CN106739235A - A kind of heat conducting element and preparation method thereof - Google Patents
A kind of heat conducting element and preparation method thereof Download PDFInfo
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- CN106739235A CN106739235A CN201611148856.9A CN201611148856A CN106739235A CN 106739235 A CN106739235 A CN 106739235A CN 201611148856 A CN201611148856 A CN 201611148856A CN 106739235 A CN106739235 A CN 106739235A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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Abstract
The invention provides a kind of heat conducting element, the heat conducting element includes heat-conducting layer, non-adhesive layer and does not paste；The non-adhesive layer, it is simultaneously provided with groove, and another side is attached with the one side of the heat-conducting layer, the setting of groove can increase frictional force, wait when mounted, and heat transfer element is difficult to slip, the one side and heat-conducting layer for being not provided with groove are attached so that the connection of heat-conducting layer and non-adhesive layer is tightr.It with the phase-change material of 40~50 mass parts is matrix that non-adhesive layer is, and metal packing with 600~800 mass parts and the ceramic packing of 300~600 mass parts combine to be formed, simultaneously, it is additionally provided with the another side of non-adhesive layer and is not pasted, so, when heat transfer element is not used, can prevent heat-conducting layer from being sticked together with other components, and dust can be avoided to enter so that heat-conducting layer loses viscosity.On this basis, the present invention also provides a kind of preparation method of the heat conducting element.
Description
Technical field
The present invention relates to electronic radiation technical field, more particularly to a kind of heat conducting element and preparation method thereof.
Background technology
In the last few years with the fast development of electronic product, electronic product integrated level more and more higher, increasingly essence of doing manual work also
Cause, thus the performance requirement to the electronic component of interiors of products is higher.
The heat dissipation problem that all of electronic component is directed to because electronic component temperature can rise in use
Height, especially transistor and some semiconductor devices are particularly easy to heating, when the temperature of electronic component is raised, electronic component
Can decline, ultimately result in the Quality Down of electronic product.
Therefore, in order to ensure the quality of electronic product, first have to solve is exactly the heat dissipation problem for handling electronic component well.
Fan of the larger electronic product of usual volume equipped with heat transmission, but for the electronic product of small volume, due to interiors of products
Insufficient space is radiated, it is necessary to be equipped with the smaller heat dissipation element of volume.When heat dissipation element is connected with heater element, generally need
The gap between heater element and heat dissipation element is filled with packing material and Heat Conduction Material.Heat-conducting pad is a kind of conventional
Heat-conducting interface material.
In the prior art, the heat-conducting mode being commonly used is that ultra-soft heat-conducting pad is attached on heater element, is reassembled
It is fixed on heat dissipation element.But the both side surface of heat-conducting pad all has viscosity, and hardness is low, and there are the following problems：One be because
Glue hand and heat-conducting pad mounting position is difficult alignment；Two is, it is necessary to heat-conducting pad surface and radiating in assembling heater element
Frictional resistance between element is unable to greatly lean and correct assembly；After three are two-sided adhesive heat-conducting pad long-time use, can and dissipate
Thermal element is bonded closely so that maintenance personal carries out the situation of operating difficulties during detachable maintaining, so as to influence maintenance to imitate
Rate.
Therefore, the heat-conducting pad of prior art is difficult in the presence of dismounting, the low defect of installation accuracy, in view of this, it would be highly desirable to pin
A kind of novel heat-conducting element is invented to such case, to improve the disassembly efficiency and installation accuracy of heat-conducting pad, so as to improve
The quality of electronic product.
The content of the invention
For drawbacks described above, present invention solves the technical problem that being, there is provided a kind of heat conducting element, to solve present technology
There is dismounting difficulty, the low problem of installation accuracy in existing heat-conducting pad.
It is the invention provides a kind of heat conducting element being arranged between heat dissipation element and heater element including heat-conducting layer, non-
Viscous layer and do not paste, the non-adhesive layer, it is simultaneously provided with groove, another side is attached with the one side of the heat-conducting layer；Its
In, the non-adhesive layer with the phase-change material of 40~50 mass parts be matrix, the metal packing with 600~800 mass parts and 300
The ceramic packing of~600 mass parts combines to be formed；It is described do not paste the another side for being arranged on the heat-conducting layer, it is described not paste
Surface area is more than the heat-conducting layer and the surface area for not pasting contact.
Preferably, the thickness of the non-adhesive layer is 0.02~0.3mm, and the metal packing includes that particle diameter is 8~15 μm
Al.
Preferably, the ceramic packing includes in Al2O3, AlN, BN, ZnO and SiN that particle diameter is 0.8~1.5 μm
Plant or various combinations.
Preferably, the heat-conducting layer, with the matrix of 5~10 mass parts, is 5~40 μm with the particle diameter of 20~80 mass parts
One or more combination is formed in Al, Al2O3, AlN, BN, ZnO and SiN.
Preferably, described matrix is polysiloxanes or organosilicon, and the end of the chain or side chain of the polysiloxanes at least contain two
Individual alkenyl.
Preferably, the polysiloxanes includes dimethyl silicone polymer that viscosity is 10~5000mPa.s.
The present invention also provides a kind of preparation method of heat conducting element, including：
1) it is matrix with the phase-change material of 10~30 mass parts, with 150~300 mass parts metal packings and 30~100 matter
The ceramic packing composition mixture of part is measured, 120~180min is stirred at 110~150 DEG C；Again by calendering technology, prepare
Non-adhesive layer；
2) using the polysiloxanes or organosilicon of 5~10 mass parts as matrix, Al, Al2O3 with 20~80 mass parts,
One or more composition mixture in AlN, BN, ZnO and SiN, stirs 60~120min；By calendering technology, heat conduction is prepared
Layer, then 20~40min is toasted at a temperature of 110~130 DEG C；
3) non-adhesive layer is overlayed on heat-conducting layer, is covered in heat-conducting layer and does not cover non-stick by that will not be pasted after calendering technology
Property layer one side, prepare with the inviscid heat conducting element of one side.
From such scheme, the invention provides a kind of heat conducting element, the heat conducting element includes heat-conducting layer, non-sticky
Layer and do not paste；The non-adhesive layer, it is simultaneously provided with groove, and another side is attached with the one side of the heat-conducting layer, groove
Setting can increase frictional force, wait when mounted, and heat transfer element is difficult to slip, and the one side and heat-conducting layer for being not provided with groove are pasted
It is attached so that the connection of heat-conducting layer and non-adhesive layer is tightr.
It with the phase-change material of 40~50 mass parts is matrix that the non-adhesive layer is, and with the metal of 600~800 mass parts
The ceramic packing of filler and 300~600 mass parts combines a kind of PCM material of the heat conduction to be formed, and it is arranged on appointing for heat-conducting layer
One surface, this material influences very little to the overall heat conductivility of heat conducting element.Meanwhile, in this programme, the peeling force of heat-conducting layer
With frictional resistance all very littles, so convenient in assembling process install and adjust, the precision of installation can be ensured, secondly as
The presence of non-adhesive layer, heater element, heat dissipation element and heat conducting element three will not simultaneously adhesion, dismounting when, also more
Plus it is convenient.
Meanwhile, it is additionally provided with the another side of heat-conducting layer and is not pasted, so, when heat transfer element is not used, can be with
Prevent heat-conducting layer from being sticked together with other components, and dust can be avoided to enter so that heat-conducting layer loses viscosity.Especially,
The surface area do not pasted is more than the heat-conducting layer and the surface area for not pasting contact, so waits when deployed, convenient
To not paste and remove.
In preferred scheme of the invention, the heat-conducting layer be with the matrix of 5~10 mass parts, and with 20~80 mass parts
Particle diameter be 5~40 μm Al, Al2O3, a kind of material that one or more of mixture combination is prepared in AlN, BN, ZnO, SiN
Material.The heat conducting element is arranged between heat dissipation element and heater element for transmitting heat, heat-conducting layer good heat conductivity, can be with
The heat that heater element is produced quickly is delivered to heat dissipation element.
Present invention also offers a kind of preparation method of heat conducting element, have by heat conducting element obtained in above-mentioned preparation method
There is internal structure firmly, be hardly damaged, good stability, convenient disassembly, the advantages of heat conductivility is excellent.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation of specific embodiment of heat conducting element provided by the present invention.
Fig. 2 is the top view of Fig. 1.
In Fig. 1-2：
Non-adhesive layer 1, groove 11, heat-conducting layer 2, do not paste 3.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The present embodiment provides a kind of heat conducting element being arranged between heat dissipation element and heater element, as shown in Figure 1-2.Its
In, Fig. 1 is a kind of structural representation of specific embodiment of heat conducting element provided by the present invention.Fig. 2 is the top view of Fig. 1.This is led
Thermal element is arranged between heat dissipation element and heater element, and it includes heat-conducting layer 2, non-adhesive layer 1 and does not paste 3, non-sticky
The one side of layer 1 sets fluted 11, and the one side of another side and heat-conducting layer 2 is attached, and the setting of groove 11 can increase and be rubbed with hand
Power is wiped, is waited when mounted, heat transfer element is difficult to slip, and the one side and heat-conducting layer 2 for being not provided with groove 11 are attached so that heat-conducting layer
2 and non-adhesive layer 1 connection it is tightr.Here, heat-conducting layer 2 and the depth of the thickness of non-adhesive layer 1 and groove 11 in figure is equal
For many times of amplifications are illustrated, non-actual size proportionate relationship.Certainly, the one side of non-adhesive layer 1 can also be arranged to salient point or rib
Etc. the structure that can strengthen its frictional force.
Wherein, it with the phase-change material of 40~50 mass parts is matrix that non-adhesive layer 1 is, and with the gold of 600~800 mass parts
The thickness that the ceramic packing of category filler and 300~600 mass parts is combined is a kind of PCM materials of heat conduction of 0.02~0.3mm
Material, its any surface for being arranged on heat-conducting layer 2, compared to using surface conditioning agent or aluminium/Copper Foil as non-adhesive layer 1, this hair
It is bright using PCM films as non-adhesive layer 1, itself have certain thermal conductivity factor, so covering on the surface of heat-conducting layer 2, to heat conduction
Element heat conductivility influences very little.
Meanwhile, it is additionally provided with the another side of heat-conducting layer 2 and does not paste 3, so, when heat transfer element is not used, can
To prevent heat-conducting layer 2 from being sticked together with other components, and dust can be avoided from entering so that heat-conducting layer 2 loses viscosity.Especially
It is, when the surface area for not pasting 3 is more than heat-conducting layer 2 and does not paste the surface area of 3 contacts, so to wait when deployed, conveniently will not
Stickup is removed.
When needing and heat transfer element is installed only need to that 3 will not be pasted and remove, heat-conducting layer 2 is then attached to installation position
Put, it is convenient in assembling process to install and adjust because peeling force and frictional resistance all very littles of heat-conducting layer 2,
Installation accuracy is ensured, due to the presence of non-adhesive layer 1, heater element, heat dissipation element and heat conducting element three will not glue simultaneously
Even, when dismounting, also more facilitate.
It should be noted that the metal packing mentioned in the present embodiment can be the Al that particle diameter is 8~15 μm, ceramic packing
Including the Al that particle diameter is 0.8~1.5 μm2O3, one or more in AlN, BN, ZnO, SiN of combination.Certainly, metal can also
Al is substituted from other metals.As long as the effect above can be played in the claimed scope of the application after metal and application
It is interior.
Further, heat conducting element is arranged between heat dissipation element (not shown) and heater element (not shown)
For transmitting heat, heat-conducting layer 2 is the main heat transfer element of heat conducting element, and the quality of the heat conductivility of heat-conducting layer 2 is directly influenced
Heat-transfer effect.Therefore, it with the polysiloxanes or organosilicon of 5~10 mass parts is matrix that heat-conducting layer of the invention 2 is, and with 20~
The particle diameter of 80 mass parts is 5~40 μm Al, Al2O3, in AlN, BN, ZnO, SiN one or more of mixture combination prepare
's.The end of the chain or side chain as the polysiloxanes of the matrix of heat-conducting layer 2 at least contain two alkenyls, and polysiloxanes is including viscosity
The dimethyl silicone polymer of 10~5000mPa.s.The heat-conducting effect of heat-conducting layer 2 of so manufacture is good, can produce heater element
Raw heat is quickly delivered to heat dissipation element.
In addition, present embodiment additionally provides the preparation method of the heat conducting element：
First, be matrix with the phase-change material of 10~30 mass parts, and with 150~300 mass parts metal packings and 30~
The mixture of the ceramic packing composition of 100 mass parts stirs 120~180min at a temperature of 110~150 DEG C, prepares combination material
Material, then by calendering technology, prepare non-adhesive layer 1；
Secondly, the polysiloxanes or organosilicon using 5~10 mass parts be used as matrix, and Al with 20~80 mass parts,
Al2O3, one or more of mixture stirs 60~120min in AlN, BN, ZnO, SiN, by calendering technology, prepares heat conduction
Layer 2, then 20~40min is toasted at a temperature of 110~130 DEG C；Preferably, the thickness of heat-conducting layer 2 prepared is 2.0~2.5mm,
Certain this scope is the preferred scope of the application, is not construed as limiting for the protection domain that this programme is limited.
Again, non-adhesive layer 1 is overlayed on heat-conducting layer 2, heat-conducting layer 2 is covered in not by 3 will not be pasted after calendering technology
The one side of non-adhesive layer 1 is covered, is prepared with the inviscid heat conducting element of one side.
In order that the more uniform of mixing must be stirred in preparation method, it is possible to use planet stirring hybrid mode.
The present invention being described in detail referring to several different embodiments, being worth understanding, the following example is to show
Example property explanation, rather than to concrete restriction of the invention.
Embodiment 1
50 mass parts phase-change materials, the Al fillers that 700 mass parts particle diameters are 15 μm and 600 mass parts particle diameters are taken for 1.5 μm
ZnO fillers sequentially add, 120min is stirred by way of planet stirring at a temperature of 110 DEG C, by calender roll
Prepare the thick heat conduction PCM materials of 0.13mm；
Substep takes the polysiloxanes of 8 mass parts, and 25 mass parts particle diameters are 5 μm of Al2O3It it is 40 μm with 40 mass parts particle diameters
Al2O3, stirred by way of planet stirring 60 minutes, the heat-conducting layer 2 for 2.0mm is rolled by calender, then at 110 DEG C
Baking 40min；
The thick PCM of 0.13mm are taken, is covered to any surface of the heat-conducting layer 2 for having rolled, by calendering, 3 will not pasted and be covered in
Heat-conducting layer 2 does not cover the one side of non-adhesive layer 1, prepares with the inviscid heat conducting element of one side.
It is random to obtain the inviscid heat conducting element sample of one side, thermal conductivity factor (w/k.m) and peeling force (N) are carried out to sample
Test, test result such as table 1.
Embodiment 2
It is 0.8 μm to take 40 mass parts phase-change materials, the Al fillers that 600 mass parts particle diameters are 8 μm and 300 mass parts particle diameters
Al2O3Filler is sequentially added, and 180min is stirred by way of planet stirring at a temperature of 150 DEG C, is rolled by calender and is made
The heat conduction PCM material thick for 0.3mm is gone out；
Substep takes the polysiloxanes of 10 mass parts, 15 mass parts particle diameters be 5 μm Al and 25 μm of 65 mass parts
Al2O3, is stirred 120 minutes by way of planet stirring, and the heat-conducting layer 2 for 2.5mm is rolled by calender, then at 130 DEG C
Lower baking 20min；
The thick PCM of 0.3mm are taken, is covered to any surface of the heat-conducting layer 2 for roll, by rolling, 3 will not be pasted be covered in and lead
Thermosphere 2 does not cover the one side of non-adhesive layer 1, prepares with the inviscid heat conducting element of one side.
It is random to obtain the inviscid heat conducting element sample of one side, thermal conductivity factor (w/k.m) and peeling force (N) are carried out to sample
Test, test result such as table 1.
Embodiment 3
45 mass parts phase-change materials, the Al fillers that 800 mass parts particle diameters are 10 μm and 600 mass parts particle diameters are taken for 1.0 μm
ZnO fillers sequentially add, 160min is stirred by way of planet stirring at a temperature of 130 DEG C, by calender roll
Prepare the thick heat conduction PCM materials of 0.02mm；
Substep takes the polysiloxanes of 10 mass parts, and 20 mass parts particle diameters are 40 μm of AlN, are stirred by way of planet stirring
Mix 80 minutes, the heat-conducting layer 2 for 2.2mm is rolled by calender, then 30min is toasted at 120 DEG C；
The thick PCM of 0.02mm are taken, is covered to any surface of the heat-conducting layer 2 for having rolled, by calendering, 3 will not pasted and be covered in
Heat-conducting layer 2 does not cover the one side of non-adhesive layer 1, prepares with the inviscid heat conducting element of one side.
It is random to obtain the inviscid heat conducting element sample of one side, thermal conductivity factor (w/k.m) and peeling force (N) are carried out to sample
Test, test result such as table 1.
Embodiment 4
Take 46 mass parts phase-change materials, the Al fillers that 650 mass parts particle diameters are 14 μm, 200 mass parts particle diameters are 1.5 μm
The ZnO and Al that 120 mass parts particle diameters are 1.2 μm2O3Filler is sequentially added, at a temperature of 120 DEG C by way of planet stirring
Stirring 140min, the thick heat conduction PCM materials of 0.25mm are prepared by calender calendering；
Substep takes the organosilicon of 5 mass parts, and 30 mass parts particle diameters are 8 μm of ZnO and 25 mass parts particle diameters are 35 μm
Al2O3, stirred by way of planet stirring 90 minutes, the heat-conducting layer 2 for 2.4mm is rolled by calender, then at 125 DEG C
Baking 40min；
The thick PCM of 0.25mm are taken, is covered to any surface of the heat-conducting layer 2 for having rolled, by calendering, 3 will not pasted and be covered in
Heat-conducting layer 2 does not cover the one side of non-adhesive layer 1, prepares with the inviscid heat conducting element of one side.
It is random to obtain the inviscid heat conducting element sample of one side, thermal conductivity factor (w/k.m) and peeling force (N) are carried out to sample
Test, test result such as table 1.
Comparative example
Substep takes the polysiloxanes of 12 mass parts, and 25 mass parts particle diameters are 5 μm of Al2O3It it is 40 μm with 40 mass parts particle diameters
Al2O3, stirred by way of planet stirring 60 minutes, the heat-conducting layer 2 for 2.0mm is rolled by calender, then at 110 DEG C
Baking 40min, prepares the heat conducting element of biadhesive.
The random heat conducting element sample for obtaining biadhesive, thermal conductivity factor (w/k.m) and peeling force (N) are carried out to sample
Test, test result such as table 1.
| Embodiment one | Embodiment two | Embodiment three | Example IV | Comparative example | |
| Thermal conductivity factor | 1.12 | 1.23 | 1.12 | 1.14 | 1.3(w/m.k) |
| Peeling force | 0.001 | 0.003 | 0.001 | 0.002 | 0.3(N) |
Table 1
It can be seen from Table 1 that, have peeling force low by heat conducting element obtained in above-mentioned preparation method, convenient disassembly,
The advantages of heat conductivility is excellent.
The foregoing description of the disclosed embodiments, enables professional and technical personnel in the field to realize or uses the present invention.
Various modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The scope most wide for causing.
Claims (7)
1. a kind of heat conducting element, for being arranged between heat dissipation element and heater element, it is characterised in that including：
Heat-conducting layer；
Non-adhesive layer, it is simultaneously provided with groove, and another side is attached with the one side of the heat-conducting layer；Wherein, the non-adhesive layer
Phase-change material with 40~50 mass parts is matrix, the pottery of metal packing and 300~600 mass parts with 600~800 mass parts
Porcelain filling combines to be formed；
Do not paste, be arranged on the another side of the heat-conducting layer, the surface area do not pasted more than the heat-conducting layer with it is described not
Paste the surface area of contact.
2. heat conducting element according to claim 1, it is characterised in that：The thickness of the non-adhesive layer is 0.02~0.3mm,
The metal packing includes Al that particle diameter is 8~15 μm.
3. heat conducting element according to claim 2, it is characterised in that：The ceramic packing includes that particle diameter is 0.8~1.5 μm
Al2O3, one or more in AlN, BN, ZnO and SiN of combination.
4. heat conducting element according to claim 3, it is characterised in that：The heat-conducting layer with the matrix of 5~10 mass parts, with
The particle diameter of 20~80 mass parts is 5~40 μm Al, Al2O3, in AlN, BN, ZnO and SiN one or more combination formed.
5. heat conducting element according to claim 4, it is characterised in that：Described matrix be polysiloxanes or organosilicon, it is described
The end of the chain or side chain of polysiloxanes at least contain two alkenyls.
6. heat conducting element according to claim 5, it is characterised in that：The polysiloxanes include viscosity be 10~
The dimethyl silicone polymer of 5000mPa.s.
7. a kind of preparation method of heat conducting element, it is characterised in that including：
1) it is matrix with the phase-change material of 40~50 mass parts, with 600~800 mass parts metal packings and 300~600 mass parts
Ceramic packing composition mixture, at 110~150 DEG C stir 120~180min；Again by calendering technology, non-stick is prepared
Property layer；
2) using the polysiloxanes or organosilicon of 5~10 mass parts as matrix, Al, Al with 20~80 mass parts2O3、AlN、BN、
One or more composition mixture in ZnO and SiN, stirs 60~120min；By calendering technology, heat-conducting layer is prepared, then
20~40min is toasted at a temperature of 110~130 DEG C；
3) non-adhesive layer is overlayed on heat-conducting layer, is covered in heat-conducting layer and does not cover non-adhesive layer by that will not be pasted after calendering technology
One side, prepare with the inviscid heat conducting element of one side.
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| CN205142769U (en) * | 2015-12-01 | 2016-04-06 | 深圳市添正弘业科技有限公司 | Graphite heat radiation structure for smart phone and tablet computer |
| CN105940560A (en) * | 2014-02-04 | 2016-09-14 | 迪睿合株式会社 | Anisotropic conductive film and method for producing same |
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2016
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101488434A (en) * | 2008-01-16 | 2009-07-22 | 西安东旺精细化学有限公司 | Graphite composite heat conducting sheet |
| CN102555331A (en) * | 2012-01-18 | 2012-07-11 | 苏州领胜电子科技有限公司 | Thermal-conductive silicon sheet and manufacturing method thereof |
| CN105940560A (en) * | 2014-02-04 | 2016-09-14 | 迪睿合株式会社 | Anisotropic conductive film and method for producing same |
| CN205142769U (en) * | 2015-12-01 | 2016-04-06 | 深圳市添正弘业科技有限公司 | Graphite heat radiation structure for smart phone and tablet computer |
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Application publication date: 20170531 |
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