CN106469776B - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereof Download PDFInfo
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- CN106469776B CN106469776B CN201611120377.6A CN201611120377A CN106469776B CN 106469776 B CN106469776 B CN 106469776B CN 201611120377 A CN201611120377 A CN 201611120377A CN 106469776 B CN106469776 B CN 106469776B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/04—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/007—Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
- G02B19/0066—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED in the form of an LED array
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- G—PHYSICS
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- G02B3/00—Simple or compound lenses
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- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0031—Replication or moulding, e.g. hot embossing, UV-casting, injection moulding
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- G—PHYSICS
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- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2105/00—Planar light sources
- F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
- G02B3/0068—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between arranged in a single integral body or plate, e.g. laminates or hybrid structures with other optical elements
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an electronic device and a manufacturing method thereof. The electronic device comprises a driving circuit substrate, a light-emitting element, an optical layer and an adhesion layer. The light emitting element is disposed on the driving circuit substrate, and the optical layer is disposed on the light emitting element. The adhesion layer is arranged between the optical layer and the light-emitting element. The optical layer comprises a first surface and a second surface which are opposite to each other. The first surface of the optical layer is provided with a plurality of first convex lens structures, and at least one part of the first convex lens structures are at least partially overlapped with the light-emitting elements in a vertical projection direction.
Description
Technical field
The present invention is a kind of transposition and packaging technology technology, especially a kind of electronic device and its manufacturing method.
Background technology
Light emitting diode (Light Emitting Diode；LED) be a kind of solid-state light emitting element, because its tool is low in energy consumption,
The characteristics such as long lifespan, small and brightness is high and the pixel unit that can be used for building LED display panel.In general,
In technique, LED display panel need to use transposition technology so that light-emitting diode transposition is located at required installation
In target base plate.However during transposition, it is easy to cause light-emitting diode crawl yield to decline because of lower pressure unevenness.
Since light-emitting diode crawl yield declines, thus increases and moved on layer from element in moving process light-emitting diode
The risk fallen.
Invention content
One of the objects of the present invention is to provide a kind of electronic device and its manufacturing method, it can be used to improve electronic device
Manufacturing yield, and improve the light extraction efficiency of electronic device.
In one embodiment, a kind of electronic device includes：One drive circuit substrate, a plurality of light-emitting elements, an optical layer with
An and adhesion layer.These light-emitting components are set in drive circuit substrate, and optical layer is set on light-emitting component.Adhesion layer
It is set between optical layer and light-emitting component.Wherein, optical layer includes each other relative first surface and second surface.Optical layer
First surface there are multiple first convex lens structures, and at least part of first convex lens structures are in a upright projection side
It is least partially overlapped with light-emitting component upwards.
Wherein, which is a flat surface structure.
Wherein, which has multiple second convex lens structures.
Wherein, which mutually overlaps on the upright projection direction with first convex lens structures.
Wherein, the average height of second convex lens structures is less than or equal to the average height of first convex lens structures.
Wherein, respectively the radius of curvature of first convex lens structures is less than or equal to the curvature of respectively second convex lens structures partly
Diameter.
Wherein, the refractive index of the optical layer is between 1.4 to 1.6.
Wherein, the coefficient of elasticity of the optical layer between 1MPa between 12MPa.
Wherein, respectively the light-emitting component has a first electrode and a second electrode；And
The drive circuit substrate includes：
One substrate；
Multiple driving elements are set in the substrate；
One insulating layer is set in the driving element；
Multiple first connection electrodes, are set on the insulating layer, wherein respectively first connection electrode have a first end with
One second end, the first end are electrically connected with the corresponding driving element, the second end and the corresponding light-emitting component this
One electrode is electrically connected；And
Multiple second connection electrodes are electrically connected with the second electrode of the corresponding light-emitting component respectively.
Wherein, which further includes：
One patterning bank layer is set on the insulating layer, which has multiple openings, the light-emitting component
In the opening.
Wherein, which is located on the upright projection direction in the corresponding opening.
Wherein, the electronic device further includes：
One adhesive material body, between the optical layer and the drive circuit substrate, which is located at the light
The edge of layer and the edge of the drive circuit substrate are learned, the inside of the adhesive material body is located at so as to the light-emitting component.
In one embodiment, a kind of manufacturing method of electronic device includes：It provides with multiple first convex lens structures
One optical layer, formed an adhesion layer in the first convex lens structures, with the first convex lens structures pick up light-emitting component and utilize
First convex lens structures are sticked the light-emitting component transposition taken on one drive circuit substrate by optical layer.Wherein, optical layer includes
Two opposite first surfaces and a second surface, and the first surface has these first convex lens structures.After pickup,
Each light-emitting component can be bonding in the first convex lens structures by adhesion layer.
Wherein, the step for providing the optical layer includes：
It injects in an optical material a to master mold, the first surface inside the master mold has corresponding first convex lens structures
Multiple first surface grooves；
Cure the optical material in the master mold to form the optical layer；And
Detach the master mold and the optical layer.
Wherein, there are the second surface of the optical layer multiple second convex lens structures, the manufacturing method to further include：
Before in the pickup light-emitting component the step of, a carrier is bonded with second convex lens structures, the carrier with
Stickiness between second convex lens structures is less than the stickiness of the adhesion layer；And
In the light-emitting component transposition after the step in the drive circuit substrate, the carrier is removed.
Wherein, the step for providing the optical layer includes：
It injects in an optical material a to master mold, the first surface inside the master mold has corresponding first convex lens structures
Multiple first surface grooves and the master mold inside second surface have multiple the second of corresponding second convex lens structures
Curved indentations；
Cure the optical material in the master mold to form the optical layer；And
Detach the master mold and the optical layer.
Wherein, which includes：
One substrate；
Multiple driving elements are set in the substrate；
One insulating layer is set in the driving element；
Multiple first connection electrodes, wherein respectively first connection electrode has a first end and a second end, the first end
It is electrically connected with the corresponding driving element, which is set on the insulating layer；
Multiple second connection electrodes, are set on the insulating layer；And
One patterning bank layer, is set on the insulating layer, which has multiple openings；
Wherein, which includes in the step of the drive circuit substrate：
By the light-emitting component transposition in the opening, by a first electrode of the respectively light-emitting component and corresponding first company
The second end of receiving electrode is electrically connected, and by a second electrode of the respectively light-emitting component and corresponding second connection electrode
It is electrically connected.
Wherein, the manufacturing method of the electronic device further includes：
In the light-emitting component transposition after the step in the drive circuit substrate, an adhesive material body is formed in the light
It learns between layer and the drive circuit substrate；And
Cure the adhesive material body, the wherein adhesive material body is located at the edge and the drive circuit substrate of the optical layer
Edge, the inside of the adhesive material body is located at so as to the light-emitting component.
In conclusion electronic device according to the present invention is suitable for transposition light-emitting component, directly profit with its manufacturing method
Light-emitting component is sticked in optical layer with adhesion layer, and without removing optical layer after transposition light-emitting component, therefore can kept away
Exempt from light-emitting component and the generation of the events such as offset is fallen and aligned from optical layer, and then the manufacturing yield of electronic device can be improved.
Also, after transposition, optical layer still remaines on light-emitting component (without removing), using the beam condensing unit as light-emitting component, borrows
To improve light extraction efficiency.
Description of the drawings
Fig. 1 be the present invention be an embodiment electronic device manufacturing method flow chart.
Fig. 2 and Fig. 3 is the summary stereogram of the different visual angles of the optical layer of first embodiment of the invention, wherein Fig. 2 and Fig. 3
The respectively schematic diagram of the upper and lower surface of optical layer.
Fig. 4 is the sectional view of I-I hatching lines in Fig. 2.
Fig. 5 be first embodiment of the invention be optical layer and the composite structure of adhesion layer schematic diagram.
Fig. 6 be first embodiment of the invention be optical layer, adhesion layer and light-emitting component composite structure schematic diagram.
Fig. 7 is the schematic diagram of the electronic device of first embodiment of the invention.
Fig. 8 is the explosive view of the electronic device of Fig. 7.
Fig. 9 is the flow chart of the manufacturing method of the electronic device of another embodiment of the present invention.
Figure 10 is that the electronic device of first embodiment of the invention cures the schematic diagram before adhesive material body.
Figure 11 is that the electronic device of first embodiment of the invention cures the schematic diagram after adhesive material body.
Figure 12 is the schematic diagram of the optical simulation structure of the electronic device of first embodiment of the invention.
Figure 13 to Figure 16 is the light extraction field pattern figure of the optical simulation structure of Figure 12.
Figure 17 and Figure 18 be second embodiment of the invention be optical layer different visual angles summary stereogram, wherein Figure 17
It is respectively the schematic diagram of the upper and lower surface of optical layer with Figure 18.
Figure 19 is the sectional view of II-II hatching lines in Figure 18.
Figure 20 is the schematic diagram of the electronic device of second embodiment of the invention.
Figure 21 is the schematic diagram of the optical simulation structure of the electronic device of second embodiment of the invention.
Figure 22 to Figure 25 is the light extraction field pattern figure of the optical simulation structure of Figure 21.
Figure 26 be second embodiment of the invention be optical layer and the composite structure of carrier schematic diagram.
Figure 27 is the detailed flowchart of the step S120 of the manufacturing method of the present invention.
Figure 28 is the schematic diagram of the master mold of first embodiment of the invention.
Figure 29 is the schematic diagram of the master mold of second embodiment of the invention.
Figure 30 is the summary stereogram of the electronic device of Fig. 7.
Figure 31 is the top view of the drive circuit substrate of a-quadrant in Figure 30.
Figure 32 is the sectional view of III-III hatching lines in Figure 30 and Figure 31.
Figure 33 is the summary stereogram of the electronic device of Figure 20.
Figure 34 is the top view of the drive circuit substrate of B area in Figure 33.
Figure 35 is the sectional view of IV-IV hatching lines in Figure 33 and Figure 34.
Wherein, reference numeral：
S120 provides an optical layer
S121 injects in an optical material a to master mold
S123 cures the optical material in master mold to form optical layer
S125 detaches master mold and optical layer
S140 forms an adhesion layer in the first convex lens structures
S160 picks up light-emitting component with the first convex lens structures, and it is convex by adhesion layer to be bonding on first for wherein light-emitting component
On lens arrangement
First convex lens structures are sticked the light-emitting component transposition taken on one drive circuit substrate by S180 using optical layer
S190 forms an adhesive material body between optical layer and drive circuit substrate
S192 cures adhesive material body, and wherein adhesive material body is located at the edge and drive circuit substrate of optical layer
Edge, whereby light-emitting component be located at the inside of adhesive material body
20 optical layer, 20 ' optical layer
200 ontology, 210 first surface
212 second surface, 230 first convex lens structures
232 second convex lens structures, 30 adhesion layer
40 light-emitting component, 401 first electrode
402 second electrode, 50 drive circuit substrate
510 substrate, 530 driving element
550 insulating layer, 552 perforation
570 first connection electrode, 572 second connection electrode
590 patterning bank layers 592 are open
60 adhesive material body, 70 carrier
80 master mold, 80 ' master mold
810 first surface, 812 second surface
830 first surface groove, 832 second curved indentations
90 peripheral regions
I-I hatching line II-II hatching lines
III-III hatching line IV-IV hatching lines
The regions the A regions B
H1 height H2 height
Specific implementation mode
Please refer to Fig. 1 to Fig. 4.First, an optical layer 20 (step S120) is provided.In some embodiments, optical layer 20
Refractive index (n) between 1.4 to 1.6.In some embodiments, the coefficient of elasticity (E) of optical layer 20 between 1MPa extremely
Between 12MPa, 1MPa is preferably between between 5MPa.In some embodiments, the material of optical layer 20 is, for example, poly- diformazan
Radical siloxane (Polydimethylsiloxane, PDMS) or molding silica resin (Moldable Silicone, MS) etc. are transparent
And soft material.For example, when the material of optical layer 20 is PDMS (Sylgard 184), with 1.43 refraction
The coefficient of elasticity of rate and 1.84MPa.When the material of optical layer 20 is MS-1002 (Dow Corning Corporation's production), have
1.41 refractive index and the coefficient of elasticity of 11.2MPa.When the material of optical layer 20 is MS-1003 (Dow Corning Corporation's production)
When, the coefficient of elasticity with 1.41 refractive index and 4.5MPa.
In the present embodiment, optical layer 20 includes upper and lower surface relative to each other, i.e. first surface 210 and the second table
Face 212.Multiple first convex lens structures 230 are formed on first surface 210.Wherein, each first convex lens structures 230 be positioned at
Planoconvex spotlight (plano convex lens) on first surface 210.In other words, the one side of each first convex lens structures 230 is
Convex surface.The another side of each first convex lens structures 230 is plane, and this plane is bonded with the overlapping of first surface 210.At some
In embodiment, the ontology 200 of each first convex lens structures 230 and optical layer 20 is integrally formed, that is, the first convex lens structures
It is not present on 230 flat surfaces being bonded with ontology 200 (first surface 210).In other words, the first convex lens structures
230 be that the multiple convex surfaces of (positive Z-direction) protrusion are realized outward by first surface 210.
Then, an adhesion layer 30 is formed in the first convex lens structures 230 (step S140), as shown in Figure 5.In some realities
It applies in example, adhesion layer 30 can be distributed on the whole surface, i.e., have adhesion layer on first surface 210 and the first convex lens structures 230
30.In further embodiments, adhesion layer 30 can be only distributed in the first convex lens structures 230 (schema is not painted).
In some embodiments, adhesion layer 30 can pass through coating or sprinkling adhesion material in the first convex lens structures 230
And it is formed.Wherein, the refractive index of adhesion layer 30 can be between 1.4 to 1.7.In some embodiments, the material of adhesion layer 30
It may be, for example, ultraviolet optical cement (Ultraviolet adhesive), glass viscose (Glass Glue) or fruit juice gel (AB glue)
Equal optical cements.For example, when the material of adhesion layer 30 is the ultraviolet optical cement of HRI-1655 (Dow Corning Corporation's production), tool
There is 1.65 refractive index.When the material of adhesion layer 30 is NOA 1625 (Norland Optical Adhesive 1625)
When the ultraviolet optical cement of (Norland Products, Inc. production), with 1.625 refractive index.When the material of adhesion layer 30
For AB glue (3M productions) (fruit juice gel) when, with 1.45 refractive index.Then, with the first convex lens knot with adhesion layer 30
Structure 230 picks up a plurality of light-emitting elements 40 (step S160), as shown in Figure 6.These light-emitting components 40 are bonding on by adhesion layer 30
In first convex lens structures 230.In details of the words, on the upright projection direction (Z axis) perpendicular to optical layer 20, each light-emitting component
40 correspond to the first convex lens structures 230, and one of them is configured, and is bonding on corresponding first convex lens knot by adhesion layer 30
On structure 230.First convex lens structures 230 are least partially overlapped with corresponding light-emitting component 40 on upright projection direction (Z axis).
In one embodiment, each light-emitting component 40 corresponds to first convex lens structures 230 and configures, and but not limited to this, at other
In embodiment, each first convex lens structures 230 can correspond to a plurality of light-emitting elements 40.
In some embodiments, after adhesion layer 30 is formed in the first convex lens structures 230, the light with adhesion layer 30
It learns layer 20 and is moved to 40 top of light-emitting component.At this point, the first convex lens structures 230 can be intended for the light-emitting surface of light-emitting component 40,
And in alignment with corresponding light-emitting component 40.After alignment, the optical layer 20 with adhesion layer 30 is moved down, so as to have adhesion layer
30 the first convex lens structures 230 contact and fit in the light-emitting surface of corresponding light-emitting component 40.In some embodiments, it can borrow
The first convex lens structures 230 are made to be fitted closely with corresponding light-emitting component 40 by pushing optical layer 20 or solidification adhesion layer 30.
After pickup (step S160), recycle optical layer 20 that first convex lens structures 230 are sticked the light-emitting component taken
40 transposition are on one drive circuit substrate 50 (step S180), as shown in Figures 7 and 8.In some embodiments, light-emitting component 40
For crystal covering type (Flip Chip) light-emitting component.The side of each light-emitting component 40 is light-emitting surface, and the other side is junction (Pad).
After step S160, the light-emitting surface of light-emitting component 40 fits in corresponding first convex lens structures 230, and light-emitting component 40
Junction is located at lower section (other side in relative luminous face).Then, optical layer 20 is moved with glutinous light-emitting component 40 thereon
To waiting for transposition area (in drive circuit substrate 50), and make the junction of light-emitting component 40 towards having in drive circuit substrate 50
The surface of connection electrode.Then, make the junction of light-emitting component 40 accurately in alignment with drive by alignment device (not painted in figure)
The connection electrode of dynamic circuit board 50, is electrically connected with the junction of electroluminescent element 40 and the connection electrode of drive circuit substrate 50
Knot.
Fig. 9 is please referred to, Fig. 9 is the flow chart of the manufacturing method of the electronic device of another embodiment of the present invention.In some realities
It applies in example, in 40 transposition of light-emitting component after (step S180) in drive circuit substrate 50, an adhesive material body 60 can be formed
Between optical layer 20 and drive circuit substrate 50 (step S190), as shown in Figure 10.Then, solidification is in optical layer 20 and driving
Adhesive material body 60 (step S192) between circuit board 50, as shown in figure 11.Adhesive material body 60 is located at optical layer 20
Edge and positioned at the edge of drive circuit substrate 50, whereby, light-emitting component 40 is set to the inside of adhesive material body 60.In detail and
Yan Zhi, in the present embodiment, the top surface of adhesive material body 60 along optical layer 20 edge join in optical layer 20, and adhesive material
The bottom surface of body 60 along drive circuit substrate 50 edge join in drive circuit substrate 50, light-emitting component 40 is set to adhesive material
Body 60 is formed by the inside of framework.
Please refer to Fig.1 the schematic diagram of the optical simulation structure for the electronic device that 2, Figure 12 is first embodiment of the invention.
In the present embodiment, optical layer 20 is Flat protruding type optical layer 20, i.e. the first surface 210 of optical layer 20 has one first convex lens knot
Structure 230, and second surface 212 is flat surfaces (i.e. planar structure).The material of optical layer 20 is PDMS.Figure 13 to Figure 16 is figure
The light extraction field pattern figure of 12 optical simulation structure.When the radius of curvature of the first convex lens structures 230 is 28 μm (microns) and is shone
When the peripheral region 90 of element 40 is not filled with colloid (i.e. peripheral region 90 is full of air), light extraction efficiency is about 22.7%, such as Figure 13 institutes
Show.When the radius of curvature of the first convex lens structures 230 is not filled with colloid (i.e. week for the peripheral region 90 of 100 μm and light-emitting component 40
Enclose area 90 and be full of air) when, light extraction efficiency is about 22.8%, as shown in figure 14.When the radius of curvature of the first convex lens structures 230
The colloid of HRI-1655 (Dow Corning Corporation's production) is filled by the peripheral region 90 of 28 μm and light-emitting component 40 (to be made with adhesion layer 30
Glue material) when, light extraction efficiency is about 40.7%, as shown in figure 15.When the radius of curvature of the first convex lens structures 230 is 100 μ
When colloid (with the glue material used in adhesion layer 30) of HRI-1655 is filled in the peripheral region 90 of m and light-emitting component 40, light extraction efficiency
About 39.8%, as shown in figure 16.
7 to Figure 20 are please referred to Fig.1, the electronic device of second embodiment of the invention is different from the electronic device of first embodiment
The optical layer being in the electronic device of second embodiment of the invention further includes multiple second convex lens structures 232.In this implementation
In example, optical layer 20 ' is double-convex type optical layer 20 '.As shown in Figure 17, Figure 19 and Figure 20, the first surface 210 of optical layer 20 '
It is formed with to glutinous multiple first convex lens structures 230 for taking simultaneously transposition light-emitting component 40.As shown in Figure 18, Figure 19 and Figure 20,
The second surface 212 of optical layer 20 ' is formed with multiple second convex lens structures 232.
In the present embodiment, each second convex lens structures 232 are the planoconvex spotlight (plano on second surface 212
convex lens).In other words, the one side of each second convex lens structures 232 is convex surface.Each second convex lens structures 232 it is another
It is plane on one side, and this plane is bonded with the overlapping of second surface 212.In some embodiments, each second convex lens structures 232 with
The ontology 200 of optical layer 20 ' is integrally formed, that is, the second convex lens structures 232 are bonded with ontology 200 (second surface 212)
It is not present on flat surface.In other words, the second convex lens structures 232 are outside (negative Z-direction) by second surface 212
The multiple convex surfaces of protrusion are realized.Details about the first convex lens structures of the present embodiment 230 is because of the optics with first embodiment
Layer 20 is similar, therefore just repeats no more.
In the present embodiment, on upright projection direction (Z axis), the first convex lens structures 230 and the second convex lens structures
232 be mutually overlapping.In other words, the first convex lens structures 230 be correspond in the second convex lens structures 232, but not with
This is limited.
In some embodiments, the average height of the second convex lens structures 232 is less than or equal to the first convex lens structures 230
Average height.Wherein, the average height of the first convex lens structures 230 refers to the first convex lens structures 230 from first surface 210
To being averaged for the most short vertical range (height H1) between the summit of the first convex lens structures 230.Second convex lens structures 232
Average height refers to the second convex lens structures 232 from most short between the summit of 212 to the second convex lens structures 232 of second surface
Vertical range (height H2) is averaged.
In addition, in some embodiments, the radius of curvature of each first convex lens structures 230 is less than or equal to each second convex lens
The radius of curvature of mirror structure 232.In other words, the convex surface of the first convex lens structures 230 is compared to the second convex lens structures 232
Convex surface is more gentle.
Please refer to Fig.2 the schematic diagram of the optical simulation structure for the electronic device that 1, Figure 21 is second embodiment of the invention.
In the present embodiment, optical layer 20 ' is double-convex type optical layer 20 ', i.e. the first surface 210 of optical layer 20 ' has one first convex lens
Mirror structure 230, and second surface has one second convex lens structures 232.In following experiments, the material of optical layer 20 ' is
The radius of curvature of PDMS and the first convex lens structures 230 is fixed as 28 μm.Figure 22 to Figure 25 is the optical simulation structure of Figure 21
Light extraction field pattern figure.When the radius of curvature of the second convex lens structures 232 is not filled with glue for the peripheral region 90 of 28 μm and light-emitting component 40
When body (i.e. peripheral region 90 is full of air), light extraction efficiency is about 22.4%, as shown in figure 22.When the second convex lens structures 232
When radius of curvature is 100 μm and the peripheral region 90 of light-emitting component 40 is not filled with colloid (i.e. peripheral region 90 is full of air), go out light efficiency
Rate is about 22.7%, as shown in figure 23.When the radius of curvature of the second convex lens structures 232 is around 28 μm and light-emitting component 40
When colloid (with the glue material used in adhesion layer 30) of HRI-1655 is filled in area 90, light extraction efficiency is about 39.3%, such as Figure 24 institutes
Show.When the radius of curvature of the second convex lens structures 232 is 100 μm and the glue of the filling of peripheral region 90 HRI-1655 of light-emitting component 40
When body (with glue material used in adhesion layer 30), light extraction efficiency is about 36.3%, as shown in figure 25.
By Figure 13 above-mentioned to Figure 16 and Figure 22 to Figure 25 results as it can be seen that there is filling glue in the peripheral region 90 of light-emitting component 40
It can make the luminous distribution uniformity and improving extraction efficiency of light-emitting component 40 when body.Also, light can be finely tuned under different curvature
Field pattern.Furthermore the form (Flat protruding type optical layer 20 and double-convex type optical layer 20 ') of optical layer can then adjust the shape for the distribution that shines
Shape.
In some embodiments, when the second surface of optical layer 20 ' 212 is formed with multiple second convex lens structures 232,
A carrier 70 can be bonded with the second convex lens structures 232, such as Figure 26 institutes before pickup light-emitting component 40 (step S160)
Show.Wherein, the stickiness between carrier 70 and the second convex lens structures 232 is less than the stickiness of adhesion layer 30.In other words, carrier 70 with
There are stickiness between second convex lens structures 232, to stick in the second convex lens structures 232.Therefore, in down-stream,
The second convex lens structures 232 can be protected by carrier 70, and be moved easily optical layer 20 '.Also, in 40 transposition of light-emitting component
After (step S180), then carrier 70 removed from optical layer 20 '.
In some embodiments of step S120, optical layer 20 (or optical layer 20 ') can be formed using a master mold.
With reference to Figure 27.First, it injects in an optical material a to master mold (step S121).Wherein master mold please refer to Figure 28 and
Figure 29.
Figure 28 is the schematic diagram of the master mold of first embodiment of the invention.With reference to Figure 28, the first surface 810 inside master mold 80
With multiple first surface grooves 830.First surface groove 830 is more by being recessed into first surface 810 downwards (positive Z-direction)
A convex surface is realized.Referring to Fig. 4 and Figure 28, these first surface grooves 830 correspondence of master mold 80 is intended to be formed
The first convex lens structures 230 in optical layer 20.In other words, the profile of first surface groove 830 is substantially the same right in its institute
The profile for the first convex lens structures 230 to be formed answered.In some embodiments, the radius of curvature of first surface groove 830
It is identical to the radius of curvature of corresponding the first convex lens structures 230 to be formed.In addition, the second surface inside master mold 80
812 be a flat surfaces, and first surface 810 is intended for second surface 812.
Figure 29 is the schematic diagram of the master mold of second embodiment of the invention.With reference to Figure 29, the internal first surface of master mold 80 '
810 have multiple first surface grooves 830.First surface groove 830 is by downward (positive Z-direction) indent of first surface 810
It is realized at multiple convex surfaces.Referring to Figure 19 and Figure 29, these first surface grooves 830 of master mold 80 ', which correspond to, is intended to shape
At optical layer 20 ' on the first convex lens structures 230.In other words, the profile of first surface groove 830 is substantially the same in it
The profile of corresponding the first convex lens structures 230 to be formed.In some embodiments, the curvature of first surface groove 830
Radius is identical to the radius of curvature of corresponding the first convex lens structures 230 to be formed.In addition, the second of 80 ' inside of master mold
It is downward (negative Z-direction) by second surface 812 that surface 812, which has multiple second curved indentations 832, the second curved indentations 832,
Multiple convex surfaces are inside recessed into be realized.Wherein, first surface 810 is intended for second surface 812.These second songs of master mold 80 '
Face groove 832 corresponds to the second convex lens structures 232 on the second surface 212 for the optical layer 20 ' to be formed.In other words,
The profile of two curved indentations 832 is substantially the same the second convex lens structures 232 of the optical layer 20 ' to be formed corresponding to it
Profile.In some embodiments, the radius of curvature of the second curved indentations 832 is identical to the corresponding optical layer to be formed
The radius of curvature of 20 ' the second convex lens structures 232.
In one embodiment, optical material be, for example, dimethyl silicone polymer (Polydimethylsiloxane, PDMS),
Mold silica resin (Moldable Silicone, MS) or other suitable optical materials.
After injection optics material (step 121), cure the optical material in master mold to form optical layer (step 123).
After solidification (step 123), separation master mold and optical layer is to get to the optical layer (step 125) of required shape.
Figure 28 is please referred to, in the present embodiment, after curing the optical material in master mold 80, in first surface groove 830
Optical material is to be molded into the first convex lens structures 230 of optical layer 20, and the optics contacted with the second surface of master mold 80 812
Material is then molded into the second surface 212 of flat optical layer 20.Then, master mold 80 is detached with optical layer 20 to get to
The optical layer 20 that there are the first convex lens structures 230 on one surface 210 and second surface 212 is flat condition.
Figure 29 is please referred to, in the present embodiment, after curing the optical material in master mold 80 ', in first surface groove 830
Optical material is to be molded into the first convex lens structures 230 of optical layer 20 ', and the optical material in the second curved indentations 832 is
It is molded into the second convex lens structures 232 of optical layer 20 '.Then, master mold 80 ' is detached with optical layer 20 ' to get to the first table
Face 210 has the first convex lens structures 230 and second surface 212 to have the second convex lens structures 232.Optical layer 20 '.
In some embodiments, light-emitting component 40 above-mentioned can be light emitting diode (Light-Emitting Diode；
LED).Preferably, light-emitting component 40 above-mentioned can be microminiaturization LED (Micro Light-Emitting Diode；Micro-
LED).In some embodiments, the electronic device of aforementioned any embodiment also can simultaneously be turned with its manufacturing method with same way
Set the microcomponents such as chip.
For example, by taking the application of LED display panel as an example, drive circuit substrate 50 can be active array base
Plate or passive multiple substrate.It can be by micromation LED (light-emitting component 40) by the manufacturing method of the electronic device of any embodiment
It is transposed on actively or passively multiple substrate (drive circuit substrate 50), as shown in Figure 30 to Figure 32 or Figure 33 to Figure 35.
With reference to Figure 30 to Figure 32 or Figure 33 to Figure 35, it (is hereinafter referred to as the first electricity that each light-emitting component 40, which has two junctions,
Pole 401 and second electrode 402).For example, first electrode 401 can be N electrode, and second electrode 402 can be P electrode, but be not limited to
This.
Drive circuit substrate 50 includes a substrate 510, multiple driving elements 530, an insulating layer 550, multiple first connections
Electrode 570 and multiple second connection electrodes 572.These driving elements 530 are set in substrate 510, and insulating layer 550 is arranged
In in driving element 530.First connection electrode 570 and the second connection electrode 572 are set on insulating layer 550, and second connects
Receiving electrode 572 is electrically connected with driving element 530.Each light-emitting component 40 corresponds to one of these driving elements 530.
The first electrode 401 of light-emitting component 40 and the first connection electrode 570 are electrically connected.In the present embodiment, first connects
Receiving electrode 570 is being connected to a fixation current potential.In other words, the first electrode 401 of light-emitting component 40 can be via the first connection electricity
Pole 570 electrically conducts to fixed current potential.Wherein, fixed current potential may be, for example, earthing potential, but not limited to this.
The second electrode 402 of light-emitting component 40 and the second connection electrode 572 are electrically connected.In the present embodiment, first connects
Receiving electrode 570 be used for being electrically connected to driving element 530 an electrode (such as：Source/drain).In this, the second connection electrode 572
First end be electrically connected corresponding driving element 530, and the second end of the second connection electrode 572 is located at the upper of insulating layer 550,
And it is electrically connected the second electrode 402 of corresponding light-emitting component 40.In other words, each second connection electrode 572 passes through insulating layer
Perforation (throughhole) 552 on 550 makes the second electrode 402 of light-emitting component 40 via corresponding second connection electrode
572 electrically conduct to corresponding driving element 530.Therefore, light-emitting component 40 can provide luminous required by driving element 530
Driving voltage.
In some embodiments, drive circuit substrate 50 can further include a patterning bank layer (bank) 590, and this figure
Case bank layer 590 is set on insulating layer 550.This patterning bank layer 590 has multiple openings 592.Also, in transposition
Afterwards, light-emitting component 40 is located in opening 592, to promote the light-out effect of light-emitting component 40 by patterning bank layer 590.
In other words, in an embodiment of step S180, using optical layer 20 (or optical layer 20 ') by the first convex lens knot
Structure 230 sticks 40 transposition of light-emitting component that takes in the opening 592 in drive circuit substrate 50, so that the first of light-emitting component 40
Electrode 401 and corresponding first connection electrode 570 are electrically connected and the second electrode 402 of light-emitting component 40 and corresponding the
Two connection electrodes 572 are electrically connected.
In some embodiments, in 40 transposition of light-emitting component in 570 and second connection electrode of corresponding first connection electrode
When 572, can pass through heat driven circuit board 50 makes each first connection electrode 570 and the first electrode of corresponding light-emitting component 40
401 weldings and make second electrode 402 welding of each second connection electrode 572 with corresponding light-emitting component 40, so as to ensuring to send out
The first electrode 401 of optical element 40 electrically conducts with corresponding first connection electrode 570 and the second electrode of light-emitting component 40
402 electrically conduct with corresponding second connection electrode 572.
In some embodiments, after 40 transposition of light-emitting component, colloid can be filled in the peripheral region of light-emitting component 40, i.e., will
Colloid is injected into opening 592.For example, colloid can be by between the edge and the edge of drive circuit substrate 50 of optical layer 20
Gap injection so that the peripheral region of light-emitting component 40 be full of colloid, but not limited to this.That is, optical layer 20 (or light
Learn layer 20 '), the space between light-emitting component 40 and drive circuit substrate 50 there is colloid.In this, the colloid of injection (filling) is
Transparent colloid.In some embodiments, this colloid may be, for example, the optical cements such as ultraviolet optical cement, glass viscose or fruit juice gel.
In some embodiments, after filling colloid, colloid can be cured, so as to engagement optical layer 20 and drive circuit substrate
50 and strengthen the connection between light-emitting component 40 and drive circuit substrate 50.In further embodiments, after filling colloid,
It can be further formed and cure an adhesive material body 60 between the edge of optical layer 20 and the edge of drive circuit substrate 50, borrow
This, the colloid of light-emitting component 40 and filling is located at the inside of adhesive material body 60.
In conclusion electronic device according to the present invention is suitable for transposition light-emitting component 40 with its manufacturing method, directly
Light-emitting component 40 is sticked in optical layer 20 (or optical layer 20 ') using adhesion layer 30, and after transposition light-emitting component 40
Without removing optical layer 20 (or optical layer 20 '), thus be avoided that light-emitting component 40 fallen from optical layer 20 (or 20 ') and
The events such as contraposition offset occur, and then can improve the yield of electronic device.Also, after transposition, optical layer 20 (or optical layer
20 ') it still remaines on light-emitting component 40 (without removing), using the beam condensing unit as light-emitting component 40, so as to improving out light efficiency
Rate.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
Various corresponding change and deformations, but these corresponding change and deformations can be made according to the present invention by knowing those skilled in the art
The protection domain of the claims in the present invention should all be belonged to.
Claims (18)
1. a kind of electronic device, which is characterized in that including：
One drive circuit substrate；
A plurality of light-emitting elements are located in the drive circuit substrate；
One optical layer is located on such light-emitting component, which includes a first surface and a second surface opposite to each other,
There are the first surface multiple first convex lens structures, first convex lens structures to be protruded towards the light-emitting component, and at least
Such first convex lens structures of a part are least partially overlapped with such light-emitting component on a upright projection direction；And
One adhesion layer, between the light-emitting component and corresponding first convex lens structures, to adhesive light-emitting element with it is right
The first convex lens structures answered.
2. electronic device according to claim 1, which is characterized in that the second surface is a flat surface structure.
3. electronic device according to claim 1, which is characterized in that the second surface has multiple second convex lens knots
Structure.
4. electronic device according to claim 3, which is characterized in that second convex lens structures are in the upright projection direction
It is upper mutually to overlap with first convex lens structures.
5. electronic device according to claim 3, which is characterized in that the average height of second convex lens structures be less than or
Equal to the average height of first convex lens structures.
6. electronic device according to claim 3, which is characterized in that respectively the radius of curvature of first convex lens structures is less than
Or the radius of curvature equal to respectively second convex lens structures.
7. electronic device according to claim 1, which is characterized in that the refractive index of the optical layer between 1.4 to 1.6 it
Between.
8. electronic device according to claim 1, which is characterized in that the coefficient of elasticity of the optical layer between 1MPa extremely
Between 12MPa.
9. electronic device according to claim 1, it is characterised in that：
Respectively the light-emitting component has a first electrode and a second electrode；And
The drive circuit substrate includes：
One substrate；
Multiple driving elements are set in the substrate；
One insulating layer is set in the driving element；
Multiple first connection electrodes, are set on the insulating layer, wherein respectively first connection electrode has a first end and one the
Two ends, the first end are electrically connected with the corresponding driving element, first electricity of the second end and the corresponding light-emitting component
Pole is electrically connected；And
Multiple second connection electrodes are electrically connected with the second electrode of the corresponding light-emitting component respectively.
10. electronic device according to claim 9, which is characterized in that the drive circuit substrate further includes：
One patterning bank layer is set on the insulating layer, which there are multiple openings, the light-emitting component to be located at
In the opening.
11. electronic device according to claim 10, which is characterized in that respectively first convex lens structures are in the upright projection
It is located in the corresponding opening on direction.
12. electronic device according to claim 1, which is characterized in that further include：
One adhesive material body, between the optical layer and the drive circuit substrate, which is located at the optical layer
Edge and the drive circuit substrate edge, the inside of the adhesive material body is located at so as to the light-emitting component.
13. a kind of manufacturing method of electronic device, which is characterized in that including：
An optical layer is provided, which includes two opposite first surfaces and a second surface, which has more
A first convex lens structures；
An adhesion layer is formed in first convex lens structures；
A plurality of light-emitting elements are picked up with first convex lens structures, which is bonding on first convex lens by the adhesion layer
In mirror structure；And
First convex lens structures are sticked to the light-emitting component transposition taken on one drive circuit substrate using the optical layer.
14. the manufacturing method of electronic device according to claim 13, which is characterized in that the step of providing the optical layer is wrapped
It includes：
It injects in an optical material a to master mold, the first surface inside the master mold has the more of corresponding first convex lens structures
A first surface groove；
Cure the optical material in the master mold to form the optical layer；And
Detach the master mold and the optical layer.
15. the manufacturing method of electronic device according to claim 13, which is characterized in that the second surface of the optical layer
With multiple second convex lens structures, which further includes：
Before in the pickup light-emitting component the step of, a carrier is bonded with second convex lens structures, the carrier with this
Stickiness between two convex lens structures is less than the stickiness of the adhesion layer；And
In the light-emitting component transposition after the step in the drive circuit substrate, the carrier is removed.
16. the manufacturing method of electronic device according to claim 15, which is characterized in that the step of providing the optical layer is wrapped
It includes：
It injects in an optical material a to master mold, the first surface inside the master mold has the more of corresponding first convex lens structures
Second surface inside a first surface groove and the master mold has multiple second curved surfaces of corresponding second convex lens structures
Groove；
Cure the optical material in the master mold to form the optical layer；And
Detach the master mold and the optical layer.
17. the manufacturing method of electronic device according to claim 13, which is characterized in that the drive circuit substrate includes：
One substrate；
Multiple driving elements are set in the substrate；
One insulating layer is set in the driving element；
Multiple first connection electrodes, wherein respectively first connection electrode has a first end and a second end, the first end with it is right
The driving element answered is electrically connected, which is set on the insulating layer；
Multiple second connection electrodes, are set on the insulating layer；And
One patterning bank layer, is set on the insulating layer, which has multiple openings；
Wherein, which includes in the step of drive circuit substrate：
By the light-emitting component transposition in the opening, by a first electrode of the respectively light-emitting component and the corresponding first connection electricity
The second end of pole is electrically connected, and a second electrode of the respectively light-emitting component and corresponding second connection electrode is electrical
Connection.
18. the manufacturing method of electronic device according to claim 13, which is characterized in that further include：
In the light-emitting component transposition after the step in the drive circuit substrate, formed an adhesive material body in the optical layer with
Between the drive circuit substrate；And
Cure the adhesive material body, wherein the adhesive material body is located at the edge of the optical layer and the side of the drive circuit substrate
Edge is located at the inside of the adhesive material body so as to the light-emitting component.
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| CN108183157B (en) * | 2017-11-30 | 2019-11-12 | 华灿光电（浙江）有限公司 | Light-emitting diode and preparation method thereof |
| TWI686973B (en) * | 2018-07-16 | 2020-03-01 | 友達光電股份有限公司 | Display apparatus and manufacturing method thereof |
| US11005014B2 (en) * | 2018-07-30 | 2021-05-11 | Facebook Technologies, Llc | Optics formation using pick-up tools |
| TWI676980B (en) * | 2018-09-27 | 2019-11-11 | 友達光電股份有限公司 | Display |
| TWI757069B (en) * | 2021-01-27 | 2022-03-01 | 友達光電股份有限公司 | Display apparatus |
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Also Published As
| Publication number | Publication date |
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| CN106469776A (en) | 2017-03-01 |
| US10256381B2 (en) | 2019-04-09 |
| TWI598859B (en) | 2017-09-11 |
| US10600941B2 (en) | 2020-03-24 |
| US20190189872A1 (en) | 2019-06-20 |
| US20180114886A1 (en) | 2018-04-26 |
| TW201816753A (en) | 2018-05-01 |
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