CN106785700A - Carry the collector of built-in sensors - Google Patents

Carry the collector of built-in sensors Download PDF

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Publication number
CN106785700A
CN106785700A CN201611062074.3A CN201611062074A CN106785700A CN 106785700 A CN106785700 A CN 106785700A CN 201611062074 A CN201611062074 A CN 201611062074A CN 106785700 A CN106785700 A CN 106785700A
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CN
China
Prior art keywords
module
collector
output end
electrically connected
sensor
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611062074.3A
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Chinese (zh)
Other versions
CN106785700B (en
Inventor
王知非
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Swr Science & Technology Co Ltd
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Jiangsu Swr Science & Technology Co Ltd
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Priority to CN201611062074.3A priority Critical patent/CN106785700B/en
Publication of CN106785700A publication Critical patent/CN106785700A/en
Application granted granted Critical
Publication of CN106785700B publication Critical patent/CN106785700B/en
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6675Structural association with built-in electrical component with built-in electronic circuit with built-in power supply
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66Structural association with built-in electrical component
    • H01R13/665Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6691Structural association with built-in electrical component with built-in electronic circuit with built-in signalling means

Abstract

The invention discloses a kind of collector for carrying built-in sensors, including housing, enclosure interior is provided with circuit board, collector includes setting MCU module on circuit boards, external tapping module, ADC modular converters, communication module, power supply module and memory, external tapping module includes some external tappings of connection external sensor, and each external tapping is electrically connected with reading circuit, reading circuit is provided with the first output end and the second output end, and the first output end of reading circuit is connected with the first input end of ADC modular converters, first output end of ADC modular converters is electrically connected with the first input end of MCU module.Collector of the present invention solve the problems, such as collector analog sensor and digital sensorses access collector when can not be compatible.

Description

Carry the collector of built-in sensors
Technical field
The present invention relates to a kind of electric coupler component and electric connector, more particularly to a kind of electricity of cooperation circuit system module Connector assembly and electric connector.
Background technology
Current education sector sensor typically divides analog output sensor and digital output sensor, and collector is all Analog sensor input port and digital quantity input port are set, and the analog sensor and digital sensorses of collector connect The different passages of collector are respectively connected to when entering collector, using differentiation trouble can not be compatible, while collector It is connected with exterior terminal and is typically chosen the USB way of outputs, communication modes is relatively simple.
In view of this, it is necessary to which the existing collector for carrying built-in sensors is further improved, it is above-mentioned to solve Problem.
The content of the invention
It is an object of the invention to provide a kind of collector, to solve to be accessed when analog sensor and digital sensorses Problem that can not be compatible during collector.
To achieve the above object, the present invention provides a kind of collector for carrying built-in sensors, including housing, the housing Inside is provided with circuit board, the collector include setting MCU module on circuit boards, external tapping module, ADC modular converters, Communication module, power supply module and memory, the external tapping module include some external tappings of connection external sensor, and often One external tapping is electrically connected with reading circuit, and the reading circuit is provided with the first output end and the second output end, the reading First output end of circuit is connected with the first input end of the ADC modular converters, the first output end of the ADC modular converters First input end with the MCU module is electrically connected with, the second output end of the reading circuit and the second of the MCU module Input is electrically connected with, and the reading circuit is capable of identify that the analog signal and data signal of external sensor, when the reading When circuit recognizes analog signal, transmitted to the ADC modular converters by the first output end of reading circuit, changed through ADC Transmitted to the MCU module by the first output end of ADC modular converters after module conversion, when the reading circuit recognizes number During word signal, transmitted to the MCU module by the second output end of the reading circuit.
As a further improvement on the present invention, be provided with the housing pressure transducer and with the pressure transducer The pressure signal acquisition module of electric connection, the output end of the pressure signal acquisition module is defeated with the ADC modular converters Enter end to be electrically connected with.
As a further improvement on the present invention, UV sensor is provided with the housing and is passed with the ultraviolet The ultraviolet signal acquisition module that sensor is electrically connected with, output end and the ADC of the ultraviolet signal acquisition module are changed The input of module is electrically connected with.
As a further improvement on the present invention, be provided with the housing light intensity sensor and with the light intensity sensor The light intensity signal collection module of electric connection, output end and the MCU module of the light intensity signal collection module are electrically connected with.
As a further improvement on the present invention, Temperature Humidity Sensor is provided with the housing and is passed with the humiture The temperature-humidity signal acquisition module that sensor is electrically connected with, output end and the MCU module of the temperature-humidity signal acquisition module It is electrically connected with.
As a further improvement on the present invention, be provided with the housing heart rate sensor and with the heart rate sensor The heart rate signal acquisition module of electric connection, output end and the MCU module of the heart rate signal acquisition module are electrically connected with.
As a further improvement on the present invention, also it is serially connected with conditioning between each reading circuit and the ADC modular converters Circuit, pre-processes with to the analog signal and data signal.
As a further improvement on the present invention, the external tapping module includes four RJ45 external tappings, each RJ45 interface It is provided with two ECP Extended Capabilities Ports.
As a further improvement on the present invention, the communication module includes usb communication module and the wireless communication module, The output end of the communication module is electrically connected with the MCU module, so that the collector can be by the usb communication mould Block or the wireless communication module are communicated with exterior terminal, the system of the exterior terminal is Android, IOS, MAC and Windows。
As a further improvement on the present invention, the power supply module is powered for internal battery to the collector, or Person is powered by external power supply to the collector.
The beneficial effects of the invention are as follows:The present invention provides a kind of new collector, including main control MCU module, external tapping Module and ADC modular converters are engaged, and the reading circuit in the external tapping module is capable of identify that the simulation letter of external sensor Number and data signal, when reading circuit recognizes analog signal, the first output end of reading circuit is transmitted to ADC moduluss of conversion Block, transmits to MCU module again after being changed through ADC modular converters, when reading circuit recognizes data signal, the of reading circuit Two output ends are transmitted to MCU module so that super collector solves the analog sensor and digital sensorses of collector Access collector when can not be compatible problem.
Brief description of the drawings
Fig. 1 is the internal module structure chart of collector of the present invention;
Fig. 2 is the structure chart of collector external tapping module of the present invention;
Fig. 3 A are the partial circuit diagram that collector modulate circuit of the present invention processes analog signal;
Fig. 3 B are another partial circuit diagram that collector modulate circuit of the present invention processes analog signal;
Fig. 3 C are the partial circuit diagram that collector modulate circuit of the present invention processes data signal.
Specific embodiment
In order that the object, technical solutions and advantages of the present invention are clearer, below in conjunction with the accompanying drawings with specific embodiment pair The present invention is described in detail.
Reference picture 1, proposes a kind of super collector, including housing in the present embodiment, enclosure interior is provided with circuit board, adopts Storage include setting main control MCU module on circuit boards, external tapping module, ADC modular converters, communication module, power supply module, Memory and some sensors being built in housing.
Reference picture 2, external tapping module includes some external tappings of connection external sensor, and each external tapping is electrically gone here and there Reading circuit is connected to, reading circuit is provided with the first output end and the second output end, and the first output end and the ADC of reading circuit are changed The first input end of module is electrically connected with, and the first output end of ADC modular converters is electrical with the first input end of main control MCU module Connection, the second output end of reading circuit is electrically connected with the second input of main control MCU module.
Reading circuit is capable of identify that the analog signal and data signal of external sensor, when reading circuit recognizes simulation letter Number when, transmitted to ADC modular converters by the first output end of reading circuit, through ADC modular converters change after by ADC change First output end of module is transmitted to main control MCU module, when reading circuit recognizes data signal, by the of reading circuit Two output ends are transmitted to main control MCU module.
External tapping module includes four RJ45 external tappings, and each RJ45 interface is provided with two ECP Extended Capabilities Ports, and four RJ45 connect Mouth is respectively J6A, J6B, J7A and J7B, institute on RJ45 interface J6A, RJ45 interface J6B, RJ45 interface J7A and RJ45 interfaces J7B Corresponding port A2, A3 and A8 are mainly used for automatic identification sensor, read the function such as information of the storage in sensor internal.
It is the reading circuit structure chart that external sensor is read to J6A external tappings, the information to sensor to be done reads Afterwards, data signal and analog signal are fed through modulate circuit and are processed by reading circuit respectively by A4 and A5 ports.Outside J6A Interface includes control element, the high level VCC being connected with port A1.A4 and A5 ports are connected with main control MCU module, to receive master Control the control signal of MCU module.
Reading circuit is specially:The port A1 of RJ45 interfaces J6A is connected with high level VCC, and RJ45 interfaces J6A port A4 and A5 are connected with main control MCU chip U1, and the port A4 of RJ45 interfaces J6A is connected with drawing for resistance R92 and diode D3 Pin 3, and the other end of resistance R92 is connected with main control MCU chip U1, the pin 2 of diode D3 is connected with high level VCC, and The pin 1 of diode D3 is grounded, and the port A5 of RJ45 interfaces J6A is connected with the pin 3 of resistance R93 and diode D5, and resistance The other end of R93 is connected with main control MCU chip U1, and the pin 2 of diode D5 is connected with high level VCC, RJ45 interface J6A's Port A6 is connected with high level VCC, and the pin 1 of diode D5 is grounded, and the port A2 of RJ45 interfaces J6A is connected with resistance R51, And the other end ground connection of resistance R51, the port A3 of RJ45 interfaces J6A is connected with resistance R52, and the other end of resistance R52 is grounded, The port A7 ground connection of RJ45 interfaces J6A, the port A8 of RJ45 interfaces J6A is connected with the pin 2 of resistance R53 and diode D21, electricity The other end ground connection of R51 is hindered, the pin 1 of diode D21 is connected with high level VCC, and the pin 3 of diode D21 is grounded.
The port B1 of RJ45 interfaces J6B is connected with high level VCC, and RJ45 interfaces J6B port B4 and B5 and master control MCU chip U1 is connected, and the port B4 of RJ45 interfaces J6B is connected with the pin 3 of diode D4, and the pin 2 of diode D4 is connected There is high level VCC, and the pin 1 of diode D4 is grounded, the port B5 of RJ45 interfaces J6B is connected with the pin 3 of diode D6, two The pin 2 of pole pipe D6 is connected with the port B6 of high level VCC and RJ45 interface J6B, and the pin 1 of diode D6 is grounded, RJ45 The port B2 of interface J6B is connected with resistance R54, and the other end of resistance R54 is grounded, and the port B3 of RJ45 interfaces J6B is connected with Resistance R56, and resistance R56 the other end ground connection, RJ45 interfaces J6B port B7 ground connection, RJ45 interfaces J6B port B8 connection There is the pin 2 of resistance R55 and diode D22, the other end ground connection of resistance R55, the pin 1 of diode D22 is connected with high level VCC, and the pin 3 of diode D22 is grounded.
The port A1 of RJ45 interfaces J7A is connected with high level VCC, and RJ45 interfaces J7A port A4 and A5 and master control MCU chip U1 is connected, and the port A4 of RJ45 interfaces J7A is connected with the pin 3 of diode D7, and the pin 2 of diode D7 is connected There is high level VCC, and the pin 1 of diode D7 is grounded, the port A5 of RJ45 interfaces J7A is connected with the pin 3 of diode D10, The pin 2 of diode D10 is connected with the port A6 of high level VCC and RJ45 interface J7AB, and the pin 1 of diode D10 is grounded, The port A2 of RJ45 interfaces J7A is connected with resistance R59, and the other end of resistance R59 is grounded, and the port A3 of RJ45 interfaces J7A connects Resistance R60 is connected to, and the other end of resistance R60 is grounded, the port A7 ground connection of RJ45 interfaces J7A, the port A8 of RJ45 interfaces J7A The pin 2 of resistance R61 and diode D20 is connected with, the other end ground connection of resistance R60, the pin 1 of diode D20 is connected with height Level VCC, and the pin 3 of diode D20 is grounded.
The port B1 of RJ45 interfaces J7B is connected with high level VCC, and RJ45 interfaces J7B port B4 and B5 and master control MCU chip U1 is connected, and the port B4 of RJ45 interfaces J7B is connected with the pin 3 of diode D8, and the pin 2 of diode D8 is connected There is high level VCC, and the pin 1 of diode D8 is grounded, the port B5 of RJ45 interfaces J7B is connected with the pin 3 of diode D9, two The pin 2 of pole pipe D9 is connected with the port B6 of high level VCC and RJ45 interface J7B, and the pin 1 of diode D9 is grounded, RJ45 The port B2 of interface J7B is connected with resistance R62, and the other end of resistance R62 is grounded, and the port B3 of RJ45 interfaces J7B is connected with Resistance R63, and resistance R63 the other end ground connection, RJ45 interfaces J7B port B7 ground connection, RJ45 interfaces J7B port B8 connection There is the pin 2 of resistance R64 and diode D19, the other end ground connection of resistance R64, the pin 1 of diode D19 is connected with high level VCC, and the pin 3 of diode D19 is grounded.
Reference picture 3A ~ Fig. 3 C, modulate circuit is also serially connected between each reading circuit and ADC modular converters, with to simulation Signal and data signal are pre-processed, and modulate circuit includes element U14, element U15, element U17 and element U18, element U15, element U17 and element U18 mainly carry out impedance variations and send into MCU module after filtering to the analog signal of sensor ADC channel, element U14 be used for buffer sensor feeding data signal input, and for will receive digital data transmission extremely Middle control MCU module.The model of element U14, element U15, element U17 and element U18 is SGM8582XMS8G.
Some sensors include that pressure transducer, UV sensor, light intensity sensor, heart rate sensor, humiture are passed Sensor.Pressure transducer is electrically connected with by a pressure signal acquisition module with ADC modular converters, pressure signal acquisition module Input is electrically connected with pressure transducer, and output end is electrically connected with the input of ADC modular converters.
Pressure transducer is electrically connected with by a pressure signal acquisition module with ADC modular converters, pressure signal collection mould The input of block is electrically connected with pressure transducer, and output end is electrically connected with the input of ADC modular converters.
UV sensor is electrically connected with by a ultraviolet signal acquisition module with ADC modular converters, ultraviolet signal The input of acquisition module is electrically connected with UV sensor, and output end is electrically connected with the input of ADC modular converters.
Light intensity sensor is electrically connected with by a light intensity signal collection module with ADC modular converters, light intensity signal collection mould The input of block is electrically connected with light intensity sensor, and output end is electrically connected with main control MCU module.
Temperature Humidity Sensor is electrically connected with by a temperature-humidity signal acquisition module with main control MCU module, temperature-humidity signal The input of acquisition module is electrically connected with Temperature Humidity Sensor, and output end is electrically connected with main control MCU module.
Heart rate sensor is electrically connected with by rate signals acquisition module with main control MCU module, heart rate signal collection mould The input of block is electrically connected with heart rate sensor, and output end is electrically connected with main control MCU module.Collector can be gathered simultaneously Temperature, humidity, pressure, light intensity, ultraviolet, heart rate signal, acquisition range are wide, disclosure satisfy that teaching demand.
Communication module includes usb communication module and wireless communication module, and output end and the MCU module of communication module electrically connect Connect, so that collector can be communicated by usb communication module or wireless communication module with exterior terminal, the system of exterior terminal Can be Android, IOS, MAC and Windows, so that the terminal device of application different system, with stronger adaptability.
Power supply module is powered for internal battery to collector, or collector is powered by external power supply, The inside of power supply module is provided with electric power management circuit, and electric power management circuit includes element U10, element U12 and button K1, electricity Element U10 in source control module boosts sensor for 5V comes to system power supply, and element U10 model SY77063, unit Power supply is processed as 3.3V power supplys for system power supply by part U12, and element U10 model RT9187, button K1 is used as switching on and shutting down Key and other operation keypress functions, it is main to realize that length presses start, it is long operated by selection function etc. with short by be shut down.
Operation principle:Pressure signal acquisition module by pressure transducer can be to external world pressure detected, it is ultraviolet Line signal acquisition module by UV sensor can be to external world UV signal detected, and pressure signal acquisition module To ADC modular converters, ADC modular converters are by the data biography after conversion for the data transfer that will be gathered with ultraviolet signal acquisition module It is defeated onto main control MCU module U1, main control MCU module U1 is communicated by communication module with exterior terminal, light intensity signal collection Module by light intensity sensor can be to external world light intensity measure, temperature-humidity signal acquisition module by humiture pass Sensor can be to external world temperature and humidity detected that heart rate signal acquisition module can be entered by heart rate sensor to heart rate Row is detected, and light intensity signal collection module, humiture collection module, heart rate signal acquisition module arrive the data transfer of collection In main control MCU module, main control MCU module can be communicated by communication module with exterior terminal so that super collection Device is various with the communication modes of exterior terminal.
To sum up, the reading circuit in the external tapping module in collector of the present invention is capable of identify that the external sensing on external tapping The analog signal and data signal of device, when reading circuit recognizes analog signal, the first output end of reading circuit transmit to ADC modular converters, transmit to MCU module again after being changed through ADC modular converters, when reading circuit recognizes data signal, read Second output end of sense circuit is transmitted to MCU module, and super collector solves the analog sensor and digital quantity of collector Sensor access collector when can not be compatible problem;And collector has usb communication transmission and wireless communication transmissions etc. Communication mode.
The above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, although with reference to preferred embodiment to this hair It is bright to be described in detail, it will be understood by those within the art that, technical scheme can be modified Or equivalent, without deviating from the spirit and scope of technical solution of the present invention.

Claims (10)

1. a kind of collector for carrying built-in sensors, including housing, the enclosure interior is provided with circuit board, it is characterised in that: The collector includes setting MCU module, external tapping module, ADC modular converters, communication module, power supply mould on circuit boards Block and memory, the external tapping module include some external tappings of connection external sensor, and each external tapping is electrical Reading circuit is connected with, the reading circuit is provided with the first output end and the second output end, the first output of the reading circuit End is connected with the first input end of the ADC modular converters, the first output end and the MCU module of the ADC modular converters First input end be electrically connected with, the second output end of the reading circuit electrically connects with the second input of the MCU module Connect, the reading circuit is capable of identify that the analog signal and data signal of external sensor, when the reading circuit recognizes mould When intending signal, transmitted to the ADC modular converters by the first output end of reading circuit, led to after being changed through ADC modular converters The first output end for crossing ADC modular converters is transmitted to the MCU module, when the reading circuit recognizes data signal, is led to The second output end for crossing the reading circuit is transmitted to the MCU module.
2. a kind of collector for carrying built-in sensors according to claim 1, it is characterised in that:Set in the housing There are pressure transducer and the pressure signal acquisition module being electrically connected with the pressure transducer, the pressure signal gathers mould The output end of block is electrically connected with the input of the ADC modular converters.
3. a kind of collector for carrying built-in sensors according to claim 2, it is characterised in that:Set in the housing There are UV sensor and the ultraviolet signal acquisition module being electrically connected with the UV sensor, the ultraviolet letter The output end of number acquisition module is electrically connected with the input of the ADC modular converters.
4. a kind of collector for carrying built-in sensors according to claim 3, it is characterised in that:Set in the housing There are light intensity sensor and the light intensity signal collection module being electrically connected with the light intensity sensor, the light intensity signal collection mould The output end of block is electrically connected with the MCU module.
5. a kind of collector for carrying built-in sensors according to claim 4, it is characterised in that:Set in the housing There are Temperature Humidity Sensor and the temperature-humidity signal acquisition module being electrically connected with the Temperature Humidity Sensor, the humiture letter The output end of number acquisition module is electrically connected with the MCU module.
6. a kind of collector for carrying built-in sensors according to claim 5, it is characterised in that:Set in the housing There are heart rate sensor and the heart rate signal acquisition module being electrically connected with the heart rate sensor, the heart rate signal gathers mould The output end of block is electrically connected with the MCU module.
7. a kind of collector for carrying built-in sensors according to claim any one of 1-6, it is characterised in that:Each reading Modulate circuit is also serially connected between sense circuit and the ADC modular converters, it is pre- to carry out to the analog signal and data signal Treatment.
8. a kind of collector for carrying built-in sensors according to claim 7, it is characterised in that:The external tapping module Including four RJ45 external tappings, each RJ45 interface is provided with two ECP Extended Capabilities Ports.
9. a kind of collector for carrying built-in sensors according to claim 1, it is characterised in that:The communication module bag Usb communication module and the wireless communication module are included, the output end of the communication module is electrically connected with the MCU module, with The collector is set to be communicated with exterior terminal by the usb communication module or the wireless communication module, it is described outer The system of portion's terminal is Android, IOS, MAC and Windows.
10. a kind of collector for carrying built-in sensors according to claim 1, it is characterised in that:The power supply module For internal battery is powered to the collector, or the collector is powered by external power supply.
CN201611062074.3A 2016-11-28 2016-11-28 The collector of included built-in sensors Active CN106785700B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
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CN106785700B CN106785700B (en) 2019-03-08

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Cited By (2)

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CN109994895A (en) * 2019-04-08 2019-07-09 沈阳仪表科学研究院有限公司 A kind of Intelligent Cable and its processing method for in-pipeline detector
CN111402564A (en) * 2020-04-15 2020-07-10 承德市德盛达科技发展有限公司 Sensor wireless module

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CN105629806A (en) * 2014-10-28 2016-06-01 江苏绿扬电子仪器集团有限公司 Four-path data acquisition system based on single-chip microcomputer
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GB2502983A (en) * 2012-06-12 2013-12-18 Incus Lab Ltd Electronic host device with flexible interface for accessory connection
CN203206483U (en) * 2013-03-11 2013-09-18 江苏苏威尔科技有限公司 Sensor data forwarding device based on Internet of things
CN103860165A (en) * 2014-02-28 2014-06-18 马骁 Lead standard interface for collecting electrocardiogram signal and electrocardiograph monitoring device
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109994895A (en) * 2019-04-08 2019-07-09 沈阳仪表科学研究院有限公司 A kind of Intelligent Cable and its processing method for in-pipeline detector
CN109994895B (en) * 2019-04-08 2023-06-20 沈阳仪表科学研究院有限公司 Intelligent cable for in-pipeline detector and processing method thereof
CN111402564A (en) * 2020-04-15 2020-07-10 承德市德盛达科技发展有限公司 Sensor wireless module

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