CN106735660A - A kind of soldering cellular board panel high strength alumin ium alloy composite plate, core, clad and skin material - Google Patents

A kind of soldering cellular board panel high strength alumin ium alloy composite plate, core, clad and skin material Download PDF

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Publication number
CN106735660A
CN106735660A CN201611156331.XA CN201611156331A CN106735660A CN 106735660 A CN106735660 A CN 106735660A CN 201611156331 A CN201611156331 A CN 201611156331A CN 106735660 A CN106735660 A CN 106735660A
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CN
China
Prior art keywords
composite plate
clad
soldering
core
skin material
Prior art date
Application number
CN201611156331.XA
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Chinese (zh)
Inventor
宋友宝
吕金明
段海龙
严安
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无锡银邦防务科技有限公司
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Priority to CN201611156331.XA priority Critical patent/CN106735660A/en
Publication of CN106735660A publication Critical patent/CN106735660A/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/18Sheet panels
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/10Aluminium or alloys thereof

Abstract

The present invention relates to a kind of soldering cellular board panel high strength alumin ium alloy composite plate, core, clad and skin material.The composite plate includes the skin material, the first clad, core, the second clad that are sequentially overlapped, and thickness is 0.5 2.5mm, wherein, the skin material is 4 line aluminium alloys, and the mass content of Si is 4.5 11%;First clad and the second clad are 1050 aluminium alloys containing Si elements, and the mass content of Si is 0.7 0.9%;The core is 6 line aluminium alloys, its solidus temperature >=580 DEG C.Carrier gas soldering high-strength aluminum alloy composite plate of the invention, core, clad and skin material, its intensity is still maintained not decline while composite plate weight saving is ensured, and cause that the panel material of aluminum honeycomb panel containing Mg is applied to carrier gas soldering, improve soldering production efficiency and reduce production cost.

Description

A kind of soldering cellular board panel high strength alumin ium alloy composite plate, core, clad and Pi Cai

Technical field

It is compound with high strength alumin ium alloy the invention mainly relates to soldering cellular board field, more particularly to soldering cellular board panel Plate, core, clad and skin material.

Background technology

Aluminum honeycomb panel due to series of advantages such as lightweight, intensity is high, rigidity is big, good stability, heat-and sound-insulatings, extensively It is general to be applied in the fields such as track traffic, building, ship, aircraft.Cellular board is made up of panel and honeycomb core, traditional aluminium honeybee Nest plate is formed by connecting panel and honeycomb core are gluing, and the working environment of its intensity, service life and permission is largely It is limited by the performance of adhesive.Easily taken off in high humidity, vibration working environment lower panel too drastic, too high or too low for temperature Glue, causes flatwise tensile strength and peel strength reduction.Soldering aluminum honeycomb panel is that aluminium alloy panel and honeycomb core are passed through into method for welding The aluminium alloy plate being formed by connecting, realizes the metallurgical binding of panel and honeycomb core, and its mechanical property is not only above the glue of same specification Viscous cellular board, and the shortcomings of can overcome that gluing cellular board high temperature resistant is poor, be influenceed big by working environment.

Existing soldering aluminum honeycomb panel panel is formed by the aluminium alloy of the multilayer difference trade mark through Rolling compund, its Aluminium Alloys in Common Use It is 4xxx/3xxx/4xxx to constitute, and wherein 4xxx aluminium alloys are referred to as skin material, and solder is served as in soldering, and its thickness accounts for whole panel 10% or so of thickness;Middle 3xxx aluminium alloys are referred to as core, there is provided strength support, is the main composition portion of panel material Point, therefore such panel material is also called 3 line aluminium alloy plates.

However, 3 line aluminium alloys cause its pricker deposited strength to be limited because not heat-treatable strengthened.And " lightweight, high-performance, Safety and environmental protection and energy saving " are the inexorable trend of the industry development such as communications and transportation and building, and then renewal is proposed to aluminum honeycomb panel Requirement higher, that is, still maintain intensity not decline while requiring thinning honeycomb plate thickness, weight saving.And traditional 3 are Aluminium alloy panel can not meet lightweight requirements.

Through research, it is known that Mg elements are added in aluminium can improve intensity of aluminum alloy, but aluminium alloy containing Mg is in carrier gas soldering, Mg to be easily evaporated and generate MgO with O, and MgO can reduce solder fluidity;In addition, Mg can also be with brazing flux reaction consumption brazing flux.Cause Vacuum brazing being used this aluminium alloy containing Mg more.But current vacuum brazing equipment is expensive, efficiency is low, can greatly increase production cost. Therefore, exploitation to raising aluminum honeycomb panel intensity, reduces production cost suitable for the panel material of aluminum honeycomb panel containing Mg of carrier gas soldering It is particularly important.

Thus, it is necessary to soldering cellular board panel high strength alumin ium alloy composite is developed, to ensure composite plate weight Still maintain its intensity not decline while mitigation, and cause that the panel material of aluminum honeycomb panel containing Mg is applied to carrier gas soldering, carry High efficiency, reduces production cost.

The content of the invention

Regarding to the issue above, the present invention is intended to provide soldering cellular board panel high strength alumin ium alloy composite plate, core, cladding Layer and skin material, still maintain its intensity not decline, and cause the honeycomb of aluminium containing Mg with while composite plate weight saving is ensured Plate face plate material is applied to carrier gas soldering, and improve production efficiency reduces production cost.

The invention provides a kind of soldering cellular board panel high strength alumin ium alloy composite plate, the composite plate includes folding successively Plus skin material, the first clad, core, the second clad, wherein, the skin material is 4 line aluminium alloys, and the mass content of Si is 4.5-11%;First clad and the second clad are 1050 aluminium alloys containing Si elements, and the mass content of Si is 0.7-0.9%;The core is 6 line aluminium alloys, its solidus temperature >=580 DEG C.

Above-mentioned composite plate, the thickness of the composite plate is 0.5-2.5mm.

Above-mentioned composite plate, the thickness of the skin material is 40-200 μm.

The thickness of above-mentioned composite plate, first clad and the second clad is identical, and thickness is 40-200 μm.

Above-mentioned composite plate, the composite plate is annealed state aluminium alloy compound plate.

Above-mentioned composite plate, the yield strength of the composite plate after soldering is more than 100MPa.

Above-mentioned composite plate, the composite board material after soldering includes Mg2Si hardening constituents.

The present invention also provides a kind of core of soldering cellular board panel high strength alumin ium alloy composite plate, and the core is for 6 Aluminium alloy, its solidus temperature >=580 DEG C.

The present invention also provides a kind of clad of soldering cellular board panel high strength alumin ium alloy composite plate, and the clad is 1050 aluminium alloys containing Si elements, the mass content of Si is 0.7-0.9%.

The present invention also provides a kind of skin material of soldering cellular board panel high strength alumin ium alloy composite plate, and the skin material is for 4 Aluminium alloy, the mass content of Si is 4.5-11%.

The core of soldering cellular board panel composite plate of the present invention uses 6 line aluminium alloys, heat-treatable strengthened, soldering and pricker The cooling procedure of postwelding, solution strengthening treatment, therefore the face after soldering have been carried out equivalent to 6 line aluminium alloys in composite panel Plate intensity is greatly promoted, and then improves soldering aluminum honeycomb panel intensity.And contain appropriate Si elements in each layer aluminium alloy, it is higher The Si of content can react to form Mg with Mg2Si hardening constituents, further increase the intensity of panel, while Mg can be prevented in soldering It is evaporated in journey, realizes the good carrier gas brazing property of panel containing Mg, improve soldering efficiency, reduces brazing cost.

Brief description of the drawings

Fig. 1 is the structural representation of the four-layer structure soldering cellular board panel composite plate of the embodiment of the present invention.

Specific embodiment

Below in conjunction with drawings and Examples, specific embodiment of the invention is described in more details, so as to energy Enough more fully understand the advantage of the solution of the present invention and various aspects.However, specific embodiments described below and implementation Example is only descriptive purpose, rather than limitation of the present invention.

To solve the problems, such as that existing aluminum honeycomb panel low intensity, the brazing cost of aluminium alloy panel containing Mg be high, efficiency is low, the present invention A kind of new soldering aluminum honeycomb panel Al alloy composite and composite plate are provided, the panel material is made up of four layers of aluminium alloy, And successively by skin material aluminium alloy, the first clad aluminium alloy, core aluminium alloy, the second clad is aluminum alloy rolled is complex as plate Material, alloy supply of material state is annealed state.Wherein skin material uses 4 line aluminium alloys, and the mass content of Si is 4.5-11%;First cladding Layer uses 1050+Si aluminium alloys with the second clad, and the mass content of Si is 0.7-0.9%;Core uses 6 line aluminium alloys, Its solidus temperature >=580 DEG C.Limitation to core solidus temperature is to adapt to corresponding carrier gas brazing temperature.

Cooling procedure after soldering and soldering, solution strengthening treatment has been carried out equivalent to 6 line aluminium alloys in composite plate, Therefore slab strength is greatly improved, and then improves soldering aluminum honeycomb panel intensity.Great number tested data is counted, described after soldering The yield strength of composite plate is more than 100MPa.

The thickness of the composite board is 0.5-2.5mm, and wherein skin material thickness is 40-200 μm, the first and second cladding thickness Degree is identical, and thickness range is 40-200 μm;Remaining as core.The structural representation of composite board is as shown in figure 1, wherein part 1 is Pi Cai, part 2 is the first clad, and part 3 is core, and part 4 is the second clad.

Compared with background technology, traditional aluminum honeycomb panel panel is 3 line aluminium alloys, not heat-treatable strengthened treatment, panel Intensity is limited, it is impossible to meet light-weighted requirement, and aluminium alloy containing Mg must use vacuum as aluminum honeycomb panel panel material Soldering, low production efficiency, high cost.And the aluminum honeycomb panel panel that the present invention is provided is 6 line aluminium alloys, heat-treatable strengthened, pricker Cooling procedure after weldering and soldering, solution strengthening treatment, therefore soldering have been carried out equivalent to 6 line aluminium alloys in composite panel Slab strength afterwards is greatly promoted, and then improves the intensity of soldering aluminum honeycomb panel.And using 1050+Si aluminium alloys as cladding Layer, core contains appropriate Si elements with skin material, and the Si of high level can react to form Mg with Mg2Si hardening constituents, further carry The intensity of panel high, while Mg can be prevented to be evaporated in brazing process, realizes the good carrier gas soldering of panel containing Mg Can, soldering efficiency is improve, reduce brazing cost.

Embodiment 1

Aluminium alloy compound plate is prepared, thickness is 1.2mm, and alloy state is annealed state.Wherein, skin material is closed using 4043 aluminium Gold, skin material thickness is 60 μm, and the mass content of Si is 4.5%;First clad and the second clad are closed using 1050+Si aluminium Gold, the mass content of Si is 0.75%, and coating thickness is 50 μm;Core is 6061 aluminium alloys, and fusion temperature scope is 582- 652 DEG C, thickness is 1.04mm.Soldering is simulated to the aluminium alloy compound plate, carrier gas brazing temperature is 570 DEG C, insulation 10min, protective atmosphere is nitrogen.Composite plate yield strength after soldering is 110MPa, and common 3 line aluminium alloy composite plate soldering Yield strength is only 40-60MPa afterwards, therefore has been greatly improved the intensity of soldering aluminum honeycomb panel, and composite plate thinner thickness, Body weight is lighter, realizes lightweight.

Embodiment 2

Aluminium alloy compound plate is prepared, thickness is 1.0mm, and alloy state is annealed state.Wherein, skin material is closed using 4045 aluminium Gold, the mass content of Si is 10%, and skin material thickness is 90 μm;First clad and the second clad use 1050+Si aluminium alloys, The mass content of Si is 0.85%, and coating thickness is 60 μm;Core is 6063 aluminium alloys, and fusion temperature scope is 615-655 DEG C, thickness is that 0.79mm. is simulated soldering to the aluminium alloy compound plate, and carrier gas brazing temperature is 605 DEG C, and soaking time is 15min, protective atmosphere is nitrogen.Composite plate yield strength after soldering is 123MPa, and common 3 line aluminium alloy composite plate soldering Yield strength is only 40-60MPa afterwards, therefore is greatly improved soldering aluminum honeycomb panel intensity, and composite plate thinner thickness, body weight It is relatively light, realize lightweight.

Embodiment 3

Aluminium alloy compound plate is prepared, thickness is 0.8mm, and alloy state is annealed state.Wherein, skin material is closed using 4343 aluminium Gold, the mass content of Si is 8%, and skin material thickness is 40 μm;First clad and the second clad use 1050+Si aluminium alloys, The mass content of Si is 0.80%, and coating thickness is 50 μm;Core is 6151 aluminium alloys, and fusion temperature scope is 588-650 DEG C, thickness is that 0.66mm. is simulated soldering to the aluminium alloy compound plate, and carrier gas brazing temperature is 575 DEG C, and soaking time is 8min, protective atmosphere is nitrogen.Composite plate yield strength after soldering is 105MPa, and common 3 line aluminium alloy composite plate soldering Yield strength is only 40-60MPa afterwards, therefore is greatly improved soldering aluminum honeycomb panel intensity, and composite plate thinner thickness, body weight It is relatively light, realize lightweight.

Embodiment 4

Aluminium alloy compound plate is prepared, thickness is 0.5mm, and alloy state is annealed state.Wherein, skin material is closed using 4047 aluminium Gold, the mass content of Si is 11%, and skin material thickness is 120 μm;First clad and the second clad are closed using 1050+Si aluminium Gold, the mass content of Si is 0.7%, and coating thickness is 40 μm;Core is 6951 aluminium alloys, and fusion temperature scope is 615- 654 DEG C, thickness is that 0.3mm. is simulated soldering to the aluminium alloy compound plate, and carrier gas brazing temperature is 600 DEG C, and soaking time is 8min, protective atmosphere is nitrogen.Composite plate yield strength after soldering is 103MPa, and common 3 line aluminium alloy composite plate soldering Yield strength is only 40-60MPa afterwards, therefore is greatly improved soldering aluminum honeycomb panel intensity, and composite plate thinner thickness, body weight It is relatively light, realize lightweight.

Embodiment 5

Aluminium alloy compound plate is prepared, thickness is 2.5mm, and alloy state is annealed state.Wherein, skin material is closed using 4045 aluminium Gold, the mass content of Si is 10%, and skin material thickness is 200 μm;First clad and the second clad are closed using 1050+Si aluminium Gold, the mass content of Si is 0.9%, and coating thickness is 200 μm;Core is 6053 aluminium alloys, and fusion temperature scope is 596- 651 DEG C, thickness is that 1.9mm. is simulated soldering to the aluminium alloy compound plate, and carrier gas brazing temperature is 580 DEG C, and soaking time is 8min, protective atmosphere is nitrogen.Composite plate yield strength after soldering is 130MPa, and common 3 line aluminium alloy composite plate soldering Yield strength is only 40-60MPa afterwards, therefore is greatly improved soldering aluminum honeycomb panel intensity, and composite plate thinner thickness, body weight It is relatively light, realize lightweight.

Finally it should be noted that:Obviously, above-described embodiment is only intended to clearly illustrate example of the present invention, and simultaneously The non-restriction to implementation method.For those of ordinary skill in the field, can also do on the basis of the above description Go out the change or variation of other multi-forms.There is no need and unable to be exhaustive to all of implementation method.And thus drawn Obvious change that Shen goes out or among changing still in protection scope of the present invention.

Claims (10)

1. a kind of soldering cellular board panel high strength alumin ium alloy composite plate, the composite plate includes the skin material, first that are sequentially overlapped Clad, core, the second clad, wherein,
The skin material is 4 line aluminium alloys, and the mass content of Si is 4.5-11%;
First clad and the second clad are 1050 aluminium alloys containing Si elements, and the mass content of Si is 0.7- 0.9%;
The core is 6 line aluminium alloys, its solidus temperature >=580 DEG C.
2. composite plate as claimed in claim 1, it is characterised in that the thickness of the composite plate is 0.5-2.5mm.
3. composite plate as claimed in claim 1 or 2, it is characterised in that the thickness of the skin material is 40-200 μm.
4. composite plate as claimed in claim 3, it is characterised in that the thickness phase of first clad and the second clad Together, thickness is 40-200 μm.
5. the composite plate as described in claim 1,2 or 4, it is characterised in that the composite plate is annealed state aluminium alloy compound plate.
6. composite plate as claimed in claim 5, it is characterised in that the yield strength of the composite plate after soldering is 100MPa More than.
7. composite plate as claimed in claim 6, it is characterised in that the composite board material after soldering includes Mg2Si strengthens Phase.
8. a kind of soldering cellular board panel core of high strength alumin ium alloy composite plate, it is characterised in that the core is that aluminium is closed for 6 Gold, 6 line aluminium alloy solidus temperature >=580 DEG C.
9. a kind of soldering cellular board panel clad of high strength alumin ium alloy composite plate, it is characterised in that the clad be containing 1050 aluminium alloys of Si elements, the mass content of Si is 0.7-0.9%.
10. a kind of soldering cellular board panel skin material of high strength alumin ium alloy composite plate, it is characterised in that the skin material is aluminium for 4 Alloy, the mass content of Si is 4.5-11%.
CN201611156331.XA 2016-12-14 2016-12-14 A kind of soldering cellular board panel high strength alumin ium alloy composite plate, core, clad and skin material CN106735660A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107962825A (en) * 2017-09-26 2018-04-27 缪彬彬 A kind of aluminum alloy honeycomb plate

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869421A (en) * 1988-06-20 1989-09-26 Rohr Industries, Inc. Method of jointing titanium aluminide structures
JPH10216870A (en) * 1997-02-05 1998-08-18 Nippon Light Metal Co Ltd Honeycomb panel
US6758388B1 (en) * 2001-02-27 2004-07-06 Rohr, Inc. Titanium aluminide honeycomb panel structures and fabrication method for the same
CN101155937A (en) * 2005-04-12 2008-04-02 株式会社神户制钢所 Aluminum alloy brazing sheet and aluminum alloy tube for heat exchanger
CN101372161A (en) * 2007-08-23 2009-02-25 南通华特铝热传输材料有限公司 Brazing aluminium alloy multilayer composite board material and method for producing the same
CN103009013A (en) * 2012-06-01 2013-04-03 青岛泰泓轨道装备有限公司 Method for preparing metal honeycomb core and honeycomb sandwich board
CN104080935A (en) * 2011-11-02 2014-10-01 株式会社Uacj Aluminum alloy clad material for molding
CN105880866A (en) * 2015-01-15 2016-08-24 江苏财发铝业股份有限公司 Heat-resistant aluminum alloy soldering composite material and preparation method thereof
CN106041354A (en) * 2016-07-06 2016-10-26 江苏常铝铝业股份有限公司 High-corrosion-resistance four-layer aluminum alloy brazing plate and manufacturing method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4869421A (en) * 1988-06-20 1989-09-26 Rohr Industries, Inc. Method of jointing titanium aluminide structures
JPH10216870A (en) * 1997-02-05 1998-08-18 Nippon Light Metal Co Ltd Honeycomb panel
US6758388B1 (en) * 2001-02-27 2004-07-06 Rohr, Inc. Titanium aluminide honeycomb panel structures and fabrication method for the same
CN101155937A (en) * 2005-04-12 2008-04-02 株式会社神户制钢所 Aluminum alloy brazing sheet and aluminum alloy tube for heat exchanger
CN101372161A (en) * 2007-08-23 2009-02-25 南通华特铝热传输材料有限公司 Brazing aluminium alloy multilayer composite board material and method for producing the same
CN104080935A (en) * 2011-11-02 2014-10-01 株式会社Uacj Aluminum alloy clad material for molding
CN103009013A (en) * 2012-06-01 2013-04-03 青岛泰泓轨道装备有限公司 Method for preparing metal honeycomb core and honeycomb sandwich board
CN105880866A (en) * 2015-01-15 2016-08-24 江苏财发铝业股份有限公司 Heat-resistant aluminum alloy soldering composite material and preparation method thereof
CN106041354A (en) * 2016-07-06 2016-10-26 江苏常铝铝业股份有限公司 High-corrosion-resistance four-layer aluminum alloy brazing plate and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107962825A (en) * 2017-09-26 2018-04-27 缪彬彬 A kind of aluminum alloy honeycomb plate

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Application publication date: 20170531