CN106683988A - Target material device - Google Patents

Target material device Download PDF

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Publication number
CN106683988A
CN106683988A CN201611237980.2A CN201611237980A CN106683988A CN 106683988 A CN106683988 A CN 106683988A CN 201611237980 A CN201611237980 A CN 201611237980A CN 106683988 A CN106683988 A CN 106683988A
Authority
CN
China
Prior art keywords
connector
target device
protective plate
retainer ring
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201611237980.2A
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Chinese (zh)
Other versions
CN106683988B (en
Inventor
朱桔源
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to CN201611237980.2A priority Critical patent/CN106683988B/en
Publication of CN106683988A publication Critical patent/CN106683988A/en
Application granted granted Critical
Publication of CN106683988B publication Critical patent/CN106683988B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26Bombardment with radiation
    • H01L21/263Bombardment with radiation with high-energy radiation
    • H01L21/2633Bombardment with radiation with high-energy radiation for etching, e.g. sputteretching
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching

Abstract

The embodiment of the invention discloses a target material device. The target material device is provided with a connecting piece and a protective plate, wherein the connecting piece comprises a supporting ring and a fixed ring, and multiple ceramic connecting piece accessories are arranged on the fixed ring at intervals; the protective plate comprises a bottom and a top formed by extending from the bottom, the top is hollow, the bottom is supported by the connecting piece accessories and covers one end face of the fixed ring, and the inner circumferential face, extending from the bottom, of the top encircles the end face, away from the fixed ring, of the supporting ring. The target material device has the advantages that the connecting piece structure exposed outside is placed into the protective plate to be protected, the protective plate is capable of protecting the connecting piece structure exposed outside from sputter of substances formed during target material sputtering coating to prevent the connecting piece from being damaged, and the service life of the connecting piece is prolonged. The substances sputtered on the protective plate are washed away easily, so that the use ratio of the connecting piece and the protective plate is increased, and the production cost is greatly reduced.

Description

A kind of target device
Technical field
The present invention relates to display processing technique field, more particularly to a kind of target device.
Background technology
Thin film transistor liquid crystal display screen (TFT-LCD) is by thin film transistor (TFT) (TFT) array base palte and color film (CF) substrate Box is formed.Wherein, sunk on CF substrates, it is necessary to pass through the methods such as magnetron sputtering or evaporation coating during CF substrate manufactures One layer of indium tin oxide (ITO) film of product.Ito thin film has excellent electric conductivity and visible light transmissivity, is a kind of important Nesa coating, is usually at present that the ito thin film on CF substrates is prepared using magnetron sputtering technique.It is prepared by magnetron sputtering technique The principle of ito thin film is to realize plasma discharge under vacuum, and the motion of charged particle, bombardment are controlled using electromagnetic field ITO target, ITO target atom is knocked away, and is attached on CF substrates, so as to form required film on CF substrates.So And, during magnetic control spattering target coated basal plate, the material formed in sputter procedure easily splashes down the connection in target bottom On part, the structure of connector is destroyed, the service life of connector is reduced, so as to cause production cost to sharp rise.While ITO targets Polyether-ether-ketone (peek) accessory exposure on the connector of material bottom is easily shocked by electricity and is burned out in atmosphere, is burned out Connector accessory is easily caused production equipment cancel closedown, it is necessary to the connector accessory for more renewing can just restart work, makes Into the waste of capacity loss and time, manpower, material etc., the shipment yield of product is greatly have impact on.
The content of the invention
Embodiment of the present invention offer is a kind of can be with the target device of extension device service life.
A kind of target device is the embodiment of the invention provides, the device is provided with connector and protective plate, the connector Including support ring and retainer ring, the support ring is positioned within the retainer ring, and multiple potteries are interval with the retainer ring The connector accessory of porcelain;The protective plate includes bottom and the top extended from the bottom, and the top is in hollow Shape, the bottom is by the connector fitting supports and is covered in the end face of the retainer ring, and the top is from the bottom The inner peripheral surface of extension be surrounded on the support ring away from the end face of the retainer ring outside.
The embodiment of the present invention has technical effect that addition protective plate enters in the exposed connecting-piece structure in target bottom Row protection, protective plate can protect exposed connecting-piece structure, it is to avoid the material formed when it is by target as sputter plated film splashes Fall, prevent connector to be destroyed, so as to extend the service life of connector.The material splashed down on protective plate is easily cleaned Fall, the protective plate for cleaning up can come into operation again, so as to improve the utilization rate of connector and protective plate, substantially reduce life Produce cost.The protective plate can also surround connector accessory, it is to avoid connector accessory is exposed in atmosphere, so as to avoid target Arcing is produced with aerial connector accessory directly contact is exposed when target device discharges during vacuum coating, Cause product to produce ill effect, reduce product turnout yield.Meanwhile, by the connector accessory polyether-ether-ketone material of target device Be replaced by refractory ceramics material, the connector accessory after replacing will not because of target device vacuum coating when the point discharge that produces And arcing is produced, and prevent the connector accessory to be electrically shocked and burn, reduce the connector being burned out by replacing in production process Accessory and cause the waste of time, manpower, material etc., improve product turnout yield.
Brief description of the drawings
Technical scheme in order to illustrate more clearly the embodiments of the present invention, embodiment will be described below needed for be used Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are some embodiments of the present invention, general for this area For logical technical staff, on the premise of not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is a kind of schematic perspective view of the first embodiment of target device.
Fig. 2 is a kind of schematic perspective view of the second embodiment of target device.
Fig. 3 is that mark schematic diagram is guided in a kind of installation of the second embodiment protective plate of target device.
Fig. 4 is a kind of connector schematic perspective view of the second embodiment of target device.
Fig. 5 is a kind of protective plate schematic perspective view of target device.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete Site preparation is described, it is clear that described embodiment is a part of embodiment of the invention, rather than whole embodiments.Based on this hair Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained under the premise of creative work is not made Example, belongs to the scope of protection of the invention.
It should be appreciated that when using in this specification and in the appended claims, term " including " and "comprising" instruction The presence of described feature, entirety, step, operation, element and/or component, but it is not precluded from one or more of the other feature, whole The presence or addition of body, step, operation, element, component and/or its set.
It is also understood that the term used in this description of the invention is merely for the sake of the mesh for describing specific embodiment And be not intended to limit the present invention.As used in description of the invention and appended claims, unless on Other situations are hereafter clearly indicated, otherwise " one " of singulative, " one " and " being somebody's turn to do " is intended to include plural form.
Fig. 1 is refer to, it is a kind of schematic perspective view of the first embodiment of target device.Target device 100 is provided with Connector 12, protective plate 13 and target 11.
Connector 12 includes motor layer 121, support ring 122 and retainer ring 123.Connector 12 is method in the present embodiment It is blue.One end of connector 12 is fixedly connected with one end of target 11 and supports target 11.Retainer ring 123 is sheathed on support ring 122 Outside, motor layer 121 is positioned over the top of support ring 122.Motor layer 121 is provided with a motor, control support when the motor works Ring 122 is rotated, and the retainer ring 123 is maintained static.The connector accessory 1231 of multiple ceramics is interval with retainer ring 123.Even Fitting accessory 1231 and retainer ring be fixedly connected can using various connected modes, for example can using being screwed, be welded and fixed, It is pivotally connected fixed etc..In the present embodiment, connector accessory 1231 is fixed using threaded connection.In some possible embodiments, even Fitting accessory 1231 is in hollow circular cylinder shape, and in some other feasible embodiments, connector accessory 1231 can be hollow rib Column, hollow, rectangular shape etc..Connector accessory uses polyether-ether-ketone material in the prior art, because polyether-ether-ketone connector is matched somebody with somebody Part in target vacuum coating because its good insulation properties produces arcing under high voltage condition easy point discharge so that Cause polyether-ether-ketone accessory to be electrically shocked to burn.In the present embodiment, the connector accessory 1231 uses resistant to elevated temperatures ceramic material, should Ceramic fitting will not under high voltage condition when target vacuum coating produce arcing, also will not because of electric shock effect quilt Burn.
Protective plate 13 includes bottom 132 and the top 131 extended from the bottom 132, and the top 131 is in hollow circle Bar shape, the bottom 132 is supported by the connector accessory 1231 and is covered in the end face of retainer ring 123, and the top 131 certainly should Bottom 132 extend inner peripheral surface be surrounded on the support ring 122 away from the end face of retainer ring 123 outside.The connector accessory 1231 are used to support the bottom 132, so as to prevent protective plate 13 from producing electrostatic with the directly contact of retainer ring 123, while avoiding preventing Situations such as frictional force being produced when when backplate 13 being rotated by target 11 with 123 relative motion of retainer ring.Preferably, the bottom The size of 132 end faces for being covered in retainer ring 123 matches with the size of the end face of retainer ring 123.Certainly should at the top 131 Size phase of size and the support ring 122 for the inner peripheral surface that bottom 132 extends away from the outer circumference surface of the retainer ring 122 Match somebody with somebody.The protective plate 13 is used to prevent the material sputtered during 100 vacuum coating of target device from splashing down in the connector 12, is used for Ballistic support ring 122 away from retainer ring 123 outside and retainer ring 123 near target end face.
Target 11 is in hollow circular cylinder shape, is set in outside connector motor layer 121, and one end of the target 11 is placed on company In fitting support ring 122, the material that the target 11 is used specifically needs the film classification of plated film according to substrate to determine.For example, , it is necessary to plate ito thin film on CF substrates in the present embodiment, the target 11 uses ITO target.In the present embodiment, the target has 2.5 rice is high, 21 millimeters thicks.Motor layer 121 on connector is provided with a motor, and control support ring 122 rotates when the motor works, One end of the target 11 is fixed in support ring 122 and is rotated by support ring 122.Therefore, the target 11 and support ring 122 Coaxial rotating, and geo-stationary is kept, the remains stationary state of retainer ring 123.
In the above-described embodiments, add protective plate to be protected in the exposed connecting-piece structure in target bottom, prevent Backplate can protect exposed connecting-piece structure, it is to avoid the material formed when it is by target as sputter plated film is splashed to, and is prevented Connector is destroyed, so as to extend the service life of connector.The material splashed down on protective plate is easily cleaned out, and cleaning is dry Net protective plate can come into operation again, so as to improve the utilization rate of connector and protective plate, substantially reduce production cost.Should Protective plate can also surround connector accessory, it is to avoid connector accessory is exposed in atmosphere, so as to avoid target vacuum coating During target device when discharging with the aerial connector accessory directly contact of exposure and produce arcing, cause product Ill effect is produced, product turnout yield is reduced.Meanwhile, by the polyether-ether-ketone material of connector accessory 1231 in target device 100 Matter is replaced with resistant to elevated temperatures ceramic material, and changing rear connectors accessory will not be burnt in target vacuum coating by electric shock effect Ruin, thus during reducing target vacuum coating because of connector accessory that replacing is burned out and caused by time, manpower, material etc. Waste, improve product turnout yield.
Fig. 2 is refer to, it is a kind of schematic perspective view of the second embodiment of target device.The present embodiment two and embodiment One difference is to be additionally provided with multiple installation in the retainer ring 123 of connector 12 to guide mark 1232, and mark is guided in the installation 1232 between two neighboring connector accessory 1231.The first component a and second component b of the protective plate 13 are in any peace Dress is guided at mark 1232 and is connected through a screw thread fixation, and two can formed between first component a and second component b are inevitable Corresponding gap c, gap c do not influence the film-plating process of target device in 5-10 millimeters of scope.Referred to by installing Tendering note 1232 installs protective plate 13 and can ensure that gap c not at connector accessory 1231, so that it is guaranteed that the connector accessory 1231 are covered by the bottom 132, and the connector accessory 1231 is not exposed in air, so as to avoid target vacuum coating process Arcing is produced with the aerial directly contact of connector accessory 1231 is exposed when middle device discharges, causes product to produce Ill effect, reduces product turnout yield.
Fig. 3 is refer to, mark schematic diagram is guided in a kind of installation of protective plate of the second embodiment of target device.
In the present embodiment two, the connector accessory 1231 in retainer ring 123 is replaced with by original polyether-ether-ketone material Resistant to elevated temperatures ceramic material, and multiple installation guide marks 1232 are additionally provided with retainer ring 123, mark is guided in the installation 1232 between two neighboring connector accessory 1231.The protective plate 13 includes bottom 132 and prolongs from the bottom 132 The top 131 stretched out, the top 131 is in hollow circular cylinder shape, and the bottom 132 is used to be covered in the end face of retainer ring 123, Therefore, the end face of the shape of the bottom 132, size and retainer ring 123 matches;The top 131 extends from the bottom 132 Inner peripheral surface be used for surround outer circumference surface of the support ring 122 away from the retainer ring 122, therefore, the shape at the top 131, greatly The small outer circumference surface with support ring 122 away from retainer ring 122 matches.The protective plate 13 is used to prevent the vacuum of target device 100 The material sputtered during plated film is splashed down on the connector 12, for ballistic support ring 122 away from the outside of retainer ring 123 and admittedly Determine end face of the ring 123 near target.
The protective plate 13 includes symmetrically arranged first component a and second component b, in the present embodiment, the protective plate 13 First component a and second component b be connected through a screw thread fixation, first component a and second at guide mark 1232 in any installation The two inevitable corresponding gap c that can be formed between part b, gap c do not influence in 5-10 millimeters of scope The film-plating process of target device.The installation protective plate 13 of mark 1232 is guided to can ensure that gap c does not match somebody with somebody in connector by installing At part 1231, so that it is guaranteed that the connector accessory 1231 surrounds covering by the bottom 132, the connector accessory 1231 will not expose In atmosphere, so as to straight with the aerial connector accessory 1231 of exposure when avoiding that device discharges during target vacuum coating Contact and produce arcing, cause product to produce ill effect, reduce product turnout yield.
Refer to Fig. 4, a kind of connector schematic perspective view of the second embodiment of target device.The connector 12 includes electricity Machine layer 121, support ring 122 and retainer ring 123.Retainer ring 123 is sheathed on outside support ring 122, and motor layer 121 is positioned over branch The top of pushing out ring 122.Motor layer 121 is provided with a motor, and the connector accessory of multiple ceramics is interval with retainer ring 123 1231.The connector accessory 1231 use resistant to elevated temperatures ceramic material, the Ceramic fitting will not because of target vacuum coating when height Arcing is produced under voltage conditions, will not be also burned out because of electric shock effect.The connector accessory 1231 is used to support this Bottom 132, so as to produce electrostatic when preventing protective plate 13 with 123 directly contact of retainer ring, while avoiding protective plate 13 by target 11 when being rotated with 123 relative motion of retainer ring when situations such as produce frictional force.The retainer ring 123 is additionally provided with multiple installations Mark 1232 is guided, the installation guides mark 1232 between two neighboring connector accessory 1231.The protective plate 13 First component a and second component b it is any install to guide start to install at mark 1232, therefore, first component a and second Between part b formed two corresponding gaps not at connector accessory 1231, so that it is guaranteed that the quilt of connector accessory 1231 The bottom 132 is covered, and the connector accessory 1231 is not exposed in air, so as to avoid device during target vacuum coating Arcing is produced with the aerial directly contact of connector accessory 1231 is exposed during electric discharge, causes product to produce bad effect Should, reduce product turnout yield.
Refer to Fig. 5, a kind of protective plate schematic perspective view of target device.The protective plate 13 includes symmetrically arranged first Part a and second component b, first component a include the first bottom 1321 and the first top 1311, and second component b includes the The bottom 132 is formed on two bottoms 1322 and the second top 1312,1321 and second bottom of the first bottom 1322, first top 1312 form the top 131 at the top of 1311 and second.The top 131 is in hollow circular cylinder shape, and the bottom 132 is used to be covered in admittedly Determine on the end face of ring 123, therefore, the end face of the shape, size and retainer ring 123 of the bottom 132 matches;The top 131 inner peripheral surfaces extended from the bottom 132 are used to surround outer circumference surface of the support ring 122 away from the retainer ring 122, because This, the shape at the top 131, size and support ring 122 match away from the outer circumference surface of retainer ring 122.The protective plate 13 is used The material sputtered when 100 vacuum coating of target device is prevented is splashed down on the connector 12, remote for ballistic support ring 122 From the outside of retainer ring 123 and retainer ring 123 near target end face.The first component a and second component b of the protective plate 13 Between can be connected using various ways, in some possible embodiments, first component a and second component b can use spiral shell Line is fixedly connected, and in some other feasible embodiments, can use and be welded and fixed, is pivotally connected fixation.In the present embodiment, first Part a and second component b form two inevitable corresponding gap c after being threadably secured connection.Gap c is in 5-10 The film-plating process of target device is not influenceed during the scope of millimeter.
In above-described embodiment, add protective plate to be protected in the exposed connecting-piece structure in target bottom, protect Plate can protect exposed connecting-piece structure, it is to avoid the material formed when it is by target as sputter plated film is splashed to, the company of preventing Fitting is destroyed, so as to extend the service life of connector.The material splashed down on protective plate is easily cleaned out, and cleans up Protective plate can come into operation again, so as to improve the utilization rate of connector and protective plate, substantially reduce production cost.This is prevented Backplate can also surround connector accessory, it is to avoid connector accessory is exposed in atmosphere, so as to avoid target vacuum coating Arcing is produced with aerial connector accessory directly contact is exposed when target device discharges in journey, causes product to produce Raw ill effect, reduces product turnout yield.Meanwhile, by the connector accessory 1231 in target device 100 by original polyethers Ether ketone material is replaced with resistant to elevated temperatures ceramic material, because polyether-ether-ketone connector accessory is good because of its in target vacuum coating Good insulating properties under high voltage condition easy point discharge and produce arcing, so as to cause polyether-ether-ketone accessory to be electrically shocked burning Ruin.The connector accessory 1231 after replacing uses resistant to elevated temperatures ceramic material, and the ceramic connecting piece accessory 1231 will not be because of target Arcing is produced under high voltage condition during material vacuum coating, will not be also burned out because of electric shock effect.It is existing so as to solve The exposure of connector accessory is easily electrically shocked the problem burnt in atmosphere in having technology, it is to avoid because the connector that replacing is burned out is matched somebody with somebody Part and cause the waste of time, manpower, material etc. in film-plating process, improve product turnout yield.
In some possible embodiments, multiple installation can be provided with the retainer ring 123 of connector 12 and guides mark 1232, the installation guides mark 1232 between two neighboring connector accessory 1231.The first component a of the protective plate 13 Be connected through a screw thread fixation at guide mark 1232 in any installation with second component b, between first component a and second component b Two for being formed inevitably corresponding gap c, gap c do not influence target device in 5-10 millimeters of scope Film-plating process.Guide mark 1232 that protective plate 13 is installed to can ensure that gap c not at connector accessory 1231 by installing, from And ensuring that the connector accessory 1231 is surrounded covering by the bottom 132 completely, the connector accessory 1231 is not exposed to air In, so as to when avoiding that device discharges during target vacuum coating with the aerial directly contact of connector accessory 1231 of exposure And arcing is produced, and cause product to produce ill effect, reduce product turnout yield.
The above, specific embodiment only of the invention, but protection scope of the present invention is not limited thereto, and it is any Those familiar with the art the invention discloses technical scope in, various equivalent modifications can be readily occurred in or replaced Change, these modifications or replacement should all be included within the scope of the present invention.Therefore, protection scope of the present invention should be with right It is required that protection domain be defined.

Claims (10)

1. a kind of target device, it is characterised in that described device includes:
Connector, the connector includes support ring and retainer ring, and the support ring is positioned within the retainer ring, described solid Determine to be interval with multiple ceramic connector accessories on ring;
Protective plate, the protective plate includes bottom and the top extended from the bottom, and the top is in hollow form, institute Bottom is stated by the connector fitting supports and the end face of the retainer ring is covered in, the top extends from the bottom Inner peripheral surface be surrounded on the support ring away from the end face of the retainer ring outside.
2. target device as claimed in claim 1, it is characterised in that the protective plate include symmetrically arranged first component and Second component, the first component includes the first bottom and the first top, and the second component includes the second bottom and the second top The bottom is formed on portion, first bottom and second bottom, and first top and the described second top form described Top.
3. target device as claimed in claim 2, it is characterised in that formed between the first component and the second component Two corresponding gaps.
4. target device as claimed in claim 1, it is characterised in that the bottom is covered in the end face of the retainer ring Size matches with the size of the end face of the retainer ring.
5. target device as claimed in claim 1, it is characterised in that the inner peripheral surface that the top extends from the bottom Size of the size with the support ring away from the outer circumference surface of the retainer ring matches.
6. target device as claimed in claim 1, it is characterised in that the retainer ring is provided with multiple installation and guides mark, Described installation guides mark to be located between two neighboring connector accessory.
7. target device as claimed in claim 1, it is characterised in that the connector accessory is resistant to elevated temperatures ceramic material.
8. target device as claimed in claim 1, it is characterised in that the connector also includes motor layer, the motor layer Motor is provided with, the motor layer is positioned on the support ring and drives the support ring to rotate.
9. target device as claimed in claim 8, it is characterised in that target is positioned in the support ring, the target set Outside the inner ring.
10. target device as claimed in claim 9, it is characterised in that the retainer ring is maintained static.
CN201611237980.2A 2016-12-28 2016-12-28 A kind of target device Active CN106683988B (en)

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Application Number Priority Date Filing Date Title
CN201611237980.2A CN106683988B (en) 2016-12-28 2016-12-28 A kind of target device

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Application Number Priority Date Filing Date Title
CN201611237980.2A CN106683988B (en) 2016-12-28 2016-12-28 A kind of target device

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CN106683988B CN106683988B (en) 2019-05-24

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2280717Y (en) * 1996-08-27 1998-05-06 深圳市创益科技发展有限公司 Flat magnetic-control sputter target board of transparent conductive film
CN102265376A (en) * 2008-10-24 2011-11-30 应用材料股份有限公司 Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a tar
CN103361612A (en) * 2012-04-05 2013-10-23 鸿富锦精密工业(深圳)有限公司 Cylindrical magnetron sputtering target
CN103422067A (en) * 2007-06-18 2013-12-04 应用材料公司 Sputtering target having increased life and sputtering uniformity
CN103602952A (en) * 2013-11-13 2014-02-26 上海华力微电子有限公司 Vacuum sputtering device
CN205046193U (en) * 2015-10-15 2016-02-24 广东耐信镀膜科技有限公司 Novel cyclic annular target mechanism
CN105755437A (en) * 2014-12-16 2016-07-13 宁波江丰电子材料股份有限公司 Target assembly structure and magnetron sputtering system
US20160343551A1 (en) * 2014-01-21 2016-11-24 Sumitomo Chemical Company, Limited Sputtering target

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2280717Y (en) * 1996-08-27 1998-05-06 深圳市创益科技发展有限公司 Flat magnetic-control sputter target board of transparent conductive film
CN103422067A (en) * 2007-06-18 2013-12-04 应用材料公司 Sputtering target having increased life and sputtering uniformity
CN102265376A (en) * 2008-10-24 2011-11-30 应用材料股份有限公司 Rotatable sputter target base, rotatable sputter target, coating installation, method of producing a rotatable sputter target, target base connection means, and method of connecting a rotatable target base device for sputtering installations to a tar
CN103361612A (en) * 2012-04-05 2013-10-23 鸿富锦精密工业(深圳)有限公司 Cylindrical magnetron sputtering target
CN103602952A (en) * 2013-11-13 2014-02-26 上海华力微电子有限公司 Vacuum sputtering device
US20160343551A1 (en) * 2014-01-21 2016-11-24 Sumitomo Chemical Company, Limited Sputtering target
CN105755437A (en) * 2014-12-16 2016-07-13 宁波江丰电子材料股份有限公司 Target assembly structure and magnetron sputtering system
CN205046193U (en) * 2015-10-15 2016-02-24 广东耐信镀膜科技有限公司 Novel cyclic annular target mechanism

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