CN106659071A - Heat dissipation bottom plate, power source module with same and unmanned aerial vehicle - Google Patents

Heat dissipation bottom plate, power source module with same and unmanned aerial vehicle Download PDF

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Publication number
CN106659071A
CN106659071A CN201611069893.0A CN201611069893A CN106659071A CN 106659071 A CN106659071 A CN 106659071A CN 201611069893 A CN201611069893 A CN 201611069893A CN 106659071 A CN106659071 A CN 106659071A
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CN
China
Prior art keywords
plate
radiating
module
layer
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611069893.0A
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Chinese (zh)
Inventor
杜强
黄桃丽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HEFEI SIWILL INTELLIGENT Co Ltd
Original Assignee
HEFEI SIWILL INTELLIGENT Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HEFEI SIWILL INTELLIGENT Co Ltd filed Critical HEFEI SIWILL INTELLIGENT Co Ltd
Priority to CN201611069893.0A priority Critical patent/CN106659071A/en
Publication of CN106659071A publication Critical patent/CN106659071A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/033 layers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/30Properties of the layers or laminate having particular thermal properties
    • B32B2307/302Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2605/00Vehicles
    • B32B2605/18Aircraft

Abstract

The invention discloses a heat dissipation bottom plate. The heat dissipation bottom plate is divided into three layers, wherein the top layer is made of a resin material, the middle layer is made of a heat conduction insulating material, and the bottom layer is an aluminum substrate; the top layer is used for loading all components and performing heat dissipation on the components. The invention also provides a power source module with the above small-size, light-weight heat-dissipation bottom plate. The power source module includes a power source switch module, a voltage conversion module and the special heat dissipation bottom plate; the special heat dissipation bottom plate is connected with the heat dissipation surface of a voltage conversion chip in the voltage conversion module; and heat generated by the voltage conversion chip in a working process is dissipated through the heat dissipation bottom plate. The present invention also provides an unmanned aerial vehicle with the above power source module. According to the heat dissipation bottom plate, the power source module with same and the unmanned aerial vehicle of the invention, a radiator or fan is not required for auxiliary heat dissipation, and therefore, the size and weight of the entire power source module are greatly reduced, and the unmanned aerial vehicle can be possibly smaller and lighter.

Description

A kind of radiating bottom plate and power module and unmanned plane with the base plate
Technical field
The present invention relates to the power module used on power module, especially unmanned plane.
Background technology
Current power output is that the dc source of 150W or so is typically designed using inverse-excitation type switch power-supply or module. Because Switching Power Supply typically all can cause small product size excessive using components and parts such as transformer, electrochemical capacitor, inductance, electromagnetism is simultaneous Capacitive is poor.And using the dc source of finished product power supply module design all containing bulky radiator, volume weight is difficult controlled.
Patent such as Patent No. 201521111633.6, a kind of entitled battery radiator structure and the unmanned plane containing it is public A kind of battery radiator structure is opened, it includes fan, fin;Fan is arranged on the top of fin;Fin includes accommodating Box, multiple fins, multiple fins are to be arranged on the upper surface of accommodating case and upwardly extending laminated structure;Set in accommodating case There are multiple receiving spaces for accommodating battery.Its advantage is radiated by the battery that fan, aluminum radiating fin, battery are constituted Structure can effectively solve heat dissipation problem, so as to extending the service life of battery and guaranteeing its security.But just because of Its comprising modules is more, therefore, the volume and weight of whole power supply module is larger.
Unmanned plane is extremely harsh to own vol and weight demands, and general dc source module is not particularly suited for nobody Machine.
The content of the invention
The technical problem to be solved there are provided a kind of small volume that can make whole power module, weight Light radiating bottom plate.
The present invention is to solve above-mentioned technical problem by the following technical programs:A kind of radiating bottom plate, is divided into three layers:Top layer Resin material, intermediate layer is adopted to adopt heat-conducting insulation material, bottom for aluminium base.Top layer is used for placing all of components and parts, right Components and parts are radiated.
Used as the technical scheme of further optimization, the resin material of the top layer adopts FR-4 sheet materials as circuit substrate, FR-4 is the substrate that PCB is used, and is a kind of classification of plate.Plate presses reinforcing material difference, and classification is following four:1) FR-4:Glass cloth substrate;2) FR-1, FR-2 etc.:Paper base plate;3) CEM is serial:Composite base plate;4) special material substrate (ceramics, Metal Substrate etc.) FR-4 soaked by special electronic cloth and suppressed with the plate-like layers of the material Jing HTHP hot pressing such as epoxy phenolics Product.Top layer can not affect the using effect of technical solution of the present invention using existing any one FR-4 sheet material as circuit substrate.
Used as the technical scheme of further optimization, the top layer thickness is 0.2mm~0.4mm, optimization, and top layer thickness is 0.3mm。
Used as the technical scheme of further optimization, the intermediate layer adopts thermal conductive insulation glue.
Optimization, the intermediate layer thickness is 0.07mm~0.09mm, and optimum thickness is 0.08mm.
Used as the technical scheme of further optimization, the bottom is the fine aluminium substrate that thickness is 1mm~3mm.
As the technical scheme for more optimizing, in order to further enhance the radiating effect to top layer components and parts, PCB design is carried out When large area paving copper is carried out to the top surface of top layer.
Further, some vias are placed in the larger areas of copper.
The via is located at components and parts bottom and surrounding.
Present invention also offers a kind of power module with above-mentioned small volume, lightweight radiating bottom plate.The power supply Module includes power switching module, voltage transformation module, the part of special heat-radiating base plate three, and the input of voltage transformation module is connected to Power switching module, carries out input voltage voltage conversion and exports, the radiating of the voltage conversion chip in voltage transformation module Face is connected with the top surface of special heat-radiating base plate.When carrying out PCB design, all devices are both placed in into top layer, it is ensured that bottom does not have Device.
Used as the technical scheme of further optimization, if power switching module adopts dry passage toggle switch to realize, each leads to Road is respectively connecting to voltage transformation module.It is different according to load in the power module course of work, can flexibly be beaten by toggle switch The power supply output of on or off Bi Mou road.When toggle switch pushes ON positions, represent that the channel power source is opened, when toggle switch is dialled To OFF, represent that the channel power source is turned off without output.
Special heat-radiating base plate is connected with the radiating surface of voltage conversion chip in voltage transformation module, voltage conversion chip work During the heat that produces heat quickly can either be conducted by via again by the copper sheet of top layer natural heat dissipation upwards To intermediate layer, intermediate layer conducts heat to aluminium base and is radiated by high heat conductive insulating glue again.Without by scattered Hot device and fan reach natural heat dissipation, greatly reduce the volume and weight of whole power module, are the lighter less of unmanned plane There is provided possible.
Used as the technical scheme of further optimization, voltage transformation module carries out Power convert using four ISL8216 chips, Input voltage is separately converted to into two-way 6V and two-way 12V voltage outputs, per road 4A electric currents can be individually exported.
Present invention also offers a kind of unmanned plane with above-mentioned power module.
The present invention has compared to existing technology advantages below:
1st, heat dissipation design is carried out as a result of the circuit board of special construction, it is no longer necessary to which radiator or fan carry out auxiliary Radiating is helped, causes the volume very little of power module, the long 50mm of long 85mm width can be reached, it is lightweight, less than 100g.
2nd, power module is designed using autonomous channel, and break down other passages that do not affect of certain passage normally run, spirit It is active high.
3rd, due to good heat dissipation effect, the fully loaded input power of power supply exports 144W, efficiency 90%, power conversion up to 160W Efficiency high
4th, the radiating bottom plate is applied widely, the radiating of the power supply except can be used for unmanned plane, can be also used for other right The radiating of higher components and parts is required in the volume and weight of power module.
Description of the drawings
Fig. 1 is the theory of constitution figure of the radiating bottom plate of the embodiment of the present invention;
Fig. 2 is the theory of constitution figure of embodiment of the present invention power module.
Specific embodiment
Embodiments of the invention are elaborated below, the present embodiment is carried out under premised on technical solution of the present invention Implement, give detailed embodiment and specific operating process, but protection scope of the present invention is not limited to following enforcements Example.
Embodiment one
Fig. 1 is referred to, a kind of radiating bottom plate is divided into three layers:Top layer adopts heat conductive insulating material using resin material, intermediate layer Material, bottom are aluminium base.Top layer is used for placing all of components and parts, and components and parts are radiated.
Used as the technical scheme of further optimization, the resin material of the top layer adopts FR-4 sheet materials as circuit substrate, FR-4 is the substrate that PCB is used, and is a kind of classification of plate.Plate presses reinforcing material difference, and classification is following four:1) FR-4:Glass cloth substrate;2) FR-1, FR-2 etc.:Paper base plate;3) CEM is serial:Composite base plate;4) special material substrate (ceramics, Metal Substrate etc.) FR-4 soaked by special electronic cloth and suppressed with the plate-like layers of the material Jing HTHP hot pressing such as epoxy phenolics Product.Top layer can not affect the using effect of technical solution of the present invention using existing any one FR-4 sheet material as circuit substrate.
Used as the technical scheme of further optimization, the top layer thickness is 0.2mm~0.4mm, optimization, and top layer thickness is 0.3mm。
Used as the technical scheme of further optimization, the intermediate layer adopts thermal conductive insulation glue.
Optimization, the intermediate layer thickness is 0.07mm~0.09mm, and optimum thickness is 0.08mm.
Used as the technical scheme of further optimization, the bottom is the fine aluminium substrate that thickness is 1mm~3mm.
As the technical scheme for more optimizing, in order to further enhance the radiating effect to top layer components and parts, PCB design is carried out When large area paving copper is carried out to the top surface of top layer.
Further, some vias are placed in the larger areas of copper.
The via is located at components and parts bottom and surrounding.
Embodiment two
Present invention also offers the power supply mould of a kind of small volume with described in embodiment one, lightweight radiating bottom plate Block.Fig. 2 is referred to, the power module includes the radiating bottom plate three in power switching module, voltage transformation module, embodiment one Part, the input of voltage transformation module is connected to power switching module, input voltage is carried out into voltage conversion and is exported, and voltage turns The radiating surface of voltage conversion chip in mold changing block is connected with the top surface of radiating bottom plate.It is when carrying out PCB design, all devices are equal It is placed on top layer, it is ensured that bottom does not have device.
Used as the technical scheme of further optimization, power switching module is realized using four-way toggle switch, four passages It is respectively connecting to voltage transformation module.It is different according to load in the power module course of work, can flexibly be opened by toggle switch Or close power supply output of certain road.When toggle switch pushes ON positions, represent that the channel power source is opened, when toggle switch is pushed OFF, represents that the channel power source is turned off without output.
Special heat-radiating base plate is connected with the radiating surface of voltage conversion chip in voltage transformation module, voltage conversion chip work During the heat that produces heat quickly can either be conducted by via again by the copper sheet of top layer natural heat dissipation upwards To intermediate layer, intermediate layer conducts heat to aluminium base and is radiated by high heat conductive insulating glue again.Without by scattered Hot device and fan reach natural heat dissipation, greatly reduce the volume and weight of whole power module, are the lighter less of unmanned plane There is provided possible.
Used as the technical scheme of further optimization, voltage transformation module carries out Power convert using four ISL8216 chips, Input voltage is separately converted to into two-way 6V and two-way 12V voltage outputs, per road 4A electric currents can be individually exported.
Embodiment three
Present invention also offers a kind of unmanned plane with the power module of structure described in above-described embodiment two.
Presently preferred embodiments of the present invention is the foregoing is only, not to limit the present invention, all essences in the present invention Any modification, equivalent and improvement made within god and principle etc., should be included within the scope of the present invention.

Claims (10)

1. a kind of radiating bottom plate, it is characterised in that be divided into three layers:Top layer adopts heat conductive insulating material using resin material, intermediate layer Material, bottom are aluminium base, and top layer is used for placing all of components and parts, components and parts are radiated.
2. a kind of radiating bottom plate according to claim 1, it is characterised in that the resin material of the top layer adopts FR-4 plates Material is used as circuit substrate.
3. a kind of radiating bottom plate according to claim 1 and 2, it is characterised in that the top layer thickness be 0.2mm~ 0.4mm, the intermediate layer thickness is 0.07mm~0.09mm, and the bottom is the fine aluminium substrate that thickness is 1mm~3mm.
4. a kind of radiating bottom plate according to claim 1, it is characterised in that the intermediate layer adopts thermal conductive insulation glue.
5. a kind of radiating bottom plate according to claim 1, it is characterised in that the top surface of the top layer carries out being covered with copper.
6. a kind of radiating bottom plate according to claim 5, it is characterised in that some vias are placed in the copper of the paving.
7. a kind of radiating bottom plate according to claim 5, it is characterised in that the via is located at components and parts bottom and week Enclose.
8. a kind of power module of the radiating bottom plate using as described in any one of claim 1-7, the power module includes electric Source switch module, voltage transformation module, it is characterised in that also including the radiating bottom plate, the input connection of voltage transformation module To power switching module, input voltage is carried out into voltage conversion and is exported, the voltage conversion chip in voltage transformation module dissipate Hot face is connected with the top surface of special heat-radiating base plate.
9. power module according to claim 8, it is characterised in that if power switching module adopts dry passage dial-up to open Close, each passage is respectively connecting to voltage transformation module, it is different according to load, flexibly opened by toggle switch or close certain Road power supply output.
10. a kind of unmanned plane using power module as claimed in claim 8 or 9.
CN201611069893.0A 2016-11-29 2016-11-29 Heat dissipation bottom plate, power source module with same and unmanned aerial vehicle Pending CN106659071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611069893.0A CN106659071A (en) 2016-11-29 2016-11-29 Heat dissipation bottom plate, power source module with same and unmanned aerial vehicle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611069893.0A CN106659071A (en) 2016-11-29 2016-11-29 Heat dissipation bottom plate, power source module with same and unmanned aerial vehicle

Publications (1)

Publication Number Publication Date
CN106659071A true CN106659071A (en) 2017-05-10

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Country Status (1)

Country Link
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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1332512A (en) * 2000-09-29 2002-01-23 深圳市中兴通讯股份有限公司 Improved modular power source structure
JP2009164351A (en) * 2008-01-07 2009-07-23 Mitsubishi Electric Corp Power conditioner
CN101586749A (en) * 2009-06-11 2009-11-25 浙江西子光电科技有限公司 LED lighting device and radiator structure thereof
CN104254195A (en) * 2014-09-17 2014-12-31 苏州合欣美电子科技有限公司 Active cooling type PCB (printed circuit board)

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1332512A (en) * 2000-09-29 2002-01-23 深圳市中兴通讯股份有限公司 Improved modular power source structure
JP2009164351A (en) * 2008-01-07 2009-07-23 Mitsubishi Electric Corp Power conditioner
CN101586749A (en) * 2009-06-11 2009-11-25 浙江西子光电科技有限公司 LED lighting device and radiator structure thereof
CN104254195A (en) * 2014-09-17 2014-12-31 苏州合欣美电子科技有限公司 Active cooling type PCB (printed circuit board)

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Application publication date: 20170510

RJ01 Rejection of invention patent application after publication