CN106338356A - Pressure sensor - Google Patents

Pressure sensor Download PDF

Info

Publication number
CN106338356A
CN106338356A CN201610862059.0A CN201610862059A CN106338356A CN 106338356 A CN106338356 A CN 106338356A CN 201610862059 A CN201610862059 A CN 201610862059A CN 106338356 A CN106338356 A CN 106338356A
Authority
CN
China
Prior art keywords
shell
circuit board
pressure sensor
pressure
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610862059.0A
Other languages
Chinese (zh)
Inventor
汤家伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou Kai Yao Asset Management Co Ltd
Original Assignee
Guangzhou Kai Yao Asset Management Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou Kai Yao Asset Management Co Ltd filed Critical Guangzhou Kai Yao Asset Management Co Ltd
Priority to CN201610862059.0A priority Critical patent/CN106338356A/en
Publication of CN106338356A publication Critical patent/CN106338356A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0092Pressure sensor associated with other sensors, e.g. for measuring acceleration or temperature

Abstract

The invention discloses a pressure sensor. The pressure sensor comprises an outer shell; the outer shell is provided with a connecting opening; the exterior of the connecting opening is provided with an interface screw thread; a pressure-introducing hole is formed at the middle of the connecting opening; a circuit board is arranged in the outer shell; one surface of the circuit board is provided with a pressure chip and a module circuit group; the other surface of the circuit board is provided with leads; the leads extend out from the outer shell; a clamping ring is arranged between the circuit board and the outer shell; a filling sheet is arranged in the outer shell; and the outer shell is filled with an insulating liquid. The pressure sensor of the invention has the advantages of simple and ingenious structure, low production cost, high impact resistance, high insulation performance, and high measurement precision, and can effectively reduce zero drift phenomena.

Description

A kind of pressure sensor
Technical field
The present invention relates to pressure checking device is and in particular to a kind of pressure sensor.
Background technology
Pressure sensor is the most commonly used a kind of sensor in industrial practice, and it is widely used in various industry automatic control rings Border, be related to water conservancy and hydropower, railway traffic, intelligent building, produce automatic control, Aero-Space, military project, petrochemical industry, oil well, electric power, ship, Numerous industry such as lathe, pipeline.Pressure chip is generally placed in shell on circuit board by traditional pressure sensor, and presses Power chip needs to be connected to external external circuitses plate by keyset, it usually needs using two-layer housing, due to there being two-layer shell Body, build-up of pressure sensor bulk is big, and cost is not easy to reduce, simultaneously because pressure chip and circuit board are put into the mistake of shell Need pressurization, crimping in journey, then be connected with external circuit, pressure chip will be led to produce internal stress, zero drift occurs; And pressure chip is directly connected by existing pressure sensor with analog-to-digital conversion module, wayward, analog-to-digital conversion module exists When carrying out converting transmission, easily cause disappearance and the mistake of data, the accuracy of impact pressure sensor measurement.
Content of the invention
In order to solve defect of the prior art, the technical problem to be solved is to provide a kind of novel pressure Sensor, its structure is simple, ingenious, low production cost, strong shock resistance, and insulating properties are high, effectively reduces zero drift existing As the high pressure sensor of certainty of measurement.
Technical scheme: a kind of pressure sensor of the present invention, including shell body, shell body is provided with connector, even Interface peripherals have interface thread, and the centre of connector is provided with tracting pressuring hole, and the inside of shell body is provided with circuit board, one side on circuit board Be provided with pressure chip and modular circuit group, on circuit board, another side is provided with lead, lead extend out to outside shell body, circuit board and It is provided with snap ring, the inside of shell body is provided with filler piece, and the inside of shell body is full of iknsulating liquid between shell body.
Further, modular circuit group includes miniature cpu, analog-to-digital conversion module, drive amplification module, interface circuit and nothing Line signal transmitting module, miniature cpu is connected with pressure chip, and miniature cpu is connected with analog-to-digital conversion module, analog-to-digital conversion module and Drive amplification module is connected, drive amplification modular connection interface circuit and wireless signal sending module.
Further, it is provided with buffering ring between snap ring and circuit board.
Further, the inwall of shell body is provided with groove, and snap ring is fixed in groove.
Further, snap ring includes card-tight part and supporting part, and one end of supporting part is contacted with inwall one end of shell body, One end of card-tight part is contacted with one end of filler piece, and the other end of filler piece is contacted with the inwall other end of shell body.
Further, interface thread is externally provided with scuff-resistant coating.
Further, modular circuit group also includes temperature sense chip, and temperature sense chip is connected with miniature cpu.
Further, circuit board is additionally provided with power module, power module and described pressure chip, modular circuit group phase Even.
Further, buffering ring is nylon or quality of rubber materials.
Further, using pottery, circuit board adopts ceramic substrate to filler piece.
The present invention compared with prior art has the advantage that in the present invention, structure is simple, ingenious, pressure chip and module Circuit is mounted on circuit board, and circuit board is placed in inside shell body, effectively mitigates the difficulty of corresponding processing technology, meanwhile, by It is concurrently placed on circuit board in pressure chip and modular circuit group, traditional little of the volume ratio of sensor, the scope of application is wider;Plus Man-hour can integrally implant circuit board inside shell body, mitigates zero drift phenomenon, improve the accuracy of data simultaneously;Pressure core Piece and modular circuit group are concurrently placed on circuit board, and pressure chip does not need to be connected with external external circuitses plate, need not be provided with Two-layer shell, only needs shell body, effectively reduces the cost, suitable commercial introduction, and due to only having shell body, shock resistance Higher with anti-shake performance, it is to avoid two-layer housing mutually clashes into and separates, and service life is longer, shell body is an entirety, sealing Performance more preferably, reduces the use of sealing ring, simplifies procedure of processing;It is provided with snap ring, and be provided with buffering ring in snap ring, to circuit board Fixation is more firm, and plays insulating effect, it is to avoid the danger that circuit board electric leakage causes;It is provided with filler piece it is ensured that circuit board is pacified Dress gap, effectively reduces shell body built-in electrical insulation fluid space simultaneously, reduces the drift of sensor, certainty of measurement is high;Module electricity Road group is controlled by miniature cpu, and the pressure simulation signal that miniature cpu is surveyed to pressure chip is collected, to the collection of data and Conversion is more intelligent, and data is more accurate;It is provided with power module, under the emergency situations such as power failure, be able to maintain that overall continuation Work a period of time;It is provided with temperature sense chip, the working environment of circuit board is monitored, and the corresponding same number pressure of data According to sending together, facilitate the subsequently process to data.
Brief description
Fig. 1 is the structural representation of the present invention;
Fig. 2 is circuit module schematic diagram on circuit board.
In figure label: 1- shell body, 2- interface thread, 3- connector, 4- circuit board, 5- snap ring, 6- groove, 7- buffering Ring, 8- card-tight part, 9- supporting part, 10- tracting pressuring hole, 11- lead, 12- pressure chip, 13- scuff-resistant coating, 14- filler piece, 15- are micro- Type cpu, 16- analog-to-digital conversion module, 17- drive amplification module, 18- interface circuit, 19- wireless signal sending module, 20- temperature Induction chip, 21- power module, 22- modular circuit group.
Specific embodiment
In order to deepen the understanding of the present invention, below we will combine accompanying drawing the invention will be further described, this embodiment It is only used for explaining the present invention, do not constitute limiting the scope of the present invention.
As Fig. 1-Fig. 2 shows a kind of embodiment of pressure sensor of the present invention, pressure sensor includes shell body 1, Shell body 1 is provided with connector 3, and connector 3 is externally provided with interface thread 2, and the centre of connector 3 is provided with tracting pressuring hole 10, shell body 1 Inside be provided with circuit board 4, circuit board 4 is simultaneously provided with pressure chip 12 and modular circuit group 22, on circuit board 4, another side sets Leaded 11, lead 11 extend out to outside shell body 1, is provided with snap ring 5, the inside of shell body 1 between circuit board 4 and shell body 1 It is provided with filler piece 14, the inside of shell body 1 is full of iknsulating liquid, and modular circuit group 22 includes miniature cpu15, analog-to-digital conversion module 16th, drive amplification module 17, interface circuit 18 and wireless signal sending module 19, miniature cpu15 is connected with pressure chip 12, micro- Type cpu15 is connected with analog-to-digital conversion module 16, and analog-to-digital conversion module 16 is connected with drive amplification module 17, drive amplification module 17 Connecting interface circuit 18 and wireless signal sending module 19, are provided with buffering ring 7 between snap ring 5 and circuit board 4, shell body 1 interior Wall is provided with groove 6, and snap ring 5 is fixed in groove 6, and snap ring 5 includes card-tight part 8 and supporting part 9, and one end of supporting part 9 is with outward Inwall one end of housing 1 contacts, and one end of card-tight part 8 is contacted with one end of filler piece 14, the other end of filler piece 14 with The inwall other end of shell body 1 contacts, and interface thread 2 is externally provided with scuff-resistant coating 13, and modular circuit group 22 also includes temperature sense Chip 20, temperature sense chip 20 is connected with miniature cpu15, and circuit board 4 is additionally provided with power module 21, power module 21 and pressure Power chip 12, modular circuit group 22 are connected, and buffering ring 7 is nylon or quality of rubber materials, and filler piece 14 is adopted using pottery, circuit board 4 Use ceramic substrate.
The operation principle of the present invention: in the present invention, pressure chip 12 is connected with miniature cpu15, analog-to-digital conversion module 16 is by micro- Type cpu15, pressure chip 12 detects the pressure of testee, and generates corresponding pressure simulation signal, and miniature cpu15 is to corresponding Pressure simulation signal be collected, and send to analog-to-digital conversion module 16, pressure simulation signal is turned by analog-to-digital conversion module 16 It is changed to data signal, drive amplification module 17 is amplified to data signal, then sent by interface circuit 18 and wireless signal Module 19 realizes the output of signal, completes the output of pressure on the number signal.
The present invention compared with prior art has the advantage that in the present invention, structure is simple, ingenious, pressure chip 12 and mould On circuit board 4, circuit board 4 is placed in inside shell body 1 block circuit group 22, effectively mitigates the difficulty of corresponding processing technology, Simultaneously as pressure chip 12 and modular circuit group 22 are concurrently placed on circuit board 4, traditional little of the volume ratio of sensor, fit Wider with scope;Zero drift phenomenon can be mitigated inside overall for circuit board 4 implantation shell body 1, improves data simultaneously during processing Accuracy;Pressure chip 12 and modular circuit group 22 are concurrently placed on circuit board 4, and pressure chip 12 does not need outer with external Connect circuit board to connect, two-layer shell need not be provided with, only need shell body 1, effectively reduce the cost, suitable commercial introduction, and by In only shell body 1, shock resistance and anti-shake performance are higher, it is to avoid two-layer housing mutually clashes into and separates, and service life is more Long, shell body 1 is an entirety, and sealing property more preferably, reduces the use of sealing ring, simplifies procedure of processing;It is provided with snap ring 5, and It is provided with buffering ring 7, the fixation to circuit board 4 is more firm, and plays insulating effect, it is to avoid circuit board 4 electric leakage causes in snap ring 5 Danger;It is provided with filler piece 14 it is ensured that gap installed by circuit board 4, effectively reduce shell body 1 built-in electrical insulation fluid space simultaneously, Reduce the drift of sensor, certainty of measurement is high;Modular circuit group 22 is controlled by miniature cpu15, and miniature cpu15 is to pressure chip 12 The pressure simulation signal surveyed is collected, and the collection to data and conversion are more intelligent, and data is more accurate;It is provided with power supply Module 21, under the emergency situations such as power failure, is able to maintain that overall working on a period of time;It is provided with temperature sense chip 20, right The working environment of circuit board 4 is monitored, and corresponding data sends together with pressure data, the convenient subsequently place to data Reason.
Above-mentioned specific embodiment, technology design only to illustrate the invention and architectural feature are familiar with this it is therefore intended that allowing The stakeholder of technology can implement according to this, but above content is not intended to limit protection scope of the present invention, every according to this Any equivalence changes or modification that bright Spirit Essence is made, all should fall under the scope of the present invention.

Claims (10)

1. a kind of pressure sensor it is characterised in that: include shell body (1), described shell body (1) is provided with connector (3), institute State connector (3) and be externally provided with interface thread (2), the centre of described connector (3) is provided with tracting pressuring hole (10), described shell body (1) Inside be provided with circuit board (4), described circuit board (4) is simultaneously provided with pressure chip (12) and modular circuit group (22), described The upper another side of circuit board (4) is provided with lead (11), and it is outside that described lead (11) extend out to shell body (1), described circuit board (4) and Be provided with snap ring (5) between shell body (1), the inside of described shell body (1) is provided with filler piece (14), described shell body (1) interior Portion is full of iknsulating liquid.
2. a kind of pressure sensor according to claim 1 it is characterised in that: described modular circuit group (22) includes miniature Cpu (15), analog-to-digital conversion module (16), drive amplification module (17), interface circuit (18) and wireless signal sending module (19), Described miniature cpu (15) is connected with described pressure chip (12), described miniature cpu (15) and described analog-to-digital conversion module (16) phase Even, described analog-to-digital conversion module (16) is connected with described drive amplification module (17), and described drive amplification module (17) connects institute State interface circuit (18) and described wireless signal sending module (19).
3. a kind of pressure sensor according to claim 1 it is characterised in that: described snap ring (5) and described circuit board (4) Between be provided with buffering ring (7).
4. a kind of pressure sensor according to claim 3 it is characterised in that: the inwall of described shell body (1) is provided with Groove (6), described snap ring (5) is fixed in described groove (6).
5. a kind of pressure sensor according to claim 4 it is characterised in that: described snap ring (5) include card-tight part (8) and Supporting part (9), one end of described supporting part (9) is contacted with inwall one end of described shell body (1), described card-tight part (8) One end is contacted with the one end of described filler piece (14), the inwall of the other end of described filler piece (14) and described shell body (1) The other end contacts.
6. a kind of pressure sensor according to claim 1 it is characterised in that: described interface thread (2) is externally provided with abrasionproof Layer (13).
7. a kind of pressure sensor according to claim 2 it is characterised in that: described modular circuit group (22) also includes temperature Degree induction chip (20), described temperature sense chip (20) is connected with described miniature cpu (15).
8. a kind of pressure sensor according to claim 2 or 7 it is characterised in that: be additionally provided with electricity on described circuit board (4) Source module (21), described power module (21) is connected with described pressure chip (12), described modular circuit group (22).
9. a kind of pressure sensor according to claim 3 it is characterised in that: described buffering ring (7) be nylon or rubber Material.
10. a kind of pressure sensor according to claim 1 it is characterised in that: described filler piece (14) is using pottery, institute State circuit board (4) and adopt ceramic substrate.
CN201610862059.0A 2016-09-28 2016-09-28 Pressure sensor Pending CN106338356A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610862059.0A CN106338356A (en) 2016-09-28 2016-09-28 Pressure sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610862059.0A CN106338356A (en) 2016-09-28 2016-09-28 Pressure sensor

Publications (1)

Publication Number Publication Date
CN106338356A true CN106338356A (en) 2017-01-18

Family

ID=57839442

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610862059.0A Pending CN106338356A (en) 2016-09-28 2016-09-28 Pressure sensor

Country Status (1)

Country Link
CN (1) CN106338356A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108106775A (en) * 2017-12-13 2018-06-01 芜湖致通汽车电子有限公司 A kind of temperature and pressure transmitter

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201464117U (en) * 2009-06-01 2010-05-12 杭州科岛微电子有限公司 Electronic oil pressure sensor
CN202493310U (en) * 2012-02-19 2012-10-17 杭州科岛微电子有限公司 Electronic oil pressure sensor of ratio resistance mode
CN202533212U (en) * 2012-03-03 2012-11-14 杭州科岛微电子有限公司 Electronic oil pressure sensor with dynamic equivalent mode
CN203858059U (en) * 2014-05-13 2014-10-01 温州盛诺汽车电器有限公司 Electronic pressure sensor
CN204630681U (en) * 2015-03-26 2015-09-09 西安远方航空技术发展总公司 A kind of pressure transducer
CN205580609U (en) * 2016-04-27 2016-09-14 鞍山沃天传感技术有限公司 Base is pressed extremely in pressure sensor integration

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201464117U (en) * 2009-06-01 2010-05-12 杭州科岛微电子有限公司 Electronic oil pressure sensor
CN202493310U (en) * 2012-02-19 2012-10-17 杭州科岛微电子有限公司 Electronic oil pressure sensor of ratio resistance mode
CN202533212U (en) * 2012-03-03 2012-11-14 杭州科岛微电子有限公司 Electronic oil pressure sensor with dynamic equivalent mode
CN203858059U (en) * 2014-05-13 2014-10-01 温州盛诺汽车电器有限公司 Electronic pressure sensor
CN204630681U (en) * 2015-03-26 2015-09-09 西安远方航空技术发展总公司 A kind of pressure transducer
CN205580609U (en) * 2016-04-27 2016-09-14 鞍山沃天传感技术有限公司 Base is pressed extremely in pressure sensor integration

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108106775A (en) * 2017-12-13 2018-06-01 芜湖致通汽车电子有限公司 A kind of temperature and pressure transmitter

Similar Documents

Publication Publication Date Title
CN201112865Y (en) Unidirectional high-pressure integrated gas sealing electric connector
CN106338356A (en) Pressure sensor
CN102008227A (en) Pressure sensor for heating container
CN203519233U (en) Balanced type diaphragm sealed pressure transmitter
CN204679204U (en) A kind of pressure unit
CN105547567A (en) Gauge age pressure sensor
CN204718729U (en) A kind of sewage pressure transmitter
CN203929309U (en) A kind of pressure unit that detects mud pressure
CN104848983A (en) Electronic pressure transducer
CN201514198U (en) Seal structure suitable for differential electric resistance strain gage and joint gage
CN203455131U (en) Pressure transmitter with dual-seal structure
CN208887837U (en) A kind of explosion-resistant enclosure of pressure transmitter
CN203205194U (en) Metal corrugated oil conservator for transformer
CN105277251A (en) Liquid level meter with double measuring pipes
CN202453136U (en) Novel capacitance pole plate suspension structure of differential metal capacitance diaphragm capsule
CN204188329U (en) A kind of electronic pressure transmitter
CN201364211Y (en) Locomotive pressure transmitter
CN204679207U (en) The two damping pressure transmitter of a kind of binodal
CN201688939U (en) Hydraulic isolating device for vacuuming and filling medium on site
CN201302504Y (en) Annular liquid leakage detection device for cylindrical metal cabin
CN203367701U (en) Waterproof connector for ultrasonic measurement of shaft
CN216717680U (en) Anti-corrosion pressure transmitter
CN216410455U (en) Miniature precision pressure sensor
CN207007416U (en) Pressure transmitter
CN201837496U (en) Extrusion pressure detection device of vacuum extruder

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20170118