CN106356422A - Substrate separation device and substrate separation method - Google Patents
Substrate separation device and substrate separation method Download PDFInfo
- Publication number
- CN106356422A CN106356422A CN201510485571.3A CN201510485571A CN106356422A CN 106356422 A CN106356422 A CN 106356422A CN 201510485571 A CN201510485571 A CN 201510485571A CN 106356422 A CN106356422 A CN 106356422A
- Authority
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- China
- Prior art keywords
- blowning installation
- air
- flow
- blowning
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 238000000926 separation method Methods 0.000 title claims abstract description 19
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 46
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 46
- 239000010703 silicon Substances 0.000 claims abstract description 46
- 238000009434 installation Methods 0.000 claims description 81
- 235000012431 wafers Nutrition 0.000 claims description 44
- 238000005204 segregation Methods 0.000 claims description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 23
- 230000001788 irregular Effects 0.000 claims description 3
- 238000007664 blowing Methods 0.000 abstract description 15
- 238000007667 floating Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000004891 communication Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A substrate separation device and a substrate separation method are provided, the substrate separation device comprises a base and two air blowing devices, the two air blowing devices are respectively arranged on two opposite sides of the base, each air blowing device is provided with at least two air outlets, the two air outlets of each air blowing device are arranged at intervals from left to right, the two air outlets of each air blowing device are used for providing two air flows, the air flow directions of the two air flows are far away from each other, and the air flow direction of the two air flows of each air blowing device is symmetrical or at least approximately symmetrical to the air flow direction of the two air flows of the other air blowing device. The present invention can separate silicon wafer effectively and maintain certain floating height without inclination to avoid sticking of silicon wafer.
Description
Technical field
The present invention relates to a kind of substrate segregation apparatuss and base plate separation method, more particularly to one kind is for dividing
Segregation apparatuss and method from silicon wafer substrate.
Background technology
At present in the manufacturing process of solaode, it is intended to for blocks of silicon wafer to be loaded into related process equipment
Carry out making when processing it will usually be blown in the both sides of silicon wafer by blowning installation, so that whole folded
Silicon wafer the top that a piece of separate with second generation, afterwards again with robotic arm draw the top
Silicon wafer, so can avoid because electrostatic or other factors produce bonding die between whole folded silicon wafer, thus anti-
The silicon wafer of second even the 3rd only being led to because of bonding die is taken up and derivative rejection tablet, rupture
Problem.
However, existing blowing method be two sidewinds directly just to the mode of blowing, this kind of mode is easily caused
The air-flow of blowout is cancelled out each other and causes the problem that silicon wafer cannot be smoothly detached to produce.If using two
Side respectively with single stock air-flow to blowing mode when, because the position of air-flow corresponds to the central authorities of silicon wafer, easily
The silicon wafer making to be brushed and floating produces the inclination situation of similar seesaw, is so also easily caused silicon wafer
Between bonding die problem generation.
Content of the invention
It is an object of the invention to provide one kind can ensure that silicon wafer efficiently separate and also can make silicon wafer tie up
Hold certain Floating Height, it is to avoid substrate segregation apparatuss and base plate separation method that silicon wafer tilts.
Substrate segregation apparatuss of the present invention, comprise: a pedestal, and two phases being located at this pedestal respectively
Blowning installation to both sides.Each blowning installation has at least two gas outlets, each blowning installation
This two gas outlets be between left and right every.Wherein, respectively this two gas outlets of this blowning installation are used for providing
Twice air-flow, the airflow direction of this twice air-flow is located remotely from each other, and this twice gas of each blowning installation
The airflow direction of stream, the airflow direction with this twice air-flow of another blowning installation is symmetrical or at least big
Cause symmetrical.
Substrate segregation apparatuss of the present invention, the quantity of the gas outlet of each blowning installation is even number and shape
Position is become to be symmetrical.
Substrate segregation apparatuss of the present invention, each blowning installation has at least two gas channels, often
This two gas channels of one blowning installation correspond in communication with this two gas outlets respectively, wherein often
The passage bearing of trend of this two gas channels of one blowning installation intersects each other.
Substrate segregation apparatuss of the present invention, this pedestal has two intervals and relatively and is respectively adjacent to this two
The side of blowning installation, described side defines one and passes through this two blowning installations and perpendicular to this two side
Bearing of trend reference direction, the airflow direction of every one air-flow with the angle of this reference direction is
15 °～30 °.
Substrate segregation apparatuss of the present invention, the airflow direction of every one air-flow and the angle of this reference direction
For 15 °～20 °.
Substrate segregation apparatuss of the present invention, the quantity of the described gas outlet of each blowning installation is more than two
Individual and be even number, the plurality of gas outlet of each blowning installation longitudinally spaced and horizontal arranged become to
Few two rows and be symmetrical each other.
Substrate segregation apparatuss of the present invention, each blowning installation have four between left and right every give vent to anger
Mouthful, it is located at the journey that the airflow direction of this two gas outlets outermost is located remotely from each other in this four gas outlets
Degree, the journey being located remotely from each other more than the airflow direction being located at this middle two gas outlets in this four gas outlets
Degree.
Substrate segregation apparatuss of the present invention, respectively this gas outlet is the elongated hole of longitudinal extension.
Substrate segregation apparatuss of the present invention, respectively this gas outlet is elongated hole, circular hole, square hole, triangle
Hole or irregular hole.
Substrate segregation apparatuss of the present invention, this pedestal is used for carrying silicon wafer.
Base plate separation method of the present invention, comprises: provides a pedestal；One folded silicon wafer is provided and is placed in
On this pedestal；There is provided two blowning installations, this two blowning installations are located at the opposite sides of this pedestal respectively,
And each blowning installation has at least two gas outlets, this two gas outlets of each blowning installation
For between left and right every wherein respectively this two gas outlets of this blowning installation are used for providing twice air-flow, this twice
The airflow direction of air-flow is located remotely from each other, and the airflow direction of this twice air-flow of each blowning installation, with
The airflow direction of this twice air-flow of another blowning installation is symmetrical or at least substantially symmetric；Separate described
Silicon wafer, wherein makes this twice air-flow of each blowning installation symmetrically and tiltedly blow in this folded silicon wafer
Top more silicon wafers side edge, with least make the top in this folded silicon wafer two panels silicon wafer each other
Separate.
Base plate separation method of the present invention, this pedestal has two intervals and relatively and is respectively adjacent to this two
The side of blowning installation, described side defines one and passes through this two blowning installations and perpendicular to this two sides
The reference direction of the bearing of trend on side, the airflow direction of every one air-flow with the angle of this reference direction is
15 °～30 °.
Base plate separation method of the present invention, the airflow direction of every one air-flow and the angle of this reference direction
For 15 °～20 °.
The beneficial effects of the present invention is: by providing a kind of substrate segregation apparatuss and method, it is mainly
Two symmetrical side of silicon wafer are made all respectively to brush with the oblique blowing gas stream of twice respectively, and what two sidewinds brushed
Mode is to be mutually symmetrical or at least substantially symmetric design each other, silicon wafer therefore can be made to efficiently separate and
Certain Floating Height can be maintained and do not tilt, to avoid silicon wafer to produce the problem of bonding die.
Brief description
Fig. 1 is the schematic top plan view of a first embodiment of the present invention；
Fig. 2 is the schematic perspective view of the blowning installation of the first embodiment of the present invention；
Fig. 3 is side schematic view when substrate in the first embodiment of the present invention is blown and separated；
Fig. 4 is the schematic top plan view of a second embodiment of the present invention；
Fig. 5 is the side schematic view of a 3rd embodiment of the present invention；
Fig. 6 is the schematic top plan view of a fourth embodiment of the present invention；
Fig. 7 is the schematic perspective view of the blowning installation of the fourth embodiment of the present invention；
Fig. 8 is the schematic top plan view of one the 5th embodiment of the present invention；And
Fig. 9 is the schematic perspective view of the blowning installation of the fifth embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail it is noted that, following
In description, similar element is to be represented with being identically numbered.
Refering to Fig. 1, Fig. 2, Fig. 3, it is the first embodiment of substrate segregation apparatuss of the present invention, wherein Fig. 1 is
The schematic top plan view of the present embodiment, Fig. 2 is the schematic perspective view of the blowning installation of the present embodiment, and Fig. 3 is this
Side schematic view when substrate in embodiment is blown and separated.This substrate segregation apparatus comprises a pedestal
2 and two blowning installations 3, this two blowning installation 3 is located at the opposite sides of this pedestal 2 respectively, and each blows
Device of air 3 has at least two gas outlets 31, this two gas outlet 31 of each blowning installation 3 be between left and right every
(can by Fig. 1,2 find out), wherein, respectively this two gas outlet 31 of this blowning installation 3 be used for providing twice air-flow
32, the airflow direction of this twice air-flow 32 is located remotely from each other, and this twice air-flow 32 of each blowning installation 3
Airflow direction, be symmetrical or at least big with the airflow direction of this twice air-flow 32 of another blowning installation 3
Cause symmetrical.And the quantity of the gas outlet 31 of each blowning installation 3 is even number and forming position is that left and right is right
Claim.In the present embodiment, described substrate such as silicon wafer 4, this pedestal 2 is used for carrying silicon wafer 4.And
And on implementing, each gas outlet 31 can correspond in communication with a gas channel 30, this gas channel
30 connection one air inlet runners 39.
In the present embodiment, the quantity of the gas outlet 31 of each blowning installation 3 is more than two and is even
Number, the plurality of gas outlet 31 of each blowning installation 3 longitudinally spaced (as Fig. 2,3) and horizontal arranged one-tenth
At least two rows and each other be symmetrical.
This pedestal 2 has two intervals relatively and is respectively adjacent to the side 21 of this two blowning installation 3, defines one and leads to
Cross this two blowning installation 3 and the reference direction 33 of the bearing of trend perpendicular to this two side 21, every one gas
The airflow direction of stream 32 can be 15 °～30 ° with the angle theta of this reference direction 33.It is preferred that every one air-flow
32 airflow direction is 15 °～20 ° with the angle theta of this reference direction 33, so that the angle of tiltedly blowing of each air-flow 32 is fitted
When good brushing effect to provide.On implementing, this two gas channels of each blowning installation 3
30 correspond in communication with this two gas outlet 31 respectively, and this two air-flows of each of which blowning installation 3 lead to
The passage bearing of trend 301 in road 30 intersects each other, and whereby, is made from correspondence by this two gas channels 30
Gas outlet 31 and the air-flow 32 that goes out, each other in the state being located remotely from each other.
The present invention also provides a kind of base plate separation method, and this substrate segregation apparatus can be coordinated to carry out.The method
Comprise: a pedestal 2 is provided.One folded silicon wafer 4 is provided and is placed on this pedestal 2.There is provided two to blow to fill
Put 3, be located at the opposite sides of this pedestal 2 respectively, and each blowning installation 3 has at least two gas outlets 31,
This two gas outlet 31 of each blowning installation 3 is between left and right every this of wherein each this blowning installation 3 two is given vent to anger
Mouth 31 is used for providing twice air-flow 32, and the airflow direction of this twice air-flow 32 is located remotely from each other, and each air blowing
The airflow direction of this twice air-flow 32 of device 3, the air-flow with this twice air-flow 32 of another blowning installation 3
Direction is symmetrical or at least substantially symmetric.Separate described silicon wafer 4, wherein make being somebody's turn to do of each blowning installation 3
Twice air-flow 32 symmetrically and tiltedly blows the side edge of the top multi-disc in this folded silicon wafer 4, at least to make this
In folded silicon wafer 4, the two panels silicon wafer 4 of the top is separated from one another.It will usually make to go up most in the present embodiment
The silicon wafer 4 of three to four of side produces pre-separation effect.In base plate separation method of the present invention,
The airflow direction of every one air-flow 32 is with the angle theta of this reference direction 33 it has been observed that 15 °～30 ° can be, relatively
It is 15 °～20 ° goodly.
Refer to Fig. 4, Fig. 4 is the schematic top plan view of a second embodiment of the present invention, be different from Fig. 1
The gas outlet of one embodiment is located at the design of Different Plane, and the gas outlet 31 in the present embodiment is all position same
In one plane, and by the suitable bearing of trend of this two gas channels 30, equally can make each blowing
Air-flow 32 out can be away from each other with the gas outlet 31 on right side for the gas outlet 31 in device of air 3 left side.This reality
The angle theta of the airflow direction of every one air-flow 32 and this reference direction 33 of applying example can be 15 °～30 °；Preferably
Ground, angle theta is 15 °～20 °, can reach and this first embodiment identical effect.
Refer to Fig. 5, Fig. 5 is the side schematic view of a 3rd embodiment of the present invention, each of which is blown
Device 3 has two gas outlets 341 and two gas channels 34, indulges for two in implementing this two gas outlet 341 upper
To extend elongated hole and be spaced be configured at the right position of this blowning installation 3.
Refer to Fig. 6, Fig. 6 is the schematic top plan view of a fourth embodiment of the present invention, each of which is blown
Device 3 have four between left and right every gas outlet 351,352, in this four gas outlet 351,352, position
The degree being located remotely from each other in the airflow direction of this two gas outlet 351 outermost, should more than positioned at middle
The degree that the airflow direction of two gas outlets 352 is located remotely from each other.In the present embodiment, respectively this gas outlet 351,
352 is the long and narrow elongated hole of longitudinal extension.
On making, when the gas outlet of blowning installation 3 is in different planes, that is, gas outlet institute
Plane can be considered an inclined plane compared to blowning installation 3, so, in boring to form gas outlet
Making when, you can using the bore mode of this plane vertical, the mode of this vertical drilling is substantially in processing
Upper meeting is relatively good to be operated and processes, and is conducive to saving the time making, avoids the generation of error simultaneously, carry
Rise overall yield.
Additionally, each gas outlet in the present embodiment is all in different planes, that is, non-co- is put down
The design in face, gives vent to anger in after above-mentioned bore mode making, can make adjacent and homonymy two whereby
The airflow direction of mouth 351,352 still maintains a little angle, is separated with providing silicon wafer 4 more preferably to blow
Effect.
Refer to Fig. 7, Fig. 7 is the schematic perspective view of the blowning installation 3 in this fourth embodiment of the present invention,
Wherein it is different from the long and narrow elongated hole of longitudinal extension, the kenel of gas outlet is also to adopt multiple circular holes
353rd, 354 mode is replacing single long and narrow elongated hole.
Refer to Fig. 8, be the schematic top plan view of one the 5th embodiment of the present invention, be different from Fig. 6 the 4th real
The gas outlet applying example is located at the design of Different Plane, and the gas outlet 361,362 in the present embodiment is all that position exists
In approximately the same plane, and in order that the gas outlet 362 air-flow energy out of the gas outlet 361 in left side, right side
Away from each other, therefore make above it is necessary to take the bore mode favouring plane to process in boring, adopt
With the design of single plane, the manufacturing process of the multiple inclined planes being pre-formed blowning installation 3 can be removed from.
Certainly, in using upper, after situation and the demand of reality can be assessed, come many using Fig. 7 fourth embodiment
The mode of single plane of the mode of individual clinoplain or Fig. 8 the 5th embodiment.Certainly, Yu Benshi
Apply in example, respectively this gas outlet 361,362 can be the long and narrow elongated hole of longitudinal extension.
Additionally, in the present embodiment, positioned at the same side and each other spaced gas outlet 361 or gas outlet
362 gas channel 371,372, it can be parallel each other, or maintains the situation having angle, Yu Ben
In Fig. 8 of embodiment be with draw parallel illustrating.
Refer to Fig. 9, Fig. 9 is the schematic perspective view of the blowning installation 3 in the present invention the 5th embodiment,
Wherein it is different from the long and narrow elongated hole of longitudinal extension, the kenel of gas outlet is also to adopt multiple circular holes
381st, 382 mode is replacing single long and narrow elongated hole.
In a word, the gas outlet in each enforcement of the present invention can also be elongated hole, circular hole, side when implementing
Hole, tri-angle-holed or irregular hole.
Additionally, the different designs that in the present invention, each implements profit can be mutually combined and take on demand with aspect
Join, be not limited to the structure illustrated by above-described embodiment and limited, also can reach desired purpose and effectiveness.
The airflow direction of this twice air-flow 32 of each blowning installation 3 that the embodiment of the present invention is proposed, with
The airflow direction of this twice air-flow 32 of another blowning installation 3 be symmetrical or at least substantially symmetric, wherein this
Individual at least substantially symmetric implication as substantially (substantially) symmetrical meaning, that is, actual make
Used time it is possible that a little error in air-flow angle rather than very full symmetric situation, but still
The effect of silicon wafer good separation in the embodiment of the present invention can be reached, that is, not very symmetrical ability
Reach the present invention desired good separation effect, the situation of this kind of a little error is also to be allowed,
It is equally the feature that the present invention is intended to advocate to protect, therefore in this explanation.Wherein, lacking in this air-flow angle
Permitted the angle theta that error refers to the twice airflow direction of homonymy, error is in 5 degree of angular range each other.
Effect of the present invention is to provide a kind of substrate segregation apparatuss, and it mainly makes the two symmetrical of silicon wafer
Side all respectively to be brushed with the oblique blowing gas stream of twice respectively, and the mode brushed of two sidewinds be each other symmetrical or
At least substantially symmetric design, therefore can make silicon wafer efficiently separate and can maintain certain Floating Height
And do not tilt, to avoid silicon wafer to produce the problem of bonding die.
The foregoing is only present pre-ferred embodiments, so it is not limited to the scope of the present invention, appoint
What person familiar with this technology, without departing from the spirit and scope of the present invention, can do on this basis
Further improvement and change, therefore protection scope of the present invention is when with following claims institute circle
Fixed scope is defined.
Claims (13)
1. a kind of substrate segregation apparatuss are it is characterised in that comprise:
One pedestal, and
Two blowning installations being located at the opposite sides of this pedestal respectively, each blowning installation has at least
Two gas outlets, this two gas outlets of each blowning installation be between left and right every；
Wherein, respectively this two gas outlets of this blowning installation are used for providing twice air-flow, this twice air-flow
Airflow direction is located remotely from each other, and the airflow direction of this twice air-flow of each blowning installation, with another
The airflow direction of this twice air-flow of blowning installation is symmetrical or at least substantially symmetric.
2. substrate segregation apparatuss as claimed in claim 1 are it is characterised in that each blowning installation
For even number and forming position is symmetrical to the quantity of gas outlet.
3. substrate segregation apparatuss as claimed in claim 2 are it is characterised in that each blowning installation has
There are at least two gas channels, this two gas channels of each blowning installation correspond respectively and communicate
In this two gas outlets, the passage bearing of trend of this two gas channels of each of which blowning installation that
This intersects.
4. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
This pedestal has two sides being spaced relatively and being respectively adjacent to this two blowning installations, described side definition
One reference direction passing through this two blowning installations and the bearing of trend perpendicular to this two side, every one
The airflow direction of air-flow and the angle of this reference direction are 15 °～30 °.
5. substrate segregation apparatuss as claimed in claim 4 are it is characterised in that the air-flow of every one air-flow
Direction is 15 °～20 ° with the angle of this reference direction.
6. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
The quantity of the described gas outlet of each blowning installation is more than two and is even number, each blowning installation
The plurality of gas outlet longitudinally spaced and horizontal arranged become at least two rows and each other be symmetrical.
7. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
Each blowning installation have four between left and right every gas outlet, in this four gas outlets be located at outermost
The degree that the airflow direction of this two gas outlets is located remotely from each other, middle more than being located in this four gas outlets
The degree that the airflow direction of this two gas outlets is located remotely from each other.
8. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
Respectively this gas outlet is the elongated hole of longitudinal extension.
9. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
Respectively this gas outlet is elongated hole, circular hole, square hole, tri-angle-holed or irregular hole.
10. the substrate segregation apparatuss as described in any claim in claims 1 to 3 it is characterised in that
This pedestal is used for carrying silicon wafer.
A kind of 11. base plate separation methods are it is characterised in that comprise:
One pedestal is provided；
One folded silicon wafer is provided and is placed on this pedestal；
There is provided two blowning installations, this two blowning installations are located at the opposite sides of this pedestal respectively, and often
One blowning installation has at least two gas outlets, and this two gas outlets of each blowning installation are left and right
Interval, wherein respectively this two gas outlets of this blowning installation are used for providing twice air-flow, this twice air-flow
Airflow direction is located remotely from each other, and the airflow direction of this twice air-flow of each blowning installation, with another
The airflow direction of this twice air-flow of blowning installation is symmetrical or at least substantially symmetric；
Separate described silicon wafer, so that this twice air-flow of each blowning installation symmetrically and is tiltedly blown in this
The side edge of the top more silicon wafers in folded silicon wafer, at least to make two of the top in this folded silicon wafer
Piece silicon wafer is separated from one another.
12. base plate separation methods as claimed in claim 11 are it is characterised in that this pedestal has two
It is spaced relatively and is respectively adjacent to the side of this two blowning installations, described side defines one and passes through this two
Blowning installation and the reference direction of the bearing of trend perpendicular to this two sides, the air-flow side of every one air-flow
It it is 15 °～30 ° to the angle with this reference direction.
13. base plate separation methods as claimed in claim 12 are it is characterised in that the gas of every one air-flow
Stream direction is 15 °～20 ° with the angle of this reference direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104122741 | 2015-07-14 | ||
| TW104122741A TWI563586B (en) | 2015-07-14 | 2015-07-14 | Substrate-separating apparatus and substrate-separating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106356422A true CN106356422A (en) | 2017-01-25 |
| CN106356422B CN106356422B (en) | 2018-02-09 |
Family
ID=57843171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510485571.3A Expired - Fee Related CN106356422B (en) | 2015-07-14 | 2015-08-10 | Substrate separation device and substrate separation method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN106356422B (en) |
| TW (1) | TWI563586B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937045A (en) * | 2021-12-08 | 2022-01-14 | 晶科能源(海宁)有限公司 | Feeding device and battery piece feeding method |
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2015
- 2015-07-14 TW TW104122741A patent/TWI563586B/en not_active IP Right Cessation
- 2015-08-10 CN CN201510485571.3A patent/CN106356422B/en not_active Expired - Fee Related
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|---|---|---|---|---|
| JPH0281838A (en) * | 1988-09-19 | 1990-03-22 | Hitachi Ltd | Device and method for separating and feeding paper or the like |
| JPH09194062A (en) * | 1996-01-19 | 1997-07-29 | Nissan Motor Co Ltd | Separation feeding device for sheet material |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113937045A (en) * | 2021-12-08 | 2022-01-14 | 晶科能源(海宁)有限公司 | Feeding device and battery piece feeding method |
| CN113937045B (en) * | 2021-12-08 | 2022-05-06 | 晶科能源(海宁)有限公司 | Feeding device and battery piece feeding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106356422B (en) | 2018-02-09 |
| TWI563586B (en) | 2016-12-21 |
| TW201703168A (en) | 2017-01-16 |
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