CN106852017A - The SMT production methods of flexible yielding PCB - Google Patents
The SMT production methods of flexible yielding PCB Download PDFInfo
- Publication number
- CN106852017A CN106852017A CN201611171783.5A CN201611171783A CN106852017A CN 106852017 A CN106852017 A CN 106852017A CN 201611171783 A CN201611171783 A CN 201611171783A CN 106852017 A CN106852017 A CN 106852017A
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- CN
- China
- Prior art keywords
- jig body
- pcb
- flexible
- flexible pcb
- production methods
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0165—Holder for holding a Printed Circuit Board [PCB] during processing, e.g. during screen printing
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of SMT production methods of PCB, specifically a kind of SMT production methods of flexible yielding PCB, comprise the following steps：Upper jig body and the lower jig body with hole position that offer is fixed to flexible PCB；Flexible PCB is placed in lower jig body；It is exposed from the hole position of upper jig body with each metal feed point area closed on jig body clamping flexible PCB, and flexible PCB；Electronic component is welded in metal feed point area；Jig body is removed to obtain welding the flexible PCB for being provided with various electronic components.Compared with the existing technology, when SMT pasters are carried out to flexible PCB, because flexible PCB is under the clamping of upper and lower jig body, make it equivalent to one piece of hard PCB, overcome mutability phenomenon of the flexible PCB when SMT pasters are carried out, reliability and accuracy of each electronic component when being welded with flexible PCB are ensured, so as to improve the yield of product.
Description
Technical field
The present invention relates to a kind of SMT production methods of PCB, more particularly to a kind of SMT producers of flexible yielding PCB
Method.
Background technology
Modern electronics industry is developed rapidly, and electronic product develops towards smaller, lighter, thinner direction, thin space more
Carry out more applications, stencil print process is more and more in electronics manufacturing application.Various electronics in electronic product production
Element is welded, it is necessary first to tin cream in each the metal feed point area on PCB, again passes through corresponding electronic element after
The mode of SMT pasters is welded in the corresponding feed point areas of PCB.
Then, some flexible PCBs just for the PCB of hard, and are being carried out SMT pasters by existing SMT pasters mode
When, because the thickness of flexible PCB is very thin, therefore during SMT pasters are carried out, flexible PCB deformation often occurs
Phenomenon so that electronic component cannot be smoothly welded in the corresponding metal feed point area of flexible PCB, or cannot be accurately welded on
In the corresponding feed point area of flexible PCB, so as to cause the yields of the SMT of flexible PCB very low.
Therefore, how it is accurate, reliably electronic component is welded on flexible PCB by way of SMT, to carry
The product yield of the SMT of high flexibility PCB is current problem to be solved.
The content of the invention
It is an object of the invention to provide a kind of SMT production methods of flexible yielding PCB, can accurately, it is reliable by electricity
Subcomponent is welded on flexible PCB by way of SMT, to improve the product yield of the SMT of flexible PCB.
To achieve these goals, the present invention relates to a kind of SMT production methods of flexible yielding PCB, comprising as follows
Step：
S1, offer one upper jig body being fixed to flexible PCB and lower jig body；Wherein, the upper tool
N number of hole position is offered on body, and the N is the natural number more than or equal to 1；
S2, the flexible PCB is placed in the lower jig body；
S3, the upper jig body is placed in the lower jig body, coordinates the lower tool to clamp the flexibility
PCB；Wherein, after the upper jig body is placed into the lower jig body, each metal feed point area on the flexible PCB
It is exposed from each hole position of the upper jig body；
S4, various electronic components are welded in corresponding metal feed point area using paster mode；
S5, various electronic components remove jig body and obtain welding and be provided with the soft of various electronic components after paster is completed
Property PCB.
Embodiments of the invention in terms of existing technologies, because flexible PCB is when SMT paster techniques are carried out, can be by
Upper jig body and lower jig body are clamped to it, simultaneously because having multiple hole positions in upper jig body, and ought above be controlled
After fitting in lower jig body, each metal feed point area on flexible PCB can directly from each hole of upper jig body for tool body
It is exposed in position, so that when SMT pasters are carried out to flexible PCB, the hole position that each electronic component can be passed through upper jig body
It is welded in the corresponding metal feed point area of flexible PCB, simultaneously because the clamping of upper and lower jig body may be such that flexible PCB
Equivalent to one piece of hard PCB, overcome mutability phenomenon of the flexible PCB when SMT pasters are carried out, it is ensured that each electronic component with
Reliability and accuracy when flexible PCB is welded, so as to improve the product yield of the SMT of flexible PCB.
In addition, also including following sub-step in step s 4：
The advance welding material in the surrounding in each metal feed point area；
Various electronic components are installed in corresponding metal feed point area；
Melt welding material, the electronic component for installing the flexible PCB surface is firmly welded on the flexible PCB
Together.
Further, the lower jig body is a magnetic, and it is described on control side towards the lower jig body
It is embedded with magnetic part.So that when the SMT attaching process of flexible PCB is carried out, can be by the mutual adhesive of upper and lower jig body
Fixation to flexible PCB is realized, while flexible PCB fixed performance is not influenceed, additionally it is possible to facilitate between upper and lower jig body
Dismounting and installation.
Further, the magnetic part is the magnet being distributed in the upper jig body.By being distributed in upper tool
Magnet on body, it can be ensured that between upper and lower jig body during mutual adhesive, the uniformity of each position suction such that it is able to right
The carrying out that flexible PCB is more uniformly distributed clamps, to lift the clamping effect to flexible PCB.
Further, the surrounding of each distribution of magnets jig body on described.Can further improve jig body and under
Clamping effect of the jig body to flexible PCB.
Further, also there is the installation position for placing the flexible PCB in the lower jig body.By being arranged on
Installation position in lower jig body, can further improve locating effect of the flexible PCB in lower jig body.
Further, the installation position is the groove being opened in the lower jig body.So that flexible PCB can be straight
Connect to be placed in the groove of lower jig body and realize from the positioning in lower jig body.
Further, the profile of the groove is identical with the profile of the flexible PCB, and equal in magnitude.So as to one can be entered
Step improves locating effect of the lower jig body to flexible PCB.
Further, the groove depth of the groove is equal to the thickness of the PCB.So as to when upper jig body with lower tool sheet
Body after bonded to each other, metal feed point area on flexible PCB can closer to hole position each corresponding in upper jig body, with
Guarantee will not set to the weldering of electronic component and impact.
Further, the upper jig body is compliant member.So that upper jig body can be controlled perfectly with
Tool body is bonded to each other, improves fixed effect of the upper and lower jig body to flexible PCB.
Further, the thickness of the upper jig body is less than 0.05mm.So as to ensure that upper and lower jig body is mutually being pasted
There is relatively thin thickness after conjunction, the weldering of Subsequent electronic element will not be set and impacted.
Brief description of the drawings
Fig. 1 is the FB(flow block) of the SMT production methods of the flexible mutability PCB of first embodiment of the invention；
Fig. 2 is the structure of upper jig body in the SMT production tools of the flexible mutability PCB of first embodiment of the invention
Schematic diagram；
Fig. 3 is the structure of lower jig body in the SMT production tools of the flexible mutability PCB of first embodiment of the invention
Schematic diagram；
Fig. 4 is for above jig body is controlled with in the SMT production tools of the flexible mutability PCB of first embodiment of the invention
Structural representation when tool body is fixed to flexible PCB.
Fig. 5 illustrates for the section of lower tool in the SMT production tools of the flexible mutability PCB of first embodiment of the invention
Figure.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing to each reality of the invention
The mode of applying is explained in detail.However, it will be understood by those skilled in the art that in each implementation method of the invention,
In order that reader more fully understands the application and proposes many ins and outs.But, even if without these ins and outs and base
Many variations and modification in following implementation method, it is also possible to realize the application technical scheme required for protection.
First embodiment of the invention is related to a kind of SMT production methods of flexible yielding PCB, as shown in figure 1, comprising
Following steps：
Step 101, offer one upper jig body 2 being fixed to flexible PCB 3 and lower jig body 1.Wherein, on
Multiple hole positions 21 are offered in jig body 2.
Step 102, flexible PCB is placed in lower jig body 1.
Step 103, upper jig body 2 is placed in lower jig body 1, coordinates the lower clamping of jig body 1 flexible PCB
3.Wherein, after upper jig body 2 is placed into lower jig body 1, each metal feed point area 31 on flexible PCB 3 is from upper tool
It is exposed in each hole position 21 of body 2.
Step 104, various electronic components are welded in corresponding metal feed point area 31 using paster mode.
Step 105, various electronic components remove jig body and obtain weldering and be provided with various electronic components after paster is completed
Flexible PCB.
By the above it is seen that, because flexible PCB 3 is when SMT paster techniques are carried out, can be by upper jig body 2
It is gripped with lower jig body 1, simultaneously because there are multiple hole positions in upper jig body 2, and when upper tool sheet
After fitting in lower jig body 1, each metal feed point area 31 on flexible PCB 3 can directly from each of upper jig body 2 for body 2
It is exposed in hole position 21, so that when SMT pasters are carried out to flexible PCB 3, can be by each electronic component by upper jig body 2
Hole position 21 be welded in the corresponding metal feed point area of flexible PCB 3, simultaneously because upper jig body 2 and lower jig body
1 clamping may be such that flexible PCB equivalent to one piece of hard PCB, overcomes mutability of the flexible PCB when SMT pasters are carried out and shows
As, it is ensured that reliability and accuracy of each electronic component when being welded with flexible PCB, so as to improve the SMT of flexible PCB
Product yield.
Specifically, in the present embodiment, electronic component can be first passed through in paster stencil printer using tin cream as
Welding material is printed on the surrounding in each metal feed point area 31 of flexible PCB 3, is then installed various electronic components by chip mounter
Onto the corresponding metal feed point area 31 of flexible PCB 3, finally by high temperature melt tin cream, will be arranged on by the tin cream after thawing
Each electronic component on the surface of flexible PCB 3 firmly welds together with flexible PCB 3.Thus it is seen that, in whole paster
During, realized by then passing through stencil printer and chip mounter, so that the paster process of whole flexible PCB 3 is complete
It is that automation is realized, so as to further increase reliability of the electronic component when weldering sets.
In addition, the above-mentioned lower jig body 1 being previously mentioned is in the present embodiment a magnetic, as shown in figure 3, being specially
One monoblock iron plate, and upper jig body 2 is as shown in Fig. 2 be one piece of steel disc for being embedded with magnetic part.So as to work as upper jig body
2 with lower jig body 1 when being gripped to flexible PCB 3, can by both mutual adhesive realize to flexible PCB 3
Fixation, not only serve the fixation to flexible PCB 3, also facilitate between jig body 2 and lower jig body 1
Installation and removal.
Also, in order to ensure upper jig body 2 with lower jig body 1 in mutual adhesive, positioned at upper jig body 2 and under
Flexible PCB 3 between jig body 1 can be by many by good clamping, the magnetic part being embedded in jig body 2
The individual magnet 22 being distributed in jig body 2 is constituted, specific as shown in Fig. 2 being distributed in the surrounding of jig body 2.So as to
When upper jig body 2 with lower jig body 1 in mutual adhesive after, as shown in figure 4, upper jig body 2 with lower jig body 1 to soft
The chucking power of property PCB 3 more can uniformly be distributed, it is to avoid flexible PCB 3 occurs that local chucking power is excessive or local chucking power
Too small phenomenon.
Meanwhile, in order to ensure each electronic component can be good, and accurately it is welded on each metal of flexible PCB 3
In feed point area 31, the thickness of the steel disc that upper jig body 2 is used is 0.05, so that it can have certain pliability, really
On guarantor jig body 2 can perfectly docile in lower jig body 1, to improve the fixed effect to flexible PCB 3.While by
In the thinner thickness of steel disc, so that lower jig body 1 to flexible PCB 3 with jig body 2 of closing after being fixed, it is soft
The upper surface of the metal feed point area 31 that property PCB 3 is exposed from each hole position of upper jig body 2 and upper jig body 2 is almost
Be the equal of to one piece of printed circuit board of monoblock in same level, therefore when SMT attaching process is carried out to flexible PCB
PCB carries out SMT pasters, therefore the weldering of electronic component will not be set and have any impact.Certainly in the present embodiment, steel disc
Thickness is illustrated only with 0 as a example by 05, and in actual application process, increase or subtract that the thickness of steel disc also can be appropriate
It is few, to meet different paster requirements.
Second embodiment of the present invention is related to a kind of SMT production methods of flexible yielding PCB, second embodiment to be
Further improvement is made on the basis of first embodiment, it mainly improves and is：As shown in figure 5, in the present embodiment,
Also there is the installation position for placing flexible PCB 3 in lower jig body 1.
Specifically, as shown in figure 5, the installation position is the groove 11 being opened in lower jig body 1, by groove 11 come
Flexible PCB 3 is accommodated, so as to realize positioning of the flexible PCB 3 in lower jig body 1.
And in order to further improve locating effect of the lower jig body 1 to flexible PCB 3, profile and the flexibility of the groove 11
The profile of PCB 3 is identical, and equal in magnitude.It is soft so as to when flexible PCB 3 is when being put into the groove 11 of lower jig body 1
The surrounding of property PCB 3 can completely fit with the cell wall of the surrounding of groove 11, so as to serve flexible PCB 3 in lower jig body 1
Upper position positioning, to ensure flexible PCB 3 when SMT pasters are carried out, the uniformity of each position of metal feed point area 31, so as to improve
The accuracy of each electronic component position when weldering sets, further improving non-defective unit of the flexible PCB 3 when SMT pasters are carried out
Rate.
Meanwhile, in order to ensure flexible PCB 3 is after the groove 11 for being put into lower jig body 1, will not be to the weldering of electronic component
If impacting, the depth of the groove 11 should be consistent with the thickness of flexible PCB 3 so that flexible PCB 3 can be buried completely
Enter in lower jig body 1, thus instantly jig body 1 after being fixed to flexible PCB 3 with jig body 2 of closing, due to
Flexible PCB 3 is fully located in the groove of lower jig body 1, hence in so that upper jig body 2 can be between lower jig body 1
Laminating degree it is higher, further increase the locating effect to flexible PCB 3.And also enable to flexible PCB 3 to be controlled from above
Has the upper surface of each metal feed point area 31 and upper jig body 2 being exposed in each hole position of body 2 further to same
Horizontal plane, so as to can further improve reliability and accuracy of the electronic component when weldering sets.
It will be understood by those skilled in the art that the respective embodiments described above are to realize specific embodiment of the invention,
And in actual applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (10)
1. a kind of SMT production methods of flexible yielding PCB, it is characterised in that：Comprise the following steps：
Upper jig body and the lower jig body with N number of hole position that S1, offer are fixed to flexible PCB；Wherein, the N
It is the natural number more than or equal to 1；
S2, the flexible PCB is placed in the lower jig body；
S3, the upper jig body is placed in the lower jig body, coordinates the lower tool folder body to hold the flexibility
PCB；Wherein, after the upper jig body is placed into the lower jig body, each metal feed point area on the flexible PCB
It is exposed from each hole position of the upper jig body；
S4, various electronic components are welded in corresponding metal feed point area using paster mode；
S5, various electronic components remove jig body and obtain welding the flexibility for being provided with various electronic components after paster is completed
PCB。
2. SMT production methods of flexible yielding PCB according to claim 1, it is characterised in that：Also wrap in step s 4
Containing following sub-step：
The advance welding material in the surrounding in each metal feed point area；
Various electronic components are installed in corresponding metal feed point area；
Melt welding material, the electronic component for installing the flexible PCB surface is firmly welded on one with the flexible PCB
Rise.
3. SMT production methods of flexible yielding PCB according to claim 1, it is characterised in that：The lower jig body
Be a magnetic, and it is described on control towards the side of the lower jig body and be embedded with magnetic part.
4. SMT production methods of flexible yielding PCB according to claim 3, it is characterised in that：The magnetic part is
It is distributed in the magnet in the upper jig body.
5. SMT production methods of flexible yielding PCB according to claim 4, it is characterised in that：Each distribution of magnets is in institute
State the surrounding of jig body.
6. SMT production methods of flexible yielding PCB according to claim 1, it is characterised in that：The lower jig body
On also have for placing the installation position of the flexible PCB.
7. the SMT production methods of the flexible yielding PCB described in claim 6 are made a thorough investigation of, it is characterised in that：The installation position is to open
It is located at the groove in the lower jig body.
8. SMT production methods of flexible yielding PCB according to claim 7, it is characterised in that：The profile of the groove
Profile with the flexible PCB is identical, and equal in magnitude.
9. SMT production methods of flexible yielding PCB according to claim 7, it is characterised in that：The groove depth of the groove
Equal to the thickness of the flexible PCB.
10. SMT production methods of flexible yielding PCB according to claim 1, it is characterised in that：The upper tool sheet
Body is compliant member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611171783.5A CN106852017A (en) | 2016-12-17 | 2016-12-17 | The SMT production methods of flexible yielding PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611171783.5A CN106852017A (en) | 2016-12-17 | 2016-12-17 | The SMT production methods of flexible yielding PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106852017A true CN106852017A (en) | 2017-06-13 |
Family
ID=59140416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611171783.5A Pending CN106852017A (en) | 2016-12-17 | 2016-12-17 | The SMT production methods of flexible yielding PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106852017A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312677A (en) * | 2019-08-02 | 2021-02-02 | 神讯电脑(昆山)有限公司 | Prevent product deformation empty welding mechanism |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0628828A (en) * | 1992-07-07 | 1994-02-04 | Nitto Denko Corp | Flexible printed circuit board for hard disk driver |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
-
2016
- 2016-12-17 CN CN201611171783.5A patent/CN106852017A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0628828A (en) * | 1992-07-07 | 1994-02-04 | Nitto Denko Corp | Flexible printed circuit board for hard disk driver |
| CN101384136A (en) * | 2008-10-17 | 2009-03-11 | 林克治 | Surface mounting process for flexible circuit board and used magnetic tool and steel mesh |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312677A (en) * | 2019-08-02 | 2021-02-02 | 神讯电脑(昆山)有限公司 | Prevent product deformation empty welding mechanism |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |