CN106523993B - Lighting device - Google Patents

Lighting device Download PDF

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Publication number
CN106523993B
CN106523993B CN201611075854.1A CN201611075854A CN106523993B CN 106523993 B CN106523993 B CN 106523993B CN 201611075854 A CN201611075854 A CN 201611075854A CN 106523993 B CN106523993 B CN 106523993B
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CN
China
Prior art keywords
plate
heat transfer
heat
medium circulation
screw
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CN201611075854.1A
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Chinese (zh)
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CN106523993A (en
Inventor
叶伟炳
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Dongguan Wenyu Industrial Co Ltd
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Dongguan Wenyu Industrial Co Ltd
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Priority to CN201611075854.1A priority Critical patent/CN106523993B/en
Publication of CN106523993A publication Critical patent/CN106523993A/en
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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V21/00Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
    • F21V21/10Pendants, arms, or standards; Fixing lighting devices to pendants, arms, or standards
    • F21V21/116Fixing lighting devices to arms or standards

Abstract

A kind of lighting device, which is characterized in that including lamp plate, removable component, light fixture, heat sink and structural strengthening component.Removable component includes multiple dismounting mould groups, and each fixed column is arranged at intervals on the one side of lamp plate, and each dismounting ring one-to-one correspondence activity is placed on outside a fixed column.Light fixture includes multiple illuminating modules, and each illuminating module includes multiple LED light emitting components.Structural strengthening component includes that fixed plate body, installation plate body, reinforcement gusset, the first screw and the second screw, the side edge of heat sink offer screw hole, and fixed plate body is attached in the side edge of heat sink.The LED light emitting component that above-mentioned lighting device can control corresponding number executes light emission operation, and then can be realized the effect of brightness control.By setting structure stiffener assembly, the mechanical strength and structural stability of lighting device can be improved, and improve lighting device and be mounted on the strong degree in external mounting bracket.

Description

Lighting device
Technical field
The present invention relates to technical field of lamps, more particularly to a kind of lighting device.
Background technique
Currently, the LED light emitting component of predetermined number is generally fixedly mounted on lamp plate by existing lamps and lanterns, later by lamp plate Be mounted in shell, in this way, the brightness of existing lamps and lanterns be it is fixed, to adjust the brightness of existing lamps and lanterns, it usually needs installation Control device, for controlling the operating power of LED light emitting component, e.g., by control lead to LED light emitting component electric current or Voltage swing, to reach the problem of controlling the brightness of LED light emitting component, however, can be improved by additionally installation control device existing There is the cost of lamps and lanterns.
Also, if existing lamp deflection is in portable design, cause existing lamps and lanterns mechanical strength it is poor.
Summary of the invention
Based on this, it is necessary to it is good and without using control device to provide a kind of brightness control effect, and passes through setting knot Structure stiffener assembly, and fixed plate body, installation plate body, reinforcement gusset, the first screw and the second screw can be improved overall structure Mechanical strength and structural stability, and improve main structure be mounted on the strong degree in external mounting bracket illumination dress It sets.
A kind of lighting device, comprising:
Lamp plate,
Removable component, the removable component include multiple dismounting mould groups, and each dismounting mould group is arranged at intervals at the lamp On the one side of plate, each dismounting mould group includes that fixed column and dismounting ring, each fixed column are arranged at intervals at the lamp On the one side of plate, each dismounting ring one-to-one correspondence activity is placed on outside a fixed column;
Light fixture, the light fixture include multiple illuminating modules, each illuminating module be arranged in a one-to-one correspondence in On the one dismounting ring, each illuminating module includes multiple LED light emitting components, each illuminating module it is each described LED light emitting component is arranged at intervals on the corresponding dismounting ring,
Heat sink, the heat sink are attached on one side of the lamp plate far from the removable component;And
Structural strengthening component, the structural strengthening component include fixed plate body, installation plate body, reinforce gusset, the first screw And second screw, the side edge of the heat sink offer screw hole, the fixed plate body is attached at the side of the heat sink On edge, the fixed plate body offers First Transition hole, and the First Transition hole aligns with the screw hole, first spiral shell Nail sequence wears the First Transition hole and the screw hole, first screw respectively with the heat sink and the fixed plate body Bolt, the installation plate body are vertically installed on the fixed plate body, the reinforcement gusset respectively with the fixed plate body and The installation plate body is mutually fixed, and the installation plate body offers the second transitional pore, and second screw wears second transition Hole, and second screw and the installation plate body bolt;
The lighting device further includes heat transfer transition apparatus and waste heat huge profit device, the heat transfer transition apparatus with it is described Heat sink connection, the waste heat huge profit device are connect with the heat transfer transition apparatus;
The heat transfer transition apparatus includes heat transfer case, medium circulation effuser, medium circulation return pipe and multiple semiconductors Cooling piece, the medium circulation effuser and the medium circulation return pipe are connected to the heat transfer case respectively, each described partly to lead Body cooling piece is mounted on the heat transfer case;
The heat transfer case includes heat transfer plate body, frame, encapsulation plate body and multiple contact partitions, the heat transfer plate body and described Encapsulation plate body is mutually fixed with the both ends of the frame respectively, and the contact partition is set on the heat transfer plate body, and described is connect Touching partition is located in the frame;The frame has hollow structure, and the first end of the frame offers the first opening, described The second end of frame offers the second opening, and the first end of the heat transfer plate body and the frame is mutually fixed, the heat transfer plate body It covers in first opening, the heat transfer plate body is for closing first opening, the encapsulation plate body and the frame Second end mutually fix, the encapsulation plate body cover at it is described second opening on, the encapsulation plate body be used for close described second Opening, the heat transfer plate body, the encapsulation plate body and the frame connect and form medium accommodating cavity, the medium accommodating cavity It is equipped with heat transfer medium in vivo;Each contact baffle interval is set on the inner sidewall of the encapsulation plate body, each contact Partition is placed in the medium accommodating cavity body, and each contact partition and the heat transfer medium contacts, each contact every Plate offers recirculation hole respectively;The heat transfer plate body offers multiple mounting grooves far from the one side of the frame, each described Semiconductor chilling plate one-to-one correspondence is placed in a mounting groove, and the two sides of each semiconductor chilling plate are respectively arranged with Cold and hot end, it is mutually solid with the bottom of a mounting groove that the hot end of each semiconductor chilling plate corresponds one Fixed, the cold end of each semiconductor chilling plate is mutually fixed with the heat sink respectively, and the heat transfer plate body is dissipated with described Interval is provided between hot plate;The both ends of the encapsulation plate body offer medium circulation tap hole respectively and medium circulation flows into Hole, the medium circulation tap hole and the medium circulation inflow hole are connected to medium accommodating cavity respectively, the medium Circulation effuser and the medium circulation return pipe are individually fixed on the encapsulation plate body, and the of the medium circulation effuser One end is connected to the medium circulation tap hole, and the first end of the medium circulation return pipe and the medium circulation inflow hole connect It is logical;
The waste heat huge profit device includes waste heat huge profit device noumenon, medium circulation access tube and medium circulation discharge Pipe, waste heat huge profit device noumenon have by thermal contact portion, and the inside by thermal contact portion offers heat release cavity, The surface setting by thermal contact portion is by thermal interface, the first end of the medium circulation access tube and medium circulation row The first end of outlet pipe is connected to the heat release cavity respectively, the second end and the medium circulation of the medium circulation access tube The second end of effuser is connected to, and the second end of the second end of the medium circulation discharge pipe and the medium circulation return pipe connects It is logical.
Reinforcing gusset in one of the embodiments, has triangular structure, reinforces the two of them side difference of gusset It is mutually fixed with fixed plate body and installation plate body.
Fixed plate body has rectangular parallelepiped structure in one of the embodiments,.
Installation plate body has rectangular parallelepiped structure in one of the embodiments,.
Fixed plate body offers multiple screw holes in one of the embodiments, and fixed plate body offers multiple First Transitions Hole, structural strengthening component are provided with multiple first screws, and every one first screw one-to-one correspondence wears a First Transition hole and a spiral shell Hole.
Installation plate body offers multiple second transitional pores in one of the embodiments, and structural strengthening component is provided with more A second screw, each screw one-to-one correspondence wear one second transitional pore.
The extending direction of the first screw and the extending direction of the second screw are perpendicular in one of the embodiments,.
The removable component of above-mentioned lighting device includes multiple dismounting mould groups, and each dismounting mould group includes fixed column and dismounting Ring, each dismounting ring one-to-one correspondence activity are placed on outside a fixed column, more easily carry out dismounting behaviour so as to make to dismount ring Make, need how many dismounting rings, then how many dismounting rings are installed, are held so as to control the LED light emitting component of corresponding number Row light emission operation, and then can be realized the effect of brightness control, and without installing control device.Also, structural strengthening component packet It includes fixed plate body, installation plate body, reinforcement gusset, the first screw and the second screw, the side edge of heat sink and offers screw hole, Gu Fixed board is shown consideration in the side edge for investing heat sink, and fixed plate body offers First Transition hole, and First Transition hole is opposite with screw hole Together, the first screw sequence wears First Transition hole and screw hole, and the first screw with heat sink and fixed plate body bolt, is installed respectively Plate body is vertically installed on fixed plate body, is reinforced gusset and is mutually fixed with fixed plate body and installation plate body respectively, installation plate body opens up There is the second transitional pore, the second screw wears the second transitional pore, and the second screw and installation plate body bolt, in this way, passing through setting Structural strengthening component, and fixed plate body, installation plate body, reinforcement gusset, the first screw and the second screw can be improved illumination dress The mechanical strength and structural stability set, and improve lighting device and be mounted on the strong degree in external mounting bracket.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the lighting device of an embodiment of the present invention;
Fig. 2 is the structural schematic diagram of another angle of lighting device shown in FIG. 1;
Fig. 3 is the structural schematic diagram of the lighting device of another embodiment of the present invention;
Fig. 4 is the structural schematic diagram of the lighting device of another embodiment of the present invention;
Fig. 5 is enlarged drawing of the lighting device shown in Fig. 4 at A;
Fig. 6 is the structural schematic diagram of the lighting device of another embodiment of the present invention;
Fig. 7 is the structural schematic diagram of the heat transfer transition apparatus of an embodiment of the present invention;
Fig. 8 is the partial structural diagram of heat transfer transition apparatus shown in Fig. 7;
Fig. 9 is the structural schematic diagram of another angle of heat transfer transition apparatus shown in Fig. 7.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant listed item.
In one embodiment, a kind of lighting device, comprising: lamp plate, removable component, the removable component include multiple dismounting Mould group, each dismounting mould group are arranged at intervals on the one side of the lamp plate, each dismounting mould group include fixed column and Ring is dismounted, each fixed column is arranged at intervals on the one side of the lamp plate, and each dismounting ring corresponds movable sleeve It is placed in outside a fixed column;Light fixture, the light fixture include multiple illuminating modules, and each illuminating module is one by one It is correspondingly arranged on a dismounting ring, each illuminating module includes multiple LED light emitting components, each luminous mould Each LED light emitting component of group is arranged at intervals on the corresponding dismounting ring, and heat sink, the heat sink is attached at institute It states on one side of the lamp plate far from the removable component;And structural strengthening component, the structural strengthening component include fixed plate body, Installation plate body, reinforcement gusset, the first screw and the second screw, the side edge of the heat sink offer screw hole, the fixation Plate body is attached in the side edge of the heat sink, and the fixed plate body offers First Transition hole, the First Transition hole It aligns with the screw hole, the first screw sequence wears the First Transition hole and the screw hole, first screw point Not with the heat sink and the fixed plate body bolt, the installation plate body is vertically installed on the fixed plate body, described To reinforce gusset mutually to fix with the fixed plate body and the installation plate body respectively, the installation plate body offers the second transitional pore, Second screw wears second transitional pore, and second screw and the installation plate body bolt.
Referring to Fig. 1, lighting device 10 includes lamp plate 100, removable component 200, light fixture 300 and heat sink 400, dissipate Hot plate 400 is set on lamp plate 100, and the heat on lamp plate 100 is quick and is transferred on heat sink 400 in time.Removable component 200 are mounted on lamp plate 100, and light fixture 300 is set on removable component 200, the heat that light fixture 300 generates when shining It is transferred on removable component 200, is transferred on lamp plate 100 again later first, is finally transferred on heat sink 400 again.
Referring to Fig. 1, removable component 200 includes multiple dismounting mould groups 210, each mould group 210 that dismounts is arranged at intervals at lamp plate On 100 one side, each dismounting mould group 210 includes that fixed column 211 and dismounting ring 212, each fixed column 211 are arranged at intervals at lamp On the one side of plate 100, in such manner, it is possible to fix fixed column 211 with 100 phase of lamp plate, each 212 one-to-one correspondence of dismounting ring activity It is placed on outside a fixed column 211, in such manner, it is possible to make to dismount the more convenient carry out disassembling operations of ring 212, i.e., by installation dismounting ring 212 When, directly will dismounting ring 212 when being caught in fixed column 211, with regard to achievable disassembly when extraction, for example, the removable component Including multiple dismounting mould groups, each dismounting mould group is arranged at intervals on the one side of the lamp plate, each dismounting mould group It is placed on outside the fixed column including fixed column and dismounting ring, the dismounting ring activity, and each dismounting mould group is described Fixed column is arranged at intervals on the one side of the lamp plate;In this way, adjustment can be corresponded in the quantity of dismounting ring 212, that is, need How many dismounting rings 212 then install how many dismounting rings 212.
In one embodiment, the dismounting ring has annular structure;For another example, the fixed column is provided with reinforcing rib, institute The extending direction for stating reinforcing rib is identical as the extending direction of the fixed column, and the dismounting ring offers sliding groove, the reinforcement Muscle is at least partly embedded in the sliding groove;For another example, the fixed column has cylindrical-shaped structure;For another example, the fixed column From being gradually reduced close to the lamp plate to the direction far from the lamp plate, the dismounting ring mutually attaches diameter with the lamp plate;Again Such as, the dismounting ring interference is placed on outside the fixed column, utilizes the inner sidewall of the dismounting ring and the outside of the fixed column The frictional force that wall generates, for making the dismounting ring be fixed on the fixed column.
Referring to Fig. 1, light fixture 300 includes multiple illuminating modules 310, each illuminating module 310 is arranged in a one-to-one correspondence In one dismounting ring 212 on, each illuminating module 310 include multiple LED light emitting components 311, each illuminating module 310 it is each LED light emitting component 311 is arranged at intervals on corresponding dismounting ring 212, the member for example, each LED of each illuminating module 310 shines Device 311 is on the edge for being set to corresponding dismounting ring 212, to install the LED light emitting component.
For example, the one side of the lamp plate towards the dismounting ring is provided with the first conductive contact film, the dismounting ring court To the one side of lamp plate be provided with the second conductive contact film, the dismounting ring is additionally provided with circuit board, the circuit board and institute State the electric connection of the second conductive contact film, the circuit board and the light fixture are electrically connected, the illuminating module with it is described Circuit board is electrically connected, when the dismounting ring is mounted on the lamp plate, i.e., when the dismounting ring is bonded with the lamp plate, First conductive contact film and second conductive contact film are electrically connected, and for powering to the illuminating module, are made described Illuminating module executes normal light emission operation.
It needs to carry out brightness by control device it should be noted that opposite conventional lamp LED light emitting component is fixed The removable component 200 of the problem of control, above-mentioned lighting device 10 include multiple dismounting mould groups 210, and each dismounting mould group 210 includes Fixed column 211 and dismounting ring 212, each 212 one-to-one correspondence activity of dismounting ring is placed on outside a fixed column 211, so as to make Dismounting ring 212 more easily carries out disassembling operations, needs how many dismounting rings 212, then installs how many dismounting rings 212, thus The LED light emitting component 311 that corresponding number can be controlled executes light emission operation, and then can be realized the effect of brightness control, and Without installing control device.
Also referring to Fig. 1 and Fig. 2, heat sink 400 is attached on one side of the lamp plate 100 far from removable component 200, is dissipated Hot plate 400 is used to be attached to external mounting bracket far from the one side of lamp plate 100, and e.g., the heat sink is far from the lamp The one side of plate is mounted on heat transfer transition apparatus for attaching, and the heat on heat sink 400 can be quick and be pacified in time Bracket is filled, if heat is absorbed by heat transfer transition apparatus, so that preferable heat spreading function is played, and in the process, heat sink 400 As transition member of conducting heat and/or radiate, the heat dissipation load undertaken is smaller, therefore, lighting device 10 can be made to realize corpusculum Long-pending and lighting design effect, and can also have preferable heat dissipation performance.For example, the mounting bracket includes heat transfer transition Device, with preferable heat dissipation performance;Certainly, mounting bracket may be indoor smallpox main structure or wall, can Flexibly to be selected according to the actual situation.
Since the heat dissipation load that the heat sink undertakes is lighter, need to carry out auxiliary heat dissipation by external mounting bracket, In order to install the heat sink with external mounting bracket, and the heat sink can be played preferably Buffer function, for example, referring to Fig. 3, the lighting device further includes snap-fit mounting assembly 500, snap-fit component 500 Including fixinig plate 510, threaded fastener 520 and snap-fit part 530, the side edge of the heat sink offers bolt apertures, The fixinig plate, which offers, keeps away a hole, and the fixinig plate is set in the side edge of the heat sink, the bolt apertures and institute State and keep away a hole and align, the threaded fastener sequence wear it is described keep away a hole and the bolt apertures, the threaded fastener One end is spirally connected with the heat sink, and the other end of the threaded fastener is mutually fixed with the fixinig plate, the snap-fit part Including weld part, elastic portion and attaching portion, the first end of the weld part is welded on the fixinig plate, and the of the weld part Two ends and the first end of the elastic portion are mutually fixed, and the second end of the elastic portion is mutually fixed with the attaching portion, the attaching Mounting hole is offered in portion, in this way, passing through the installation by the way that attaching portion to be attached on outside support, and using fixed link The heat sink can be preferably fixed in external mounting bracket by hole, so as to preferably make the heat sink with External mounting bracket is installed, and can also play preferable buffer function to the heat sink by snap-fit part.
For example, the snap-fit part has serpentine structure;For another example, the connection position of the weld part and the elastic portion The place of setting offers bit-avoiding slot;For another example, elastic portion is provided at the weld part and the link position of the elastic portion;For another example, institute Fixinig plate is stated with rectangular parallelepiped structure;For another example, the attaching portion has rectangular parallelepiped structure;For another example, the attaching portion with it is described solid Stator is perpendicular, in such manner, it is possible to better play buffer function, and overall structure stability is higher.
It is appreciated that existing lamps and lanterns are generally used for playing illuminating effect, ventilation generally can not be played and absorb discharge The effect of exhaust gas needs additionally to install exhaust fan, in order to enable the lighting device to have ventilation and absorb discharge exhaust gas Effect, for example, referring to Figure 4 together and Fig. 5, the lighting device further include ventilation component 600, ventilation component 600 include ventilation plate body 610 and exhaust equipment (not shown), and the heat sink is opened far from the one side of the removable component Equipped with embedding slot, the another side of the heat sink 400 offers ventilation hole 410, the first end in the ventilation hole It is connected to the embedding slot, the second end in the ventilation hole with external environment for being connected to, the ventilation plate body tool There is hollow structure to form ventilation cavity in the ventilation plate body, the ventilation plate body is at least partly set In in the embedding slot, the ventilation plate body cavity is connected to the ventilation hole and exhaust equipment respectively, described The second end in ventilation hole 410 runs through the lamp plate 100, and is connected to external environment, in this way, by the heat sink Ventilation hole 410 is opened up on 400, and is connected to by the exhaust equipment with ventilation hole 410, it can be in the illumination The neighboring area of device generates negative pressure, and then the lighting device can be enable to have ventilation and absorb the work of discharge exhaust gas With being more advantageous to discharge air cleaning, and certain heat spreading function can also be played.
For example, the another side of the heat sink offers multiple ventilation holes, each ventilation hole is enclosed It is arranged around the edge of the heat sink, in such manner, it is possible to further increase the intensity of vented exhaust.
It should be noted that i.e. lamp plate and radiator plays transition since the lighting device is partial to portable design The effect of heat dissipation is radiated by external mounting bracket, and therefore, the machinery that will lead to the lighting device is strong It spends poor, in order to improve the mechanical strength and structural stability of the lighting device, and improves the lighting device and be mounted on Strong degree in external mounting bracket, for example, referring to Fig. 6, the lighting device further includes structural strengthening component 700, it is described Structural strengthening component 700 includes fixed plate body 710, installation plate body 720, reinforces gusset 730, the first screw 740 and the second screw 750, the side edge of the heat sink offers screw hole, and the fixed plate body is attached in the side edge of the heat sink, The fixed plate body offers First Transition hole, and the First Transition hole aligns with the screw hole, the first screw sequence Wear the First Transition hole and the screw hole, first screw respectively with the heat sink and the fixed plate body phase spiral shell Connect, the installation plate body is vertically installed on the fixed plate body, the reinforcement gusset respectively with the fixed plate body and described Installation plate body is mutually fixed, and the installation plate body offers the second transitional pore, and second screw wears second transitional pore, and Second screw and the installation plate body bolt, in this way, by the way that the structural strengthening component 700, and fixed plate is arranged Body 710, installation plate body 720, reinforcement gusset 730, the first screw 740 and the second screw 750 can be improved the lighting device Mechanical strength and structural stability, and improve the lighting device and be mounted on the strong degree in external mounting bracket.
For example, the reinforcement gusset have triangular structure, it is described reinforce gusset two of them side respectively with it is described Fixed plate body and the installation plate body are mutually fixed;For another example, the fixed plate body has rectangular parallelepiped structure;For another example, the mounting plate Body has rectangular parallelepiped structure;For another example, the fixed plate body offers multiple screw holes, and the fixed plate body offers multiple institutes First Transition hole is stated, the structural strengthening component is provided with multiple first screws, and each first screw corresponds Wear a First Transition hole and a screw hole;For another example, the installation plate body offers multiple second transitional pores, institute It states structural strengthening component and is provided with multiple second screws, each screw one-to-one correspondence wears second transition Hole;For another example, the extending direction of first screw and the extending direction of second screw are perpendicular, in this way, passing through optimization institute The structure, connection relationship and positional relationship for stating each component of structural strengthening component, can further increase the knot of the lighting device Structure intensity.
It should be noted that since the lighting device is biased to portable design, i.e., the heat dissipation of the described lighting device Plate undertakes lesser heat dissipation load, and the heat sink is placed on outside, i.e., directly contacts with air, and the heat sink is directly and outside The mounting bracket in portion is assembled, and e.g., the heat sink is directly assembled with heat transfer transition apparatus, utilizes heat transfer transition apparatus Carry out shared heat dissipation load, therefore, it is necessary to ensure that the heat transfer transition apparatus can preferably be assembled with heat sink, And ensure the heat transfer transition apparatus can quickly and the heat on the heat sink is absorbed in time, to ensure It states the temperature on heat sink and reaches lower level, for maintaining the normal working performance of the LED light emitting component.
In order to ensure the heat transfer transition apparatus can preferably be assembled with heat sink, and ensure described conducted heat Cross device can quickly and the heat on the heat sink is absorbed in time, to ensure that the temperature on the heat sink reaches To lower level, for maintaining the normal working performance of the LED light emitting component, for example, the lighting device further includes Heat transfer transition apparatus and waste heat huge profit device, the heat transfer transition apparatus are connect with the heat sink, the heat transfer transition dress It sets for absorbing the heat from the heat sink, the waste heat huge profit device is connect with the heat transfer transition apparatus, described Waste heat huge profit is lost for that will carry out from the heat transfer transition apparatus with device;The heat transfer transition apparatus include heat transfer case, Medium circulation effuser, medium circulation return pipe and multiple semiconductor chilling plates, the heat transfer case include heat transfer plate body, frame, Encapsulate plate body and multiple contact partitions;The frame has hollow structure, and the first end of the frame offers the first opening, institute The second end for stating frame offers the second opening, and the first end of the heat transfer plate body and the frame is mutually fixed, the heat transfer plate Body covers in first opening, for closing first opening, the second end phase of the encapsulation plate body and the frame Fixed, the encapsulation plate body covers in second opening, is open for closing described second, the heat transfer plate body, described Encapsulation plate body and the frame connect and are formed medium accommodating cavity, are equipped with heat transfer medium in the medium accommodating cavity body, institute It states heat transfer medium to contact with the inner sidewall of the heat transfer plate body respectively, each contact baffle interval is set to the encapsulation plate body Inner sidewall on, each contact partition is placed in the medium accommodating cavity body, and each contact partition and the heat transfer Media contact, each contact partition offer recirculation hole respectively;The heat transfer plate body is opened up far from the one side of the frame There are multiple mounting grooves, each semiconductor chilling plate one-to-one correspondence is placed in a mounting groove, each semiconductor The two sides of cooling piece are respectively arranged with cold and hot end, and the hot end of each semiconductor chilling plate corresponds one and one The bottom of the mounting groove is mutually fixed, and the cold end of each semiconductor chilling plate is mutually fixed with the heat sink respectively, Interval is provided between the heat transfer plate body and the heat sink, the edge of the heat transfer plate body has inserting groove;The envelope The both ends of loading board body offer medium circulation tap hole and medium circulation inflow hole respectively, the medium circulation tap hole and described Medium circulation inflow hole is connected to medium accommodating cavity respectively, the medium circulation effuser and medium circulation reflux Pipe is individually fixed on the encapsulation plate body, and the first end of the medium circulation effuser and the medium circulation tap hole connect Logical, the first end of the medium circulation return pipe is connected to the medium circulation inflow hole;The waste heat huge profit includes with device Waste heat huge profit device noumenon, medium circulation access tube and medium circulation discharge pipe, the waste heat huge profit have with device noumenon By thermal contact portion, the inside by thermal contact portion offers heat release cavity, and the surface by thermal contact portion is arranged heated The first end of contact surface, the first end of the medium circulation access tube and the medium circulation discharge pipe is discharged with the heat respectively Cavity connection, the second end of the medium circulation access tube are connected to the second end of the medium circulation effuser, the medium The second end of circulation discharge pipe is connected to the second end of the medium circulation return pipe;The heat transfer medium sequence circulation flows through institute Give an account of matter accommodating cavity, the medium circulation effuser, the medium circulation access tube, heat the release cavity, the medium Recycle discharge pipe, the medium circulation return pipe.
In order to which preferably above-mentioned lighting device is explained, for example, referring to Figure 7 together and Fig. 9, the illumination Device further includes that heat transfer transition apparatus 800 and waste heat huge profit device, the heat transfer transition apparatus are connect with the heat sink, institute Heat transfer transition apparatus is stated for absorbing the heat from the heat sink, when the LED light emitting component of the lighting device When luminous generation heat, the luminous heat generated of LED light emitting component can promptly be absorbed by the heat sink, the heat sink The heat of own absorption can quickly and be in time transferred to heat transfer transition apparatus 800, and then cooling is played to the heat sink, That is heat dissipation effect.The waste heat huge profit device is connect with the heat transfer transition apparatus, and waste heat huge profit device is used for will It is scattered and disappeared or is absorbed from the heat transfer transition apparatus, the waste heat huge profit can be re-used these waste heat with device.
Referring to Figure 7 together to Fig. 9, in the lighting device of an embodiment, heat transfer transition apparatus 800 includes heat transfer Case 810, medium circulation effuser 820, medium circulation return pipe 830 and multiple semiconductor chilling plates 840, medium circulation effuser 820 and medium circulation return pipe 830 respectively with heat transfer case 810 be connected to, each semiconductor chilling plate 840 be mounted on conducts heat case 810 on.
Referring to Figure 7 together to Fig. 9, the case 810 that conducts heat includes heat transfer plate body 811, frame 812, encapsulation plate body 813 and multiple Partition 814 is contacted, heat transfer plate body 811 and encapsulation plate body 813 are mutually fixed with the both ends of frame 812 respectively, and contact partition 814 is arranged In heat transfer plate body 811 on, and contact partition 814 be located in frame 812.
Referring to Fig. 8, frame 812 has hollow structure, the first end of frame 812 offers the first opening, the frame Second end offer the second opening, heat transfer plate body 811 and the first end of frame 812 are mutually fixed, and the plate body 811 that conducts heat covers at institute It states in the first opening, for heat transfer plate body 811 for closing first opening, encapsulation plate body 813 and the second end of frame 812 are mutually solid Fixed, encapsulation plate body 813 covers in second opening, and encapsulation plate body 813 is for closing second opening, and conduct heat plate body 811, it encapsulates plate body 813 and frame 812 connects and formed medium accommodating cavity 815, be equipped with heat transfer in medium accommodating cavity 815 Medium, heat transfer medium are contacted with the inner sidewall of heat transfer plate body 811 respectively, in this way, the heat on heat transfer plate body 811 can be by medium It accommodates the heat transfer medium accommodated in cavity 815 to absorb, for reducing the heat on heat transfer plate body 811, and then described dissipate can be made Heat on hot plate is continuously transferred on the heat transfer plate body.
Referring to Fig. 8, respectively contact partition 814 be arranged at intervals at it is described encapsulation plate body inner sidewall on, it is each it is described contact every Plate is placed in the medium accommodating cavity body, and each contact partition and the heat transfer medium contacts, each contact partition Recirculation hole is offered respectively, it, can by the way that each contact partition is arranged and opens up recirculation hole on each contact partition Heat exchange degree is improved, to improve heat exchange efficiency;The heat-conducting medium is the biggish fluids of thermal coefficients such as conduction oil.
For example, heat transfer plate body 811 and contact partition 814 are prepared using heat-conducting, have preferable thermally conductive and pass The heat absorbed from the heat sink quickly and can be transferred on the heat transfer medium by hot property in time;Institute It states frame and the encapsulation plate body to be prepared using heat-insulated material, can play the role of reducing thermal loss, so that heat It is collected on the heat transfer medium.
Referring to Fig. 7, heat transfer plate body 811 offers multiple mounting groove 811a far from the one side of frame 812, each half is led The one-to-one correspondence of body cooling piece 840 is placed in a mounting groove 811a, and the two sides of each semiconductor chilling plate are respectively arranged with Cold and hot end, it is mutually solid with the bottom of a mounting groove that the hot end of each semiconductor chilling plate corresponds one Fixed, the cold end of each semiconductor chilling plate is mutually fixed with the heat sink respectively, and the heat transfer plate body is dissipated with described Interval is provided between hot plate, in this way, the cold end of the semiconductor chilling plate absorbs heat from the heat sink, it is described The hot end of semiconductor chilling plate transfers heat on the heat transfer plate body, in the process, the semiconductor chilling plate Play the role of " heat pump ".
Referring to Fig. 8, the edge of heat transfer plate body 811 has inserting groove 811b, for example, the heat sink is provided with buckle Portion, inserting groove 811b so, it is possible to ensure the heat transfer transition apparatus and heat sink for fastening with clamping part described in heat sink It is preferably assembled, and assembly and disassembly operation is simpler convenient.
Fig. 9 is please referred to, the both ends of encapsulation plate body 813 offer medium circulation tap hole and medium circulation inflow hole respectively, The medium circulation tap hole and the medium circulation inflow hole are connected to medium accommodating cavity respectively, medium circulation outflow Pipe 820 and medium circulation return pipe 830 are individually fixed on encapsulation plate body 813, the first end of medium circulation effuser 820 and institute Give an account of matter circulation tap hole connection, the first end of medium circulation return pipe 830 is connected to the medium circulation inflow hole, temperature compared with The high heat transfer medium is flowed out from the medium circulation effuser 820, after flowing through the waste heat huge profit device, and institute State heat transfer medium heat utilized by reabsorption after, the lower heat transfer medium of temperature is returned by medium circulation return pipe 830 again It is flow to the medium accommodating cavity, and reuptakes the heat on the heat transfer plate body, in such manner, it is possible to realize circulation cooling Effect, for ensure the heat transfer transition apparatus can quickly and the heat on the heat sink is absorbed in time, To ensure that the temperature on the heat sink reaches lower level, for maintaining the normal work of the LED light emitting component Energy.
It should be noted that the thermal efficiency of the semiconductor chilling plate is lower, that is to say, that the semiconductor chilling plate exists The cold end quickly generates cryogenic effect, when for absorbing the heat of the heat sink, meanwhile, the semiconductor chilling plate is in institute A large amount of heat can be generated by stating hot end, the heat that these heat a part are absorbed from the cold end from the heat sink, in addition Most Joule heat generated when working from the semiconductor chilling plate itself, it is multiple since the resistance of semiconductor is larger The semiconductor chilling plate at work, can generate a large amount of heat, in this way, being transferred on the heat transfer plate body from the hot end Heat it is more, therefore, in field of illuminating lamps, usually will not using the semiconductor chilling plate as thermal component, one As improved from the material of heat sink and the structure of heat sink, certainly, there are also the biggish lamps and lanterns meetings of cooling requirements It is forced to select semiconductor chilling plate, but can also generate a large amount of waste heat simultaneously, and will use fan etc. under radiating requirements logical Wind apparatus radiates to hot end, that is to say, that in the design of the lamps and lanterns of general radiating requirements, i.e., in the technical field of lamps and lanterns In, the radiating requirements of the lighting device of the application are moderate, and those of ordinary skill will not be using semiconductor chilling plate as radiating part Part, but the application is overcome by collecting and recycling waste heat on the semiconductor chilling plate and the heat sink The industry prejudice of the art, both improves heat dissipation effect, while also utilizing waste heat, it is ensured that the heat sink moment In low-temperature condition, the heat sink can be made to realize small size and portable design, so that the lighting device Overall structure it is lighter.
It should be pointed out that in order to preferably utilize the heat transfer medium entrained by waste heat, an embodiment it is described In lighting device, waste heat huge profit device includes waste heat huge profit device noumenon, medium circulation access tube and medium circulation discharge Pipe, waste heat huge profit device noumenon have by thermal contact portion, and the inside by thermal contact portion offers heat release cavity, described It is arranged by the surface of thermal contact portion by thermal interface, the first end of the medium circulation access tube and the medium circulation discharge pipe First end be connected to respectively with the heat release cavity, the second end of the medium circulation access tube and medium circulation outflow The second end of pipe is connected to, and the second end of the medium circulation discharge pipe is connected to the second end of the medium circulation return pipe, institute State heat transfer medium sequence circulation flow through medium accommodating cavity, the medium circulation effuser, the medium circulation access tube, Heat the release cavity, the medium circulation discharge pipe, the medium circulation return pipe, in this way, entrained by the heat transfer medium Waste heat can be absorbed by described by thermal contact portion, for so that the temperature by thermal interface rises, and then be recovered benefit With.
In one embodiment, the waste heat huge profit device further includes the pump housing, and the pump housing is set to the medium circulation On access tube or the medium circulation discharge pipe, driving force is provided for the flowing to the heat transfer medium.
In one embodiment, the waste heat huge profit is closestool with device, and the waste heat huge profit is closestool sheet with device noumenon Body, described by thermal contact portion is toilet seat, and the heat release cavity is opened in the toilet seat, and described by thermal interface is institute The surface of toilet seat is stated, the lighting device is mounted on the ceiling of lavatory, when people go to the toilet, can open the photograph in advance Bright device, at this point, the LED light emitting component shine generate heat, the heat transfer medium by the heat on the heat sink with And the heat of the semiconductor refrigerating on piece is carried to the toilet seat, for heating to the toilet seat, works as user Physical feeling and the surface of toilet seat when contacting, it is warmer, it is important to note that the heat transfer medium is by the heat dissipation The heat of heat and the semiconductor refrigerating on piece on plate is carried by the heat transfer medium, and when by the toilet seat, The toilet seat can be more leniently heated, temperature is convenient, and heats milder, relatively traditional heating toilet and need Electric calorifie installation and temperature control equipment are set, and the waste heat huge profit is more energy saving with device, and heating operation is milder, meets The energy-efficient theory of today's society advocating environment protection.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for embodiment described above, and the description thereof is more specific and detailed, but It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention Protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (7)

1. a kind of lighting device characterized by comprising
Lamp plate,
Removable component, the removable component include multiple dismounting mould groups, and each dismounting mould group is arranged at intervals at the lamp plate On one side, each dismounting mould group includes that fixed column and dismounting ring, each fixed column are arranged at intervals at the lamp plate On one side, each dismounting ring one-to-one correspondence activity is placed on outside a fixed column;
Light fixture, the light fixture include multiple illuminating modules, and each illuminating module is arranged in a one-to-one correspondence in an institute It states on dismounting ring, each illuminating module includes multiple LED light emitting components, each LED of each illuminating module Light emitting component is arranged at intervals on the corresponding dismounting ring,
Heat sink, the heat sink are attached on one side of the lamp plate far from the removable component;And
Structural strengthening component, the structural strengthening component include fixed plate body, installation plate body, reinforce gusset, the first screw and the Two screws, the side edge of the heat sink offer screw hole, and the fixed plate body is attached at the side edge of the heat sink On, the fixed plate body offers First Transition hole, and the First Transition hole aligns with the screw hole, and first screw is suitable Sequence wears the First Transition hole and the screw hole, first screw respectively with the heat sink and the fixed plate body phase spiral shell Connect, the installation plate body is vertically installed on the fixed plate body, the reinforcement gusset respectively with the fixed plate body and described Installation plate body is mutually fixed, and the installation plate body offers the second transitional pore, and second screw wears second transitional pore, and Second screw and the installation plate body bolt;
The lighting device further includes conduct heat transition apparatus and waste heat huge profit device, the heat transfer transition apparatus and the heat dissipation Plate connection, the waste heat huge profit device are connect with the heat transfer transition apparatus;
The heat transfer transition apparatus includes heat transfer case, medium circulation effuser, medium circulation return pipe and multiple semiconductor refrigeratings Piece, the medium circulation effuser and the medium circulation return pipe are connected to the heat transfer case respectively, each semiconductor system Cold is mounted on the heat transfer case;
The heat transfer case includes heat transfer plate body, frame, encapsulation plate body and multiple contact partitions, the heat transfer plate body and the encapsulation Plate body is mutually fixed with the both ends of the frame respectively, and the contact partition is set on the heat transfer plate body, and it is described contact every Plate is located in the frame;The frame has hollow structure, and the first end of the frame offers the first opening, the frame Second end offer the second opening, the first end of the heat transfer plate body and the frame is mutually fixed, and the heat transfer plate body is provide with In in first opening, the heat transfer plate body is for closing first opening, and the of encapsulation plate body and the frame Two ends are mutually fixed, and the encapsulation plate body covers in second opening, and the encapsulation plate body is open for closing described second, The heat transfer plate body, the encapsulation plate body and the frame connect and form medium accommodating cavity, in the medium accommodating cavity body It is equipped with heat transfer medium;Each contact baffle interval is set on the inner sidewall of the encapsulation plate body, each contact partition It is placed in the medium accommodating cavity body, and each contact partition and the heat transfer medium contacts, each contact partition point Recirculation hole is not offered;The heat transfer plate body offers multiple mounting grooves far from the one side of the frame, each described partly to lead Body cooling piece one-to-one correspondence is placed in a mounting groove, and the two sides of each semiconductor chilling plate are respectively arranged with cold end And hot end, the hot end one-to-one correspondence one of each semiconductor chilling plate and the bottom of a mounting groove are mutually fixed, often The cold end of one semiconductor chilling plate is mutually fixed with the heat sink respectively, the heat transfer plate body and the heat sink it Between be provided with interval;The both ends of the encapsulation plate body offer medium circulation tap hole and medium circulation inflow hole respectively, described Medium circulation tap hole and the medium circulation inflow hole are connected to medium accommodating cavity respectively, the medium circulation outflow Pipe and the medium circulation return pipe are individually fixed on the encapsulation plate body, the first end of the medium circulation effuser and institute Matter circulation tap hole connection is given an account of, the first end of the medium circulation return pipe is connected to the medium circulation inflow hole;
The waste heat huge profit device includes waste heat huge profit device noumenon, medium circulation access tube and medium circulation discharge pipe, Waste heat huge profit device noumenon has by thermal contact portion, and the inside by thermal contact portion offers heat release cavity, institute The surface setting by thermal contact portion is stated by thermal interface, the first end of the medium circulation access tube and medium circulation discharge The first end of pipe is connected to the heat release cavity respectively, the second end of the medium circulation access tube and the medium circulation stream The second end of outlet pipe is connected to, and the second end of the medium circulation discharge pipe is connected to the second end of the medium circulation return pipe.
2. lighting device according to claim 1, which is characterized in that the reinforcement gusset has triangular structure, described The two of them side for reinforcing gusset is mutually fixed with the fixed plate body and the installation plate body respectively.
3. lighting device according to claim 1, which is characterized in that the fixed plate body has rectangular parallelepiped structure.
4. lighting device according to claim 1, which is characterized in that the installation plate body has rectangular parallelepiped structure.
5. lighting device according to claim 4, which is characterized in that the fixed plate body offers multiple screw holes, The fixed plate body offers multiple First Transition holes, and the structural strengthening component is provided with multiple first screws, Each first screw one-to-one correspondence wears a First Transition hole and a screw hole.
6. lighting device according to claim 1, which is characterized in that the installation plate body offers multiple second mistakes Cross hole, the structural strengthening component is provided with multiple second screws, and each screw one-to-one correspondence wears one described the Two transitional pores.
7. lighting device according to claim 1, which is characterized in that the extending direction of first screw and described second The extending direction of screw is perpendicular.
CN201611075854.1A 2016-11-29 2016-11-29 Lighting device Active CN106523993B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201787405U (en) * 2010-09-25 2011-04-06 深圳市三能低碳照明有限公司 LED lamp capable of replacing light source module
CN203099584U (en) * 2013-01-14 2013-07-31 朱健荣 Filling station lamp with multiple light sources
CN204328729U (en) * 2014-12-04 2015-05-13 厦门格绿能光电股份有限公司 A kind of new structure of LED lamp

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110080746A1 (en) * 2009-10-07 2011-04-07 Patti Anthony G Lighting enclosure system
CN102313186A (en) * 2010-06-29 2012-01-11 富士迈半导体精密工业(上海)有限公司 Indoor illumination device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201787405U (en) * 2010-09-25 2011-04-06 深圳市三能低碳照明有限公司 LED lamp capable of replacing light source module
CN203099584U (en) * 2013-01-14 2013-07-31 朱健荣 Filling station lamp with multiple light sources
CN204328729U (en) * 2014-12-04 2015-05-13 厦门格绿能光电股份有限公司 A kind of new structure of LED lamp

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