CN106634760A - Epoxy resin pouring sealant with excellent mechanical properties - Google Patents
Epoxy resin pouring sealant with excellent mechanical properties Download PDFInfo
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- CN106634760A CN106634760A CN201611244401.7A CN201611244401A CN106634760A CN 106634760 A CN106634760 A CN 106634760A CN 201611244401 A CN201611244401 A CN 201611244401A CN 106634760 A CN106634760 A CN 106634760A
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- epoxy resin
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- short fiber
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
- C09J163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/14—Polymer mixtures characterised by other features containing polymeric additives characterised by shape
- C08L2205/16—Fibres; Fibrils
Abstract
The present invention discloses an epoxy resin pouring sealant with excellent mechanical properties. The pouring sealant comprises, by weight, 20-40 parts of phenol aldehyde modified epoxy resin, 10-20 parts of organic fluorine epoxy resin, 25-35 parts of E-44 epoxy resin, 20-30 parts of modified short cotton fiber, 2-8 parts of attapulgite clay, 5-15 parts of carboxyl-terminated nitrile rubber, 1-3 parts of epoxidized SBS, 1-3 parts of trimethyl hexamethylenediamine, 1-2 parts of polyethenoxyamine, 1-2 parts of triethanolamine, 2-4 parts of hydroxypropyl cellulose, 20-50 parts of diglycidyl ether. The epoxy resin pouring sealant has the advantages of good mechanical properties and permeability, and can be stored for a long period.
Description
Technical field
The present invention relates to epoxy resin embedding adhesive technical field, more particularly to a kind of asphalt mixtures modified by epoxy resin with excellent mechanical performance
Fat casting glue.
Background technology
Epoxy resin is a kind of thermosetting resin, with excellent chemical stability, corrosion resistance, its adhesive property is good,
High mechanical strength, electrical insulating property is strong, is industrially widely used, especially in devices such as electronic device, transformers
Cast, encapsulation aspect, are even more widely used.But, pure epoxy resin has high cross-linked structure, thus it is crisp, easily tired to there is matter
The shortcomings of labor, heat resistance are not good enough, toughness is poor, and epoxy resin embedding adhesive overcomes disadvantages mentioned above, in electronic device
It is more extensive in the practical application of embedding, however existing epoxy resin embedding adhesive exist mechanical property it is poor, infiltration property it is poor, store up
Deposit the time short, it would be highly desirable to solve.
The content of the invention
The present invention proposes a kind of epoxy resin embedding adhesive with excellent mechanical performance, and mechanical property is good, and infiltration property is good,
Storage time is long.
A kind of epoxy resin embedding adhesive with excellent mechanical performance proposed by the present invention, its raw material includes by weight：
Phenol aldehyde modified epoxy resin 20-40 parts, organic epoxy resin 10-20 parts, E-44 epoxy resin 25-35 parts, be modified cotton staple
Dimension 20-30 parts, Attagel 2-8 parts, nbr carboxyl terminal 5-15 parts, epoxidized SBS 1-3 part, trimethylhexane diamine 1-3 parts,
Polyether diamine 1-2 parts, triethanolamine 1-2 parts, hydroxypropyl cellulose 2-4 parts, diglycidyl ether 20-50 parts.
Preferably, the cotton short fiber that is modified is prepared using following technique：By N, it is molten that N, N- trimethyl chitin is dissolved in acetic acid
In liquid, silver nitrate solution is added dropwise under stirring, continues to stir after completion of dropping, sodium borohydride solution is added dropwise, after completion of dropping
Continue to stir, add cotton short fiber, silane coupler stirring, filter, be dried to constant weight, send into the irradiation tube containing ethanol solution
In, under nitrogen protection, it is put in Co 60 radioactive source and is irradiated to 25kGy, dry, pulverize, obtain modified cotton short fiber.
Preferably, the cotton short fiber that is modified is prepared using following technique：By weight by 2-5 part N, N, N- trimethyl chitin
It is 0.3-0.6mol/L nitre that 30-50 parts concentration is dissolved in for 1-5 parts concentration in 2-2.6% acetic acid solutions, is added dropwise under stirring
Sour silver-colored solution, continues to stir 5-15min after completion of dropping, and it is 0.3-0.6mol/L sodium borohydride solutions that 1-2 parts concentration is added dropwise, and is dripped
Plus follow-up continuous stirring 20-40min is finished, add 10-20 part cotton short fibers, 0.5-1.5 parts silane coupler stirring 50-
100min, filters, and is dried to constant weight, in sending into containing the irradiation tube that concentration is 40-60wt% ethanol solutions, under nitrogen is protected,
It is put in Co 60 radioactive source and is irradiated to 25kGy, dry, pulverize, obtains modified cotton short fiber.
Preferably, phenol aldehyde modified epoxy resin, organic epoxy resin, the weight ratio of E-44 epoxy resin are 30-34：
14-16：30-32.
Preferably, modified cotton short fiber, Attagel, nbr carboxyl terminal, the weight ratio of epoxidized SBS are 26-28：4-
6：10-12：1.5-2.2.
Preferably, trimethylhexane diamine, polyether diamine, the weight ratio of triethanolamine are 1.5-2：1.4-1.6：1.2-1.5.
Preferably, modified cotton short fiber, the weight ratio of hydroxypropyl cellulose are 26-28：2.5-3.2.
Preferably, the epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenolic aldehyde changes
Property epoxy resin 30-34 parts, organic epoxy resin 14-16 parts, E-44 epoxy resin 30-32 parts, be modified cotton short fiber 26-28
Part, Attagel 4-6 parts, nbr carboxyl terminal 10-12 parts, epoxidized SBS 1.5-2.2 part, trimethylhexane diamine 1.5-2 parts,
Polyether diamine 1.4-1.6 parts, triethanolamine 1.2-1.5 parts, hydroxypropyl cellulose 2.5-3.2 parts, diglycidyl ether 30-40
Part.
The present invention is obtained using conventional fabrication process.
The present invention not only viscosity it is relatively low, infiltration property it is good, mobility is good, and shrinkage factor is little, solidfied material surfacing, light,
Hardness is high, heat-resist；In the modified cotton short fiber of the present invention, N, N, N- trimethyl chitin, silver nitrate and sodium borohydride are matched somebody with somebody
Cooperation is used, and under certain condition the silver nano-particle of generation is carried on cotton short fiber in the presence of silane coupler, is resisted
Bacterium property is good and persistently, and through heat treatment and irradiation, product not only porous, pliability is good, and mechanical performance is excellent, and possesses good
Resistance to chemical corrosion, coordinates the effect of nbr carboxyl terminal, epoxidized SBS and hydroxypropyl cellulose, and infiltration property is good excellent；And
Phenol aldehyde modified epoxy resin, organic epoxy resin, E-44 epoxy resin coordinate trimethylhexane diamine, polyether diamine, three ethanol
Amine is crosslinked, then coordinates with modified cotton short fiber, improves the viscosity of the present invention；With Attagel, nbr carboxyl terminal, epoxidation
SBS is filler, and curing rate is fast, and mechanical property is fabulous after solidification, even if at relatively high temperatures, heat endurance, heat-resist, is glued
Degree is high, and storage time is long, and safety and environmental protection, free from environmental pollution.
Specific embodiment
Below, technical scheme is described in detail by specific embodiment.
Embodiment 1
A kind of epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenol aldehyde modified epoxy
40 parts of resin, 10 parts of organic epoxy resin, 35 parts of E-44 epoxy resin, be modified 20 parts of cotton short fiber, and 8 parts of Attagel holds carboxylic
5 parts of base nitrile rubber, 3 parts of epoxidized SBS, 1 part of trimethylhexane diamine, 2 parts of polyether diamine, 1 part of triethanolamine, hydroxypropyl is fine
4 parts of dimension element, 20 parts of diglycidyl ether.
Embodiment 2
A kind of epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenol aldehyde modified epoxy
20 parts of resin, 20 parts of organic epoxy resin, 25 parts of E-44 epoxy resin, be modified 30 parts of cotton short fiber, and 2 parts of Attagel holds carboxylic
15 parts of base nitrile rubber, 1 part of epoxidized SBS, 3 parts of trimethylhexane diamine, 1 part of polyether diamine, 2 parts of triethanolamine, hydroxypropyl is fine
2 parts of dimension element, 50 parts of diglycidyl ether.
Embodiment 3
A kind of epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenol aldehyde modified epoxy
34 parts of resin, 14 parts of organic epoxy resin, 32 parts of E-44 epoxy resin, be modified 26 parts of cotton short fiber, and 6 parts of Attagel holds carboxylic
10 parts of base nitrile rubber, 2.2 parts of epoxidized SBS, 1.5 parts of trimethylhexane diamine, 1.6 parts of polyether diamine, 1.2 parts of triethanolamine,
3.2 parts of hydroxypropyl cellulose, 30 parts of diglycidyl ether.
Modified cotton short fiber is prepared using following technique：By weight by 5 parts of N, N, N- trimethyl chitin is dissolved in 30
Part concentration is that in 2.6% acetic acid solution, it is 0.6mol/L silver nitrate solutiones that 1 part of concentration is added dropwise under stirring, after completion of dropping
Continue to stir 5min, it is 0.3mol/L sodium borohydride solutions that 2 parts of concentration are added dropwise, continue to stir 40min after completion of dropping, add 10
Part cotton short fiber, 1.5 parts of silane couplers stir 50min, filter, and are dried in 80 DEG C of vacuum drying ovens of temperature to constant weight, send into
Containing concentration in the irradiation tube of 40wt% ethanol solutions, under nitrogen protection, to be put in Co 60 radioactive source and being irradiated to 25kGy, do
It is dry, crush, obtain modified cotton short fiber.
Embodiment 4
A kind of epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenol aldehyde modified epoxy
30 parts of resin, 16 parts of organic epoxy resin, 30 parts of E-44 epoxy resin, be modified 28 parts of cotton short fiber, and 4 parts of Attagel holds carboxylic
12 parts of base nitrile rubber, 1.5 parts of epoxidized SBS, 2 parts of trimethylhexane diamine, 1.4 parts of polyether diamine, 1.5 parts of triethanolamine, hydroxyl
2.5 parts of propyl cellulose, 40 parts of diglycidyl ether.
Modified cotton short fiber is prepared using following technique：By weight by 2 parts of N, N, N- trimethyl chitin is dissolved in 50
Part concentration is that in 2% acetic acid solution, it is 0.3mol/L silver nitrate solutiones that 5 parts of concentration are added dropwise under stirring, and completion of dropping is follow-up
Continuous stirring 15min, it is 0.6mol/L sodium borohydride solutions that 1 part of concentration is added dropwise, and continues to stir 20min after completion of dropping, adds 20
Part cotton short fiber, 0.5 part of silane coupler stir 100min, filter, and are dried in temperature 70 C vacuum drying oven to constant weight, send into
Containing concentration in the irradiation tube of 60wt% ethanol solutions, under nitrogen protection, to be put in Co 60 radioactive source and being irradiated to 25kGy, do
It is dry, crush, obtain modified cotton short fiber.
Embodiment 5
A kind of epoxy resin embedding adhesive with excellent mechanical performance, its raw material includes by weight：Phenol aldehyde modified epoxy
32 parts of resin, 15 parts of organic epoxy resin, 31 parts of E-44 epoxy resin, be modified 27 parts of cotton short fiber, and 5 parts of Attagel holds carboxylic
11 parts of base nitrile rubber, 1.9 parts of epoxidized SBS, 1.8 parts of trimethylhexane diamine, 1.5 parts of polyether diamine, 1.3 parts of triethanolamine,
2.8 parts of hydroxypropyl cellulose, 36 parts of diglycidyl ether.
Modified cotton short fiber is prepared using following technique：By weight by 3.5 parts of N, N, N- trimethyl chitin is dissolved in
45 parts of concentration are in 2.3% acetic acid solution, 2 parts of concentration to be added dropwise under stirring for 0.45mol/L silver nitrate solutiones, completion of dropping
Continue afterwards to stir 10min, it is 0.45mol/L sodium borohydride solutions that 1.6 parts of concentration are added dropwise, continue to stir 32min after completion of dropping,
Add 16 parts of cotton short fibers, 1.2 parts of silane couplers to stir 80min, filter, be dried to perseverance in 76 DEG C of vacuum drying ovens of temperature
Weight, sends into containing concentration in the irradiation tube of 55wt% ethanol solutions, under nitrogen protection, to be put in Co 60 radioactive source and being irradiated to
25kGy, dry, pulverize, and obtain modified cotton short fiber.
The above, the only present invention preferably specific embodiment, but protection scope of the present invention is not limited thereto,
Any those familiar with the art the invention discloses technical scope in, technology according to the present invention scheme and its
Inventive concept equivalent or change in addition, all should be included within the scope of the present invention.
Claims (8)
1. a kind of epoxy resin embedding adhesive with excellent mechanical performance, it is characterised in that its raw material includes by weight：Phenolic aldehyde
Modified epoxy 20-40 parts, organic epoxy resin 10-20 parts, E-44 epoxy resin 25-35 parts, be modified cotton short fiber 20-
30 parts, Attagel 2-8 parts, nbr carboxyl terminal 5-15 parts, epoxidized SBS 1-3 part, trimethylhexane diamine 1-3 parts, polyethers
Diamines 1-2 parts, triethanolamine 1-2 parts, hydroxypropyl cellulose 2-4 parts, diglycidyl ether 20-50 parts.
2. there is according to claim 1 the epoxy resin embedding adhesive of excellent mechanical performance, it is characterised in that modified cotton staple
Dimension is prepared using following technique：N, N, N- trimethyl chitin are dissolved in acetic acid solution, silver nitrate is added dropwise under stirring
Solution, continues to stir after completion of dropping, and sodium borohydride solution is added dropwise, and continues to stir after completion of dropping, adds cotton short fiber, silane
Coupling agent is stirred, and is filtered, and is dried to constant weight, in sending into the irradiation tube containing ethanol solution, under nitrogen protection, is put into Co 60 radiation
25kGy is irradiated in source, be dry, pulverize, obtain modified cotton short fiber.
3. the epoxy resin embedding adhesive with excellent mechanical performance according to claim 1 or claim 2, it is characterised in that modified cotton
Chopped fiber is prepared using following technique：By weight by 2-5 part N, N, N- trimethyl chitin is dissolved in 30-50 parts concentration for 2-
In 2.6% acetic acid solution, it is 0.3-0.6mol/L silver nitrate solutiones that 1-5 parts concentration is added dropwise under stirring, and completion of dropping is follow-up
Continuous stirring 5-15min, it is 0.3-0.6mol/L sodium borohydride solutions that 1-2 parts concentration is added dropwise, and continues to stir 20- after completion of dropping
40min, adds 10-20 part cotton short fibers, 0.5-1.5 parts silane coupler stirring 50-100min, filters, and is dried to constant weight, send
Enter containing concentration in the irradiation tube of 40-60wt% ethanol solutions, under nitrogen protection, to be put in Co 60 radioactive source and being irradiated to
25kGy, dry, pulverize, and obtain modified cotton short fiber.
4. there is the epoxy resin embedding adhesive of excellent mechanical performance according to any one of claim 1-3, it is characterised in that phenol
Aldehyde modified epoxy, organic epoxy resin, the weight ratio of E-44 epoxy resin are 30-34：14-16：30-32.
5. there is the epoxy resin embedding adhesive of excellent mechanical performance according to any one of claim 1-4, it is characterised in that change
Property cotton short fiber, Attagel, nbr carboxyl terminal, epoxidized SBS weight ratio be 26-28：4-6：10-12：1.5-2.2.
6. there is the epoxy resin embedding adhesive of excellent mechanical performance according to any one of claim 1-5, it is characterised in that three
Methyl hexamethylene diamine, polyether diamine, the weight ratio of triethanolamine are 1.5-2：1.4-1.6：1.2-1.5.
7. there is the epoxy resin embedding adhesive of excellent mechanical performance according to any one of claim 1-6, it is characterised in that change
Property cotton short fiber, hydroxypropyl cellulose weight ratio be 26-28：2.5-3.2.
8. there is the epoxy resin embedding adhesive of excellent mechanical performance according to any one of claim 1-7, it is characterised in that its
Raw material includes by weight：Phenol aldehyde modified epoxy resin 30-34 parts, organic epoxy resin 14-16 parts, E-44 epoxy resin
30-32 parts, be modified cotton short fiber 26-28 parts, Attagel 4-6 parts, nbr carboxyl terminal 10-12 parts, epoxidized SBS 1.5-
2.2 parts, trimethylhexane diamine 1.5-2 parts, polyether diamine 1.4-1.6 parts, triethanolamine 1.2-1.5 parts, hydroxypropyl cellulose
2.5-3.2 part, diglycidyl ether 30-40 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244401.7A CN106634760A (en) | 2016-12-29 | 2016-12-29 | Epoxy resin pouring sealant with excellent mechanical properties |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611244401.7A CN106634760A (en) | 2016-12-29 | 2016-12-29 | Epoxy resin pouring sealant with excellent mechanical properties |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106634760A true CN106634760A (en) | 2017-05-10 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611244401.7A Withdrawn CN106634760A (en) | 2016-12-29 | 2016-12-29 | Epoxy resin pouring sealant with excellent mechanical properties |
Country Status (1)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112646522A (en) * | 2020-12-18 | 2021-04-13 | 广州市乐基智能科技有限公司 | Pipeline thread sealant and preparation method thereof |
| CN112852369A (en) * | 2021-03-17 | 2021-05-28 | 东莞市德聚胶接技术有限公司 | High-temperature-resistant epoxy adhesive and preparation method thereof |
| CN114921210A (en) * | 2022-06-17 | 2022-08-19 | 宜春宇泽新能源有限公司 | Adhesive for solar-grade silicon wafer suitable for large-size flaking and preparation process and use method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103614107A (en) * | 2013-11-21 | 2014-03-05 | 安徽康瑞鑫电子科技有限公司 | Epoxy potting adhesive |
| CN104947418A (en) * | 2015-06-09 | 2015-09-30 | 中国林业科学研究院林产化学工业研究所 | Preparation method of chitosan quaternary ammonium salt-silver nanoparticle antibacterial cotton fibers |
-
2016
- 2016-12-29 CN CN201611244401.7A patent/CN106634760A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103614107A (en) * | 2013-11-21 | 2014-03-05 | 安徽康瑞鑫电子科技有限公司 | Epoxy potting adhesive |
| CN104947418A (en) * | 2015-06-09 | 2015-09-30 | 中国林业科学研究院林产化学工业研究所 | Preparation method of chitosan quaternary ammonium salt-silver nanoparticle antibacterial cotton fibers |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112646522A (en) * | 2020-12-18 | 2021-04-13 | 广州市乐基智能科技有限公司 | Pipeline thread sealant and preparation method thereof |
| CN112646522B (en) * | 2020-12-18 | 2022-09-30 | 广州市乐基智能科技有限公司 | Pipeline thread sealant and preparation method thereof |
| CN112852369A (en) * | 2021-03-17 | 2021-05-28 | 东莞市德聚胶接技术有限公司 | High-temperature-resistant epoxy adhesive and preparation method thereof |
| CN112852369B (en) * | 2021-03-17 | 2021-10-12 | 东莞市德聚胶接技术有限公司 | High-temperature-resistant epoxy adhesive and preparation method thereof |
| CN114921210A (en) * | 2022-06-17 | 2022-08-19 | 宜春宇泽新能源有限公司 | Adhesive for solar-grade silicon wafer suitable for large-size flaking and preparation process and use method thereof |
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Application publication date: 20170510 |