CN106465568A - Electroconductive adhesive film, printed circuit board, and electronic device - Google Patents
Electroconductive adhesive film, printed circuit board, and electronic device Download PDFInfo
- Publication number
- CN106465568A CN106465568A CN201580028537.1A CN201580028537A CN106465568A CN 106465568 A CN106465568 A CN 106465568A CN 201580028537 A CN201580028537 A CN 201580028537A CN 106465568 A CN106465568 A CN 106465568A
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- Prior art keywords
- electric conductivity
- cement layers
- electroconductive particle
- junction film
- thickness
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Provided is an electroconductive adhesive film, a printed circuit board, and an electronic device with which it is possible to reduce the incidence of flaws that involve a drop in shielding performance due to an increase in electrical resistance even when an electronic component is covered using the simple method of pressing. An electroconductive adhesive film (1) for carrying out electromagnetic wave shielding by expanding, in the direction of the film surface, a portion of the printed circuit board that corresponds to a recessed portion to be cut, so that an electronic component (5) is covered. The present invention has an electroconductive adhesive layer (10) formed from an isotropic electroconductive material containing electroconductive particles (10a), and an underground adhesive layer (11) positioned closer to an electronic component (2) than the electroconductive adhesive layer (10) during pressing, the underground adhesive layer (11) being formed of an anisotropic electroconductive material containing electroconductive particles (11a).
Description
Technical field
The present invention relates to a kind of electric conductivity junction film, printed wiring board and electronic equipment.
Background technology
There is a kind of screening cover for avoiding external electromagnetic waves to invade the electronic component on printed wiring board and prevent in the past
The electromagnetic wave outside portion that only electronic circuit produces flows out（As patent documentation 1）.This screening cover is made up of metal levels such as rustless steels
Lid, and when configuring, make it cover need electronic component to be protected.Additionally, with regard to this screening cover, its metal level is connected to print
Earthy wiring pattern on wiring plate, shield effectiveness is improved.
But, screening cover inner wall surface thereof needs to reserve space and between electronic component, in order to avoid internal face contact print wiring plate
On electronic component, therefore, it is difficult to reaching the slimming of printed wiring board.With regard to this, as shown in patent documentation 2 and 3, also will lead
Electric cream is printed on the mode on printed wiring board.Additionally, patent document 4 discloses that a kind of technology, with corresponding with substrate shape
Thermal softening electromagnetic shielding material covers the whole substrate including installation elements, cold to the heating of major general's above-mentioned shielding material
But so as to be fitted tightly on substrate.
Look-ahead technique document Prior Art
Patent documentation
Patent documentation 1：JP（Japan Patent）2001-345592 publication
Patent documentation 2：JP（Japan Patent）2009-016715 publication
Patent documentation 3：JP（Japan Patent）2010-245139 publication
Patent documentation 4：JP（Japan Patent）Flat 5-327270 publication.
Content of the invention
Problems to be solved by the invention
However, patent documentation 2 ~ 4 or manufacturing process are complicated or load is larger.Therefore, in recent years, similar to the screen of patent documentation 1
Covering lid becomes main flow.Additionally, allow as described in patent documentation 4 electromagnetic shielding material coordinate electronic component shape when, electromagnetic screen
Cover the resistance rising caused by material deformation and can reduce shield effectiveness.
In view of the above problems, it is an object of the invention to provide a kind of electric conductivity junction film, printed wiring board and electronics set
Standby, by the present invention, it is not easy to appearance when with this simple and easy method overlay electronic element of press process and makes because resistance increases
Become the problem that shielding propertiess decline.
The technological means that solve problem is taken
The present invention relates to a kind of electric conductivity junction film, make it corresponding with recess with blocking of printed wiring board by press process
Position is stretched and overlay electronic element to face direction, shields electromagnetic wave with this, this electric conductivity junction film contains：Led by containing first
Electric conductivity cement layers that the isotropism conductive material of conductive particles is formed and being located at than above-mentioned in above-mentioned press process
Electric conductivity cement layers near above-mentioned electronic component side position, by the anisotropic conductive material containing the second electroconductive particle
The bottom cement layers that material is formed.
When by press process with electric conductivity junction film overlay electronic element, electric conductivity junction film can be with printed wiring
Blocking of plate is correspondingly stretched with recess shapes.Now, electric conductivity junction film is from electronic component toward lateral direction gradually significantly
Degree stretches.In said structure, the outermost electric conductivity cement layers being located remotely from electronic component are by containing the first electric conductivity grain
The isotropism conductive material of son is formed, and the bottom cement layers positioned at electronic component side are by each containing the second electroconductive particle
Anisotropy conductive material is formed.Contained by isotropism conductive material, the ratio of electroconductive particle is more than anisotropic conductive material,
Therefore, though electric conductivity cement layers bigger than bottom cement layers stretch amplitude it is also possible to prevent the first electroconductive particle it
Between occur gap and lead to electric conductivity reduce.Shielding propertiess are led to decline because resistance increases therefore, it is possible to prevent
Problem.
Additionally, in the electric conductivity junction film of the present invention, can arrange as follows：Described first electroconductive particle is after stretching, extension
Described electric conductivity cement layers in at least a portion contact with each other density dispersion.
By said structure, electroconductive particle can be effectively prevented and be easiest to each other produce the position in gap
I.e. in electric conductivity cement layers, the electric conductivity at extension degree maximum position declines.
Additionally, the electric conductivity junction film of the present invention can be as follows：Contained described in described electric conductivity cement layers
One electroconductive particle is the flaky particle of 15% ~ 25% of thickness before the stretching, extension that average major diameter is described electric conductivity cement layers,
This contained first electroconductive particle is 40 weight % ~ 80 weight % of described electric conductivity cement layers gross weight.
By said structure, the position being easiest to produce gap in electroconductive particle each other is that electric conductivity engages
In oxidant layer, the major diameter direction of the first electroconductive particle can be consistent with the face direction of electric conductivity cement layers, therefore, press process
First electroconductive particle easily contacts each other afterwards, can effectively prevent the electric conductivity at the maximum position of extension degree from declining.
Additionally, the electric conductivity junction film of the present invention can be as follows：The mean diameter of described second electroconductive particle is described
The 10% ~ 50% of thickness before the cement layers stretching, extension of bottom, and this contained second electroconductive particle is described bottom cement layers
40 weight % ~ 80 weight % of gross weight.
It is prevented from by said structure each other gap occurring and lead to whole bottom to connect because of the second electroconductive particle
The electric conductivity of mixture layer declines, and prevents resistance from increasing led to shielding propertiess further and declines.
In the electric conductivity junction film of the present invention, described second electroconductive particle can be dendroid particle.
In said structure, the second electroconductive particle is dendroid particle, with the non-dendroid particle using same weight %
Compare, it is possible to increase the second electroconductive particle contact rate each other.The cement of bottom cement layers is prevented from this
Amount reduce such that it is able to improve conductive in the case of not reducing the zygosity of electric conductivity cement layers and bottom cement layers
Property.
The electric conductivity junction film of the present invention can also be arranged as follows：Thickness before the stretching, extension of described electric conductivity cement layers
For the 1% ~ 3% of the groove depth of described recess, before the stretching, extension of described bottom cement layers, thickness is the 4% ~ 8% of the groove depth of described recess,
The two total thickness before stretching is the 5% ~ 11% of the groove depth of described recess.
The electric conductivity junction film of the present invention can also be as follows：The thickness of described electric conductivity cement layers is 10 m ~ 30 m, institute
The thickness stating bottom cement layers is 40 m ~ 80 m.
The electric conductivity junction film of the present invention can be as follows：Transfer film is laminated in connecing with bottom of described electric conductivity cement layers
On the contrary face of mixture layer, the storage moduluss under temperature conditionss more than 150 DEG C for the described transfer film are below 20MPa.
By said structure, transfer film is easy to when hot pressing is processed extend, and can lift electric conductivity junction film to electronics
Element and the landfill characteristics blocked with recess of printed wiring board.
The shielding printed wiring board of the present invention is characterised by containing above-mentioned electric conductivity junction film.
The electronic equipment of the present invention is characterised by containing above-mentioned shielding printed wiring board.
Invention effect
With press process, this simple method is prevented from when covering electric conductivity junction film on electronic component increasing because of resistance
Plus and lead to shielding propertiess to decline.
Brief description
Fig. 1 is the sectional view of electric conductivity junction film.
Fig. 2 is the detailed description figure of electric conductivity junction film.
Fig. 3 is the press process explanatory diagram of electric conductivity junction film.
Fig. 4 is the form explanatory diagram of the electric conductivity junction film being layered on epoxy glass substrate in embodiment.
Fig. 5 is the assay method explanatory diagram of the sheet resistance value of electric conductivity junction film in embodiment.
Specific embodiment
With reference to the accompanying drawings the preferred embodiment of the present invention is illustrated.
As shown in figure 1, the electric conductivity junction film 1 of present embodiment is arranged on shielding printed wiring board 100, by compacting
Processing makes the position corresponding with recess stretch overlay electronic element 2 to face direction, carries out electromagnetic wave shielding with this.
Specifically, printed wiring board 100 is provided with：Cloth including the signal pattern on substrate 4 and grounding pattern etc.
Line is in the electronic component such as the passive elements such as interior line pattern, capacitor and inductance and integrated circuit chip 2.These electronics
Element 2 passes through the encapsulating material 3 such as resin plastic-sealed and has carried out integral packaging.Multiple electronics by integral packaging are formed with substrate 4
The unit module of element 2 composition, unit module passes through concave groove（Recess）Make a distinction.Substrate 4 with unit module is
Unit is blocked from recess, and arranges the various electronic equipment such as notebook computer and tablet terminal 300 as printed wiring board 100
In.In addition, the blocking of printed wiring board in the present invention refers to above-mentioned recess with recess.
（Electric conductivity junction film 1）
Make electric conductivity junction film 1 cover multiple unit modules of setting on substrate 4, and carry out press process.With this, electric conductivity connects
Close the position being located in film 1 on the upside of recess to enter in the groove of recess, stretch to face direction.
This electric conductivity junction film 1 contains conductive cement layers 10 and is located at more close than electric conductivity cement layers 10
The bottom cement layers 11 of electronic component 2 side.That is, electric conductivity junction film 1 is by electric conductivity cement layers 10 and bottom cement
Layer 11 stratification.
Electric conductivity cement layers 10 and bottom cement layers 11 are led by the mixture of electroconductive particle and binding agent
Electrically cement is formed.The electrical connection of electric conductivity cement is by the continuously mechanical contact of the electroconductive particle in binding agent
And realize, this electrical connection is maintained by the bonding force of binding agent.
The binding agent of electric conductivity cement layers 10 and bottom cement layers 11 can include acrylic resin, epoxiess
Resin, silicon resinoid, thermoplastic elastomer (TPE) resinoid, rubber resin, polyester resin, polyurethane based resin etc..In addition, connecing
Mixture can be individually one kind of above-mentioned resin can also be its mixture.Additionally, binding agent can also contain viscosifier again.Make
Fatty acid hydrocarbon resin, C5/C9 hybrid resin, Colophonium, rosin derivative, terpene resin, the fragrant same clan can be enumerated for viscosifier
Hydrocarbon resin, heat reactivity resin etc..
The electroconductive particle of electric conductivity cement layers 10 and bottom cement layers 11 use carbon, silver, copper, nickel, scolding tin,
The metal packings such as aluminum, stannum, bismuth and the silver-plated silver-colored copper-clad obtaining of copper powder, also gold-plated genus on the thing such as resin beads and glass microballoon
Obtained from filler or these fillers mixture.
The shape of electroconductive particle 10a and 11a can be any in spherical, needle-like, threadiness, flake, dendroid
A kind of.Additionally, as shown in Fig. 2 in the present embodiment, the electroconductive particle 10a of electric conductivity cement layers 10（First electric conductivity
Particle）Using laminar electroconductive particle, the electroconductive particle 11a of bottom cement layers 11（Second electroconductive particle）Using tree
Dendritic electroconductive particle.
(electric conductivity junction film 1：Electric conductivity cement layers 10）
Electric conductivity cement layers 10 are formed by the isotropism conductive material containing electroconductive particle 10a.Electric conductivity cement layers 10
It can also be more than two layers of multiple structure.Electric conductivity cement layers 10 stretch before thickness lower limit with the 1.0% of recess groove depth be
Preferably, more preferably 1.5%.Additionally, the thickness upper limit before electric conductivity cement layers 10 stretch is advisable with 3.0%, more preferably 2.0%.More
For body, the lower limit of electric conductivity cement layers 10 thickness is advisable with 10 m, and 15 m are more preferable.Electric conductivity cement layers 10 thickness upper
Limit is advisable with 30 m, and 20 m are more preferable.The lower limit of electric conductivity cement layers less than above-mentioned value, stretch electric conductivity junction film 1 after
It is difficult between electroconductive particle contact, therefore, the electric conductivity at the maximum position of extension degree will be impaired.And electric conductivity cement layers
The upper limit exceed above-mentioned value, then to small recess filled when landfill characteristics will be deteriorated, and from an economic point of view
Also uneconomical.
Electric conductivity cement layers 10 are formed by isotropism conductive material, therefore electric conductivity cement layers 10 can be in thickness side
"on" position is guaranteed in the three-dimensional omnirange constituting to, width and long side direction.
Electroconductive particle 10a is close with contact with each other at least partially preferably in the electric conductivity cement layers 10 after stretching, extension
Degree dispersion.In addition, so-called " contacting with each other at least partially " be not limited to make in the electric conductivity cement layers 10 after stretching, extension contained
The whole electroconductive particle 10a contacts having are simultaneously continuous（Electrical connection）This situation, as long as conductive particle 10a is at least in thickness
The realization that contacts with each other of direction, width or long side direction electrically connects.
Specifically, the containing ratio lower limit of electroconductive particle 10a be electric conductivity cement layers 10 gross weight 40 weight % then
More suitable, 50 weight % are more preferable.The containing ratio upper limit of electroconductive particle 10a is the 80 of the gross weight of electric conductivity cement layers 10
Weight % is advisable, and 60 weight % are more preferable.The containing ratio lower limit of electroconductive particle is then led after electric conductivity junction film 1 stretches less than above-mentioned value
It is difficult between conductive particles contact, the electric conductivity at the therefore maximum position of extension degree will be impaired.And the containing of electroconductive particle
If the rate upper limit exceedes above-mentioned value, zygosity can decline, and economically uneconomical.
As shown in the electroconductive particle 10a of present embodiment, the first contained electric conductivity in electric conductivity cement layers 10
Particle is preferably flaky particle.Additionally, before the lower limit of the average major diameter of electroconductive particle 10a is with electric conductivity cement layers 10 stretching, extension
The 15% of thickness is advisable, and 18% is more preferable.The upper limit of the average major diameter of electroconductive particle 10a stretches front thickness with electric conductivity cement layers 10
25% be advisable, 22% is more preferable.The flake being shaped as major diameter of the first electroconductive particle 10a, therefore connects in aftermentioned electric conductivity
Close in the Stacking steps of electric conductivity cement layers 10 in the manufacture method of film 1, the major diameter side of contained electroconductive particle 10a
To will be consistent with the face direction of electric conductivity cement layers.With this, pressed with the printed wiring board of recess to having to block
After system processing, easily contact between electroconductive particle 10a, the electric conductivity being stretched over maximum position can be effectively prevented
Decline.In addition, the average major diameter of electroconductive particle and mean diameter can be measured with laser diffraction and scattering method.Additionally, electric conductivity
If the average major diameter lower limit of particle 10a is less than 15% of thickness before stretching, electroconductive particle after electric conductivity cement layers 10 stretching, extension
Between be difficult to contact, therefore can damage at utmost stretch position electric conductivity.
In addition, so-called " forming electric conductivity cement layers 10 by isotropism conductive material " refers to electric conductivity cement layers 10
Thickness direction, width and long side direction be "on" position.That is, leading by suitable adjustment electric conductivity cement layers 10
The shape of conductive particles, the species of binding agent, with respect to binding agent electroconductive particle mixed proportion, pressurization compacting when pressure
Power and temperature etc. are obtaining isotropism conductive material.
(electric conductivity junction film 1：Bottom cement layers 11）
Bottom cement layers 11 are formed by the anisotropic conductive material containing electroconductive particle 11a.In addition, bottom cement layers 11
It can also be more than two layers of multiple structure.Thickness lower limit before the stretching, extension of bottom cement layers 11 with the 4% of the groove depth of recess is
Preferably, preferably 5%.Additionally, the thickness upper limit before bottom cement layers 11 stretch is advisable with 8%, preferably 6%.More specifically,
The lower limit that bottom cement layers 11 stretch front thickness is advisable with 40 m, and 50 m are more preferable.The upper limit of bottom cement layers 11 thickness with
80 m are advisable, and 60 m are more preferable.The lower limit of bottom cement layers less than above-mentioned value, electric conductivity junction film 1 stretch after electric conductivity
It is difficult between particle contact, so the electric conductivity at the position at utmost stretched will be impaired.And the upper limit of electric conductivity cement layers
If exceeding above-mentioned value, to small recess filled when landfill characteristics can be deteriorated, and economically also uneconomical.
The anisotropic conductive material forming bottom cement layers 11 has and only makes, in compression aspect, the property that electric current passes through.
Therefore, the bottom cement layers 11 being formed with anisotropic conductive cement can only keep making electric current pass through in thickness direction
State.
The containing ratio lower limit of electroconductive particle 11a is that 40 weight % of bottom cement layers 11 gross weight are advisable, 50 weight %
More preferably.The containing ratio upper limit of electroconductive particle 11a is that 80 weight % of bottom cement layers 11 gross weight are advisable, and 60 weight % are more
Good.The containing ratio lower limit of electroconductive particle, less than above-mentioned value, is difficult between electroconductive particle after electric conductivity junction film 1 stretching, extension
Contact, so the electric conductivity at the position farthest stretched will be impaired.And the containing ratio upper limit of electroconductive particle exceedes
If stating value, zygosity can decline, and economically uneconomical.
As shown in the electroconductive particle 11a of present embodiment, the first contained electric conductivity grain in bottom cement layers 11
Son is preferably dendroid particle.Additionally, the lower limit of electroconductive particle 11a mean diameter stretches front thickness with bottom cement layers 11
10% be advisable, 20% is more preferable.The upper limit of electroconductive particle 11a mean diameter stretches the 50% of front thickness with bottom cement layers 11
It is advisable, 40% is more preferable.
So-called " bottom cement layers 11 are formed by anisotropic conductive material " refers to that bottom cement layers 11 are in and only exists
One direction（Thickness direction）Guarantee the state making electric current pass through.That is, by the electric conductivity of suitable adjustment bottom cement layers 11
The shape of particle, the species of binding agent, electroconductive particle with respect to binding agent mixed proportion, pressurization compacting when pressure, with
And temperature etc. is obtaining anisotropic conductive material.
In addition, the thickness before electric conductivity junction film 1 stretching, extension of itself is electric conductivity cement layers 10 and bottom engages
Gross thickness before oxidant layer 11 stretching, extension（The thickness of electric conductivity cement layers 10 and the sum total of bottom cement layers 11 thickness）Lower limit
It is advisable with the 5% of the groove depth of recess, more preferably 7%.Additionally, the thickness before electric conductivity junction film 1 stretching, extension of itself is conduction
Property cement layers 10 and bottom cement layers 11 stretch before the upper limit of gross thickness be advisable with 11%, more preferably 9%.
(manufacture method of electric conductivity junction film 1)
As shown in figure 3, electric conductivity junction film 1 is placed on electronic component 2 in the state of being laminated with transfer film 12, then place buffering
Film 13 simultaneously pressurizes from upside in this case.With regard to the manufacture method of electric conductivity junction film 1, first, this transfer film 12 passes through T-shaped
The extrusion moldings such as die methods, form membranaceous.As long as in addition, transfer film 12 has stripping for electric conductivity cement layers 10
Property, it is not particularly limited, such as can use tripolycyanamide mould release or the acrylic acid mould release of coating silicon or non-silicon class
PET film etc..In addition, the storage moduluss under temperature conditionss preferably more than 150 DEG C for the transfer film 12 are below 20MPa.With this,
It is obtained in that when blocking with recess that good landfill is special by what electric conductivity junction film 1 filled printed wiring board in press process
Property.
By the isotropism conductive material containing electroconductive particle 10a being coated with this transfer film 12 come in transfer film 12
Upper stacking electric conductivity cement layers 10.On the other hand, separately apply on the not shown stripping film being formed by extrusion molding
Cloth contains the anisotropic conductive material of electroconductive particle 11a, forms bottom cement layers 11 with this.Then, to this two layers
Stack is laminated, and is formed with this and is sequentially laminated with transfer film 12, electric conductivity cement layers 10, bottom cement layers 11 and no schemes
Show the laminate structure of stripping film.
So, the electric conductivity junction film 1 being formed is in the state being clipped between transfer film 12 and stripping film.In addition, this
Laminate structure can be rolled into cylinder keeping and transport etc. with the form of above-mentioned four-layer structure.In addition it is also possible in only stripping
After film with the form reel of three-decker and keeping and transport etc..When with three-decker reel, preferably to conductive on transfer film 12
The face of the opposite side of property 10 lamination surface of cement layers carries out release process.
Additionally, be not limited by above-mentioned laminating method being led it is also possible to being directed to and being laminated with transfer film 12 to make
Electrically the duplexer of cement layers 10 is coated the anisotropic conductive material containing electroconductive particle 11a, is consequently formed bottom
Cement layers 11.Electric conductivity junction film 1 can be laminated on transfer film 12 with this.
（Press process）
As shown in figure 3, covered that with the electric conductivity junction film 1 being layered on transfer film 12 encapsulating material 3 integral packaging is used on substrate 4
Electronic component 2, place buffer film 13 carry out press process in this case in transfer film 12 side.In present embodiment
In, carry out press process with flat board, but not limited to this, it is possible to use clamp-on the mould of recess.Now can not also use
Buffer film 13.
In above-mentioned illustrating, in order that the present invention is more readily understood and mainly distinctive part is said
Bright, but the invention is not restricted to embodiment described in details described above, the present invention is readily adaptable for use in other embodiment, its
Range of application should obtain widely explaining as far as possible.
In addition, word as used in this specification and grammer are only used for definitely the present invention being described, it is simultaneously unrestrictedly right
The effect of the explanation of the present invention.As long as additionally, those skilled in the art are just easy to join from inventive concept described in this specification
Expect other structures included in concept of the present invention, system and method etc..Therefore, the content that claims are described should be by
It is considered as comprising other equivalent structures in the range of without departing from the technology of the present invention thought.In addition, in order to fully understand the present invention's
Purpose and the effect of the present invention, hope reader fully with reference to published document etc..
Embodiment
（Embodiment 1 ~ 4, comparative example 1 ~ 3）
Used in embodiment, electric conductivity junction film is laminated by following part：The isotropism of sheet-containing shape electroconductive particle
Electric conductivity cement layers that conductive material is formed and by the anisotropic conductive material shape containing dendritic electroconductive particle
The bottom cement layers becoming.Thickness before being stretched by compacting for the electric conductivity cement layers of embodiment 1 ~ 4 respectively 20 m,
20µm、15µm、10µm.Additionally, thickness before being stretched by compacting for the bottom cement layers of embodiment 1 ~ 4 is respectively 40
m、60µm、60µm、80µm.
The electric conductivity junction film that comparative example 1,2 uses is laminated by following part：By containing dendroid electroconductive particle
Electric conductivity cement layers and the isotropism conduction material by sheet-containing shape electroconductive particle that anisotropic conductive material is formed
The bottom cement layers that material is formed.Additionally, the electric conductivity junction film that comparative example 3 uses is laminated by following part：By containing tree
Electric conductivity cement layers that the anisotropic conductive material of dendritic electroconductive particle is formed and by electroconductive particle containing dendroid
Anisotropic conductive material formed bottom cement layers.The electric conductivity cement layers of comparative example 1 ~ 3 are being stretched by compacting
Thickness before exhibition is respectively 60 m, 80 m, 60 m.Additionally, before the bottom cement layers of comparative example 1 ~ 3 are stretched by compacting
Thickness is respectively 20 m, 20 m, 60 m.
In addition, the electric conductivity in embodiment 1 ~ 4 and the respective electric conductivity cement layers of comparative example 1 ~ 3 and bottom cement layers
Particle be mixed into the 60wt% that ratio is the respective total amount of electric conductivity cement layers and bottom cement layers.The conduction of embodiment 1 ~ 4
Property cement layers and comparative example 1,2 bottom cement layers used in the average major diameter of laminar electroconductive particle and averagely short
Footpath is respectively 5 m, 1 m, the bottom cement layers of embodiment 1 ~ 4 and comparative example 3 and the electric conductivity cement of comparative example 1 ~ 3
Used in layer, the mean diameter of dendroid electroconductive particle is 13 m.These electric conductivity junction films are laminated transfer film, then
Put buffer film, compacting object carries out press process.
Transfer film use 150 DEG C storage moduluss be 10MPa vistanex（Thickness 50 m）.Additionally, buffering
Film uses Mitsui Chemicals Tohcello, Inc.（Mitsui Chemicals Tohcello, Inc.）Produce
CR1012MT4 (thickness 150 m）.Press process is under conditions of 170 DEG C of heating-up temperature, 30 minutes press times, pressure 3MPa
Carry out.
Compacting object use simulation electronic component load substrate, on epoxy glass substrate arrange groove width
0.6mm, the checker board of groove depth 1mm（It is divided into 8 × 8 regions）Obtained substrate after recess.
As described above, electric conductivity junction film is attached on compacting object by press process.Then, to having peeled off buffer film
Measure all adjacent areas with the electric conductivity junction film of the embodiment 1 ~ 4 after transfer film and comparative example 1 ~ 3 as shown in Figure 4, Figure 5
Between sheet resistance value（Total 112 times）.Specifically, as shown in figure 4, having recessed by above-mentioned channel-shaped on epoxy glass substrate 20
Portion 20b is divided into the region 20a of 8 × 8.Each recess 20b is on epoxy glass substrate 20 with the setting in clathrate of 10mm interval.
Press process electric conductivity junction film 1 cover at least a portion of all region 20a on epoxy glass substrate 20.That is, epoxy
6 × 6 region 20a of the central part on glass substrate 20 are all covered by electric conductivity junction film 1, positioned at epoxy glass substrate
A part of the region 20a at 20 edge is covered by electric conductivity junction film 1.Press process is carried out with this form, then electric conductivity connects
Close the recess 20b that film 1 can fill epoxy glass substrate 20.With this, electric conductivity junction film 1 forms recess 1b.That is, electric conductivity
The region 1a being marked off by recess 1b is formed on junction film 1.Then, clip the recessed of electric conductivity junction film 1 as shown in figure 5, measuring
Sheet resistance value R between the adjacent region 1a of portion 1b.To between embodiment 1 ~ 4 and all region 1a of comparative example 1 ~ 3（112
Plant combination each once）Carry out the mensure of as above sheet resistance value R.Sheet resistance value R in embodiment 1 ~ 4 and comparative example 1 ~ 3
Maximum, minima, meansigma methodss and its test and appraisal are shown in Table 1.
In addition, test and appraisal are implemented as follows.Specifically, when the meansigma methodss of sheet resistance value, maximum and minima are equal
Situation during not up to 1 Ω is designated as "○".By the meansigma methodss of sheet resistance value less than 1 Ω but maximum 1 more than Ω situation
It is designated as " △ ".When the meansigma methodss of sheet resistance value and maximum are all designated as " X " in the situation of 1 more than Ω.
Table 1
Learn from table 1, in conductive film, electric conductivity cement layers are by the isotropism conductive material of sheet-containing shape electroconductive particle
Formed, and bottom cement layers are obtained by the embodiment that the anisotropic conductive material containing dendroid electroconductive particle is formed
Good result.For example, changed, in embodiment 2 and comparative example 1, the order being laminated, but the sheet resistance value of embodiment 2 is average
Value, less than 1/10th of the sheet resistance value meansigma methodss of comparative example 1, illustrates that said structure is obtained in that good result.
Numbering explanation
1 electric conductivity junction film
1a region
1b recess
2 electronic components
3 encapsulating materials
4 substrates
10 electric conductivity cement layers
10a electroconductive particle
11 bottom cement layers
11a electroconductive particle
12 transfer films
13 buffer films
20 epoxy glass substrates
20a region
20b recess
100 printed wiring boards
300 electronic equipments
Claims (10)
1. a kind of electric conductivity junction film, makes its blocking with the corresponding position of recess to film with printed wiring board by press process
Face direction stretch and overlay electronic element, electromagnetic wave is shielded with this, this electric conductivity junction film be characterised by containing：
The electric conductivity cement layers that formed by the isotropism conductive material containing the first electroconductive particle,
And in described press process be located at than described electric conductivity cement layers near described electronic component side position,
The bottom cement layers being formed by the anisotropic conductive material containing the second electroconductive particle.
2. electric conductivity junction film according to claim 1 it is characterised in that：
Described first electroconductive particle is close with contact with each other at least partially in the described electric conductivity cement layers after stretching, extension
Degree dispersion.
3. electric conductivity junction film according to claim 1 and 2 it is characterised in that：
In described electric conductivity cement layers, contained described first electroconductive particle is that average major diameter engages for described electric conductivity
The flaky particle of the 15% ~ 25% of thickness before the stretching, extension of oxidant layer,
This contained first electroconductive particle is 40 weight % ~ 80 weight % of described electric conductivity cement layers gross weight.
4. the electric conductivity junction film according to claims 1 to 3 wherein any one it is characterised in that：
The mean diameter of described second electroconductive particle is 10% ~ 50% of thickness before described bottom cement layers stretch,
This contained second electroconductive particle is 40 weight % ~ 80 weight % of described bottom cement layers gross weight.
5. electric conductivity junction film according to claim 4 it is characterised in that：
Described second electroconductive particle is dendroid particle.
6. the electric conductivity junction film according to claim 1 to 5 wherein any one it is characterised in that：
Before the stretching, extension of described electric conductivity cement layers, thickness is the 1% ~ 3% of the groove depth of described recess, described bottom cement layers
Before stretching, extension, thickness is the 4% ~ 8% of the groove depth of described recess,
The two total thickness before stretching is the 5% ~ 11% of the groove depth of described recess.
7. the electric conductivity junction film according to claim 1 to 5 wherein any one it is characterised in that：
The thickness of described electric conductivity cement layers is 10 m ~ 30 m,
The thickness of described bottom cement layers is 40 m ~ 80 m.
8. the electric conductivity junction film according to claim 1 to 7 wherein any one it is characterised in that：
Transfer film is laminated on the face contrary with bottom cement layers of described electric conductivity cement layers,
Storage moduluss under temperature conditionss more than 150 DEG C for the described transfer film are below 20MPa.
9. a kind of shielding printed wiring board it is characterised in that：
Containing the electric conductivity junction film described in claim 1 to 8 wherein any one.
10. a kind of electronic equipment it is characterised in that：
Containing the shielding printed wiring board described in claim 9.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014113849 | 2014-06-02 | ||
| JP2014-113849 | 2014-06-02 | ||
| PCT/JP2015/065549 WO2015186624A1 (en) | 2014-06-02 | 2015-05-29 | Electroconductive adhesive film, printed circuit board, and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106465568A true CN106465568A (en) | 2017-02-22 |
| CN106465568B CN106465568B (en) | 2019-01-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580028537.1A Active CN106465568B (en) | 2014-06-02 | 2015-05-29 | Electric conductivity junction film, printed wiring board and electronic equipment |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6190528B2 (en) |
| KR (1) | KR101850809B1 (en) |
| CN (1) | CN106465568B (en) |
| TW (1) | TWI627256B (en) |
| WO (1) | WO2015186624A1 (en) |
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| US10798814B2 (en) | 2018-06-14 | 2020-10-06 | Universal Scientific Industrial (Shanghai) Co., Ltd. | SiP module and manufacturing method of the SiP module |
| CN115867626A (en) * | 2022-03-30 | 2023-03-28 | 东洋油墨Sc控股株式会社 | Adhesive for metal plate, reinforcing member for printed wiring board and method for producing same, and wiring board and method for producing same |
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| US9953929B2 (en) | 2016-03-18 | 2018-04-24 | Intel Corporation | Systems and methods for electromagnetic interference shielding |
| TWI613943B (en) * | 2016-07-12 | 2018-02-01 | Method for manufacturing wafer fixed structure | |
| CN110312772A (en) * | 2017-02-17 | 2019-10-08 | 日立化成株式会社 | Adhesive film |
| JP2019029549A (en) * | 2017-08-01 | 2019-02-21 | 住友ベークライト株式会社 | Film set |
| WO2019044512A1 (en) * | 2017-08-31 | 2019-03-07 | 住友ベークライト株式会社 | Electromagnetic wave shield film |
| KR20190076250A (en) | 2017-12-22 | 2019-07-02 | 삼성전자주식회사 | Semiconductor package and semiconductor Module |
| JP6504302B1 (en) | 2018-06-12 | 2019-04-24 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet, component mounting board, and electronic device |
| KR102522663B1 (en) | 2018-10-02 | 2023-04-18 | 삼성전자주식회사 | Electronic device comprising structure connecting display and conductive supporting member with conductive adhesive member |
| JP6497477B1 (en) | 2018-10-03 | 2019-04-10 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shield sheet and electronic component mounting board |
| WO2020105622A1 (en) | 2018-11-21 | 2020-05-28 | タツタ電線株式会社 | Shield package |
| JP2021086912A (en) * | 2019-11-27 | 2021-06-03 | 東洋インキＳｃホールディングス株式会社 | Electronic component mounting board and electronic device |
| KR102248813B1 (en) * | 2019-12-02 | 2021-05-11 | 엘티메탈 주식회사 | Method for manufacturing porous thermoelectric material and thermoelectric device comprising porous thermoelectric material |
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Also Published As
| Publication number | Publication date |
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| JP6190528B2 (en) | 2017-08-30 |
| WO2015186624A1 (en) | 2015-12-10 |
| TW201606043A (en) | 2016-02-16 |
| JPWO2015186624A1 (en) | 2017-04-20 |
| KR20170013202A (en) | 2017-02-06 |
| CN106465568B (en) | 2019-01-01 |
| KR101850809B1 (en) | 2018-04-20 |
| TWI627256B (en) | 2018-06-21 |
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