CN106338800B - It is a kind of to be used for optical fiber and the horizontal coupler of chip chamber optical signal transmission - Google Patents
It is a kind of to be used for optical fiber and the horizontal coupler of chip chamber optical signal transmission Download PDFInfo
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- CN106338800B CN106338800B CN201610929509.3A CN201610929509A CN106338800B CN 106338800 B CN106338800 B CN 106338800B CN 201610929509 A CN201610929509 A CN 201610929509A CN 106338800 B CN106338800 B CN 106338800B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4227—Active alignment methods, e.g. procedures and algorithms
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
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- Optics & Photonics (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a kind of for optical fiber and the horizontal coupler part of chip chamber optical signal transmission, including the first acquisition module, for guiding and collecting the first mould spot in single order linear polarization pattern, second acquisition module, for guiding and collecting the second mould spot in single order linear polarization pattern, coupling module, equipped with the first transmission channel, the second transmission channel and main channel, first transmission channel receives the first mould spot, second transmission channel receives the second mould spot, and the space overlapping for passing through mould field is realized from the main transmission channel of coupling module and exports single order transverse electric mode.The present invention realizes the transparent coupling that the single order transverse electric mode that single order linear polarization pattern is converted into chip in optical fiber is also ensured to basic mode simultaneously, so that the two can reach higher coupling efficiency, low-loss, big bandwidth, large capacity signal transmission between optical fiber and chip are realized.
Description
Technical field
The present invention is applied to communication technique field, more particularly, to one kind for optical fiber and chip chamber optical signal transmission
Horizontal coupler.
Background technology
Fibre Optical Communication Technology is excellent due to its super large message capacity, super large bandwidth, high-speed, low-loss and low cost etc.
Point has become indispensable core technology in communication networks nowadays network.In order to meet " big data " epoch day to the full extent
The often data throughout and transmission speed needed for life, based on to five physical dimensions (time, frequency, space, polarization state, just
The property handed over) data load capability makes full use of, and various multiplexing technologies and advanced modulation formats have been widely used in fiber optic communication
In system.In the existing fiber communications field while target development towards longer distance, higher rate, more capacity, " green
The theory of communication " brings the integrated trend of device, make following low-power consumption, small size developing goal must be by it
Road.
With the extensive use of silicon substrate integrated device in fiber optic communication systems, transceiver module and base based on silicon base chip
How to be realized between the transmission link of optical fiber low-loss connect into order to one merit attention the problem of：Firstly, since chip and
The size difference of fiber cross-sections is too big, is directly connected to due to mould field size, the severe mismatch being distributed to cause more than 27dB's
Loss；In addition, with the promotion of traffic capacity demands, all kinds of novel optical fibers based on space division multiplexing technology (such as less fundamental mode optical fibre, more
Mode fiber, multi-core optical fiber etc.) also come into being.Therefore, how to design and optimize high performance coupled apparatus, it is all kinds of new to meet
The matching of type optical fiber and chip chamber mould field also becomes thing followed important topic so as to fulfill efficient coupling.
Based on the thinking to the above problem, people design and propose all kinds of coupling schemes, wherein be most widely used
Two classes are grating coupler and back taper waveguide coupler.Vertical coupled design of the grating coupler based on optical fiber and chip, i.e.,
In chip upper surface diffraction occurs for light field in chip upper silicon layer etching period refractive index distribution structure makes optical fiber, makes its change
The direction of propagation is simultaneously coupled on piece waveguide.Since the program can provide higher coupling degree of freedom, and do not need to chip end face
It is pre-processed, therefore can effectively reduce technique and packaging cost, while be also used as coupling with multi-core optical fiber array excellent
It is good alternative；However the structure have stronger wavelength and polarization selectivity, this make its application in multidimensional multiplex system by
Limitation.The another kind of back taper waveguide coupler then horizontal Coupling Design based on optical fiber and chip, passes through back taper waveguide
The light field that chip is coupled into from end face level is guided and collected by tip, will be in top covering using the waveguiding structure of slow increasing
Energy is adiabatically coupled on piece waveguide and transmits.In order to further improve technique tolerance and coupling efficiency, some are novel
Such as multistage back taper waveguide of structure, cantilever beam, both-end waveguide, the waveguide of trident type are suggested in succession.However, that reports at present is each
Kind scheme is coupled mainly for optical fiber with the basic mode on piece waveguide, rarely has the relevant report that higher order mode couples.
Invention content
In view of the foregoing drawbacks, optical fiber and the horizontal coupler of chip chamber optical signal transmission are used for the present invention provides a kind of,
Aim to solve the problem that conventional flat coupler be primarily due to end face section it is small be difficult to realize higher order mode coupling the technical issues of.
In order to solve the above technical problem, the present invention provides a kind of level for optical fiber and chip chamber optical signal transmission
Coupler, including
First acquisition module is aligned with the first mould spot transmitted in a fiber, for acquiring the single order line transmitted in optical fiber
Polarization mode (LP11Pattern) the first mould spot；
Second acquisition module is aligned with the second mould spot transmitted in a fiber, for acquiring the LP transmitted in optical fiber11Pattern
The second mould spot；And
Coupling module, including the first transmission channel, the second transmission channel and main transmission channel, first transmission channel
One end connect with the first end of main transmission channel, the other end of the first transmission channel connects the first acquisition module, for receiving
And transmit the first mould spot；One end of second transmission channel is connect with the first end of main transmission channel, and second transmission is logical
The other end in road connects the second acquisition module, for receiving and transmitting the second mould spot；The second end of the main transmission channel is used for
The output waveguide being connected with function elements other on chip is connected, for the first mould spot and the second mould spot to be coupled as single order transverse electric
Mould (TE1Pattern) output；
First acquisition module is symmetrically arranged with second acquisition module, and the first transmission channel and the second transmission are logical
Road is symmetrically arranged.
Since the first acquisition module being used to acquire the first mould spot in the present invention, the second acquisition module acquires the second mould spot, real
Now to LP in optical fiber11Whole acquisitions of pattern, simultaneously because the first acquisition module and the second acquisition module are symmetrically arranged, and first
Transmission channel is symmetrically arranged with the second transmission channel so that the light path that the light path and the second mould spot that the first mould spot is undergone are undergone
It is identical so that the first mould spot phase and the second mould spot phase are still maintained as π, are passed through coupling module and are realized TE on chip1Pattern
Output, so as to reach LP in optical fiber11TE in pattern to chip1The high efficiency coupling of pattern.
Further, first acquisition module is the first back taper waveguide, the first back taper waveguide narrow end surface and optical fiber
In the first mould spot be aligned, for receiving and transmitting the first mould spot；
Second acquisition module is the second back taper waveguide, the second back taper waveguide narrow end surface and the second mould spot in optical fiber
Alignment, for receiving and transmitting the second mould spot；
The coupling module be Y-branch type waveguide, the waveguide of Y-branch type be equipped with the first branch-waveguide, the second branch-waveguide and
Main waveguide, first branch-waveguide one end connect main waveguide first end, the first branch-waveguide other end and the first back taper waveguide wide end
Face connects, and for receiving and transmitting the first mould spot, second branch-waveguide one end connects main waveguide first end, and the second branch-waveguide is another
One end is connect with the second back taper waveguide wide end surface, for receiving and transmitting the second mould spot, main waveguide second end connection on chip
The output waveguide that other function elements are connected, for being coupled the first mould spot and the second mould spot and exporting LP11Pattern；
First back taper waveguide and the arrangement of the second back taper guide symmetry, the first branch-waveguide and the second branch-waveguide are symmetrical
Arrangement.
Further, first acquisition module is the first both-end waveguide, equipped with first end to the 4th end, the first both-end wave
The first end led is aligned with second end with the first mould spot in optical fiber, for receiving and transmitting the first mould spot；
Second acquisition module is the second both-end waveguide, equipped with first end to the 4th end, the second both-end waveguide first
End is aligned with the 4th end with the second mould spot in optical fiber, for receiving and transmitting the second mould spot；
The waveguide of cascade Y-branch type includes left first order waveguide, right first order waveguide and second level waveguide,
The left first order waveguide is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, second branch's wave
It leads and main waveguide, the first branch-waveguide is connect with the third end of the first both-end waveguide, it is described for collecting and transmitting the first mould spot
Second branch-waveguide of left first order waveguide is connect with the 4th end of the first both-end waveguide, for collecting and transmitting the first mould spot,
The main waveguide of left first order waveguide is connect with first of second level waveguide, for coupling first branch's wave of left first order waveguide
Lead transmission the first mould spot and the second branch-waveguide transmission the first mould spot, the first mould spot of output,
The right first order waveguide is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, second branch's wave
It leads and main waveguide, the first branch-waveguide connect to collect and transmit the second mould spot with the third end of the second both-end waveguide, and second
Branch-waveguide is connect with the 4th end of the second both-end waveguide, for collecting and transmitting the second mould spot, the main wave of right first order waveguide
Lead and connect with second of second level waveguide, for couple the second mould spot of the first branch-waveguide of right first order waveguide transmission and
Second mould spot of the second branch-waveguide transmission, the second mould spot of output,
The second level waveguide is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the second branch-waveguide
With main waveguide, first branch-waveguide one end is connect with the main waveguide of left first order waveguide, the other end and the main wave of second level waveguide
First end connection is led, for the second mould spot collected and transmitted, the second branch-waveguide is connect with the main waveguide of right first order waveguide,
The other end is connect with the main waveguide first end of second level waveguide, for the second mould spot collected and transmitted, the master of second level waveguide
The output waveguide that waveguide second end is connected with function elements other on chip, it is defeated by the main waveguide of left first order waveguide for coupling
The the second mould spot and the second mould spot of the main waveguide output of right first order waveguide gone out, exports TE1Pattern；
The first both-end waveguide and the second both-end waveguide are both-end waveguide, both-end waveguide include two it is symmetrical fall
Tapered transmission line, the narrow end surface of a back taper waveguide are first end, and wide end surface is third end, the narrow end surface of another back taper waveguide
For second end, wide end surface is the 4th end.
Further, at the two symmetrical wide sections of back taper waveguide 6-11 μm of interval in double back taper waveguides, double with guarantee
Effective alignment of two mould spots of single order mould field in tapered transmission line and top covering, so as to improve light field in top covering be coupled into it is double fall
Tapered wave-guide efficiency.
Further, top covering, first end and optical fiber align are further included, the first mould spot transmitted in second end face and first
Acquisition module is aligned, and the second mould spot transmitted in second end face is aligned with the second acquisition module, for receiving in simultaneously Transmission Fibers
LP11Pattern.
Further, top covering is 12-24 μm in end face width, is passed with ensureing that light field is preferably limited in top covering
It is defeated, increase mould field overlap integral.
Further, distance of the narrow end surface of back taper waveguide apart from chip edge is 1-3 μm, is realized in prior art
Under the conditions of improve mould field in top covering and be coupled into the efficiency of back taper waveguide.
Further, the sum of width of the first branch-waveguide of Y-branch type waveguide and the second branch-waveguide should be less than or wait
In the width of main waveguide, with reduce when mould field is transmitted in the first branch-waveguide and the second branch-waveguide issuable leakage or
Loss.
Further, the first branch-waveguide of Y-branch type waveguide and the second linear flexural property of branch-waveguide Bezier, with
Realize that more smooth transition reduces the loss in transmission process.
By the above technical scheme conceived by the present invention, compared with prior art, can obtain following
Advantageous effect：
1st, the first acquisition module is to the LP that is transmitted in quasi-fiber11First mould spot of pattern simultaneously acquires the first mould spot, and second adopts
The LP transmitted in collection module alignment optical fiber11Second mould spot of pattern simultaneously acquires the second mould spot, realizes to LP11Phase phase in pattern
The first mould spot of poor π and the acquisition of the second mould spot, the first mould spot enter the first transmission channel in coupling module, and the second mould spot enters coupling
The second transmission channel in block is molded, the coupling of the first mould spot and the second mould spot is realized by the superposition of mould field in space, by coupling
The main transmission channel output of block is molded, since the first transmission channel and the second transmission channel are symmetrical, which is considered as
It is the inverse process that pattern generates super model to the first transmission channel and the second transmission channel in main transmission channel, according to linear system
Reciprocity, in the second mould spot phase still phase difference of pi that the first mould spot of the first transmission channel transmission and the second transmission channel transmit.
First mould spot and the second mould spot are coupled into phase difference during becoming owner of transmission waveguide and keep constant, finally in the main biography for supporting multimode
The output terminal of defeated channel obtains TE1Pattern realizes LP in optical fiber11TE in pattern to chip1The high efficiency coupling of pattern.
2nd, the present invention can realize LP in optical fiber11TE in pattern to chip1The high efficiency coupling of pattern, for basic mode
LP01To TE0Or TM0There is higher coupling efficiency, when transmitting basic mode in optical fiber, by the first acquisition module and the second acquisition mould
Block acquires the mould spot of basic mode simultaneously, and the light path that the mould spot of the basic mode of the acquisition of the first acquisition module is undergone before coupling is adopted with second
The identical light path that undergoes before coupling of mould spot of the basic mode of collection module acquisition is identical so that the mould spot of two basic modes is into overcoupling
Still it is basic mode after module coupling.
Description of the drawings
The technical solution of the utility model is further described in detail below in conjunction with the accompanying drawings.
Fig. 1 specific embodiment of the invention tomographs, in figure, the 1, first both-end waveguide, 2 second both-end waveguides, 3,
Left first order waveguide, 4, right first order waveguide, 5, second level waveguide；
Fig. 2 specific embodiment of the invention overlooking structure figures, in figure, the 1, first both-end waveguide, 2 second both-end waveguides, 3,
Left first order waveguide, 4, right first order waveguide, 5, second level waveguide, 6, top covering (most clearly characterize effect to reach, the knot
Structure is omitted in Fig. 1)；
Fig. 3 (a) is the coupling process schematic diagram of fundamental mode field in first order waveguide in embodiment provided by the invention；
Fig. 3 (b) is the coupling process schematic diagram of single order mould field in the waveguide of the second level in embodiment provided by the invention；
The waveguide cross-section mode distributions figure of Fig. 4 specific embodiment of the invention, wherein：(a) top covering mode distributions figure；
(b) main waveguide sections mode distributions figure in left first order waveguide；(c) the first branch-waveguide of second level waveguide and the second branch-waveguide
Section mode distributions figure；(d) the main waveguide sections mode distributions figure of second level waveguide.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, it is right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The present invention proposes the horizontal coupler for optical fiber and chip chamber optical signal transmission, including the first acquisition module, the
Two acquisition modules and coupling module, the first acquisition module with transmitting LP in a fiber11The first mould spot alignment of pattern, second adopts
Collection module with transmitting LP in a fiber11The second mould spot alignment of pattern, the first acquisition module acquire and transmit the first mould spot, and second
Acquisition module acquires and transmits the second mould spot, realizes to LP in optical fiber11Whole acquisitions of pattern, the first mould spot and the second mould spot exist
Phase difference of pi in phase, since the first acquisition module and the second acquisition module are symmetrically arranged so that after the transmission of the first acquisition module
First mould spot with by the second acquisition module transmission after the second mould spot phase difference still be π.
Coupling module includes the first transmission channel, the second transmission channel and main transmission channel, first transmission channel one end
It is connect with the first end of main transmission channel, the other end connects the first acquisition module, for receiving by the first acquisition mould spot output
The first mould spot and the first mould spot is transmitted to main transmission channel, second transmission channel one end and the first end of main transmission channel connect
It connects, the other end connects the second acquisition module, for receiving the second mould spot due to the second acquisition mould spot output and by the second mould
Spot is transmitted to main transmission channel, since the first transmission channel and the second transmission channel are symmetrically arranged so that the first mould spot is coupling
The light path that the light path and the second mould spot undergone in module is undergone in coupling module is identical so that the first mould spot and the second mould
Phase difference of the spot before the first end for entering main transmission channel remains as π, and the second end connection chip of main transmission channel receives mould
Block by the superposition of the first mould spot and the second mould spot in main transmission channel, is realized and is coupled as the first mould spot and the second mould spot
LP11Pattern exports, and realizes LP in optical fiber11Pattern switchs to the TE in chip1Pattern.
As another part of the present invention, the horizontal coupler provided in the present invention is for basic mode LP01To TE0Or TM0
There is higher coupling efficiency, when transmitting basic mode in optical fiber, basic mode is acquired by the first acquisition module and the second acquisition module simultaneously
Mould spot, the light path and the basic mode mould of the second acquisition module acquisition that the basic mode mould spot of the acquisition of the first acquisition module is undergone before coupling
The identical light path that spot is undergone before coupling is identical so that two basic mode mould spots into overcoupling module couple after still be basic mode.
In first embodiment provided by the invention, the first acquisition module be the first back taper waveguide, the first back taper waveguide
Narrow end surface is aligned with the first mould spot in optical fiber, and for receiving and transmitting the first mould spot, effect is to draw the light field of disperse
It leads and collects, adiabatically coupled by back taper waveguide, energization capture range improves the efficiency of coupling；Second acquisition mould
Block is the second back taper waveguide, and the second back taper waveguide narrow end surface is aligned with the second mould spot in optical fiber, for receiving and transmitting the
Two mould spots；First back taper waveguide and the arrangement of the second back taper guide symmetry so that the first mould spot is in the first back taper waveguide
Phase difference is still π after being transmitted in the second back taper waveguide with the second mould spot after transmission, and coupling module is Y-branch type waveguide, and Y divides
The waveguide of branch type is equipped with the first branch-waveguide, the second branch-waveguide and main waveguide, and first branch-waveguide one end connects main waveguide first
End, the other end are connect with the first back taper waveguide wide end surface, and for receiving and transmitting the first mould spot, second branch-waveguide one end connects
Main waveguide first end is connect, the other end is connect with the second back taper waveguide wide end surface, for receiving and transmitting the second mould spot, first point
Branch waveguide and the second branch-waveguide are symmetrically arranged so that the first mould spot is after the transmission of the first branch-waveguide and the second mould spot is second
Phase still phase difference of pi after branch-waveguide transmission realizes the first mould spot and the second mould spot in main waveguide by mould field in space overlapping
In coupling, by main waveguide export TE1Pattern, main waveguide second end are connected defeated for connection with function elements other on chip
Go out waveguide.In addition, the horizontal coupler provided in first embodiment is for basic mode LP01To TE0Or TM0There is higher coupling effect
Rate.By the mould field guidance capability of back taper waveguide and the Optical Field Superposition characteristic of Y-branch type waveguide in embodiment provided by the invention
It is combined, has been put forward for the first time LP between optical fiber and chip11The horizontal coupling scheme of pattern, while also ensure the transparent coupling of basic mode
It closes, the two can reach higher coupling efficiency.
In second embodiment provided by the invention, including top covering, the first back taper waveguide, the second back taper waveguide and Y-branch
Type waveguide, top covering, for receiving LP in simultaneously Transmission Fibers11Pattern, top covering first end transmit quasi-fiber in second end face
The first mould spot be aligned with the first acquisition module, the second mould spot transmitted in second end face is aligned with the second acquisition module, use
Covering is to the LP in optical fiber11The transmission of pattern can be effectively protected the damage of the first back taper waveguide and the second back taper waveguide
Bad, the first back taper waveguide receives top covering output LP11First mould spot in pattern, the second back taper waveguide receive top covering output LP11
Second mould spot in pattern, the first back taper waveguide and the arrangement of the second back taper guide symmetry so that the first mould spot is in the first back taper
Phase difference is still π after being transmitted in the second back taper waveguide with the second mould spot after being transmitted in shape waveguide, and coupling module is Y-branch type
Waveguide, the waveguide of Y-branch type are equipped with the first branch-waveguide, the second branch-waveguide and main waveguide, first branch-waveguide one end connection master
Waveguide first end, the other end are connect with the first back taper waveguide wide end surface, for receiving and transmitting the first mould spot, second branch's wave
It leads one end and connects main waveguide first end, the other end is connect with the second back taper waveguide wide end surface, for receiving and transmitting the second mould
Spot, the first branch-waveguide and the second branch-waveguide are symmetrically arranged so that the first mould spot is after the transmission of the first branch-waveguide and second
Phase still phase difference of pi of the mould spot after the transmission of the second branch-waveguide realizes the first mould spot and the second mould by mould field in space overlapping
Coupling of the spot in main waveguide exports TE by main waveguide1Pattern, main waveguide second end is for connection and other effectors on chip
The output waveguide that part is connected is realized LP in optical fiber11Pattern switchs to the TE in chip1Pattern.
As shown in Figure 1, for 3rd embodiment provided by the invention, the first acquisition module is the first both-end waveguide 1, both-end wave
It leads including two symmetrical back taper waveguides, the narrow end surface of a back taper waveguide is first end, and wide end surface is third end, separately
The narrow end surface of one back taper waveguide is second end, and wide end surface is the 4th end, and the first end and second end of the first both-end waveguide 1 are equal
With the LP of top covering second end face output11The first mould spot alignment of pattern, for receiving and transmitting the first mould spot, two are symmetrically divided
The back taper waveguide of cloth realizes preferably guiding and collects the first mould spot.
Second acquisition module is the second both-end waveguide 2, and both-end waveguide includes two symmetrical back taper waveguides, a back taper
The narrow end surface of shape waveguide is first end, and wide end surface is third end, and the narrow end surface of another back taper waveguide is second end, wide end
Face is the 4th end, 2 first end of the second both-end waveguide and LP of the 4th end with the output of top covering second end face11Pattern the second mould spot
Alignment, for receiving and transmitting the second mould spot.
The waveguide of cascade Y-branch type includes left first order waveguide 3, right first order waveguide 4 and second level waveguide 5, the left first order
Waveguide 3, right first order waveguide 4 and second level waveguide 5 are Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the
Two branch-waveguides and main waveguide.
First branch-waveguide of left first order waveguide 3 is connect with the third end of the first both-end waveguide 1, for collecting and transmitting
First mould spot, the second branch-waveguide of left first order waveguide 3 are connect with the 4th end of the first both-end waveguide 1, for collecting and passing
Defeated first mould spot, the main waveguide of left first order waveguide 3 are connect with first of second level waveguide 5, for coupling left first order wave
The first mould spot of 3 the first branch-waveguide transmission and the first mould spot of the second branch-waveguide transmission are led, exports the first mould spot.
Right 4 first branch-waveguide of first order waveguide connect to collect and transmit with the third end of the second both-end waveguide 2
Two mould spots, the second branch-waveguide are connect with the 4th end of the second both-end waveguide 2, for collecting and transmitting the second mould spot, the right side first
The main waveguide of grade waveguide 4 is connect with second of second level waveguide 5, is passed for coupling the first branch-waveguide of right first order waveguide
The second defeated mould spot and the second mould spot of the second branch-waveguide transmission, export the second mould spot.
Second level waveguide 5 is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the second branch-waveguide and master
Waveguide, first branch-waveguide one end are connect with the main waveguide of left first order waveguide 3, the main waveguide of the other end and second level waveguide the
One end connects, and for the second mould spot collected and transmitted, the second branch-waveguide is connect with the main waveguide of right first order waveguide 4, separately
One end is connect with the main waveguide first end of second level waveguide, for the second mould spot collected and transmitted, the main wave of second level waveguide 5
It leads second end and is used for the output waveguide being connected with function elements other on chip, for coupling the main waveguide by left first order waveguide
Second mould spot of output and the second mould spot of the main waveguide output of right first order waveguide, export TE1Pattern, realizing will be in optical fiber
LP11Pattern switchs to the TE in chip1Pattern.
The embodiment provided in the present invention is by the mould field guidance capability of both-end back taper waveguide and the light field of Y-branch type waveguide
Superimposed characteristics are combined, and have been put forward for the first time the horizontal coupling scheme of higher order mode between optical fiber and chip, while also ensure base
The transparent coupling of mould so that the two can reach higher coupling efficiency, realize low-loss between optical fiber and chip, big bandwidth,
Large capacity signal transmission.
Fig. 2 is the vertical view of 3rd embodiment provided by the invention, the first acquisition module, the second acquisition in 3rd embodiment
Module and cascade Y-branch type waveguide are to carry out etching obtained waveguiding structure completely, while to protect in chip upper silicon layer
The good limitation of light field is demonstrate,proved, the silica top covering 6 of one layer of finite width is deposited on chip.It should be noted that it is
The coupler structure of Fig. 1 is made to characterize more apparent, on silica top covering is omitted in Fig. 1.
As the LP in optical fiber11After pattern is coupled into top covering by level, light field is converted into silica top covering
TE1Pattern continues to transmit.For light field is made preferably to be limited in finite region, silica top covering is carved using deep trench
Erosion, i.e., in the both sides of both-end waveguide, the rectangular region from chip edge on piece all carves top covering on silica
Erosion, obtains limited top covering width so as to limit the lateral disperse of light field.Accurate optimization is passed through in two groups of both-end back taper waveguides
Spacing, respectively to TE in silica top covering1The mould spot energy of two phase by pi of pattern is guided and is collected, such as Fig. 3
(a) shown in, the first mould spot is acquired by both-end waveguide, by and by left first order waveguide the first branch-waveguide and the second branch
Waveguide, which is coupled into, to be become owner of in waveguide, the process can be regarded as in the main waveguide of the first order waveguide pattern to the first branch-waveguide and
The inverse process of super model is generated in second branch-waveguide, the second mould spot is acquired by both-end waveguide, by and by right first order waveguide
The first branch-waveguide and the second branch-waveguide be coupled into and become owner of in waveguide, according to the reciprocity of linear system, in the left first order
The trunk waveguide output end of waveguide and right first order waveguide will respectively obtain the mould spot of two phase place phase difference of pi, as shown in Fig. 3 (b),
Two mould spots are by respectively enteing the first branch-waveguide and the second branch-waveguide of second level waveguide, since two mould spots are in symmetrical structure
The light path of middle experience is identical, and phase difference is kept constant during being coupled into the main waveguide in the second level, finally in the master for supporting multimode
Waveguide output end obtains the TE of on piece1Pattern, so as to fulfill LP11Pattern is to TE1The efficient coupling of pattern and conversion.
In view of the technological requirement and loss characteristic of actual fabrication, the of present embodiment selection Y-branch type waveguide
One branch-waveguide and the second branch-waveguide replace traditional straight wave guide by the linear curved waveguide of Bezier, more smooth to realize
The section of loss in transition reduction transmission process, back taper waveguide and Y-branch type waveguide is rectangular, preferably to support electric field
Along the TM patterns of chip height direction vertical vibration, the first branch-waveguide of Y-branch type waveguide and the width of the second branch-waveguide
The sum of should be less than or the width equal to main waveguide, with reduce can when mould field is transmitted in the first branch-waveguide and the second branch-waveguide
The leakage or loss that can be generated.The end face width of top covering is 12-24 μm, to ensure that light field is preferably limited in top covering
Transmission increases mould field overlap integral.When the end face width of top covering is less than 12 μm, top covering is narrow to be will be unable to have device
Effect covering, may cause part light field to leak；When the end face width of top covering is more than 24 μm, top covering is wide so as to light field
Restriction effect weakens, and overlap integral is reduced rapidly.Interval 6-11 μ at the two symmetrical wide sections of back taper waveguide in double back taper waveguides
M, to ensure the waveguide of two-arm back taper and effective alignment of two mould spot of single order mould field in top covering, so as to improve light field in top covering
The efficiency being coupled into back taper waveguide；After beyond this range, coupling efficiency subtracts rapidly the deviation generated due to alignment
It is small.Distance of the narrow end surface of back taper waveguide apart from chip edge is 1-3 μm, realizes and is wrapped with being improved under the conditions of prior art
Mould field is coupled into the efficiency in back taper waveguide in layer；It, may be because of the essence of chip edge deep etching or polishing process during less than 1 μm
Degree error damages the end face of back taper coupler, and during more than 3 μm, light field disperse in top covering is too fast, is unfavorable for down
The effective guiding and collection of taper coupler.When the end face width of silica top covering is 16 μm, the narrow end surface of both-end waveguide
Distance with silica top covering first end face is 1 μm, and the width of narrow end surface is 0.2 μm, the first branch of first order waveguide
1 μm is divided between waveguide and the second branch-waveguide, the width of the main waveguide of first order waveguide is 0.8 μm；The first of second level waveguide
9 μm, when the width of the main waveguide of second level waveguide is 1.6 μm are divided between branch-waveguide and the second branch-waveguide, horizontal coupler
By the LP in optical fiber11With optimal coupling efficiency when Mode Coupling enters receiving module in chip.
By the design of above structure, emulation obtains the mode distributions figure of device as shown in Figure 4 waveguide cross-section everywhere,
Wherein Fig. 4 (a) respectively shows the mode distributions figure in top covering section, and the main waveguide that Fig. 4 (b) illustrates left first order waveguide is cut
The mode distributions figure in face, Fig. 4 (c) illustrate the first branch-waveguide of second level waveguide and the mould field point in the second branch-waveguide section
Butut, the mode distributions figure of the main waveguide sections of Fig. 4 (d) second level waveguide, so as to more clearly from illustrate the transmission of mould field with
Change procedure.
It is last it should be noted that implement that example is merely illustrative of the technical solution of the present invention above and unrestricted, although
The present invention is described in detail with reference to preferred embodiment, it will be understood by those of ordinary skill in the art that, it can be to this hair
Bright technical solution is modified or replaced equivalently, and without departing from the spirit and scope of technical solution of the present invention, should all be contained
It covers in scope of the presently claimed invention.
Claims (9)
- It is 1. a kind of for optical fiber and the horizontal coupler of chip chamber optical signal transmission, which is characterized in that including：First acquisition module is aligned with the first mould spot transmitted in a fiber, for acquiring single order linear polarization pattern in optical fiber First mould spot；Second acquisition module is aligned with the second mould spot transmitted in a fiber, for acquiring single order linear polarization pattern in optical fiber Second mould spot；AndCoupling module, including the first transmission channel, the second transmission channel and main transmission channel, the one of first transmission channel End is connect with the first end of main transmission channel, and the other end of the first transmission channel connects the first acquisition module, for receiving and passing Defeated first mould spot；One end of second transmission channel is connect with the first end of main transmission channel, second transmission channel The other end connects the second acquisition module, for receiving and transmitting the second mould spot；The second end of the main transmission channel is used to connect The output waveguide being connected with function elements other on chip, it is horizontal for the first mould spot and the second mould spot to be coupled as single order in chip Electric mould output；First acquisition module is symmetrically arranged with second acquisition module, and the first transmission channel and the second transmission channel pair Claim arrangement；So that the light path that light path and the second mould spot that the first mould spot is undergone are undergone is identical so that the first mould spot phase with Second mould spot phase is still maintained as π, passes through the output that coupling module realizes single order transverse electric mode on chip.
- 2. according to the horizontal coupler described in claim 1, which is characterized in that first acquisition module is the first back taper Waveguide, the first back taper waveguide narrow end surface is aligned with the first mould spot of single order linear polarization pattern in optical fiber, for receiving and transmitting First mould spot；Second acquisition module is the second back taper waveguide, the second back taper waveguide narrow end surface and single order linearly polarized mode in optical fiber The second mould spot alignment of formula, for receiving and transmitting the second mould spot；The coupling module is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the second branch-waveguide and main wave It leads, first branch-waveguide one end connects main waveguide first end, and the first branch-waveguide other end and the first back taper waveguide wide end surface connect It connects, for receiving and transmitting the first mould spot, second branch-waveguide one end connects main waveguide first end, the second branch-waveguide other end It is connect with the second back taper waveguide wide end surface, for receiving and transmitting the second mould spot, main waveguide second end connects chip output waveguide, For the first mould spot and the second mould spot to be coupled and export single order transverse electric mode；First both-end back taper waveguide and the arrangement of the second both-end back taper guide symmetry, the first branch-waveguide and the second branch-waveguide It is symmetrically arranged.
- 3. according to the horizontal coupler described in claim 1, which is characterized in that first acquisition module is the first both-end wave (1) is led, equipped with first end to the 4th end, first end and single order of the second end with being transmitted in optical fiber of the first both-end waveguide (1) The first mould spot alignment of linear polarization pattern, for receiving and transmitting the first mould spot；Second acquisition module is the second both-end waveguide (2), equipped with first end to the 4th end, the second both-end waveguide (2) first End is aligned with the second mould spot of the second end with the single order linear polarization pattern transmitted in optical fiber, for receiving and transmitting the second mould Spot；The waveguide of cascade Y-branch type includes left first order waveguide (3), right first order waveguide (4) and second level waveguide (5)；The left first order waveguide (3) is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the second branch-waveguide With main waveguide, the first branch-waveguide of the left first order waveguide (3) is connect with the third end of the first both-end waveguide, for collecting With transmitting the first mould spot, the second branch-waveguide of the left first order waveguide (3) is connect with the 4th end of the first both-end waveguide, is used Connect in collecting with the first mould spot of transmission, the main waveguide of left first order waveguide (3) with the first branch-waveguide of second level waveguide (5) It connects, for coupling the second of the first mould spot of the first branch-waveguide of left first order waveguide (3) transmission and left first order waveguide (3) First mould spot of branch-waveguide transmission；The right first order waveguide (4) is Y-branch type waveguide, and the waveguide of Y-branch type is equipped with the first branch-waveguide, the second branch-waveguide With main waveguide, the first branch-waveguide of right first order waveguide (4) connect to collect and pass with the third end of the second both-end waveguide Defeated second mould spot, the second branch-waveguide of right first order waveguide (4) are connect with the 4th end of the second both-end waveguide, for collect with The second mould spot is transmitted, the main waveguide of right first order waveguide (4) is connect with the second branch-waveguide of second level waveguide (5), for coupling The the second mould spot and (4) second branch-waveguide of right first order waveguide for closing the first branch-waveguide transmission of right first order waveguide (4) pass The second defeated mould spot；The second level waveguide (5) be Y-branch type waveguide, the waveguide of Y-branch type be equipped with the first branch-waveguide, the second branch-waveguide and Main waveguide, first branch-waveguide one end are connect with the main waveguide of left first order waveguide (3), the other end and second level waveguide (5) Main waveguide first end connection, for collecting and transmitting the first mould spot, the second branch-waveguide (5) and the master of right first order waveguide (4) Waveguide connects, and the other end connect with the main waveguide first end of second level waveguide (5), for collecting and transmitting the second mould spot, second The output waveguide that the main waveguide second end of grade waveguide (5) is connected with function elements other on chip, for coupling by the left first order First mould spot of the main waveguide output of waveguide (3) and the second mould spot of the main waveguide output of right first order waveguide (4), export single order Transverse electric mode；The first both-end waveguide (1) and the second both-end waveguide (2) are both-end waveguide, and both-end waveguide is symmetrical including two Back taper waveguide, the narrow end surface of a back taper waveguide are first end, and wide end surface is third end, the narrow end of another back taper waveguide Face is second end, and wide end surface is the 4th end.
- 4. according to the horizontal coupler described in claim 3, which is characterized in that two symmetrical back taper wave in double back taper waveguides Lead 6-11 μm of interval at wide section.
- 5. according to the horizontal coupler described in claims 1 to 3 any one, which is characterized in that horizontal coupler further includes Covering, first end and optical fiber align, the first mould spot transmitted in second end face is aligned with the first acquisition module, in second end face Second mould spot of transmission is aligned with the second acquisition module, for receiving LP in simultaneously Transmission Fibers11Pattern.
- 6. according to the horizontal coupler described in claim 5, which is characterized in that top covering is 12-24 μm in end face width.
- 7. according to the horizontal coupler described in claim 5, which is characterized in that the narrow end surface of back taper waveguide is apart from chip side The distance of edge is 1-3 μm.
- 8. according to the horizontal coupler described in Claims 2 or 3, which is characterized in that the first branch-waveguide of Y-branch type waveguide It should be less than with the sum of the width of the second branch-waveguide or the width equal to main waveguide.
- 9. according to the horizontal coupler described in Claims 2 or 3, which is characterized in that the first branch-waveguide of Y-branch type waveguide It is in the linear flexural property of Bezier with the second branch-waveguide.
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| CN114397729B (en) * | 2021-12-06 | 2024-05-28 | 广东奥斯诺工业有限公司 | SiN integrated optical chip based on continuous curvature bending waveguide polarizer |
| CN114384633B (en) * | 2022-01-21 | 2024-05-24 | 合肥知宇芯光科技有限公司 | Horizontal coupler for optical signal transmission between rectangular core few-mode optical fiber and chip |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08234062A (en) * | 1995-02-27 | 1996-09-13 | Nippon Telegr & Teleph Corp <Ntt> | Optical coupling device and optical coupling method |
| CN1252901A (en) * | 1997-04-18 | 2000-05-10 | 西门子公司 | Laser device |
| CN101710195A (en) * | 2009-12-09 | 2010-05-19 | 中国科学院半导体研究所 | Free-etching oxidation manufacturing method of SOI submicron ridge optical waveguide back-taper coupler |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08234062A (en) * | 1995-02-27 | 1996-09-13 | Nippon Telegr & Teleph Corp <Ntt> | Optical coupling device and optical coupling method |
| CN1252901A (en) * | 1997-04-18 | 2000-05-10 | 西门子公司 | Laser device |
| CN101710195A (en) * | 2009-12-09 | 2010-05-19 | 中国科学院半导体研究所 | Free-etching oxidation manufacturing method of SOI submicron ridge optical waveguide back-taper coupler |
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