CN106439525B - The illuminated lamps and lanterns of module - Google Patents

The illuminated lamps and lanterns of module Download PDF

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Publication number
CN106439525B
CN106439525B CN201611079613.4A CN201611079613A CN106439525B CN 106439525 B CN106439525 B CN 106439525B CN 201611079613 A CN201611079613 A CN 201611079613A CN 106439525 B CN106439525 B CN 106439525B
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CN
China
Prior art keywords
plate
ventilation
heat
heat transfer
module
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Application number
CN201611079613.4A
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Chinese (zh)
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CN106439525A (en
Inventor
叶伟炳
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Dongguan Wenyu Industrial Co Ltd
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Dongguan Wenyu Industrial Co Ltd
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Priority to CN201611079613.4A priority Critical patent/CN106439525B/en
Publication of CN106439525A publication Critical patent/CN106439525A/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes

Abstract

A kind of illuminated lamps and lanterns of module, which is characterized in that including lamp plate, removable component, light fixture, heat sink and ventilation component.Removable component includes multiple dismounting mould groups, and each dismounting mould group includes that fixed column and dismounting ring, each fixed column are arranged at intervals on the one side of lamp plate, and each dismounting ring one-to-one correspondence activity is placed on outside a fixed column.Light fixture includes multiple illuminating modules, and each illuminating module includes multiple LED light emitting components.Ventilation component includes ventilation plate body and exhaust equipment, and heat sink offers embedding slot far from the one side of removable component.The LED light emitting component that the above-mentioned illuminated lamps and lanterns of module can control corresponding number executes light emission operation, and then can be realized the effect of brightness control.It is connected to by exhaust equipment with ventilation hole, the illuminated lamps and lanterns of module can be enable to have ventilation and absorb the effect of discharge exhaust gas, be more advantageous to discharge air cleaning.

Description

The illuminated lamps and lanterns of module
Technical field
The present invention relates to technical field of lamps, more particularly to a kind of illuminated lamps and lanterns of module.
Background technique
Currently, the LED light emitting component of predetermined number is generally fixedly mounted on lamp plate by existing lamps and lanterns, later by lamp plate Be mounted in shell, in this way, the brightness of existing lamps and lanterns be it is fixed, to adjust the brightness of existing lamps and lanterns, it usually needs installation Control device, for controlling the operating power of LED light emitting component, e.g., by control lead to LED light emitting component electric current or Voltage swing, to reach the problem of controlling the brightness of LED light emitting component, however, can be improved by additionally installation control device existing There is the cost of lamps and lanterns.
Also, existing lamps and lanterns are generally used for playing illuminating effect, generally can not play ventilation and absorb discharge exhaust gas Effect, need that exhaust fan additionally is installed.
Summary of the invention
Based on this, it is necessary to it is good and set without using control device, and by exhausting to provide a kind of brightness control effect It is standby to be connected to ventilation hole, negative pressure can be generated in the neighboring area of the illuminated lamps and lanterns of module, and then module can be made to illuminate Formula lamps and lanterns can have ventilation and absorb the effect of discharge exhaust gas, be more advantageous to discharge air cleaning, and can also play one The illuminated lamps and lanterns of the module of fixed heat spreading function.
A kind of illuminated lamps and lanterns of module, comprising:
Lamp plate,
Removable component, the removable component include multiple dismounting mould groups, and each dismounting mould group is arranged at intervals at the lamp On the one side of plate, each dismounting mould group includes that fixed column and dismounting ring, each fixed column are arranged at intervals at the lamp On the one side of plate, each dismounting ring one-to-one correspondence activity is placed on outside a fixed column；
Light fixture, the light fixture include multiple illuminating modules, each illuminating module be arranged in a one-to-one correspondence in On the one dismounting ring, each illuminating module includes multiple LED light emitting components, each illuminating module it is each described LED light emitting component is arranged at intervals on the corresponding dismounting ring,
Heat sink, the heat sink are attached on one side of the lamp plate far from the removable component；And
Ventilation component, the ventilation component include ventilation plate body and exhaust equipment, and the heat sink is remote One side from the removable component offers embedding slot, and the another side of the heat sink offers ventilation hole, described The first end in ventilation hole is connected to the embedding slot, and the second end in the ventilation hole is used to be connected to external environment, The ventilation plate body has hollow structure to form ventilation cavity in the ventilation plate body, and the ventilation is changed Gas plate body is at least partly embedded in the embedding slot, the ventilation plate body cavity respectively with the ventilation hole and Exhaust equipment connection.
The dismounting ring has annular structure in one of the embodiments,.
The fixed column is provided with reinforcing rib in one of the embodiments, the extending direction of the reinforcing rib with it is described The extending direction of fixed column is identical, and the dismounting ring offers sliding groove, and the reinforcing rib is at least partly embedded at the sliding In slot.
The fixed column has cylindrical-shaped structure in one of the embodiments,.
In one of the embodiments, the diameter of the fixed column from close to the lamp plate to far from the lamp plate direction It is gradually reduced, the dismounting ring is mutually attached with the lamp plate.
The another side of the heat sink offers multiple ventilation holes, each institute in one of the embodiments, Ventilation hole is stated to be arranged around the edge of the heat sink.
The second end in the ventilation hole runs through the lamp plate in one of the embodiments,.
The removable component of the above-mentioned illuminated lamps and lanterns of module includes multiple dismounting mould groups, each dismounting mould group include fixed column and Ring is dismounted, each dismounting ring one-to-one correspondence activity is placed on outside a fixed column, is more easily torn open so as to make to dismount ring Dress operates, and needs how many dismounting rings, then installs how many dismounting rings, the luminous first device of the LED so as to control corresponding number Part executes light emission operation, and then can be realized the effect of brightness control, and without installing control device.Also, ventilation group Part includes ventilation plate body and exhaust equipment, and heat sink offers embedding slot far from the one side of removable component, heat sink Another side offers ventilation hole, and the first end in ventilation hole is connected to embedding slot, and the second end in ventilation hole is used It being connected in external environment, ventilation plate body has hollow structure to form ventilation cavity in ventilation plate body, Ventilation plate body is at least partly embedded in embedding slot, and ventilation plate body cavity is set with ventilation hole and exhausting respectively The second end of standby connection, ventilation hole runs through lamp plate, and is connected to external environment, in this way, logical by opening up on heat sink Wind air vent, and be connected to by exhaust equipment with ventilation hole, it can be generated in the neighboring area of the illuminated lamps and lanterns of module Negative pressure, and then the illuminated lamps and lanterns of module can be enable to have ventilation and absorb the effect of discharge exhaust gas, it is more advantageous to discharge Air cleaning, and certain heat spreading function can also be played.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the illuminated lamps and lanterns of module of an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another angle of the illuminated lamps and lanterns of module shown in FIG. 1；
Fig. 3 is the structural schematic diagram of the illuminated lamps and lanterns of module of another embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the illuminated lamps and lanterns of module of another embodiment of the present invention；
Fig. 5 is enlarged drawing of the illuminated lamps and lanterns of module shown in Fig. 4 at A；
Fig. 6 is the structural schematic diagram of the illuminated lamps and lanterns of module of another embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the heat transfer transition apparatus of an embodiment of the present invention；
Fig. 8 is the partial structural diagram of heat transfer transition apparatus shown in Fig. 7；
Fig. 9 is the structural schematic diagram of another angle of heat transfer transition apparatus shown in Fig. 7.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more Any and all combinations of relevant listed item.
In one embodiment, a kind of illuminated lamps and lanterns of module, comprising: lamp plate, removable component, the removable component include more A dismounting mould group, each dismounting mould group are arranged at intervals on the one side of the lamp plate, and each dismounting mould group includes solid Fixed column and dismounting ring, each fixed column are arranged at intervals on the one side of the lamp plate, and each dismounting ring corresponds Activity is placed on outside a fixed column；Light fixture, the light fixture include multiple illuminating modules, each luminous mould Group is arranged in a one-to-one correspondence on a dismounting ring, and each illuminating module includes multiple LED light emitting components, each described Each LED light emitting component of illuminating module is arranged at intervals on the corresponding dismounting ring, heat sink, the heat sink patch It invests on one side of the lamp plate far from the removable component；And ventilation component, the ventilation component include logical Wind ventilation plate body and exhaust equipment, the heat sink offer embedding slot, the heat dissipation far from the one side of the removable component The another side of plate offers ventilation hole, and the first end in the ventilation hole is connected to the embedding slot, the ventilation For the second end of air vent for being connected to external environment, the ventilation plate body has hollow structure in the ventilation Ventilation cavity is formed in plate body, the ventilation plate body is at least partly embedded in the embedding slot, and the ventilation is changed Gas plate body cavity is connected to the ventilation hole and exhaust equipment respectively.
Referring to Fig. 1, the illuminated lamps and lanterns 10 of module include lamp plate 100, removable component 200, light fixture 300 and heat sink 400, heat sink 400 is set on lamp plate 100, and the heat on lamp plate 100 is quick and is transferred on heat sink 400 in time.It tears open Arrangement 200 is mounted on lamp plate 100, and light fixture 300 is set on removable component 200, generation when light fixture 300 shines Heat be transferred on removable component 200 first, be transferred on lamp plate 100, be finally transferred on heat sink 400 again again later.
Referring to Fig. 1, removable component 200 includes multiple dismounting mould groups 210, each mould group 210 that dismounts is arranged at intervals at lamp plate On 100 one side, each dismounting mould group 210 includes that fixed column 211 and dismounting ring 212, each fixed column 211 are arranged at intervals at lamp On the one side of plate 100, in such manner, it is possible to fix fixed column 211 with 100 phase of lamp plate, each 212 one-to-one correspondence of dismounting ring activity It is placed on outside a fixed column 211, in such manner, it is possible to make to dismount the more convenient carry out disassembling operations of ring 212, i.e., by installation dismounting ring 212 When, directly will dismounting ring 212 when being caught in fixed column 211, with regard to achievable disassembly when extraction, for example, the removable component Including multiple dismounting mould groups, each dismounting mould group is arranged at intervals on the one side of the lamp plate, each dismounting mould group It is placed on outside the fixed column including fixed column and dismounting ring, the dismounting ring activity, and each dismounting mould group is described Fixed column is arranged at intervals on the one side of the lamp plate；In this way, adjustment can be corresponded in the quantity of dismounting ring 212, that is, need How many dismounting rings 212 then install how many dismounting rings 212.
In one embodiment, the dismounting ring has annular structure；For another example, the fixed column is provided with reinforcing rib, institute The extending direction for stating reinforcing rib is identical as the extending direction of the fixed column, and the dismounting ring offers sliding groove, the reinforcement Muscle is at least partly embedded in the sliding groove；For another example, the fixed column has cylindrical-shaped structure；For another example, the fixed column From being gradually reduced close to the lamp plate to the direction far from the lamp plate, the dismounting ring mutually attaches diameter with the lamp plate；Again Such as, the dismounting ring interference is placed on outside the fixed column, utilizes the inner sidewall of the dismounting ring and the outside of the fixed column The frictional force that wall generates, for making the dismounting ring be fixed on the fixed column.
Referring to Fig. 1, light fixture 300 includes multiple illuminating modules 310, each illuminating module 310 is arranged in a one-to-one correspondence In one dismounting ring 212 on, each illuminating module 310 include multiple LED light emitting components 311, each illuminating module 310 it is each LED light emitting component 311 is arranged at intervals on corresponding dismounting ring 212, the member for example, each LED of each illuminating module 310 shines Device 311 is on the edge for being set to corresponding dismounting ring 212, to install the LED light emitting component.
For example, the one side of the lamp plate towards the dismounting ring is provided with the first conductive contact film, the dismounting ring court To the one side of lamp plate be provided with the second conductive contact film, the dismounting ring is additionally provided with circuit board, the circuit board and institute State the electric connection of the second conductive contact film, the circuit board and the light fixture are electrically connected, the illuminating module with it is described Circuit board is electrically connected, when the dismounting ring is mounted on the lamp plate, i.e., when the dismounting ring is bonded with the lamp plate, First conductive contact film and second conductive contact film are electrically connected, and for powering to the illuminating module, are made described Illuminating module executes normal light emission operation.
It needs to carry out brightness by control device it should be noted that opposite conventional lamp LED light emitting component is fixed The problem of control, the removable component 200 of the above-mentioned illuminated lamps and lanterns 10 of module include multiple dismounting mould groups 210, each dismounting mould group 210 are placed on outside a fixed column 211 including fixed column 211 and dismounting ring 212, each 212 one-to-one correspondence activity of dismounting ring, thus Dismounting ring 212 can be made more easily to carry out disassembling operations, need how many dismounting rings 212, then how many dismounting rings are installed 212, light emission operation is executed so as to control the LED light emitting component 311 of corresponding number, and then can be realized brightness control Effect, and without installing control device.
Also referring to Fig. 1 and Fig. 2, heat sink 400 is attached on one side of the lamp plate 100 far from removable component 200, is dissipated Hot plate 400 is used to be attached to external mounting bracket far from the one side of lamp plate 100, and e.g., the heat sink is far from the lamp The one side of plate is mounted on heat transfer transition apparatus for attaching, and the heat on heat sink 400 can be quick and be pacified in time Bracket is filled, if heat is absorbed by heat transfer transition apparatus, so that preferable heat spreading function is played, and in the process, heat sink 400 As transition member of conducting heat and/or radiate, the heat dissipation load undertaken is smaller, therefore, the illuminated lamps and lanterns 10 of module can be made real The design effect of existing small size and lighting, and can also have preferable heat dissipation performance.For example, the mounting bracket includes passing Heat transition device, with preferable heat dissipation performance；Certainly, mounting bracket may be indoor smallpox main structure or wall Wall can be selected flexibly according to the actual situation.
Since the heat dissipation load that the heat sink undertakes is lighter, need to carry out auxiliary heat dissipation by external mounting bracket, In order to install the heat sink with external mounting bracket, and the heat sink can be played preferably Buffer function, for example, referring to Fig. 3, the illuminated lamps and lanterns of the module further include snap-fit mounting assembly 500, snap-fit Component 500 includes fixinig plate 510, threaded fastener 520 and snap-fit part 530, and the side edge of the heat sink offers Bolt apertures, the fixinig plate, which offers, keeps away a hole, and the fixinig plate is set in the side edge of the heat sink, described to be spirally connected Hole aligns with a hole of keeping away, threaded fastener sequence wear it is described keep away a hole and the bolt apertures, the screw thread is tight One end of firmware is spirally connected with the heat sink, and the other end of the threaded fastener is mutually fixed with the fixinig plate, the elasticity Adapter includes weld part, elastic portion and attaching portion, and the first end of the weld part is welded on the fixinig plate, the welding The second end in portion and the first end of the elastic portion are mutually fixed, and the second end of the elastic portion is mutually fixed with the attaching portion, institute It states and offers mounting hole in attaching portion, in this way, by the way that attaching portion to be attached on outside support, and using fixed link across described The heat sink can be preferably fixed in external mounting bracket, so as to preferably make the heat dissipation by mounting hole Plate is installed with external mounting bracket, and can also be played preferable buffering to the heat sink by snap-fit part and be made With.
For example, the snap-fit part has serpentine structure；For another example, the connection position of the weld part and the elastic portion The place of setting offers bit-avoiding slot；For another example, elastic portion is provided at the weld part and the link position of the elastic portion；For another example, institute Fixinig plate is stated with rectangular parallelepiped structure；For another example, the attaching portion has rectangular parallelepiped structure；For another example, the attaching portion with it is described solid Stator is perpendicular, in such manner, it is possible to better play buffer function, and overall structure stability is higher.
It is appreciated that existing lamps and lanterns are generally used for playing illuminating effect, ventilation generally can not be played and absorb discharge The effect of exhaust gas needs additionally to install exhaust fan, in order to enable the illuminated lamps and lanterns of the module to have ventilation and absorb row The effect of exhaust gas out, for example, referring to Figure 4 together and Fig. 5, the illuminated lamps and lanterns of module further include ventilation component 600, Ventilation component 600 includes ventilation plate body 610 and exhaust equipment (not shown), and the heat sink is far from the dismounting group The one side of part offers embedding slot, and the another side of the heat sink 400 offers ventilation hole 410, and the ventilation is changed The first end of stomata is connected to the embedding slot, and the second end in the ventilation hole is described logical for being connected to external environment Wind ventilation plate body has hollow structure to form ventilation cavity, the ventilation plate body in the ventilation plate body At least partly in the embedding slot, the ventilation plate body cavity is set with the ventilation hole and exhausting respectively The second end of standby connection, the ventilation hole 410 runs through the lamp plate 100, and is connected to external environment, in this way, by Ventilation hole 410 is opened up on the heat sink 400, and is connected to by the exhaust equipment with ventilation hole 410, it can Negative pressure is generated in the neighboring area of the illuminated lamps and lanterns of the module, and then it is logical that the illuminated lamps and lanterns of the module can be enable to have Wind and the effect for absorbing discharge exhaust gas, are more advantageous to discharge air cleaning, and can also play certain heat spreading function.
For example, the another side of the heat sink offers multiple ventilation holes, each ventilation hole is enclosed It is arranged around the edge of the heat sink, in such manner, it is possible to further increase the intensity of vented exhaust.
It should be noted that i.e. lamp plate and radiator rises since the illuminated lamp deflection of the module is in portable design The effect radiated to transition is more to radiate by external mounting bracket, therefore, it is illuminated to will lead to the module The mechanical strength of lamps and lanterns is poor, in order to improve the mechanical strength and structural stability of the illuminated lamps and lanterns of the module, and improves Strong degree of the illuminated lamp installation of module in external mounting bracket, for example, referring to Fig. 6, the module is illuminated Lamps and lanterns further include structural strengthening component 700, and the structural strengthening component 700 includes fixed plate body 710, installation plate body 720, reinforces Gusset 730, the first screw 740 and the second screw 750, the side edge of the heat sink offer screw hole, the fixed plate body It is attached in the side edge of the heat sink, the fixed plate body offers First Transition hole, the First Transition hole and institute Screw hole is stated to align, first screw sequence wears the First Transition hole and the screw hole, first screw respectively with The heat sink and the fixed plate body bolt, the installation plate body are vertically installed on the fixed plate body, the reinforcement Gusset is mutually fixed with the fixed plate body and the installation plate body respectively, and the installation plate body offers the second transitional pore, described Second screw wears second transitional pore, and second screw and the installation plate body bolt, in this way, passing through setting institute State structural strengthening component 700, and fixed plate body 710, installation plate body 720, reinforcement gusset 730, the first screw 740 and the second spiral shell The mechanical strength and structural stability that nail 750 can be improved the illuminated lamps and lanterns of the module, and to improve the module illuminated Strong degree of the lamp installation in external mounting bracket.
For example, the reinforcement gusset have triangular structure, it is described reinforce gusset two of them side respectively with it is described Fixed plate body and the installation plate body are mutually fixed；For another example, the fixed plate body has rectangular parallelepiped structure；For another example, the mounting plate Body has rectangular parallelepiped structure；For another example, the fixed plate body offers multiple screw holes, and the fixed plate body offers multiple institutes First Transition hole is stated, the structural strengthening component is provided with multiple first screws, and each first screw corresponds Wear a First Transition hole and a screw hole；For another example, the installation plate body offers multiple second transitional pores, institute It states structural strengthening component and is provided with multiple second screws, each screw one-to-one correspondence wears second transition Hole；For another example, the extending direction of first screw and the extending direction of second screw are perpendicular, in this way, passing through optimization institute The structure, connection relationship and positional relationship for stating each component of structural strengthening component can further increase the illuminated lamp of the module The structural strength of tool.
It should be noted that due to the portable design of the illuminated lamp deflection of the module, i.e., the described illuminated lamp of module The heat sink of tool undertakes lesser heat dissipation load, and the heat sink is placed on outside, i.e., directly contacts with air, described to dissipate Hot plate is directly assembled with external mounting bracket, and e.g., the heat sink is directly assembled with heat transfer transition apparatus, is utilized Heat transfer transition apparatus carrys out shared heat dissipation load, therefore, it is necessary to ensure that the heat transfer transition apparatus can be with heat sink more It is assembled well, and ensures that the heat transfer transition apparatus can quickly and in time carry out the heat on the heat sink It absorbs, to ensure that the temperature on the heat sink reaches lower level, for maintaining the normal work of the LED light emitting component Make performance.
In order to ensure the heat transfer transition apparatus can preferably be assembled with heat sink, and ensure described conducted heat Cross device can quickly and the heat on the heat sink is absorbed in time, to ensure that the temperature on the heat sink reaches To lower level, for maintaining the normal working performance of the LED light emitting component, for example, the illuminated lamps and lanterns of the module It further include that heat transfer transition apparatus and waste heat huge profit device, the heat transfer transition apparatus are connect with the heat sink, the heat transfer Transition apparatus connects for absorbing the heat from the heat sink, the waste heat huge profit device and the heat transfer transition apparatus It connects, the waste heat huge profit is lost for that will carry out from the heat transfer transition apparatus with device；The heat transfer transition apparatus includes Conduct heat case, medium circulation effuser, medium circulation return pipe and multiple semiconductor chilling plates, and the heat transfer case includes heat transfer plate Body, frame, encapsulation plate body and multiple contact partitions；The frame has hollow structure, and the first end of the frame offers the One opening, the second end of the frame offer the second opening, and the first end of the heat transfer plate body and the frame is mutually fixed, institute It states heat transfer plate body to cover in first opening, for closing first opening, the encapsulation plate body and the frame Second end is mutually fixed, and the encapsulation plate body covers in second opening, for closing second opening, the heat transfer plate Body, the encapsulation plate body and the frame connect and are formed medium accommodating cavity, are equipped with heat transfer in the medium accommodating cavity body Medium, the heat transfer medium are contacted with the inner sidewall of the heat transfer plate body respectively, and each contact baffle interval is set to described Encapsulate plate body inner sidewall on, each contact partition is placed in the medium accommodating cavity body, and each contact partition and The heat transfer medium contacts, each contact partition offer recirculation hole respectively；It is described heat transfer plate body far from the frame one Side offers multiple mounting grooves, and each semiconductor chilling plate one-to-one correspondence is placed in a mounting groove, Mei Yisuo The two sides for stating semiconductor chilling plate are respectively arranged with cold and hot end, and the hot end one of each semiconductor chilling plate is a pair of The bottom of mounting groove described in Ying Yiyu mono- is mutually fixed, the cold end of each semiconductor chilling plate respectively with the heat sink It is mutually fixed, interval is provided between the heat transfer plate body and the heat sink, the edge of the heat transfer plate body has inserting groove； The both ends of the encapsulation plate body offer medium circulation tap hole and medium circulation inflow hole, the medium circulation tap hole respectively And the medium circulation inflow hole is connected to medium accommodating cavity respectively, the medium circulation effuser and the medium follow Loopback flow tube is individually fixed on the encapsulation plate body, and the first end and the medium circulation of the medium circulation effuser flow out Hole connection, the first end of the medium circulation return pipe are connected to the medium circulation inflow hole；The waste heat huge profit device Including waste heat huge profit device noumenon, medium circulation access tube and medium circulation discharge pipe, the waste heat huge profit device noumenon With by thermal contact portion, the inside by thermal contact portion offers heat release cavity, and the surface by thermal contact portion is arranged By thermal interface, the first end of the first end of the medium circulation access tube and the medium circulation discharge pipe respectively with the heat Cavity connection is discharged, the second end of the medium circulation access tube is connected to the second end of the medium circulation effuser, described The second end of medium circulation discharge pipe is connected to the second end of the medium circulation return pipe；The heat transfer medium sequence recycle stream Through medium accommodating cavity, the medium circulation effuser, the medium circulation access tube, the heat release cavity, described Medium circulation discharge pipe, the medium circulation return pipe.
In order to which preferably the illuminated lamps and lanterns of above-mentioned module are explained, for example, referring to Figure 7 together and Fig. 9, institute Stating the illuminated lamps and lanterns of module further includes heat transfer transition apparatus 800 and waste heat huge profit device, the heat transfer transition apparatus with it is described Heat sink connection, the heat transfer transition apparatus is for absorbing the heat from the heat sink, when the illuminated lamps and lanterns of the module The LED light emitting component shine generate heat when, LED light emitting component shine generate heat can promptly by it is described dissipate Hot plate absorbs, and the heat of own absorption can quickly and be in time transferred to heat transfer transition apparatus 800 by the heat sink, and then right The heat sink plays cooling, i.e. heat dissipation effect.The waste heat huge profit device is connect with the heat transfer transition apparatus, described useless Using device for that will be scattered and disappeared or be absorbed from the heat transfer transition apparatus, the waste heat huge profit device can incite somebody to action thermogravimetric These waste heat re-use.
Referring to Figure 7 together to Fig. 9, in the illuminated lamps and lanterns of the module of an embodiment, heat transfer transition apparatus 800 is wrapped Include heat transfer case 810, medium circulation effuser 820, medium circulation return pipe 830 and multiple semiconductor chilling plates 840, medium circulation Effuser 820 and medium circulation return pipe 830 are connected to heat transfer case 810 respectively, and each semiconductor chilling plate 840 is mounted on heat transfer case On 810.
Referring to Figure 7 together to Fig. 9, the case 810 that conducts heat includes heat transfer plate body 811, frame 812, encapsulation plate body 813 and multiple Partition 814 is contacted, heat transfer plate body 811 and encapsulation plate body 813 are mutually fixed with the both ends of frame 812 respectively, and contact partition 814 is arranged In heat transfer plate body 811 on, and contact partition 814 be located in frame 812.
Referring to Fig. 8, frame 812 has hollow structure, the first end of frame 812 offers the first opening, the frame Second end offer the second opening, heat transfer plate body 811 and the first end of frame 812 are mutually fixed, and the plate body 811 that conducts heat covers at institute It states in the first opening, for heat transfer plate body 811 for closing first opening, encapsulation plate body 813 and the second end of frame 812 are mutually solid Fixed, encapsulation plate body 813 covers in second opening, and encapsulation plate body 813 is for closing second opening, and conduct heat plate body 811, it encapsulates plate body 813 and frame 812 connects and formed medium accommodating cavity 815, be equipped with heat transfer in medium accommodating cavity 815 Medium, heat transfer medium are contacted with the inner sidewall of heat transfer plate body 811 respectively, in this way, the heat on heat transfer plate body 811 can be by medium It accommodates the heat transfer medium accommodated in cavity 815 to absorb, for reducing the heat on heat transfer plate body 811, and then described dissipate can be made Heat on hot plate is continuously transferred on the heat transfer plate body.
Referring to Fig. 8, respectively contact partition 814 be arranged at intervals at it is described encapsulation plate body inner sidewall on, it is each it is described contact every Plate is placed in the medium accommodating cavity body, and each contact partition and the heat transfer medium contacts, each contact partition Recirculation hole is offered respectively, it, can by the way that each contact partition is arranged and opens up recirculation hole on each contact partition Heat exchange degree is improved, to improve heat exchange efficiency；The heat-conducting medium is the biggish fluids of thermal coefficients such as conduction oil.
For example, heat transfer plate body 811 and contact partition 814 are prepared using heat-conducting, have preferable thermally conductive and pass The heat absorbed from the heat sink quickly and can be transferred on the heat transfer medium by hot property in time；Institute It states frame and the encapsulation plate body to be prepared using heat-insulated material, can play the role of reducing thermal loss, so that heat It is collected on the heat transfer medium.
Referring to Fig. 7, heat transfer plate body 811 offers multiple mounting groove 811a far from the one side of frame 812, each half is led The one-to-one correspondence of body cooling piece 840 is placed in a mounting groove 811a, and the two sides of each semiconductor chilling plate are respectively arranged with Cold and hot end, it is mutually solid with the bottom of a mounting groove that the hot end of each semiconductor chilling plate corresponds one Fixed, the cold end of each semiconductor chilling plate is mutually fixed with the heat sink respectively, and the heat transfer plate body is dissipated with described Interval is provided between hot plate, in this way, the cold end of the semiconductor chilling plate absorbs heat from the heat sink, it is described The hot end of semiconductor chilling plate transfers heat on the heat transfer plate body, in the process, the semiconductor chilling plate Play the role of " heat pump ".
Referring to Fig. 8, the edge of heat transfer plate body 811 has inserting groove 811b, for example, the heat sink is provided with buckle Portion, inserting groove 811b so, it is possible to ensure the heat transfer transition apparatus and heat sink for fastening with clamping part described in heat sink It is preferably assembled, and assembly and disassembly operation is simpler convenient.
Fig. 9 is please referred to, the both ends of encapsulation plate body 813 offer medium circulation tap hole and medium circulation inflow hole respectively, The medium circulation tap hole and the medium circulation inflow hole are connected to medium accommodating cavity respectively, medium circulation outflow Pipe 820 and medium circulation return pipe 830 are individually fixed on encapsulation plate body 813, the first end of medium circulation effuser 820 and institute Give an account of matter circulation tap hole connection, the first end of medium circulation return pipe 830 is connected to the medium circulation inflow hole, temperature compared with The high heat transfer medium is flowed out from the medium circulation effuser 820, after flowing through the waste heat huge profit device, and institute State heat transfer medium heat utilized by reabsorption after, the lower heat transfer medium of temperature is returned by medium circulation return pipe 830 again It is flow to the medium accommodating cavity, and reuptakes the heat on the heat transfer plate body, in such manner, it is possible to realize circulation cooling Effect, for ensure the heat transfer transition apparatus can quickly and the heat on the heat sink is absorbed in time, To ensure that the temperature on the heat sink reaches lower level, for maintaining the normal work of the LED light emitting component Energy.
It should be noted that the thermal efficiency of the semiconductor chilling plate is lower, that is to say, that the semiconductor chilling plate exists The cold end quickly generates cryogenic effect, when for absorbing the heat of the heat sink, meanwhile, the semiconductor chilling plate is in institute A large amount of heat can be generated by stating hot end, the heat that these heat a part are absorbed from the cold end from the heat sink, in addition Most Joule heat generated when working from the semiconductor chilling plate itself, it is multiple since the resistance of semiconductor is larger The semiconductor chilling plate at work, can generate a large amount of heat, in this way, being transferred on the heat transfer plate body from the hot end Heat it is more, therefore, in field of illuminating lamps, usually will not using the semiconductor chilling plate as thermal component, one As improved from the material of heat sink and the structure of heat sink, certainly, there are also the biggish lamps and lanterns meetings of cooling requirements It is forced to select semiconductor chilling plate, but can also generate a large amount of waste heat simultaneously, and will use fan etc. under radiating requirements logical Wind apparatus radiates to hot end, that is to say, that in the design of the lamps and lanterns of general radiating requirements, i.e., in the technical field of lamps and lanterns In, the radiating requirements of the illuminated lamps and lanterns of the module of the application are moderate, and those of ordinary skill will not use semiconductor chilling plate conduct Thermal component, but the application by waste heat on the semiconductor chilling plate and the heat sink by collecting and recycling benefit With overcoming the industry prejudice of the art, both improve heat dissipation effect, while also utilizing waste heat, it is ensured that described to dissipate The hot plate moment is in low-temperature condition, the heat sink can be made to realize small size and portable design, so that described The overall structure of the illuminated lamps and lanterns of module is lighter.
It should be pointed out that in order to preferably utilize the heat transfer medium entrained by waste heat, an embodiment it is described In the illuminated lamps and lanterns of module, waste heat huge profit includes that waste heat huge profit device noumenon, medium circulation access tube and medium follow with device Ring discharge pipe, waste heat huge profit device noumenon have by thermal contact portion, and the inside by thermal contact portion offers heat release chamber Body, the surface by thermal contact portion are arranged by thermal interface, and the first end of the medium circulation access tube and the medium follow The first end of ring discharge pipe is connected to the heat release cavity respectively, the second end of the medium circulation access tube and the medium Recycle the second end connection of effuser, the second end of the second end of the medium circulation discharge pipe and the medium circulation return pipe Connection, the heat transfer medium sequence circulation flow through medium the accommodating cavity, the medium circulation effuser, the medium circulation Access tube, heat the release cavity, the medium circulation discharge pipe, the medium circulation return pipe, in this way, the heat transfer medium Entrained waste heat can be absorbed by described by thermal contact portion, for so that the temperature by thermal interface rises, and then quilt It recycles.
In one embodiment, the waste heat huge profit device further includes the pump housing, and the pump housing is set to the medium circulation On access tube or the medium circulation discharge pipe, driving force is provided for the flowing to the heat transfer medium.
In one embodiment, the waste heat huge profit is closestool with device, and the waste heat huge profit is closestool sheet with device noumenon Body, described by thermal contact portion is toilet seat, and the heat release cavity is opened in the toilet seat, and described by thermal interface is institute The surface of toilet seat is stated, the illuminated lamp installation of module, when people go to the toilet, can be opened in advance on the ceiling of lavatory The illuminated lamps and lanterns of module, at this point, the LED light emitting component, which shines, generates heat, the heat transfer medium is by the heat dissipation The heat of heat and the semiconductor refrigerating on piece on plate is carried to the toilet seat, for carrying out to the toilet seat Heating, it is warmer when the surface of the physical feeling of user and toilet seat contacts, it is important to note that the heat transfer is situated between Matter is carried the heat of heat and the semiconductor refrigerating on piece on the heat sink by the heat transfer medium, and passes through institute When stating toilet seat, the toilet seat can be more leniently heated, temperature is convenient, and heating is milder, relatively traditional Heating toilet needs to be arranged electric calorifie installation and temperature control equipment, and the waste heat huge profit is more energy saving with device, heating operation It is more mild, meet the energy-efficient theory of today's society advocating environment protection.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, all should be considered as described in this specification.
Only several embodiments of the present invention are expressed for embodiment described above, and the description thereof is more specific and detailed, but It cannot be construed as a limitation to the scope of the present invention.It should be pointed out that for the ordinary skill people of this field For member, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to of the invention Protection scope.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.

Claims (7)

1. a kind of illuminated lamps and lanterns of module characterized by comprising
Lamp plate,
Removable component, the removable component include multiple dismounting mould groups, and each dismounting mould group is arranged at intervals at the lamp plate On one side, each dismounting mould group includes that fixed column and dismounting ring, each fixed column are arranged at intervals at the lamp plate On one side, each dismounting ring one-to-one correspondence activity is placed on outside a fixed column；
Light fixture, the light fixture include multiple illuminating modules, and each illuminating module is arranged in a one-to-one correspondence in an institute It states on dismounting ring, each illuminating module includes multiple LED light emitting components, each LED of each illuminating module Light emitting component is arranged at intervals on the corresponding dismounting ring,
Heat sink, the heat sink are attached on one side of the lamp plate far from the removable component；And
Ventilation component, the ventilation component include ventilation plate body and exhaust equipment, and the heat sink is far from institute The one side for stating removable component offers embedding slot, and the another side of the heat sink offers ventilation hole, the ventilation The first end of air vent is connected to the embedding slot, and the second end in the ventilation hole is described for being connected to external environment Ventilation plate body has hollow structure to form ventilation cavity, the ventilation plate in the ventilation plate body Body is at least partly embedded in the embedding slot, the ventilation plate body cavity respectively with the ventilation hole and exhausting Equipment connection；
Snap-fit component, the snap-fit component include fixinig plate, threaded fastener and snap-fit part, the heat sink Side edge offer bolt apertures, the fixinig plate, which offers, keeps away a hole, and the fixinig plate is set to the side of the heat sink On the edge of side, the bolt apertures align with a hole of keeping away, and threaded fastener sequence wears the hole and described kept away Bolt apertures, one end of the threaded fastener are spirally connected with the heat sink, the other end of the threaded fastener and the fixation Piece is mutually fixed, and the snap-fit part includes weld part, elastic portion and attaching portion, and the first end of the weld part is welded in described On fixinig plate, the second end of the weld part and the first end of the elastic portion are mutually fixed, the second end of the elastic portion and institute It states attaching portion mutually to fix, offers mounting hole in the attaching portion；The snap-fit part has serpentine structure；The welding Bit-avoiding slot is offered at the link position of portion and the elastic portion；The fixinig plate has rectangular parallelepiped structure；The attaching portion tool There is rectangular parallelepiped structure；The attaching portion and the fixinig plate are perpendicular；
Conduct heat transition apparatus, and the heat transfer transition apparatus includes conduct heat case, medium circulation effuser, medium circulation return pipe and more A semiconductor chilling plate, medium circulation effuser and medium circulation return pipe are connected to heat transfer case respectively, each semiconductor chilling plate It is mounted on heat transfer case；The case that conducts heat includes heat transfer plate body, frame, encapsulation plate body and multiple contact partitions, conduct heat plate body and encapsulation Plate body is mutually fixed with the both ends of frame respectively, and contact partition is set on heat transfer plate body, and is contacted partition and be located in frame；Frame With hollow structure, the first end of frame offers the first opening, and the second end of the frame offers the second opening, heat transfer plate The first end of body and frame is mutually fixed, and heat transfer plate body covers in first opening, and heat transfer plate body is for closing described first The second end of opening, encapsulation plate body and frame is mutually fixed, and encapsulation plate body covers in second opening, and encapsulation plate body is for sealing Second opening is closed, heat transfer plate body, encapsulation plate body and frame connect and formed medium accommodating cavity, hold in medium accommodating cavity body It is equipped with heat transfer medium, heat transfer medium is contacted with the inner sidewall of heat transfer plate body respectively；
Heat transfer plate body offers multiple mounting grooves far from the one side of frame, and each semiconductor chilling plate one-to-one correspondence is placed in one In mounting groove, the two sides of each semiconductor chilling plate are respectively arranged with cold and hot end, each semiconductor chilling plate Bottom of the hot end correspondingly with a mounting groove mutually fix, the cold end of each semiconductor chilling plate It is mutually fixed with the heat sink respectively, is provided with interval between the heat transfer plate body and the heat sink.
2. the illuminated lamps and lanterns of module according to claim 1, which is characterized in that the dismounting ring has annular structure.
3. the illuminated lamps and lanterns of module according to claim 1, which is characterized in that the fixed column is provided with reinforcing rib, institute The extending direction for stating reinforcing rib is identical as the extending direction of the fixed column, and the dismounting ring offers sliding groove, the reinforcement Muscle is at least partly embedded in the sliding groove.
4. the illuminated lamps and lanterns of module according to claim 1, which is characterized in that the fixed column has cylindrical-shaped structure.
5. the illuminated lamps and lanterns of module according to claim 4, which is characterized in that the diameter of the fixed column is by close to described Lamp plate is gradually reduced to the direction far from the lamp plate, and the dismounting ring is mutually attached with the lamp plate.
6. the illuminated lamps and lanterns of module according to claim 1, which is characterized in that the another side of the heat sink offers Multiple ventilation holes, each ventilation hole are arranged around the edge of the heat sink.
7. the illuminated lamps and lanterns of module according to claim 1, which is characterized in that the second end in the ventilation hole runs through The lamp plate.
CN201611079613.4A 2016-11-29 2016-11-29 The illuminated lamps and lanterns of module Active CN106439525B (en)

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CN102313186A (en) * 2010-06-29 2012-01-11 富士迈半导体精密工业（上海）有限公司 Indoor illumination device

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CN201401700Y (en) * 2009-03-17 2010-02-10 和谐光电科技（泉州）有限公司 LED light source module with internal power supply and closed outdoor lighting lamp
US20110080746A1 (en) * 2009-10-07 2011-04-07 Patti Anthony G Lighting enclosure system
US10113734B2 (en) * 2014-06-27 2018-10-30 Key Technology, Inc. Light source for a sorting apparatus

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CN102313186A (en) * 2010-06-29 2012-01-11 富士迈半导体精密工业（上海）有限公司 Indoor illumination device
CN201787405U (en) * 2010-09-25 2011-04-06 深圳市三能低碳照明有限公司 LED lamp capable of replacing light source module

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