CN106604536B - Polytetrafluoroethylene (PTFE) composite microwave medium material and preparation method thereof - Google Patents
Polytetrafluoroethylene (PTFE) composite microwave medium material and preparation method thereof Download PDFInfo
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- CN106604536B CN106604536B CN201710057438.7A CN201710057438A CN106604536B CN 106604536 B CN106604536 B CN 106604536B CN 201710057438 A CN201710057438 A CN 201710057438A CN 106604536 B CN106604536 B CN 106604536B
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- ptfe
- polytetrafluoroethylene
- microwave dielectric
- microwave
- dielectric material
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- 229920001343 polytetrafluoroethylene Polymers 0.000 title claims abstract description 67
- 239000004810 polytetrafluoroethylene Substances 0.000 title claims abstract description 66
- 239000000463 material Substances 0.000 title claims abstract description 40
- 239000002131 composite material Substances 0.000 title claims abstract description 29
- -1 Polytetrafluoroethylene Polymers 0.000 title claims abstract description 28
- 238000002360 preparation method Methods 0.000 title description 6
- 239000000843 powder Substances 0.000 claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 23
- 239000000945 filler Substances 0.000 claims abstract description 17
- 239000003365 glass fiber Substances 0.000 claims abstract description 17
- 238000000462 isostatic pressing Methods 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 23
- 239000003989 dielectric material Substances 0.000 claims description 22
- 239000011888 foil Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000000839 emulsion Substances 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000006185 dispersion Substances 0.000 claims description 6
- 238000007731 hot pressing Methods 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 claims description 6
- 239000003960 organic solvent Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 230000000704 physical effect Effects 0.000 abstract description 2
- 229940058401 polytetrafluoroethylene Drugs 0.000 description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- 239000011889 copper foil Substances 0.000 description 14
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 230000003068 static effect Effects 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 8
- 238000010792 warming Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012752 auxiliary agent Substances 0.000 description 4
- 239000000835 fiber Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000004321 preservation Methods 0.000 description 4
- 238000007873 sieving Methods 0.000 description 4
- 238000001291 vacuum drying Methods 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920009441 perflouroethylene propylene Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- 229920001774 Perfluoroether Polymers 0.000 description 1
- 229920006361 Polyflon Polymers 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- MTZOKGSUOABQEO-UHFFFAOYSA-L barium(2+);phthalate Chemical compound [Ba+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O MTZOKGSUOABQEO-UHFFFAOYSA-L 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 150000002576 ketones Chemical group 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
Abstract
A kind of polytetrafluoroethylene (PTFE) composite microwave medium material is counted on the basis of the gross mass of the polytetrafluoroethylene (PTFE) composite microwave medium material, and the polytetrafluoroethylene (PTFE) composite microwave medium material includes following component and mass percentage: 30 ~ 60wt% of polytetrafluoroethylene (PTFE)；35 ~ 60wt% of Microwave dielectric ceramic powder filler；5 ~ 15wt% of glass fiber powder.Isostatic pressing green compact is used in the present invention, it is ensured that the isotropism of material physical property obtains on three directions of X-axis Y-axis and Z axis all with the composite microwave medium material of low thermal expansion coefficient.
Description
Technical field
The present invention relates to printed circuit board fields, and in particular to a kind of substrate for printed circuit board and its manufacturing method.
Background technique
With the revolution of modern information technologies, gradually stepped into information processing high speed, signal transmit high frequency to digital circuit
In the stage, to handle ever-increasing data, the frequency of electronic equipment becomes higher and higher.For this purpose, meeting traditional design and system
On the basis of making demand, the requirement of update is proposed to the performance of microwave-medium circuit base material.It is electric in view of printing is applied to
Signal on the plate of road must use high frequency, therefore, how to reduce transmission loss and signal delay on circuit boards, become high frequency
The problem of circuit design and production.
Thermal expansion coefficient is the mechanical property measuring material and varying with temperature.IPC-TM-6502.4.24. plate is defined
CTE measurement method.With the variation of temperature, dielectric-slab is in X, Y, and small variation can all occur for size in Z-direction,
In, the variation in Z-direction is more crucial, because it directly influences the reliability of plated through-hole, the size in Z-direction becomes
Changing conference is broken plated through-hole.
The fluoropolymer of low-dielectric loss, as polytetrafluoroethylene (PTFE) (PTFE), tetrafluoroethylene-perfluoro alkoxy vinyl ethers are total
Polymers (PFA) and fluorinated ethylene propylene copolymer (FEP) have excellent dielectric properties, resistance to chemical corrosion and hot
Can, water absorption rate is small, and use scope is wide, very little its dielectric constant at high frequencies and dielectric loss factor change, therefore
The fluoropolymer of low-dielectric loss becomes the first choice of high frequency circuit board base plate resin.
Currently, general copper-clad plate preparation method is resin concentration dispersion liquid dipping glass-fiber-fabric both at home and abroad, one after drying
It presses and is made at a temperature of fixed.Polyflon thermal expansion coefficient is big, the high frequency circuit board baseplate material obtained in this way, by
In having glass-fiber-fabric as backing material, substantially reduced in X and Y direction thermal expansion coefficient, but in Z-direction thermal expansion coefficient
It is still very big, it is far longer than the thermal expansion coefficient of copper, brings hidden danger to the reliability of printed circuit board plated through-hole.Foreign countries have awarded
Power patent US4335180 is the PTFE substrate processing technology of another height filling content at present, is added in fluoro-resin emulsion
After mixing, demulsification settles to obtain dough material for ceramic powder and fiber powder, is then rolled into sheet material, sticks after drying
Copper foil sintering.The ceramic powder and fiber powder of high filler loading capacity play the role of physical crosslinking point in fluororesin phase, are effectively improved filling
Dielectric material thermal expansion coefficient afterwards, but during rolling processing, fluororesin molecule and fiber powder all can be inevitable
Orientations are generated in rolling direction, so that final products be caused to be greater than X and Y direction in the thermal expansion coefficient of Z-direction.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of polytetrafluoroethylene (PTFE) composite microwaves
Dielectric material and preparation method thereof.
The present invention discloses a kind of composite microwave medium material first, uses polytetrafluoroethylene (PTFE) (PTFE) for carrier material,
It is blended with Microwave dielectric ceramic powder filler and milled glass fiber, by specific processing technology, obtains in X-axis Y-axis and Z axis
All with the composite microwave medium material of low thermal expansion coefficient on three directions.
Another object of the present invention is to provide the high-frequency circuit board for using above-mentioned composite microwave medium material production, tools
There is high-frequency dielectric performance, effect is fine in the signal transmission of high-frequency circuit, in addition, hot on three directions of X-axis Y-axis and Z axis
The coefficient of expansion is low, and good hole metallization processing may be implemented.
A further object of the present invention is to provide prepare above-mentioned composite microwave medium material and make high-frequency circuit with it
The method of middle board substrate.
To achieve the above object and the other purposes present invention is by including that the following technical solution is realized.
The present invention provides a kind of polytetrafluoroethylene (PTFE) composite microwave medium material, with the polytetrafluoroethylene (PTFE) composite microwave medium
It is counted on the basis of the gross mass of material, the polytetrafluoroethylene (PTFE) microwave dielectric material includes following component and mass percentage:
30~60wt% of polytetrafluoroethylene (PTFE)
35~60wt% of Microwave dielectric ceramic powder filler
5~15wt% of glass fiber powder.
Preferably, the number-average molecular weight of the polytetrafluoroethylene (PTFE) is 35~65 × 104.It is to pass through dispersion method polytetrafluoroethyl-ne
Alkene prepares.
Preferably, angle value is 0.1-20 μm in the partial size of the Microwave dielectric ceramic powder filler, and maximum particle diameter is no more than 100
μm。
Heretofore described Microwave dielectric ceramic powder filler is selected from the dielectric constant microwave of alumina base and silicate-base
The microwave dielectric ceramic with medium dielectric constant and titania based high-permittivity microwave medium ceramics one of media ceramic, barium phthalate base
Kind is a variety of.
Preferably, the glass fiber powder be alkali-free glass fibre powder, 5-20 μm of diameter, of length no more than 100 μm.
The present invention also provides a kind of microwave dielectric material plate, the plate is obtained by the method preparation included the following steps
:
1) polytetrafluoroethylene (PTFE) dispersion emulsion, microwave-medium ceramics are weighed according to the component of polytetrafluoroethylene (PTFE) microwave dielectric material
Powder filler and glass fiber powder；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is added in Microwave dielectric ceramic powder filler and glass fiber powder, is stirred,
Glue is made；
3) sedimentation agent is added in above-mentioned glue and is stirred demulsification, solids is filtered out, then toasted in 80~300 DEG C
Remove moisture removal and sedimentation agent；
4) solids after above-mentioned drying is crushed, obtains average grain diameter in 200 μm of powdered objects below；
5) above-mentioned powder is packed into mold, carries out isostatic pressing, obtains hollow cylindrical blank material；
6) above-mentioned hollow cylindrical blank material is put into baking oven, after being no more than 400 DEG C of sinter moldings, be cooled to room temperature；
7) above-mentioned sintered hollow cylindrical blank material rotary-cut is processed, obtains plate.
Preferably, in step 3), the sedimentation agent is volatile organic solvent.The organic solvent is ketone, ether and alcohol.Example
Ethyl alcohol for example commonly used in the prior art, acetone.
Preferably, in step 5), the pressure of isostatic pressing is 15~35MPa.It is highly preferred that waiting static pressure in step 5)
Molding pressure is 20~25MPa.
The present invention also provides a kind of substrate for printed circuit board, the substrate for printed circuit board includes: microwave dielectric material plate
Material and the metal foil for being covered on its two sides respectively.
Preferably, the metal foil is the alloy or composite metallic material of copper, brass, aluminium, nickel or these metals.
The present invention provides a kind of preparation method of above-mentioned substrate for printed circuit board, includes the following steps:
Microwave dielectric material plate is respectively covered to a metal foil up and down, press is put into and carries out hot pressing, be made two-sided and cover gold
Belong to the substrate for printed circuit board of foil.
The invention also discloses polytetrafluoroethylene (PTFE) microwave dielectric material as described above and printed circuit boards as described above
Purposes of the substrate on high-frequency circuit board.
Beneficial effects of the present invention: being blended using ptfe emulsion with Microwave dielectric ceramic powder and glass fiber powder,
Microwave dielectric ceramic powder uniform filling can be made to be dispersed in poly tetrafluoro ethylene matrix, the Microwave dielectric ceramic powder of high filler loading capacity is filled out
Material and glass fiber powder play the role of physical crosslinking point in polytetrafluoroethylene (PTFE) phase, and dielectric material thermally expands after being effectively improved filling
Coefficient；Using isostatic pressing green compact, it is ensured that the isotropism of material physical property obtains in three directions of X-axis Y-axis and Z axis
On all with low thermal expansion coefficient composite microwave medium material.
Detailed description of the invention
Fig. 1 is shown as the structural schematic diagram of the substrate for printed circuit board of embodiment.
Drawing reference numeral explanation
| 100 | Metal foil layer |
| 200 | Composite microwave medium material plate |
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Before further describing the specific embodiments of the present invention, it should be appreciated that protection scope of the present invention is not limited to down
State specific specific embodiment；It is also understood that term used in the embodiment of the present invention is specific specific in order to describe
Embodiment, rather than limiting the scope of protection of the present invention.The test method of actual conditions is not specified in the following example,
Usually according to normal condition, or according to condition proposed by each manufacturer.
When embodiment provides numberical range, it should be appreciated that except non-present invention is otherwise noted, two ends of each numberical range
Any one numerical value can be selected between point and two endpoints.Unless otherwise defined, the present invention used in all technologies and
Scientific term is identical as the normally understood meaning of those skilled in the art of the present technique.Except specific method, equipment used in embodiment,
Outside material, grasp and record of the invention according to those skilled in the art to the prior art can also be used and this
Any method, equipment and the material of the similar or equivalent prior art of method described in inventive embodiments, equipment, material come real
The existing present invention.
As shown in Figure 1, the substrate for printed circuit board of the present embodiment, composite microwave medium material plate 200 and cover respectively
Metal foil 100 in its two sides.
The metal foil is selected from one of alloy or composite metallic material of copper, brass, aluminium, nickel or these metals or more
Kind.It is preferred that low profile copper foil.
Embodiment 1
Table 1
As shown in Figure 1, substrate for printed circuit board includes composite microwave medium material plate 200 and difference in the present embodiment
It is overlaid on the metal foil 100 of its two sides.Metal foil layer 100 is low-profile electrolytic copper foil, the thickness 35um of metal foil layer 100.It is multiple
Close microwave dielectric material plate 200 with a thickness of 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacturing method of the substrate for printed circuit board of the present embodiment, comprising the following steps:
It weighs 5 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 60%), 6 kilograms of Microwave dielectric ceramic powder filler
(BaO-Sm2O3-TiO2System, D50 partial size 2um, dielectric constant 90), glass fiber powder 1 kilogram of (megalith EMG13-250, diameter
13um, long 50um) mix 1 hour using blender, 1500 turns of revolving speed, obtain uniformly mixed glue.
2000ml acetone is added in above-mentioned glue to be slowly stirred, it can be seen that there is pureed solids to settle.
Solids is filtered out, vacuum drying oven is put into, moisture removal and auxiliary agent is removed in 110 DEG C of bakings, obtains light yellow powder solids.
Solids after above-mentioned drying is gently beaten broken, partial size is obtained after sieving in 200um powder below.
Above-mentioned powder is fitted into the tubbiness rubber mold that section is circular ring shape, is placed on and waits carry out in static pressure press equal static pressure
Molding, pressure 20MPa obtain internal diameter 60mm, the hollow cylindrical blank of outer diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, is warming up to 400 DEG C with 10 DEG C/min heating rate, heat preservation
30 minutes, 60 DEG C or less taking-ups are then cooled to 10 DEG C/min rate.
Above-mentioned sintered hollow cylindrical blank is placed on progress rotary-cut processing on peeler, obtains thickness 0.25mm's
Plate.
Above-mentioned plate is respectively covered to a 35um low-profile electrolytic copper foil up and down, vacuum press is put into and carries out hot pressing,
Under 2.5MPa pressure condition, 380 DEG C are warming up to 10 DEG C/min heating rate, 60 minutes are kept the temperature, then with 10 DEG C/min rate
60 DEG C or less taking-ups are cooled to, the composite board of two-sided copper foil covered is obtained.
Embodiment 2
As shown in Figure 1, substrate for printed circuit board includes composite microwave medium material plate 200 and difference in the present embodiment
It is overlaid on the metal foil 100 of its two sides.Metal foil layer 100 is low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
Close microwave dielectric material plate 200 with a thickness of 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacturing method of the substrate for printed circuit board of the present embodiment, comprising the following steps:
Weigh 3.5 kilograms of Microwave dielectric ceramic powder filler of 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 60%)
(BaO-ZnO-TiO2System, D50 partial size 5um, dielectric constant 36), glass fiber powder 1.5 kilograms of (megalith EMG13-250, diameters
13um, long 50um) mix 1 hour using blender, 1500 turns of revolving speed, obtain uniformly mixed glue.
2000ml acetone is added in above-mentioned glue to be slowly stirred, it can be seen that there is pureed solids to settle.
Solids is filtered out, vacuum drying oven is put into, moisture removal and auxiliary agent is removed in 110 DEG C of bakings, obtains light yellow powder solids.
Solids after above-mentioned drying is gently beaten broken, partial size is obtained after sieving in 200um powder below.
Above-mentioned powder is fitted into the tubbiness rubber mold that section is circular ring shape, is placed on and waits carry out in static pressure press equal static pressure
Molding, pressure 20MPa obtain internal diameter 60mm, the hollow cylindrical blank of outer diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, is warming up to 400 DEG C with 10 DEG C/min heating rate, heat preservation
30 minutes, 60 DEG C or less taking-ups are then cooled to 10 DEG C/min rate.
Above-mentioned sintered hollow cylindrical blank is placed on progress rotary-cut processing on peeler, obtains thickness 0.25mm's
Plate.
Above-mentioned plate is respectively covered to a 35um low-profile electrolytic copper foil up and down, vacuum press is put into and carries out hot pressing,
Under 2.5MPa pressure condition, 380 DEG C are warming up to 10 DEG C/min heating rate, 60 minutes are kept the temperature, then with 10 DEG C/min rate
60 DEG C or less taking-ups are cooled to, the composite board of two-sided copper foil covered is obtained.
Embodiment 3
As shown in Figure 1, substrate for printed circuit board includes composite microwave medium material plate 200 and difference in the present embodiment
It is overlaid on the metal foil 100 of its two sides.Metal foil layer 100 is low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
Close microwave dielectric material plate 200 with a thickness of 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacturing method of the substrate for printed circuit board of the present embodiment, comprising the following steps:
Weigh 4 kilograms of Microwave dielectric ceramic powder filler of 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 50%)
(BaO-ZnO-TiO2System, D50 partial size 5um, dielectric constant 36), microwave fiber powder 1 kilogram of (megalith EMG13-250, diameter
13um, long 50um) mix 1 hour using blender, 1500 turns of revolving speed, obtain uniformly mixed glue.
2000ml acetone is added in above-mentioned glue to be slowly stirred, it can be seen that there is pureed solids to settle.
Solids is filtered out, vacuum drying oven is put into, moisture removal and auxiliary agent is removed in 110 DEG C of bakings, obtains light yellow powder solids.
Solids after above-mentioned drying is gently beaten broken, partial size is obtained after sieving in 200um powder below.
Above-mentioned powder is fitted into the tubbiness rubber mold that section is circular ring shape, is placed on and waits carry out in static pressure press equal static pressure
Molding, pressure 20MPa obtain internal diameter 60mm, the hollow cylindrical blank of outer diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, is warming up to 400 DEG C with 10 DEG C/min heating rate, heat preservation
30 minutes, 60 DEG C or less taking-ups are then cooled to 10 DEG C/min rate.
Above-mentioned sintered hollow cylindrical blank is placed on progress rotary-cut processing on peeler, obtains thickness 0.25mm's
Plate.
Above-mentioned plate is respectively covered to a 35um low-profile electrolytic copper foil up and down, vacuum press is put into and carries out hot pressing,
Under 2.5MPa pressure condition, 380 DEG C are warming up to 10 DEG C/min heating rate, 60 minutes are kept the temperature, then with 10 DEG C/min rate
60 DEG C or less taking-ups are cooled to, the composite board of two-sided copper foil covered is obtained.
Embodiment 4
As shown in Figure 1, substrate for printed circuit board includes composite microwave medium material plate 200 and difference in the present embodiment
It is overlaid on the metal foil 100 of its two sides.Metal foil layer 100 is low-profile electrolytic copper foil, the thickness 18um of metal foil layer 100.It is multiple
Close microwave dielectric material plate 200 with a thickness of 0.25mm.Its unit for electrical property parameters is as shown in table 1.
The manufacturing method of the substrate for printed circuit board of the present embodiment, comprising the following steps:
Weigh 4.5 kilograms of Microwave dielectric ceramic powder filler of 10 kilograms of PTFE emulsion (great Jin D210, PTFE solid content 50%)
(BaO-ZnO-TiO2System, D50 partial size 5um, dielectric constant 36), glass fiber powder 0.5 kilogram of (megalith EMG13-250, diameter
13um, long 50um) mix 1 hour using blender, 1500 turns of revolving speed, obtain uniformly mixed glue.
2000ml acetone is added in above-mentioned glue to be slowly stirred, it can be seen that there is pureed solids to settle.
Solids is filtered out, vacuum drying oven is put into, moisture removal and auxiliary agent is removed in 110 DEG C of bakings, obtains light yellow powder solids.
Solids after above-mentioned drying is gently beaten broken, partial size is obtained after sieving in 200um powder below.
Above-mentioned powder is fitted into the tubbiness rubber mold that section is circular ring shape, is placed on and waits carry out in static pressure press equal static pressure
Molding, pressure 25MPa obtain internal diameter 60mm, the hollow cylindrical blank of outer diameter 150mm.
Above-mentioned hollow cylindrical blank is placed in high temperature oven, is warming up to 400 DEG C with 10 DEG C/min heating rate, heat preservation
30 minutes, 60 DEG C or less taking-ups are then cooled to 10 DEG C/min rate.
Above-mentioned sintered hollow cylindrical blank is placed on progress rotary-cut processing on peeler, obtains thickness 0.25mm's
Plate.
Above-mentioned plate is respectively covered to a 35um low-profile electrolytic copper foil up and down, vacuum press is put into and carries out hot pressing,
Under 2.5MPa pressure condition, 380 DEG C are warming up to 10 DEG C/min heating rate, 60 minutes are kept the temperature, then with 10 DEG C/min rate
60 DEG C or less taking-ups are cooled to, the composite board of two-sided copper foil covered is obtained.
The above, only presently preferred embodiments of the present invention, not to the present invention in any form with substantial limitation,
It should be pointed out that under the premise of not departing from the method for the present invention, can also be made for those skilled in the art
Several improvement and supplement, these are improved and supplement also should be regarded as protection scope of the present invention.All those skilled in the art,
Without departing from the spirit and scope of the present invention, when made using disclosed above technology contents it is a little more
Dynamic, modification and the equivalent variations developed, are equivalent embodiment of the invention；Meanwhile all substantial technologicals pair according to the present invention
The variation, modification and evolution of any equivalent variations made by above-described embodiment, still fall within the range of technical solution of the present invention
It is interior.
Claims (8)
1. a kind of microwave dielectric material plate, which is characterized in that the method that the microwave dielectric material plate includes the following steps
It prepares:
1) polytetrafluoroethylene (PTFE) dispersion emulsion, microwave-medium ceramics are weighed according to the component of polytetrafluoroethylene (PTFE) composite microwave medium material
Powder filler and glass fiber powder；
2) polytetrafluoroethylene (PTFE) dispersion emulsion is added in Microwave dielectric ceramic powder filler and glass fiber powder, is stirred, is made
Glue；
3) sedimentation agent is added in above-mentioned glue and is stirred demulsification, solids is filtered out, then removed in 80~300 DEG C of bakings
Moisture and sedimentation agent；
4) solids after above-mentioned drying is crushed, obtains average grain diameter in 200 μm of powdered objects below；
5) above-mentioned powder is packed into mold, carries out isostatic pressing, obtains hollow cylindrical blank material；
6) above-mentioned hollow cylindrical blank material is put into baking oven, after being no more than 400 DEG C of sinter moldings, be cooled to room temperature；
7) above-mentioned sintered hollow cylindrical blank material rotary-cut is processed, obtains plate；
It is counted on the basis of the gross mass of the polytetrafluoroethylene (PTFE) composite microwave medium plate, the polytetrafluoroethylene (PTFE) composite microwave is situated between
Material is following component and mass percentage:
30~60wt% of polytetrafluoroethylene (PTFE)
35~60wt% of Microwave dielectric ceramic powder filler
5~15wt% of glass fiber powder；
In step 3), the sedimentation agent is volatile organic solvent.
2. microwave dielectric material plate according to claim 1, which is characterized in that the Microwave dielectric ceramic powder filler
Angle value is 0.1-20 μm in partial size, and maximum particle diameter is no more than 100 μm.
3. microwave dielectric material plate according to claim 1, which is characterized in that the glass fiber powder is alkali-free glass
Fiber powder, 5-20 μm of diameter, of length no more than 100 μm.
4. microwave dielectric material plate according to claim 1, which is characterized in that the equal molecule of the number of the polytetrafluoroethylene (PTFE)
Amount is (35~65) × 104。
5. microwave dielectric material plate as described in claim 1, which is characterized in that in step 5), the pressure of isostatic pressing is
15~35MPa.
6. a kind of substrate for printed circuit board, which is characterized in that the substrate for printed circuit board includes: as Claims 1 to 5 is any
Microwave dielectric material plate described in item and the metal foil for being covered on its two sides respectively.
7. a kind of method for preparing substrate for printed circuit board as claimed in claim 6, includes the following steps: microwave dielectric material
Plate respectively covers a metal foil up and down, puts press into and carries out hot pressing, the substrate for printed circuit board of two-sided clad with metal foil is made.
8. polytetrafluoroethylene (PTFE) microwave dielectric material plate and printing as claimed in claim 6 as described in any one of Claims 1 to 5
Purposes of the board substrate on high-frequency circuit board.
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| TW202206286A (en) | 2020-07-28 | 2022-02-16 | 美商聖高拜塑膠製品公司 | Dielectric substrate and method of forming the same |
| CN111849097B (en) * | 2020-07-30 | 2022-02-11 | 佛山(华南)新材料研究院 | Preparation method of high-frequency low-dielectric material |
| EP4265073A1 (en) | 2020-12-16 | 2023-10-25 | Saint-Gobain Performance Plastics Corporation | Dielectric substrate and method of forming the same |
| CN112940415B (en) * | 2021-02-04 | 2023-08-11 | 上海材料研究所有限公司 | Polytetrafluoroethylene composite material and preparation method thereof |
| CN113135752A (en) * | 2021-06-03 | 2021-07-20 | 中国振华集团云科电子有限公司 | Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1168436A3 (en) * | 2000-06-29 | 2008-11-19 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
| CN102199330A (en) * | 2010-12-24 | 2011-09-28 | 东莞市新志密封技术有限公司 | Method for preparing modified Teflon composite material and its product |
| CN102731941A (en) * | 2012-06-13 | 2012-10-17 | 浙江大学 | Preparation method of teflon composite material |
| CN104211320A (en) * | 2014-07-25 | 2014-12-17 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite medium substrate |
| CN106188998A (en) * | 2016-07-12 | 2016-12-07 | 刘世超 | A kind of PTFE medium substrate high-frequency copper-clad plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE320656T1 (en) * | 2000-06-30 | 2006-04-15 | 3M Innovative Properties Co | HIGH FREQUENCY ELECTRONIC PART COMPRISING AN INSULATING MATERIAL AND METHOD FOR PRODUCING THE SAME |
-
2017
- 2017-01-26 CN CN201710057438.7A patent/CN106604536B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1168436A3 (en) * | 2000-06-29 | 2008-11-19 | International Business Machines Corporation | Polymer and ceramic composite electronic substrates |
| CN102199330A (en) * | 2010-12-24 | 2011-09-28 | 东莞市新志密封技术有限公司 | Method for preparing modified Teflon composite material and its product |
| CN102731941A (en) * | 2012-06-13 | 2012-10-17 | 浙江大学 | Preparation method of teflon composite material |
| CN104211320A (en) * | 2014-07-25 | 2014-12-17 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite medium substrate |
| CN106188998A (en) * | 2016-07-12 | 2016-12-07 | 刘世超 | A kind of PTFE medium substrate high-frequency copper-clad plate |
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