CN106546898A - A kind of equipment and method of testing for chip temperature test - Google Patents
A kind of equipment and method of testing for chip temperature test Download PDFInfo
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- CN106546898A CN106546898A CN201510588771.1A CN201510588771A CN106546898A CN 106546898 A CN106546898 A CN 106546898A CN 201510588771 A CN201510588771 A CN 201510588771A CN 106546898 A CN106546898 A CN 106546898A
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Abstract
The present invention relates to a kind of equipment and method of testing for chip temperature test, including high/low temperature main frame, the high/low temperature casing connected with high/low temperature main frame by air inlet pipe and muffler and one are by being dried the drying tower that trachea is connected with high/low temperature casing.Therefore, the invention has the advantages that：1. reasonable in design, simple structure and completely practicality；2. the hypothesis testing condition as laboratory high-low temperature chamber can be reached so as to which energy should be in batch production；3. low cost, energy consumption are low.
Description
Technical field
The present invention relates to the equipment and method of testing of a kind of test, more particularly, to a kind of equipment and method of testing for chip temperature test.
Background technology
The application of IC chip is more and more extensive, and the more special IC chip test production of some applications needs to carry out in the environment of high/low temperature.At present, big testing, sorting machine equipment company of external a few families, possesses high/low temperature and is particularly the manufacturing capacity that low temperature -40 spends testing, sorting, but mostly use liquid nitrogen refrigeration modes, and use cost is high.
The content of the invention
The present invention mainly solves the technical problem existing for prior art；There is provided a kind of hypothesis testing condition that can be reached as laboratory high-low temperature chamber so as to can be in a kind of equipment for chip temperature test of batch production.
Further object of the present invention is to solve the technical problem existing for prior art；There is provided a kind of low cost, a kind of low equipment for chip temperature test of energy consumption.
What the above-mentioned technical problem of the present invention was mainly addressed by following technical proposals：
A kind of equipment for chip temperature test, it is characterised in that including a high/low temperature main frame, the high/low temperature casing connected with high/low temperature main frame by air inlet pipe and muffler and one by being dried the drying tower that trachea is connected with high/low temperature casing.
In a kind of above-mentioned equipment for chip temperature test, the high/low temperature casing includes a base plate, the test suite that the base plate is provided with the test tracks for passing through for IC chip and is connected with test tracks；Four sides of the base plate are provided with and are vertically arranged the short side plate of side plate, i.e., two and two long side plates with base plate, wherein, two short side plates are provided with groove, and the bottom portion of groove is embedded with heating rod, and the base plate is provided with cover plate；The base plate, cover plate and side plate constitute a high/low temperature casing with cavity.
In a kind of above-mentioned equipment for chip temperature test, the air inlet and return-air hole connected with cavity on one of them long side plate, is respectively equipped with, the air inlet is connected with air inlet pipe one end；Return-air hole is connected with muffler one end.
In a kind of above-mentioned equipment for chip temperature test, it is provided with the long side plate of air inlet and return-air hole and is additionally provided with a dry air interface connected with cavity, the dry air interface is connected with above-mentioned one end for being dried trachea.
In a kind of above-mentioned equipment for chip temperature test, silica gel plug is respectively equipped with two grooves of two short side plates, the charging aperture and discharging opening passed through for above-mentioned test tracks between two silica gel plug bottoms and two grooves, is respectively equipped with.
A kind of method of testing of chip temperature test, it is characterized in that, when the low-temperature test of IC chip is carried out, after work a period of time, the easy frosting of inside cavity, and at entry/exit material mouth, the air themperature outside interface port can be reduced due to the cold air of inside cavity, make which be condensed into water, frost will be formed at zero degree entry/exit material mouth when temperature reaches；For these problems, in test inside cavity in addition to leading to the cryogenic gas that refrigeration source conveying comes, separately install drying tower additional and dry air is provided, dew point is below 0 degree, dry gas are blown into cavity simultaneously, the air pressure in cavity is made more than ambient pressure, even if the air of outside cannot be introduced into inside cavity, it is to avoid inside cavity frosting；In addition, in the pre-buried heating rod of orbital segment of entry/exit cavity, the temperature of entry/exit orbital segment is heated to room temperature, it is to avoid entry/exit material mouth frosting.
Therefore, the invention has the advantages that：1. reasonable in design, simple structure and completely practicality；2. the hypothesis testing condition as laboratory high-low temperature chamber can be reached so as to which energy should be in batch production；3. low cost, energy consumption are low.
Description of the drawings
Fig. 1 is the attachment structure schematic diagram of the present invention.
Fig. 2 is the main structure diagram of high/low temperature casing in Fig. 1.
Fig. 3 is the assembly structure diagram of high/low temperature casing in Fig. 1.
Fig. 4 is the dimensional structure diagram of high/low temperature casing in Fig. 1.
Specific embodiment
Below by embodiment, and accompanying drawing is combined, technical scheme is described in further detail.In figure, high/low temperature main frame 1, air inlet pipe 2, muffler 3, trachea 4, drying tower 5, base plate 6, short side plate 7, long side plate 8, groove 9, cover plate 11, air inlet 12, return-air hole 13, dry air interface 14, silica gel plug 15, high/low temperature casing 16, discharging opening 17, charging aperture 18 are dried.
Embodiment：
First, the concrete structure of the present invention is introduced, the present invention is including a high/low temperature main frame 1, the high/low temperature casing 16 connected with high/low temperature main frame 1 by air inlet pipe 2 and muffler 3 and one by being dried the drying tower 5 that trachea 4 is connected with high/low temperature casing 16.
Wherein, high/low temperature casing 16 includes a base plate 6, the test suite that base plate 6 is provided with the test tracks for passing through for IC chip and is connected with test tracks；6 four sides of base plate are provided with and are vertically arranged the short side plate of side plate, i.e., two 7 and two long side plates 8 with base plate 6, wherein, two short side plates 7 are provided with groove 9, and 9 bottom of groove is embedded with heating rod, and base plate 6 is provided with cover plate 11；Base plate 6, cover plate 11 and side plate constitute a high/low temperature casing 16 with cavity, also, are respectively equipped with the air inlet 12 and return-air hole 13 connected with cavity on a long side plate 8 wherein, and the air inlet 12 is connected with 2 one end of air inlet pipe；Return-air hole 13 is connected with 3 one end of muffler；It is provided with the long side plate 8 of air inlet 12 and return-air hole 13 and is additionally provided with a dry air interface 14 connected with cavity, the dry air interface 14 is connected with above-mentioned one end for being dried trachea 4.
Silica gel plug 15 is respectively equipped with the groove 9 of two short side plates 7, the charging aperture 18 and discharging opening 17 passed through for above-mentioned test tracks between two 15 bottoms of silica gel plug and two grooves 9, is respectively equipped with.
The present invention, mainly using the high/low temperature main frame 1 in traditional high-low temperature chamber, the device of the high/low temperature test of IC chip is carried out, it should be noted that when the low-temperature test of IC chip is carried out, after work a period of time, the easy frosting of inside cavity, and at entry/exit material mouth, the air themperature outside interface port can be reduced due to the cold air of inside cavity, make which be condensed into water, frost will be formed at zero degree entry/exit material mouth when temperature reaches；For these problems, in test inside cavity in addition to leading to the cryogenic gas that refrigeration source conveying comes, separately install drying tower 5 additional and dry air is provided, dew point is below 0 degree, dry gas are blown into cavity simultaneously, the air pressure in cavity is made more than ambient pressure, even if the air of outside cannot be introduced into inside cavity, it is to avoid inside cavity frosting；In addition, in the pre-buried heating rod of orbital segment of entry/exit cavity, the temperature of entry/exit orbital segment is heated to room temperature, it is to avoid entry/exit material mouth frosting.
During work, start high/low temperature main frame 1, the degree of circulation low-temperature cold wind -40 left and right is blown into into high/low temperature casing 16 by air inlet pipe 2, muffler 3；Meanwhile, start drying tower 5, dry gas are blown into cavity, make the air pressure in cavity more than ambient pressure, even if the air of outside cannot be introduced into inside cavity, it is to avoid inside cavity frosting；In addition, starting heating rod, the temperature of entry/exit orbital segment is heated to into room temperature, it is to avoid entry/exit material mouth frosting.Tested IC chip is sent from discharging opening 17 into test tracks and after being tested to survey IC chip by test suite by charging aperture 18.
Specific embodiment described herein is only explanation for example spiritual to the present invention.Those skilled in the art can be made various modifications or supplement or substituted using similar mode to described specific embodiment, but without departing from the spiritual of the present invention or surmount scope defined in appended claims.
Although more having used high/low temperature main frame 1, air inlet pipe 2 herein, muffler 3, being dried the terms such as trachea 4, drying tower 5, base plate 6, short side plate 7, long side plate 8, groove 9, cover plate 11, air inlet 12, return-air hole 13, dry air interface 14, silica gel plug 15, high/low temperature casing 16, discharging opening 17, charging aperture 18, the probability using other terms is not precluded from.It is used for the purpose of more easily describing and explaining the essence of the present invention using these terms；It is all contrary with spirit of the invention to be construed as any additional restriction.
Claims (4)
1. it is a kind of for chip temperature test equipment, it is characterised in that including a high/low temperature main frame（1）, by air inlet pipe（2）And muffler（3）With high/low temperature main frame（1）The high/low temperature casing of connection（16）And one by being dried trachea（4）With high/low temperature casing（16）The drying tower of connection（5）；The high/low temperature casing（16）Including a base plate（6）, the base plate（6）The test suite for being provided with the test tracks for passing through for IC chip and being connected with test tracks；The base plate（6）Four sides are provided with and base plate（6）It is vertically arranged the short side plate of side plate, i.e., two（7）With two long side plates（8）, wherein, two short side plates（7）It is provided with groove（9）, the groove（9）Bottom is embedded with heating rod, the base plate（6）It is provided with cover plate（11）；The base plate（6）, cover plate（11）And side plate constitutes a high/low temperature casing with cavity（16）.
2. it is according to claim 1 it is a kind of for chip temperature test equipment, it is characterised in that one of them long side plate（8）On be respectively equipped with the air inlet connected with cavity（12）And return-air hole（13）, the air inlet（12）With air inlet pipe（2）One end connects；Return-air hole（13）With muffler（3）One end connects；It is provided with air inlet（12）And return-air hole（13）Long side plate（8）On be additionally provided with a dry air interface connected with cavity（14）, the dry air interface（14）Trachea is dried with above-mentioned（4）One end connection.
3. it is according to claim 1 it is a kind of for chip temperature test equipment, it is characterised in that two short side plates（7）Two grooves（9）Silica gel plug is respectively equipped with inside（15）, two silica gel plugs（15）Bottom and two grooves（9）Between be respectively equipped with the charging aperture passed through for above-mentioned test tracks（18）And discharging opening（17）.
4. the method for testing that a kind of chip temperature is tested, it is characterized in that, when the low-temperature test of IC chip is carried out, after work a period of time, the easy frosting of inside cavity, and at entry/exit material mouth, the air themperature outside interface port can be reduced due to the cold air of inside cavity, make which be condensed into water, frost will be formed at zero degree entry/exit material mouth when temperature reaches；For these problems, in test inside cavity in addition to leading to the cryogenic gas that refrigeration source conveying comes, separately install drying tower additional and dry air is provided, dew point is below 0 degree, dry gas are blown into cavity simultaneously, the air pressure in cavity is made more than ambient pressure, even if the air of outside cannot be introduced into inside cavity, it is to avoid inside cavity frosting；In addition, in the pre-buried heating rod of orbital segment of entry/exit cavity, the temperature of entry/exit orbital segment is heated to room temperature, it is to avoid entry/exit material mouth frosting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588771.1A CN106546898A (en) | 2015-09-16 | 2015-09-16 | A kind of equipment and method of testing for chip temperature test |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588771.1A CN106546898A (en) | 2015-09-16 | 2015-09-16 | A kind of equipment and method of testing for chip temperature test |
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| CN106546898A true CN106546898A (en) | 2017-03-29 |
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| CN201510588771.1A Withdrawn CN106546898A (en) | 2015-09-16 | 2015-09-16 | A kind of equipment and method of testing for chip temperature test |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107894560A (en) * | 2017-11-29 | 2018-04-10 | 英特尔产品（成都）有限公司 | The chip test system and its method that oil-free air dosage reduces |
| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
| CN111751708A (en) * | 2020-06-29 | 2020-10-09 | 苏州猎奇智能设备有限公司 | Chip temperature control test bench and temperature control test method thereof |
| CN113640648A (en) * | 2021-07-31 | 2021-11-12 | 深圳市优界科技有限公司 | High-low temperature heat flow instrument for chip reliability test |
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| CN102854004A (en) * | 2012-07-10 | 2013-01-02 | 金新民 | High-low temperature endurance test machine |
| CN202757770U (en) * | 2012-07-10 | 2013-02-27 | 金新民 | High-low temperature durability testing machine |
| CN102941131A (en) * | 2012-11-07 | 2013-02-27 | 南京航空航天大学 | Small high-low temperature tester |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108957272A (en) * | 2017-05-18 | 2018-12-07 | 汉民科技股份有限公司 | Semiconductor testing device |
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| CN111751708A (en) * | 2020-06-29 | 2020-10-09 | 苏州猎奇智能设备有限公司 | Chip temperature control test bench and temperature control test method thereof |
| CN113640648A (en) * | 2021-07-31 | 2021-11-12 | 深圳市优界科技有限公司 | High-low temperature heat flow instrument for chip reliability test |
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Application publication date: 20170329 |