CN106413271A - 电路基板及其制作方法、电路板和电子装置 - Google Patents
电路基板及其制作方法、电路板和电子装置 Download PDFInfo
- Publication number
- CN106413271A CN106413271A CN201510466182.6A CN201510466182A CN106413271A CN 106413271 A CN106413271 A CN 106413271A CN 201510466182 A CN201510466182 A CN 201510466182A CN 106413271 A CN106413271 A CN 106413271A
- Authority
- CN
- China
- Prior art keywords
- substrate
- metal simple
- catalyst
- substance
- simple substance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510466182.6A CN106413271B (zh) | 2015-07-31 | 2015-07-31 | 电路基板及其制作方法、电路板和电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510466182.6A CN106413271B (zh) | 2015-07-31 | 2015-07-31 | 电路基板及其制作方法、电路板和电子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN106413271A true CN106413271A (zh) | 2017-02-15 |
CN106413271B CN106413271B (zh) | 2019-04-26 |
Family
ID=58007582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510466182.6A Active CN106413271B (zh) | 2015-07-31 | 2015-07-31 | 电路基板及其制作方法、电路板和电子装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106413271B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113926703A (zh) * | 2021-11-17 | 2022-01-14 | 陈波 | 一种电成型筛网的制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677626A (ja) * | 1992-08-25 | 1994-03-18 | Nippondenso Co Ltd | めっき回路形成方法 |
CN101228667A (zh) * | 2005-07-19 | 2008-07-23 | 住友电气工业株式会社 | 复合多孔树脂基材及其制造方法 |
CN103314135A (zh) * | 2011-01-07 | 2013-09-18 | 富士胶片株式会社 | 被镀层形成用组成物以及具有金属膜的积层体的制造方法 |
CN103392388A (zh) * | 2011-02-18 | 2013-11-13 | 富士胶片株式会社 | 多层基板的制造方法、去胶渣处理方法 |
-
2015
- 2015-07-31 CN CN201510466182.6A patent/CN106413271B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0677626A (ja) * | 1992-08-25 | 1994-03-18 | Nippondenso Co Ltd | めっき回路形成方法 |
CN101228667A (zh) * | 2005-07-19 | 2008-07-23 | 住友电气工业株式会社 | 复合多孔树脂基材及其制造方法 |
CN103314135A (zh) * | 2011-01-07 | 2013-09-18 | 富士胶片株式会社 | 被镀层形成用组成物以及具有金属膜的积层体的制造方法 |
CN103392388A (zh) * | 2011-02-18 | 2013-11-13 | 富士胶片株式会社 | 多层基板的制造方法、去胶渣处理方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113926703A (zh) * | 2021-11-17 | 2022-01-14 | 陈波 | 一种电成型筛网的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN106413271B (zh) | 2019-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102799307A (zh) | 具有射频识别的触摸传感器 | |
JP2012138017A (ja) | タッチパネル、及びこのタッチパネルを備えた表示装置 | |
CN104105350A (zh) | 选择性电镍金的方法及pcb板、装置 | |
CN102541368A (zh) | 一种电容式触控面板及其制造方法 | |
CN106201041A (zh) | 一种触摸屏制备方法 | |
CN103582285A (zh) | 一种ito导电膜汇流电极及其制作方法 | |
US9179557B2 (en) | Touch screen and method of producing the same | |
TW201635015A (zh) | 用於光刻金屬網格觸控感應器的製造之催化性光阻 | |
CN210516001U (zh) | 一种柔性透明显示屏 | |
CN104902710B (zh) | 具有二维线路结构的壳体及其制造方法 | |
CN103605448A (zh) | 一种菲林结构电容式触摸屏感应器线路图的一体成型制作方法及其制成的产品 | |
KR101771951B1 (ko) | 투명 연성회로기판 제조방법 | |
JP5815473B2 (ja) | 導電パターン形成基板の製造方法 | |
CN106413271A (zh) | 电路基板及其制作方法、电路板和电子装置 | |
CN103579173A (zh) | 半导体封装件及其制法 | |
KR101796525B1 (ko) | 터치스크린패널의 제조방법 및 이로부터 제조된 터치스크린패널 | |
CN109992163A (zh) | 触控感测模组及其制作方法以及应用其的电子装置 | |
TWI633818B (zh) | 透明電路板及其製作方法 | |
CN111475064B (zh) | 透明线圈板及其制作方法、透明电磁感应板及显示设备 | |
CN105988621A (zh) | 一种触摸屏及其制备方法 | |
CN102223764A (zh) | 软性电路板的制作方法 | |
CN111326640A (zh) | 在发光二极管载板形成开窗的方法 | |
TWI548315B (zh) | 電路基板及其製作方法、電路板和電子裝置 | |
CN102149255B (zh) | 多引线通孔的形成方法 | |
CN208569590U (zh) | 薄膜层叠结构、触控屏和触控显示装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170302 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Zhending Technology Co., Ltd. |
|
CB02 | Change of applicant information |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Applicant after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Applicant after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Applicant before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Applicant before: Peng Ding Polytron Technologies Inc |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |