CN106784386A - Encapsulating structure, method for packing and electroluminescent device - Google Patents

Encapsulating structure, method for packing and electroluminescent device Download PDF

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Publication number
CN106784386A
CN106784386A CN201710025157.3A CN201710025157A CN106784386A CN 106784386 A CN106784386 A CN 106784386A CN 201710025157 A CN201710025157 A CN 201710025157A CN 106784386 A CN106784386 A CN 106784386A
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CN
China
Prior art keywords
substrate
surface
encapsulating structure
cover plate
substrate surface
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CN201710025157.3A
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Chinese (zh)
Inventor
任华进
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纳晶科技股份有限公司
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Priority to CN201710025157.3A priority Critical patent/CN106784386A/en
Publication of CN106784386A publication Critical patent/CN106784386A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3223Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED] combined with dummy elements, i.e. non-functional features
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5246Sealing arrangements having a self-supporting structure, e.g. containers characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof

Abstract

The invention provides a kind of encapsulating structure, method for packing and electroluminescent device, wherein, the encapsulating structure includes:Substrate;Cover plate, the first lid surface of cover plate is oppositely arranged with the first substrate surface of substrate, and has interval between the first lid surface and first substrate surface;Luminescent device, is arranged in interval, and contact is arranged on first substrate surface;Wherein, the first lid surface and/or first substrate surface include being circumferentially positioned at the rough region of luminescent device periphery;Packaging plastic portion, is arranged in interval, and at least partly packaging plastic portion contacts setting with rough region, and the first lid surface, first substrate surface and packaging plastic portion form the confined space for surrounding luminescent device.The encapsulating structure can well intercept steam and oxygen.

Description

Encapsulating structure, method for packing and electroluminescent device

Technical field

The present invention relates to electroluminescent device encapsulation technology field, in particular to a kind of encapsulating structure, method for packing With electroluminescent device.

Background technology

In display technology field, liquid crystal display (LCD, Liquid Crystal Display), Organic Light Emitting Diode (OLED, Organic Light-Emitting Diode) display, quanta point electroluminescent diode (QLED, Quantum Dot Light-Emitting Diode) etc. flat panel display progressively substitution cathode-ray picture tube (CRT, Cathode Ray Tube) display.Wherein, with its unique advantage, such as with self-luminous, driving voltage is low, light effect for OLED and QLED Rate is high, the response time is short, definition and contrast are high, be capable of achieving Flexible Displays and large area total colouring etc., and extensively should Used in mobile phone screen, computer monitor, full-color TV etc., it is the display device for most having development potentiality to be known as by industry.

OLED and QLED has anode, luminescent layer and the negative electrode being sequentially formed on substrate.Wherein, the luminescent layer in OLED It is organic matter, it is all very sensitive to the pollutant in air, steam and oxygen, in containing steam, the environment of oxygen easily Generation electrochemical corrosion, causes damage to OLED, makes its life-span shorter, and this seriously governs OLED industry developments;And Luminescent layer in QLED uses inorganic material, and the water resistant oxygen ability relative to OLED is stronger, but the long-term ring for being in water oxygen In border, certain influence still is produced to its luminous efficiency.Therefore, it is necessary to effectively be encapsulated to OLED and QLED, water is prevented Vapour, oxygen enter inside it.

The encapsulation of OLED and QLED mainly includes following several ways:Drier encapsulation, the encapsulation of UV glue are (also known as Damonly Encapsulation), UV glue and filling glue encapsulation (also known as Dam&Fill encapsulation), glass cement encapsulation (also known as Frit encapsulation) etc..Wherein, UV glue Encapsulation technology is that OLED encapsulation is also earliest the most frequently used technology, and it has following features:Solvent is not used or is used a small amount of molten Agent, reduces pollution of the solvent to environment;Power consumption is few, low-temperature curable, it is adaptable to the material sensitive to UV;Curing rate is fast, Efficiency high, can use in high-speed production lines, and curing apparatus floor space is small etc..But, the sealing used in the encapsulation of UV glue Glue is easier due to the reason such as the adhesion with bonding agent solidification defect, porous and substrate, encapsulation cover plate is weak, steam with oxygen Inner seal region is infiltrated through through gap, so as to the performance for causing device is comparatively fast degenerated, the lost of life.

Therefore, effectively encapsulated by device, it is ensured that the good sealing in OLED inside, reduced as far as possible The service life of device contact with oxygen, steam in external environment condition, stable performance for device and extension device is to closing weight Will.Reach more preferable packaging effect to still need to further be improved existing encapsulating structure and method for packing, to intercept water Vapour penetrates into luminescent device with oxygen.

The encapsulating structure of luminescent device of the prior art, general groove cover plate or plate glass using hydrofluoric acid etch Encapsulation, but also some companies make a few large-sized concaveconvex structures on the cover board by hydrofluoric acid photoetching process, then will be used for The frame glue of encapsulation is packaged located at the scheme between concaveconvex structure and substrate, but the relief structured surface relatively light in such scheme It is sliding, cause the relative defective tightness in the interface between frame glue and encapsulation cover plate, substrate, it is impossible to which effectively stop steam and oxygen is from frame glue Interface between encapsulation cover plate, substrate is penetrated into, and encapsulation cover plate needs photoetching process and glass with the concaveconvex structure on substrate Glass reduction process makes, and production cost is higher, and encapsulation cover plate closes with the concavo-convex set completely on substrate during encapsulation, to equipment and work The required precision of skill is higher.Therefore, this scheme is not widely used.

The content of the invention

It is a primary object of the present invention to provide a kind of encapsulating structure, and preparation method thereof and photo luminescent devices, with solve The certainly poor problem of light emitting device package construction insulation water oxygen ability in the prior art.

To achieve these goals, according to an aspect of the invention, there is provided a kind of encapsulating structure, the encapsulating structure Including:Substrate;Cover plate, the first lid surface of the cover plate is oppositely arranged with the first substrate surface of the substrate, and described There is interval between first lid surface and the first substrate surface;Luminescent device, is arranged in the interval, and contact sets Put on the first substrate surface;Wherein, first lid surface and/or the first substrate surface are included around setting In the rough region of luminescent device periphery;Packaging plastic portion, is arranged in the interval, and at least partly packaging plastic portion Setting is contacted with the rough region, first lid surface, the first substrate surface form with the packaging plastic portion and wrap Enclose the confined space of the luminescent device.

Further, the roughness of the rough region is between 0 to 1000 μm, between preferably 0 to 400 μm.

Further, the rough region is to be made using laser engraving method or pressure-air sand-blast.

Further, first lid surface and/or the first substrate surface also include smooth region, described coarse Region includes multiple adjacent projections, and the raised top is no more than the surface where the smooth region.

Further, the raw material for forming the packaging plastic portion is UV glue.

According to another aspect of the present invention, there is provided a kind of method for packing, the method for packing includes step:S1, Rough region is set in the first substrate surface of substrate and/or the first lid surface of cover plate;S2, on the first substrate surface On non-described rough region on contact set luminescent device;S3, around the luminescent device on the first substrate surface Packaging plastic portion is set;S4, first lid surface and first substrate surface are oppositely arranged, and by the cover plate and the base Plate is pressed.

Further, the method for packing also includes step S5, solidifies the packaging plastic portion.

Further, the step S1 includes:Using laser to the first substrate surface and/or first cover plate Surface performs etching, and obtains being provided with the substrate and/or cover plate of rough region.

Further, the step S1 includes:Using pressure-air sand-blast to the first substrate surface and/or described First lid surface is performed etching, and obtains being provided with the substrate and/or cover plate of rough region.

According to a further aspect of the invention, a kind of electroluminescent device applications technical scheme is additionally provided, Because the first lid surface or first substrate surface or first substrate surface and the first lid surface include rough region, and Packaging plastic portion for being bonded cover plate and substrate at least partly contacts with above-mentioned rough region, increased the area of contact interface, So as to enhance the cohesive force between substrate or cover plate and packaging plastic portion, while increased the path length of water oxygen infiltration, reduce The amount that water oxygen is penetrated into from substrate or cover plate with the contact position in packaging plastic portion, effectively improves encapsulating structure resistance in the prior art The effect of water proof oxygen, solves the poor technical problem of existing light emitting device package construction insulation water oxygen ability.

In addition to objects, features and advantages described above, the present invention also has other objects, features and advantages. Below with reference to figure, the present invention is further detailed explanation.

Brief description of the drawings

The Figure of description for constituting a part of the invention is used for providing a further understanding of the present invention, of the invention to show Meaning property and its illustrates, for explaining the present invention, not constitute inappropriate limitation of the present invention embodiment.In the accompanying drawings:

Fig. 1 shows a kind of schematic diagram of optional encapsulating structure provided by the present invention;

Fig. 2 shows the schematic diagram of another optional encapsulating structure provided by the present invention;

Fig. 3 shows a kind of top view of the substrate/cover plate of optional encapsulating structure provided by the present invention;

Fig. 4 shows the top view of the substrate/cover plate of another optional encapsulating structure provided by the present invention;

Fig. 5 shows a kind of side view of the substrate/cover plate of optional encapsulating structure provided by the present invention;And

Fig. 6 shows a kind of flow chart of optional method for packing provided by the present invention.

Wherein, above-mentioned accompanying drawing is marked including the following drawings:

1st, luminescent device corresponding region;2nd, rough region;3rd, smooth region;10th, substrate;11st, first substrate surface;20、 Packaging plastic portion;30th, luminescent device;40th, cover plate;41st, the first lid surface.

Specific embodiment

It should be noted that in the case where not conflicting, the embodiment in the present invention and the feature in embodiment can phases Mutually combination.Describe the present invention in detail below with reference to the accompanying drawings and in conjunction with the embodiments.

In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention Accompanying drawing, is clearly and completely described to the technical scheme in the embodiment of the present invention, it is clear that described embodiment is only The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people The every other embodiment that member is obtained under the premise of creative work is not made, should all belong to the model of present invention protection Enclose.

It should be noted that term " first ", " in description and claims of this specification and above-mentioned accompanying drawing Two " it is etc. for distinguishing similar object, without for describing specific order or precedence.It should be appreciated that so using Data can exchange in the appropriate case, so as to embodiments of the invention described herein.Additionally, term " including " and " tool Have " and their any deformation, it is intended that covering is non-exclusive to be included, for example, containing series of steps or unit Process, method, system, product or equipment are not necessarily limited to those steps clearly listed or unit, but may include without clear It is listing to Chu or for these processes, method, product or other intrinsic steps of equipment or unit.

As described in background technology, light emitting device package construction insulation water oxygen ability of the prior art is poor. Present inventor is studied regarding to the issue above, it is proposed that a kind of encapsulating structure, method for packing and electroluminescent device, As depicted in figs. 1 and 2, the encapsulating structure includes substrate 10;Cover plate 40, the of the first lid surface 41 of cover plate 40 and substrate 10 One substrate surface 11 is oppositely arranged, and has interval between the first lid surface 41 and first substrate surface 11;Luminescent device 30, It is arranged in interval, and contact is arranged on first substrate surface 11;Wherein, the first lid surface 41 and/or first substrate table Face 11 includes being circumferentially positioned at the rough region 2 of luminescent device periphery;Packaging plastic portion 20, is arranged in interval, and at least partly Packaging plastic portion 20 contacts setting with rough region 2, and the first lid surface 41, first substrate surface 11 and packaging plastic portion 20 form bag Enclose the confined space of luminescent device 30.

Substrate 10 in above-described embodiment can be glass substrate, and now, rough region 2 can correspond to shaggy Frosted glass region, above-mentioned luminescent device 30 can be organic electroluminescence device (Organic Light-Emitting Diode, abbreviation OLED), or quanta point electroluminescent device (Quantum Dot Light-Emitting Diode, Abbreviation QLED), cover plate can be plane cover plate as shown in Figure 1, or " recessed " type cover plate as shown in Figure 2, work as cover plate During for shape as shown in Figure 2, the first lid surface 41 is the nonplanar surface being oppositely arranged with first substrate surface 11.

Using the present invention, due to the first lid surface or first substrate surface or first substrate surface and the first cover plate table Face includes rough region, and is at least partly contacted with above-mentioned rough region for being bonded the packaging plastic portion of cover plate and substrate, increases The area of contact interface is added, so as to enhance the cohesive force between substrate or cover plate and packaging plastic portion, while increased water oxygen The path length of infiltration, reduces the amount that water oxygen is penetrated into from substrate or cover plate with the contact position in packaging plastic portion, effectively improves Encapsulating structure intercepts the effect of water oxygen in the prior art, solves existing light emitting device package construction insulation water oxygen ability poor Technical problem.In an optional embodiment, above-mentioned first lid surface and/or first substrate surface can also include putting down Skating area domain, the roughness can be equal to or short in the surface where smooth domain.

In a preferred embodiment, above-mentioned rough region can include multiple adjacent projections, and raised top is not More than the surface on (the first lid surface 41 or first substrate surface 11) where smooth region.

In an optional embodiment, the roughness of above-mentioned rough region can be between 0 to 1000 μm, preferably Between 0 to 400 μm, the roughness in above-described embodiment refers to surface roughness, namely refers to have on the piece surface after processing Smaller spacing and the microcosmos geometric shape feature that is constituted of small peak valley, usually by the processing method taken or other because What element was formed.

By above-described embodiment, can make the roughness of rough region in a suitable scope, be allowed to and packaging plastic Portion can have good contact, increase the adhesion in packaging plastic portion.Rough region in above-described embodiment is to be circumferentially positioned at Luminescent device periphery, wherein, circular mode can be closed surrounding, or non-enclosed circular.

The above-mentioned substrate with rough region or cover plate are described in detail with reference to Fig. 3 to Fig. 5.

As shown in Fig. 3, Fig. 4 and Fig. 5, rough region 2 is looped around the outside of luminescent device corresponding region 1, smooth region 3 In the outside of rough region 2, luminescent device corresponding region 1, rough region 2 and smooth region 3 are all disposed within substrate 10 or cover plate On 40 side surface, wherein, as shown in figure 3, rough region 2 can be looped around luminescent device corresponding region 1 with fully closed Outside;As shown in figure 4, rough region 2 can also be the non-fully closed outside for being looped around luminescent device corresponding region 1. Both can be side's annular as shown in Figure 3, or as shown in Figure 4 also, the shape of rough region can be arbitrary Multiple strips, those skilled in the art can according to actual needs select suitable figure.

Rough region in above-described embodiment can be using laser engraving method or the making of pressure-air sand-blast Into.The method for preparing above-mentioned rough region can include two kinds, and the first is made using laser engraving method, for example green Or ultraviolet laser, being performed etching under 5w power or more, 5~20kHz frequencies, laser facula is smaller than being equal to hot spot Diameter is advisable, and spacing is optimal, but not limited to this parameter in 2/3rds spot diameter, and those skilled in the art can basis It is actually needed adjustment technology parameter;Second method is pressure-air sand-blast.For example:The pressure that sandblasts is 0.5Ma, and spray gun is with glass Glass distance is 100mm, and the rhombus Buddha's warrior attendant of a diameter of 50um is husky, and angle of gun is 90 degree, and selective pattern is stained with glass (will not Wish to be directed onto the place of sand with being stained with gummed paper, it would be desirable to expose in the place sandblasted) gummed paper, 30~50s of blast time, But the method is also not necessarily limited to this parameter, those skilled in the art can adjustment technology parameter according to actual needs.

The rough region made by the above method, can include multiple irregular minor structures, and eyes seem to set There is frosted finish effect into rough surface, the surface of specific rough region is by many not of uniform size in irregular shape small Koppie is constituted, and surface forms stronger diffusing reflection, as ground glass surface topography.So trapezoidal recessed compared to existing The surface of male structure, contact area is bigger, and cohesive force is stronger, and the path distance that water oxygen penetrates into device is longer, therefore with more preferable Obstruct water oxygen corrode effect.

In order that above-mentioned encapsulating structure has more preferable packaging effect, and production cost is reduced, form packaging plastic portion 20 Raw material can be UV glue.

In an optional embodiment, the contact area on packaging plastic portion 20 and first substrate surface 11, more than or equal to the Rough region 2 on one substrate surface 11;The contact area of the lid surface 41 of packaging plastic portion 20 and first, more than or equal to the first lid Rough region 2 in plate surface 41.

By above-described embodiment, outside UV glue is arranged in rough region and slightly above rough region during encapsulation, setting Region all covers coarse domain, and size is greater than the size of above-mentioned rough region, can facilitate highly to come by glass dust Control encapsulation pressing height and the width.

In the first lid surface 41 or on first substrate surface 11 or in the first lid surface 41 and first substrate On surface 11, around rough region 2 periphery be outer rim smooth region 3, packaging plastic portion 20 also with least part of outer rim smooth area Domain 3 contacts, and the steam and oxygen of outside can so be preferably isolated in outside encapsulating structure.

According to another aspect of the present invention, a kind of method for packing is additionally provided, as shown in fig. 6, the method for packing includes step:

S1, rough region is set in the first lid surface of the first substrate surface of substrate and/or cover plate;

S2, contacts on the non-rough region on first substrate surface and sets luminescent device;

S3, packaging plastic portion is set on first substrate surface around luminescent device;

S4, the first lid surface is oppositely arranged with first substrate surface, and cover plate and substrate are pressed.

By above-mentioned method for packing, the encapsulating structure including substrate, cover plate, packaging plastic portion and luminescent device is formd, by In being provided with rough region on the first lid surface or first substrate surface or first substrate surface and the first lid surface, and Packaging plastic portion for being bonded cover plate and substrate contacts with above-mentioned rough region, increased the area of contact interface, so as to strengthen Cohesive force between substrate or cover plate and packaging plastic portion, while increased the path length of water oxygen infiltration, reduce water oxygen from The amount that substrate or cover plate penetrate into the contact position in packaging plastic portion, effectively improves encapsulating structure in the prior art and intercepts water oxygen Effect, solves the poor technical problem of existing light emitting device package construction insulation water oxygen ability.

In the above-described embodiments, method for packing can also include step S5, solidify above-mentioned packaging plastic portion, so that luminescent device Preferably protected.

Also, the specific method that rough region is set in the step S1 in above-described embodiment can include two kinds.

The first is:First substrate surface and/or the first lid surface are performed etching using laser, is provided with The substrate and/or cover plate of rough region, wherein, laser is green or ultraviolet laser, and the power of etching is more than or equal to 5w, The frequency range of etching is 5~20kHz, and the laser facula of etching is smaller than being equal to the diameter of laser facula, preferably laser light The spot diameter that spot spacing is equal to 2/3rds.

It is for second:First substrate surface and/or the first lid surface are performed etching using pressure-air sand-blast, is obtained To the substrate and/or cover plate that are provided with rough region, wherein, the pressure that sandblasts of sand-blast is 0.5Ma, spray gun and first substrate table The distance of face and/or the first lid surface is 100mm, and the rhombus Buddha's warrior attendant in sand-blast using a diameter of 50um is husky, angle of gun It it is 90 degree, blast time is 30~50s.

Rough region is made on substrate or cover plate using above two mode, not only process is simple, and low cost It is honest and clean, relatively low to processing technology requirement.

In accordance with a further aspect of the present invention, there is provided a kind of electroluminescent device, the electroluminescent device includes that encapsulation is tied Structure, the encapsulating structure is the encapsulating structure in above-mentioned any one embodiment.

There is above-mentioned encapsulating structure so that electroluminescent device is not susceptible to steam and oxygen in the electroluminescent device Influence, it is ensured that photoelectric device have the life-span more long.

In order that obtaining those skilled in the art can clearly understand the technical scheme of the application, below with reference to The method for packing of OLED is illustrated with encapsulating structure specific embodiment.

Specific encapsulation process is in hundred grades of clean rooms.Specific method for packing includes:

First, the cover plate with coarse structure is made.

By industrial thickness for the glass cover plate surfaces of 0.7mm are cleaned, (the first lid surface) is true on the cover board The region of fixed luminescent device to be placed, the Outboard Sections around above-mentioned zone on the cover board set rough region, above-mentioned coarse The use pressure-air sand-blast in region is performed etching, and obtains being provided with the substrate of rough region, wherein, the pressure that sandblasts of sand-blast Power is 0.5Ma, and the distance of spray gun and the first lid surface is 100mm, using the rhombus diamond dust of a diameter of 50um in sand-blast, Angle of gun is 90 degree, and blast time is 50s.Then the cover plate with rough region that will have been etched is cleaned, drying for standby.

Secondly, the substrate with coarse structure is made.

Prepare clean TFT substrate, according to the size of the pre- luminescent device for making, (first substrate surface) is true on substrate The region of fixed luminescent device to be placed, and the position for being looped around the rough region of above-mentioned luminescent device areas outside.Using laser Rough region on device engraving method treatment substrate, using ultraviolet laser, performs etching under 5w power and 20kHz frequencies, swashs The spot diameter that light hot spot spacing is equal to 2/3rds, etching depth is 1000 μm, and etch period is 45s, the dust suction in etching. Then the substrate that will have been etched is cleaned, drying for standby.

Again, the hot evaporation luminescent device OLED on substrate.

Luminescent device OLED includes the first electrode layer that order is stacked, the first functional layer, the second functional layer, luminous Layer, the 3rd functional layer, the 4th functional layer and the second electrode lay, the material for forming first electrode layer (anode) are tin indium oxide (ITO), the material of the first functional layer is CuPC, and the material of the second functional layer is NPD, blue light and red light-emitting that luminescent layer is used Layer material is respectively the 8-hydroxyquinoline aluminium (Alq3) of DPVBi and doping 0.7%DCJTB, and the material of the 3rd functional layer is 8- hydroxyls Base quinoline aluminum (Alq3), the 4th functional layer is lithium fluoride (LiF), and the second electrode lay (negative electrode) is aluminium, wherein, first electrode layer sets Put on the tft substrate.

4th, in the rough region of substrate, UV glue is set.

On the first substrate surface of substrate, in the rough region for setting, coating UV glue (can be formed after UV adhesive curings Packaging plastic portion), make UV glue all above-mentioned rough regions of covering.

5th, the above-mentioned cover plate with above-mentioned rough region is pressed with the aforesaid substrate with above-mentioned UV glue, form envelope Assembling structure, and solidify above-mentioned UV glue.

By cover plate together with UV glue, baseplate-laminating so that UV glue is contacted with the rough region on cover plate, and covers cover plate On whole rough regions, and slightly exceed above-mentioned rough region.Then, ultraviolet light polymerization UV glue, forms it into packaging plastic portion, pressure Post package glue portion height 12um or so is closed, the encapsulating structure shown in Fig. 1 is formed.

Finally, device is put into 60 DEG C of constant temperature, is placed in the environment of constant humidity 85%, and test.

Device is put into thermostatic constant wet equipment carries out temperature 60 C, in the environment of humidity 85%RH, observes and logger Start the time for circular pore occur inside part, observation interval be 4 hours once.By the testing time of 220 hours, Test condition and test structure are as shown in table 1.

Table 1

By the test result of above-mentioned table 1, under the conditions of the different encapsulation of identity unit, there is the time of circular stain not Together, wherein, using the luminescent device being respectively provided with the encapsulating structure of the substrate of rough region and cover plate, than the base for being even surface The encapsulating structure of plate and cover plate, the time for stain needs occur is longer, it was demonstrated that be difficult using the device of the encapsulating structure of the application Influenceed by factors such as extraneous water oxygens.

As can be seen from the above description, the application the above embodiments realize following technique effect:

1), the encapsulating structure in the application is due on the first lid surface or first substrate surface or first substrate surface Rough region is provided with the first lid surface, and is connect with above-mentioned rough region for being bonded the packaging plastic portion of cover plate and substrate Touch, the area of contact interface is increased, so as to enhance the cohesive force between substrate or cover plate and packaging plastic portion, while increased The path length that water oxygen is penetrated into, reduces the amount that water oxygen is penetrated into from substrate or cover plate with the contact position in packaging plastic portion, effectively changes It has been apt to the effect that encapsulating structure in the prior art intercepts water oxygen, has solved existing light emitting device package construction insulation water oxygen ability Poor technical problem.

2), the method for packing in the application, in substrate and cover plate at least one surface is roughened, and is obtained Substrate and/or cover plate with rough region, then contact packaging plastic portion with above-mentioned rough region, form by packaging plastic Portion, substrate, the sealing space of cover plate composition, while increased the cohesive force between substrate and cover plate and packaging plastic portion, enhance The performance of the waterproof oxygen attack of encapsulating structure, plays preferable steam and oxygen obstruction effect, it is to avoid steam enters envelope with oxygen The inside of assembling structure, influences the life-span of luminescent device.

3), the electroluminescent device of the application has above-mentioned encapsulating structure so that electroluminescent device is not susceptible to water The influence of vapour and oxygen, it is ensured that electroluminescent device has the life-span more long.

The preferred embodiments of the present invention are the foregoing is only, is not intended to limit the invention, for the skill of this area For art personnel, the present invention can have various modifications and variations.It is all within the spirit and principles in the present invention, made any repair Change, equivalent, improvement etc., should be included within the scope of the present invention.

Claims (10)

1. a kind of encapsulating structure, it is characterised in that the encapsulating structure includes:
Substrate (10);
Cover plate (40), first lid surface (41) of the cover plate (40) and first substrate surface (11) phase of the substrate (10) There is interval to setting, and between first lid surface (41) and the first substrate surface (11);
Luminescent device (30), is arranged in the interval, and contact is arranged on the first substrate surface (11), wherein, institute The first lid surface (41) and/or the first substrate surface (11) are stated including being circumferentially positioned at the thick of the luminescent device periphery Rough region (2);
Packaging plastic portion (20), is arranged in the interval, and at least partly packaging plastic portion (20) and the rough region (2) Contact is set, and first lid surface (41), the first substrate surface (11) form with the packaging plastic portion (20) and surround The confined space of the luminescent device (30).
2. encapsulating structure according to claim 1, it is characterised in that the roughness of the rough region (2) is 0 to 1000 Between μm, between preferably 0 to 400 μm.
3. encapsulating structure according to claim 1, it is characterised in that
The rough region (2) is to be made using laser engraving method or pressure-air sand-blast.
4. encapsulating structure according to claim 1, it is characterised in that first lid surface (41) and/or described One substrate surface (11) also includes smooth region (3), and the rough region includes multiple adjacent projections, the raised top No more than the surface where the smooth region (3).
5. encapsulating structure according to claim 1, it is characterised in that the raw material for forming the packaging plastic portion (20) is UV Glue.
6. a kind of method for packing, it is characterised in that the method for packing includes step:
S1, rough region is set in the first lid surface of the first substrate surface of substrate and/or cover plate;
S2, contacts in the non-described rough region on the first substrate surface and sets luminescent device;
S3, packaging plastic portion is set on the first substrate surface around the luminescent device;
S4, first lid surface and first substrate surface is oppositely arranged, and the cover plate is pressed with the substrate.
7. method for packing according to claim 6, it is characterised in that the method for packing also includes step:
S5, solidifies the packaging plastic portion.
8. method for packing according to claim 6, it is characterised in that the step S1 includes:
The first substrate surface and/or first lid surface are performed etching using laser, obtains being provided with coarse The substrate and/or cover plate in region.
9. method for packing according to claim 6, it is characterised in that the step S1 includes:
The first substrate surface and/or first lid surface are performed etching using pressure-air sand-blast, is set It is equipped with the substrate and/or cover plate of rough region.
10. a kind of electroluminescent device, including encapsulating structure, it is characterised in that the encapsulating structure is in claim 1 to 5 Encapsulating structure described in any one.
CN201710025157.3A 2017-01-13 2017-01-13 Encapsulating structure, method for packing and electroluminescent device CN106784386A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101009303A (en) * 2006-01-27 2007-08-01 三星Sdi株式会社 Organic light emitting display and method of fabricating the same
JP2007258006A (en) * 2006-03-23 2007-10-04 Pioneer Electronic Corp Method of manufacturing sealing member for optical device, method of manufacturing optical device, optical device, and sealing member for optical device
CN103885249A (en) * 2012-12-19 2014-06-25 索尼公司 Moisture-proof structure and display device
CN104332563A (en) * 2014-09-01 2015-02-04 京东方科技集团股份有限公司 Packaging method, display panel and manufacturing method thereof, and display device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101009303A (en) * 2006-01-27 2007-08-01 三星Sdi株式会社 Organic light emitting display and method of fabricating the same
JP2007258006A (en) * 2006-03-23 2007-10-04 Pioneer Electronic Corp Method of manufacturing sealing member for optical device, method of manufacturing optical device, optical device, and sealing member for optical device
CN103885249A (en) * 2012-12-19 2014-06-25 索尼公司 Moisture-proof structure and display device
CN104332563A (en) * 2014-09-01 2015-02-04 京东方科技集团股份有限公司 Packaging method, display panel and manufacturing method thereof, and display device

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