CN106900138A - A kind of high penetration LED display element circuit plate and preparation method thereof - Google Patents
A kind of high penetration LED display element circuit plate and preparation method thereof Download PDFInfo
- Publication number
- CN106900138A CN106900138A CN201710253964.0A CN201710253964A CN106900138A CN 106900138 A CN106900138 A CN 106900138A CN 201710253964 A CN201710253964 A CN 201710253964A CN 106900138 A CN106900138 A CN 106900138A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- hard
- hard circuit
- plate
- high penetration
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000035515 penetration Effects 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims description 13
- 239000011324 bead Substances 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 3
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
A kind of high penetration LED display element circuit plate and its manufacture method, wherein high penetration LED display element circuit plate includes strip hard circuit board, flexible circuit board, and several LED lamp beads, at least two-tier circuit is provided with the hard circuit board, several electrical and non-electrical pads are equipped with first plate face and the second plate face of the hard circuit board, the electrical pad is electrical connected with the circuit in hard circuit board, the flexible circuit board overlay on the side of hard circuit board the 3rd and pass through pad solder hard circuit board first, second plate face, the LED lamp bead is periodically installed on the flexible circuit board of the lateral location of hard circuit board the 3rd successively, and all LED lamp beads are located on straight line.The present invention has high penetration characteristic, while can guarantee that picture element density higher again, can be widely applied to each display screen field.
Description
Technical field
The present invention relates to LED display technical field, and in particular to a kind of high penetration LED display element circuit plate and its
Preparation method.
Background technology
LED display is widely used in every field, but in the application scenario of some demand light transmittances, then needs LED to show
Display screen has structure that is unobstructed or blocking less, to improve the high-permeability of LED lamp bead.LED display of the prior art,
The general effect by using the production technology of copper post via technology side patch lamp bead to realize high penetration, but LED in the technology
The paster technique production of pearl is complicated, there is risk greatly, poor reliability, so as to have impact on the quality of LED display.
The content of the invention
The present invention is in order to solve the above mentioned problem that prior art is present, there is provided a kind of both to have high-permeability, while again
Can guarantee that high penetration LED display element circuit plate of picture element density higher and preparation method thereof.
To achieve the above object, it is hard the invention provides a kind of high penetration LED display element circuit plate, including strip
Property circuit board, flexible circuit board, and several LED lamp beads are provided with least two-tier circuit in the hard circuit board, described hard
Property circuit board the first plate face and the second plate face on be equipped with several electrically and non-electrical pad, the electrical pad with
Circuit in hard circuit board is electrical connected, and the flexible circuit board is overlayed on the side of hard circuit board the 3rd and welded by pad
First, second plate face of hard circuit board is connect, the LED lamp bead is periodically installed at positioned at the side of hard circuit board the 3rd successively
On the flexible circuit board of position, and all LED lamp beads are located on straight line.
Preferably, the rigid circuit plate thickness is less than or equal to 2.0mm.
Preferably, driving IC, electric capacity and resistance are also posted in first, second plate face of the hard circuit board.
Present invention also offers a kind of preparation method of high penetration LED display element circuit plate, comprise the following steps：
Make and be provided with least two-tier circuit in a kind of and be the hard circuit board of strip, and flexible PCB；
The side of flexible circuit board is attached in the first plate face of hard circuit board, and is fixed by pad solder, and it is flexible
The opposite side of circuit board extend horizontally away the first plate face of hard circuit board；
LED lamp bead successively compartment of terrain is arranged on flexible circuit board along straight line, and LED lamp bead and hard circuit board the 3rd
Side has certain distance；
The opposite side of above-mentioned flexible PCB is overlayed on the side of hard circuit board the 3rd, and with the plate face of hard circuit board second on
Pad solder, and cause all LED lamp beads be arranged on the side of hard circuit board the 3rd along straight line.
Preferably, the opposite side of the flexible PCB is attached to the table of the plate face of hard circuit board second after folding
Face.
Preferably, the opposite side of the flexible PCB overlays on the plate face of hard circuit board second with the 3rd side phase
On the edge for connecing.
High penetration LED display element circuit plate of the invention and preparation method thereof can reach following beneficial effect：
（1）Do not keep the sun off, the effect of perspective can be reached；
（2）High-permeability has been reached as far as possible；
（3）The construction weight of integral LED display screen is effectively alleviated, with more preferable display effect；
（4）Reached using penetrating degree and combined with the aesthetic feeling at scene；
（5）The characteristics of LED display has high penetration, can be widely applied to glass curtain wall building, airport, hotel, stage,
Shopper window etc., has not only reached preferable spot effect so, and can guarantee that picture higher again while high penetration is reached
Plain density.
Brief description of the drawings
The present invention is further detailed explanation with reference to the accompanying drawings and detailed description.
The structural representation of the example that Fig. 1 is provided for high penetration LED display element circuit plate of the present invention；
Structural representation in the preparation process that Fig. 2 is provided for high penetration LED display element circuit plate of the present invention；
In figure：1st, hard circuit board, 2, flexible circuit board, 3, LED lamp bead.
The object of the invention is realized, functional characteristics and advantage will be described further referring to the drawings in conjunction with the embodiments.
Specific embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is described further.Drawn in preferred embodiment
Such as " on ", D score, "left", "right", " centre " and " one " term, only for ease of narration understand, and be not used to limit
The enforceable scope of the present invention, its relativeness is altered or modified, under without essence change technology contents, when being also considered as this hair
Bright enforceable category.
The structural representation of the example that Fig. 1 is provided for high penetration LED display element circuit plate of the present invention, such as Fig. 1 institutes
Show, high penetration LED display element circuit plate includes hard circuit board 1, flexible circuit board 2, and several LED lamp beads 3, institute
It is that strip and thickness are less than or equal in 2.0mm, and hard circuit board 1 and are provided with least two-tier circuit, institute to state hard circuit board 1
The both sides plate face for stating hard circuit board 1 is respectively the first plate face and the second plate face, is equipped with first, second plate face some
Individual electrical and non-electrical pad, the electrical pad is electrical connected with the circuit in hard circuit board 1, the flexible circuit
Plate 2 is overlayed on a side of hard circuit board 1, and the both sides of flexible PCB are attached to the first plate face and the second plate face respectively
Surface, and fixed by pad solder, the side of hard circuit board 1 one covered by flexible circuit board 2 can be referred to as the 3rd side
Side, the LED lamp bead 3 is periodically installed on the flexible circuit board 2 of the lateral location of hard circuit board 1 successively, and all
LED lamp bead 3 is located on straight line.
In specific implementation, driving IC, electric capacity and resistance are also posted in first, second plate face of the hard circuit board 1, driven
The circuit of dynamic IC, electric capacity and resistance composition works for LED lamp bead 3.
In other embodiments, according to pad set location is different, and the side of flexible PCB 2 is attached to the first plate face
Surface, opposite side then need not also be attached to the surface of the second plate face, but overlay on what the second plate face connected with the 3rd side
On edge.Opposite, the side of flexible PCB 2 is attached to the surface of the second plate face, and opposite side is also without being attached to
The surface of the first plate face, but overlay on the edge that the first plate face connects with the 3rd side, it is also possible.
Structural representation in the preparation process that Fig. 2 is provided for high penetration LED display element circuit plate of the present invention, with reference to
Shown in Fig. 2, present invention also offers a kind of preparation method of high penetration LED display element circuit plate, the method includes following
Step：
Step 11, to make and be provided with least two-tier circuit in a kind of and be the hard circuit board 1 of strip, and flexible PCB；
Step 12, the side of flexible circuit board 2 is attached to the surface of the plate face of hard circuit board 1 first, and by pad solder
It is fixed, and the opposite side of flexible PCB extend horizontally away the first plate face of hard circuit board 1；
Step 13, LED lamp bead 3 successively compartment of terrain is arranged on flexible circuit board 2 along straight line, and LED lamp bead 3 and hardness
The side of circuit board 1 has certain distance；
Step 14, bypasses the opposite side of above-mentioned flexible PCB the side of hard circuit board 1 and is attached to hard circuit board 1
The surface of two plate faces, and fixed by pad solder, and cause that all LED lamp beads 3 are arranged in rigid electricity along straight line
On the side of road plate 1.
In above-mentioned steps 13, hard circuit board 1 and flexible PCB are in same plane, and LED lamp bead 3 can be same flat
Face paster production, can so solve the problems, such as that traditional lamp bead paster work is complicated.
In above-mentioned steps 12 and step 14, flexible PCB is equal in first plate face and the second plate face of hard circuit board 1
Welded using electrical or non-electrical pad, can make the LED lamp bead 3 on the element circuit plate of each LED display can be with
Point-blank again inertia, reach good fixed purpose, so as to solve the reliability of LED lamp bead 3, can also be more
Thin LED display lamp bar production technology provides solution.
In preparation process, the set location according to pad is different, and flexible PCB 2 can be attached to the first or second plate
The surface in face, it is also possible to overlay on the edge that the first or second plate face connects with the 3rd side, as long as can realize that pad is connected
.
Although the foregoing describing specific embodiment of the invention, those skilled in the art should be appreciated that this
It is merely illustrative of, various changes or modifications can be made to present embodiment, without departing from principle of the invention and essence,
Protection scope of the present invention is only limited by the claims that follow.
Claims (6)
1. a kind of high penetration LED display element circuit plate, it is characterised in that including strip hard circuit board, flexible circuit
Plate, and several LED lamp beads, are provided with least two-tier circuit, first, the of the hard circuit board in the hard circuit board
Several are equipped with two plate faces electrically and non-electrical pad, the electrical pad is electrical with circuit in hard circuit board
It is connected, the flexible circuit board is overlayed on the side of hard circuit board the 3rd and passes through the first of pad solder hard circuit board, the
Two plate faces, the LED lamp bead is periodically installed on the flexible circuit board of the lateral location of hard circuit board the 3rd successively, and
All LED lamp beads are located on straight line.
2. according to the high penetration LED display element circuit plate described in claim 1, it is characterised in that the hard circuit board
Thickness is less than or equal to 2.0mm.
3. according to the high penetration LED display element circuit plate described in claim 1, it is characterised in that the hard circuit board
First, second plate face on also post driving IC, electric capacity and resistance.
4. a kind of preparation method of high penetration LED display element circuit plate, it is characterised in that comprise the following steps：
Make and be provided with least two-tier circuit in a kind of and be the hard circuit board of strip, and flexible PCB；
The side of flexible circuit board is attached in the first plate face of hard circuit board, and is fixed by pad solder, and it is flexible
The opposite side of circuit board extend horizontally away the first plate face of hard circuit board；
LED lamp bead successively compartment of terrain is arranged on flexible circuit board along straight line, and LED lamp bead and hard circuit board the
Three sides have certain distance；
The opposite side of above-mentioned flexible PCB is overlayed on the side of hard circuit board the 3rd, and with the plate face of hard circuit board second on
Pad solder, and cause all LED lamp beads be arranged on the side of hard circuit board the 3rd along straight line.
5. according to the preparation method of the high penetration LED display element circuit plate described in claim 4, it is characterised in that described
The opposite side of flexible PCB is attached to the surface of the plate face of hard circuit board second after folding.
6. according to the preparation method of the high penetration LED display element circuit plate described in claim 4, it is characterised in that described
The opposite side of flexible PCB is overlayed on the edge that the plate face of hard circuit board second connects with the 3rd side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253964.0A CN106900138A (en) | 2017-04-18 | 2017-04-18 | A kind of high penetration LED display element circuit plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710253964.0A CN106900138A (en) | 2017-04-18 | 2017-04-18 | A kind of high penetration LED display element circuit plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106900138A true CN106900138A (en) | 2017-06-27 |
Family
ID=59196702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710253964.0A Pending CN106900138A (en) | 2017-04-18 | 2017-04-18 | A kind of high penetration LED display element circuit plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106900138A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120087140A1 (en) * | 2010-10-08 | 2012-04-12 | Au Optronics Corporation | Light Module |
| US8876326B1 (en) * | 2011-09-08 | 2014-11-04 | Rockwell Collins, Inc. | Multi-mode LED edge-light for NVIS compatible operation |
| CN204756569U (en) * | 2015-05-08 | 2015-11-11 | 鹤山市银雨照明有限公司 | Flexible video lamp area of LED |
| CN204901409U (en) * | 2015-08-10 | 2015-12-23 | 太龙（福建）商业照明股份有限公司 | LED module that gives out light; give off light |
| CN105221984A (en) * | 2015-11-10 | 2016-01-06 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
| CN105276424A (en) * | 2015-11-10 | 2016-01-27 | 台龙电子（昆山）有限公司 | Force-electric-separation type flexible-rigid combined board luminous light bar |
| CN105303981A (en) * | 2014-02-14 | 2016-02-03 | 林谊 | Display unit of LED display screen |
| CN206650921U (en) * | 2017-04-18 | 2017-11-17 | 金罡视觉技术（深圳）有限公司 | A kind of high penetration LED display element circuit plate |
-
2017
- 2017-04-18 CN CN201710253964.0A patent/CN106900138A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120087140A1 (en) * | 2010-10-08 | 2012-04-12 | Au Optronics Corporation | Light Module |
| US8876326B1 (en) * | 2011-09-08 | 2014-11-04 | Rockwell Collins, Inc. | Multi-mode LED edge-light for NVIS compatible operation |
| CN105303981A (en) * | 2014-02-14 | 2016-02-03 | 林谊 | Display unit of LED display screen |
| CN204756569U (en) * | 2015-05-08 | 2015-11-11 | 鹤山市银雨照明有限公司 | Flexible video lamp area of LED |
| CN204901409U (en) * | 2015-08-10 | 2015-12-23 | 太龙（福建）商业照明股份有限公司 | LED module that gives out light; give off light |
| CN105221984A (en) * | 2015-11-10 | 2016-01-06 | 台龙电子（昆山）有限公司 | A kind of two-sided rigid-flex luminous lamp strip |
| CN105276424A (en) * | 2015-11-10 | 2016-01-27 | 台龙电子（昆山）有限公司 | Force-electric-separation type flexible-rigid combined board luminous light bar |
| CN206650921U (en) * | 2017-04-18 | 2017-11-17 | 金罡视觉技术（深圳）有限公司 | A kind of high penetration LED display element circuit plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170627 |
|
| RJ01 | Rejection of invention patent application after publication |