023351.5A CN201511023351A CN106937513A CN 106937513 A CN106937513 A CN 106937513A CN 201511023351 A CN201511023351 A CN 201511023351A CN 106937513 A CN106937513 A CN 106937513A
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- China
- Prior art keywords
- heat
- grade
- fixture
- lid
- conducting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of heat exchange chamber, comprising a heat-conducting substrate, a lid and multiple fixtures.Heat-conducting substrate has multiple fin.Lid is arranged on heat-conducting substrate and covers fin.Be fixed on lid on heat-conducting substrate by fixture.
Description
Technical field
The present invention is espespecially a kind of lid is fixed on heat-conducting substrate using fixture on a kind of heat exchange chamber
Heat exchange chamber and the liquid cooling apparatus with this heat exchange chamber.
Background technology
Heat abstractor is closely bound up with the development of electronic product.Because electronic product is in running, in circuit
Electric current unnecessary heat energy can be produced because of the influence of impedance, if these heat energy can not be excluded effectively
And on the electronic component accumulated inside electronic product, electronic component is just possible to because continuous elevated temperature
Spend and damage.Therefore, the good and bad running influence on electronic product of heat abstractor is very huge.
At present, the most frequently used heat abstractor of electronic product is to pass through that for the end thereof contacts of heat pipe heat can be produced
Electronic component, other end connection fin, and fin is radiated with radiator fan.However, dissipating
Hot-air fan is produced under rotating speed high to disturb people's noise and power consumption high, and often manufacturer is difficult to
The problem for overcoming.Therefore, liquid cooling apparatus just in response to and give birth to.
In general, liquid cooling apparatus are mainly to be made up of heat exchange chamber and pump.Liquid cooling apparatus are to electricity
It is that coolant is squeezed into heat exchange chamber by pump when subcomponent is radiated, heat exchange chamber absorbs electronic component
Produced heat, then cooled down by coolant.The lid of prior art heat exchange chamber is only placed in leads
On hot substrate, lid is with heat-conducting substrate without fixed relationship so that the inner surface of lid dissipates with heat-conducting substrate
There is larger gap between backing.Because above-mentioned gap is smaller for the resistance that liquid flows, therefore,
Part coolant will be flowed into above-mentioned gap so that coolant cannot uniformly flow to each fin.
Therefore, coolant effectively cannot take away heat from each fin so that electronic installation is carried because of temperature
It is high and influence its efficiency.
The content of the invention
The heat exchange chamber and have that be fixed on lid on heat-conducting substrate by a kind of utilization fixture of present invention offer
The liquid cooling apparatus of this heat exchange chamber, it is above-mentioned to solve the problems, such as.
According to an embodiment, heat exchange chamber of the invention is solid comprising a heat-conducting substrate, a lid and multiple
Determine part.Heat-conducting substrate has multiple fin.Lid is arranged on heat-conducting substrate and covers fin.Gu
Determine part lid is fixed on heat-conducting substrate.
According to another embodiment, liquid cooling apparatus of the invention include a heat exchange chamber and a housing.Heat is handed over
Change chamber and include a heat-conducting substrate, a lid and multiple fixtures.Heat-conducting substrate has multiple fin.
Lid is arranged on heat-conducting substrate and covers fin.Be fixed on lid on heat-conducting substrate by fixture.Shell
Body is arranged on heat-conducting substrate.
In sum, be fixed on lid on heat-conducting substrate using fixture by heat exchange chamber system of the invention.
After be fixed on lid on heat-conducting substrate by fixture, the inner surface of lid can be made close or even fitted in lead
The fin of hot substrate, to reduce even between the inner surface and the fin of heat-conducting substrate of elimination lid
Gap.Thereby, the coolant into heat exchange chamber can uniformly flow to each fin, effectively will
The heat of each fin is taken away, and then promotes radiating effect.
Can be obtained into one by following detailed description of the invention and institute's accompanying drawings on the advantages and spirit of the present invention
The understanding of step.
Brief description of the drawings
Fig. 1 is the stereogram of the liquid cooling apparatus according to one embodiment of the invention.
Fig. 2 is the liquid cooling apparatus in Fig. 1 in the stereogram at another visual angle.
Fig. 3 is the explosive view of the liquid cooling apparatus in Fig. 1.
Fig. 4 is the liquid cooling apparatus in Fig. 1 in the explosive view at another visual angle.
Fig. 5 is profile of the heat exchange chamber in Fig. 3 along line A-A.
Fig. 6 is the explosive view of the heat exchange chamber in Fig. 3.
Fig. 7 is the heat exchange chamber in Fig. 3 in the explosive view at another visual angle.
Fig. 8 is the explosive view of the heat exchange chamber according to another embodiment of the present invention.
Fig. 9 is the explosive view of the heat exchange chamber according to another embodiment of the present invention.
Wherein, reference
1 liquid cooling apparatus
10th, 10 ', 10 " heat exchange chamber
12 housings
14 pumps
16 screws
100 heat-conducting substrates
102 lids
104 fixtures
106 fin
108th, 110 fixing hole
A-A hatchings
Specific embodiment
Fig. 1 to Fig. 7 is referred to, Fig. 1 is the stereogram of the liquid cooling apparatus 1 according to one embodiment of the invention,
Fig. 2 be liquid cooling apparatus 1 in Fig. 1 in the stereogram at another visual angle, Fig. 3 is the liquid cooling apparatus 1 in Fig. 1
Explosive view, Fig. 4 be liquid cooling apparatus 1 in Fig. 1 in the explosive view at another visual angle, during Fig. 5 is Fig. 3
Heat exchange chamber 10 along line A-A profile, Fig. 6 be Fig. 3 in heat exchange chamber 10 explosive view, Fig. 7
It is the heat exchange chamber 10 in Fig. 3 in the explosive view at another visual angle.
As shown in Figures 1 to 4, liquid cooling apparatus 1 include a heat exchange chamber 10, a housing 12 and a pump
14.Housing 12 is arranged on heat exchange chamber 10.Pump 14 is arranged in housing 12 and positioned at heat exchange chamber
On 10.In this embodiment, using multiple screws 16 by heat exchange chamber 10, housing 12 and pump 14
It is fixed together.
As shown in Figures 5 to 7, heat exchange chamber 10 comprising a heat-conducting substrate 100, a lid 102 and
Multiple fixtures 104.Heat-conducting substrate 100 can by copper, aluminium or other there is the material system of high heat-conduction coefficient
Into.When liquid cooling apparatus of the invention 1 are used for radiating electronic component (not shown), heat exchange chamber
10 heat-conducting substrate 100 is to be attached on electronic component, and coolant (not shown) is squeezed into heat by pump 14
Inverting chamber 10, heat exchange chamber 10 absorbs the heat produced by electronic component, then is cooled down by coolant.
Heat-conducting substrate 100 has multiple fin 106, and fin 106 is spaced.Fin 106
Can be arranged on heat-conducting substrate 100 by modes such as stickup, engaging, welding.Additionally, fin 106
Also can be formed on heat-conducting substrate 100 by backing-off cutting mode, and be integrally formed with heat-conducting substrate 100.Compare
In modes such as stickup, engaging, welding, fin 106 is formed directly into heat-conducting substrate in backing-off cutting mode
The thermal resistance between fin 106 and heat-conducting substrate 100 can be effectively reduced on 100, and then effectively improves hot biography
Lead efficiency.
Lid 102 is arranged on heat-conducting substrate 100 and covers fin 106.It is fixed in this embodiment
Part 104 can be copper post, and lid 102 can be made of plastics.Therefore, fixture 104 can be penetrated via embedment
Go out shaping (insert molding) technique to be arranged on the corner of lid 102.In another embodiment, Gu
Determining part 104 can also be integrally formed with lid 102 via plastic ejection moulding technique.In another embodiment,
Fixture 104 can also be integrally formed with lid 102 via metal casting moulding process.
Heat-conducting substrate 100 has multiple fixing holes 108, the wherein correspondence of fixing hole 108 fixture 104.In
In this embodiment, fixture 104 first can be directed at fixing hole 108, then via Sheet Metal Forming Technology by fixture 104
Press-in fixing hole 108 so that fixture 104 is fixed in fixing hole 108 in the way of tight fit.Thereby,
Can be fixed on lid 102 on heat-conducting substrate 100 by fixture 104.As shown in figure 5, in fixture
After 104 are fixed on heat-conducting substrate 100 lid 102, because Sheet Metal Forming Technology system is by lid 102 towards heat conduction
The direction punching press of substrate 100, the inner surface of lid 102 can be approached and even fit in heat-conducting substrate 100
Fin 106, to reduce the fin 106 of the inner surface and the heat-conducting substrate 100 that even eliminate lid 102
Between gap.Thereby, the coolant into heat exchange chamber 10 can uniformly flow to each fin 106,
Effectively the heat of each fin 106 is taken away, and then promotes radiating effect.
Fig. 8 is referred to, Fig. 8 is the explosive view of the heat exchange chamber 10 ' according to another embodiment of the present invention.Heat
It is in place of inverting chamber 10 ' and the main difference of above-mentioned heat exchange chamber 10, the fixture of heat exchange chamber 10 '
104 are integrally formed with heat-conducting substrate 100, as shown in Figure 8.In this embodiment, can be via computer number
Value control (Computer Numerical Control, CNC) technique is solid in being milled out on heat-conducting substrate 100
Determine part 104.Additionally, lid 102 has multiple fixing holes 110, the wherein corresponding fixture of fixing hole 110
104.In this embodiment, fixture 104 first can be directed at fixing hole 110, then will via Sheet Metal Forming Technology
Fixture 104 is pressed into fixing hole 110 so that fixture 104 is fixed on fixing hole 110 in the way of tight fit
In.Thereby, can be fixed on lid 102 on heat-conducting substrate 100 by fixture 104.
It should be noted that, the fixture 104 depicted in the 8th figure also may be designed to coupler construction, to lid
Fixing hole 110 or draw-in groove the (not shown) engaging of body 102, heat-conducting substrate is fixed on by lid 102
On 100.In other words, be fixed on lid 102 on heat-conducting substrate 100 using snap fit also by the present invention,
It is not limited to the above-mentioned fixed form that fixture 104 is pressed into fixing hole 110 via Sheet Metal Forming Technology.
Refer to Fig. 9, Fig. 9 is the heat exchange chamber 10 according to another embodiment of the present invention " explosive view.Heat
The main difference part of inverting chamber 10 " and above-mentioned heat exchange chamber 10 is, heat exchange chamber 10 " fixture
104 be independent component, as shown in Figure 9.Additionally, heat-conducting substrate 100 has multiple fixing holes 108,
And lid 102 has multiple fixing holes 110, wherein fixing hole 108,110 corresponds to fixture 104 respectively.
In this embodiment, first fixing hole 108,110 can be mutually aligned, then via Sheet Metal Forming Technology by fixture
104 press-in fixing holes 108,110 so that fixture 104 be fixed in the way of tight fit fixing hole 108,
In 110.Thereby, can be fixed on lid 102 on heat-conducting substrate 100 by fixture 104.
In sum, be fixed on lid on heat-conducting substrate using fixture by heat exchange chamber system of the invention.
After be fixed on lid on heat-conducting substrate by fixture, the inner surface of lid can be made close or even heat conduction base is fitted in
The fin of plate, to reduce the gap between the inner surface and the fin of heat-conducting substrate that even eliminate lid.
Thereby, the coolant into heat exchange chamber can uniformly flow to each fin, effectively dissipate each
The heat of backing is taken away, and then promotes radiating effect.
The foregoing is only presently preferred embodiments of the present invention, all equalizations done according to scope of the present invention patent
Change and modification, should all belong to the protection domain of appended claims of the present invention.
Claims (9)
1. a kind of heat exchange chamber, it is characterised in that include：
One heat-conducting substrate, with multiple fin；
One lid, is arranged on the heat-conducting substrate and covers the grade fin；And
Multiple fixtures, the lid is fixed on the heat-conducting substrate.
2. heat exchange chamber as claimed in claim 1, it is characterised in that the grade fixture is copper post, should
It is arranged on the lid via embedment jetting formation process Deng fixture, the heat-conducting substrate has multiple fixed
Hole, to that should wait fixture, the grade fixture is fixed on the grade in the way of tight fit to be fixed the grade fixing hole
Kong Zhong.
3. heat exchange chamber as claimed in claim 1, it is characterised in that the grade fixture and the lid one
Body formed, the heat-conducting substrate has multiple fixing holes, and the grade fixing hole to that should wait fixture, fix by the grade
Part is fixed in the grade fixing hole in the way of tight fit.
4. heat exchange chamber as claimed in claim 1, it is characterised in that the grade fixture and the heat conduction base
Plate is integrally formed, and the lid has multiple fixing holes, and the grade fixing hole to that should wait fixture, fix by the grade
Part is fixed in the grade fixing hole in the way of tight fit.
5. a kind of liquid cooling apparatus, it is characterised in that include：
One heat exchange chamber, comprising a heat-conducting substrate, a lid and multiple fixtures, the heat-conducting substrate has
Multiple fin, the lid is arranged on the heat-conducting substrate and covers the grade fin, and the grade fixture should
Lid is fixed on the heat-conducting substrate；And
One housing, is arranged on the heat exchange chamber.
6. liquid cooling apparatus as claimed in claim 5, it is characterised in that the grade fixture is copper post, should
It is arranged on the lid via embedment jetting formation process Deng fixture, the heat-conducting substrate has multiple fixed
Hole, to that should wait fixture, the grade fixture is fixed on the grade in the way of tight fit to be fixed the grade fixing hole
Kong Zhong.
7. liquid cooling apparatus as claimed in claim 5, it is characterised in that the grade fixture and the lid one
Body formed, the heat-conducting substrate has multiple fixing holes, and the grade fixing hole to that should wait fixture, fix by the grade
Part is fixed in the grade fixing hole in the way of tight fit.
8. liquid cooling apparatus as claimed in claim 5, it is characterised in that the grade fixture and the heat conduction base
Plate is integrally formed, and the lid has multiple fixing holes, and the grade fixing hole to that should wait fixture, fix by the grade
Part is fixed in the grade fixing hole in the way of tight fit.
9. liquid cooling apparatus as claimed in claim 5, it is characterised in that additionally comprise a pump, be arranged at this
In housing and on the heat exchange chamber.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011307210.7A CN112714588A (en) | 2015-12-30 | 2015-12-30 | Heat exchange cavity and liquid cooling device |
| CN201511023351.5A CN106937513A (en) | 2015-12-30 | 2015-12-30 | Heat exchange chamber and liquid cooling apparatus |
| US15/395,954 US10509446B2 (en) | 2015-12-30 | 2016-12-30 | Cooling apparatus for electronic components |
| US16/661,872 US11061450B2 (en) | 2015-12-30 | 2019-10-23 | Cooling apparatus for electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511023351.5A CN106937513A (en) | 2015-12-30 | 2015-12-30 | Heat exchange chamber and liquid cooling apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011307210.7A Division CN112714588A (en) | 2015-12-30 | 2015-12-30 | Heat exchange cavity and liquid cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106937513A true CN106937513A (en) | 2017-07-07 |
Family
ID=59440984
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511023351.5A Pending CN106937513A (en) | 2015-12-30 | 2015-12-30 | Heat exchange chamber and liquid cooling apparatus |
| CN202011307210.7A Pending CN112714588A (en) | 2015-12-30 | 2015-12-30 | Heat exchange cavity and liquid cooling device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011307210.7A Pending CN112714588A (en) | 2015-12-30 | 2015-12-30 | Heat exchange cavity and liquid cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN106937513A (en) |
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| CN201417421Y (en) * | 2009-05-07 | 2010-03-03 | 无锡市福曼科技有限公司 | Micro-channel highly-effective water cooling exchanger |
| CN202352650U (en) * | 2012-03-02 | 2012-07-25 | 东莞爱美达电子有限公司 | Finned water-cooling plate |
| CN102714929A (en) * | 2010-01-12 | 2012-10-03 | 日本轻金属株式会社 | Substrate with integrated fins and method of manufacturing substrate with integrated fins |
| CN202748722U (en) * | 2012-08-27 | 2013-02-20 | 无锡市福曼科技有限公司 | Double-channel mixed water-cooling and air-cooling device for CPU of computer |
| CN202979539U (en) * | 2012-08-23 | 2013-06-05 | 保锐科技股份有限公司 | Liquid-cooled heat exchange module with uniform flow channels |
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| CN201135007Y (en) * | 2007-11-28 | 2008-10-15 | 讯凯国际股份有限公司 | Heat radiating device and fastening piece of heat radiating base |
| TWI394524B (en) * | 2010-02-10 | 2013-04-21 | Delta Electronics Inc | Modularized heat dissipating apparatus |
| CN202617585U (en) * | 2012-05-29 | 2012-12-19 | 讯凯国际股份有限公司 | Water-cooled heat dissipation device |
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2015
- 2015-12-30 CN CN201511023351.5A patent/CN106937513A/en active Pending
- 2015-12-30 CN CN202011307210.7A patent/CN112714588A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201417421Y (en) * | 2009-05-07 | 2010-03-03 | 无锡市福曼科技有限公司 | Micro-channel highly-effective water cooling exchanger |
| CN102714929A (en) * | 2010-01-12 | 2012-10-03 | 日本轻金属株式会社 | Substrate with integrated fins and method of manufacturing substrate with integrated fins |
| CN103503589A (en) * | 2011-05-12 | 2014-01-08 | 丰田自动车株式会社 | Cooler and manufacturing method for cooler |
| CN202352650U (en) * | 2012-03-02 | 2012-07-25 | 东莞爱美达电子有限公司 | Finned water-cooling plate |
| CN202979539U (en) * | 2012-08-23 | 2013-06-05 | 保锐科技股份有限公司 | Liquid-cooled heat exchange module with uniform flow channels |
| CN202748722U (en) * | 2012-08-27 | 2013-02-20 | 无锡市福曼科技有限公司 | Double-channel mixed water-cooling and air-cooling device for CPU of computer |
| CN203040088U (en) * | 2012-12-17 | 2013-07-03 | 深圳市大族激光科技股份有限公司 | Water cooling radiator |
| CN203086911U (en) * | 2013-01-14 | 2013-07-24 | 保锐科技股份有限公司 | A heat exchange module |
| CN203340506U (en) * | 2013-05-30 | 2013-12-11 | 天津清源电动车辆有限责任公司 | Liquid cooling radiator for integrated power electronic module |
| CN203313585U (en) * | 2013-06-24 | 2013-11-27 | 讯凯国际股份有限公司 | Water-cooled heat dissipating device |
| CN103629850A (en) * | 2013-12-04 | 2014-03-12 | 中国科学院光电技术研究所 | Liquid cooling head for air cooling and liquid cooling dual-purpose radiator |
| CN204836927U (en) * | 2015-08-11 | 2015-12-02 | 讯凯国际股份有限公司 | Liquid cooling type head that dispels heat and cooling system thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112714588A (en) | 2021-04-27 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170707 |
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| RJ01 | Rejection of invention patent application after publication |