CN106311908B - Short-circuited conducting sleeve device for assembling - Google Patents

Short-circuited conducting sleeve device for assembling Download PDF

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Publication number
CN106311908B
CN106311908B CN201510369126.0A CN201510369126A CN106311908B CN 106311908 B CN106311908 B CN 106311908B CN 201510369126 A CN201510369126 A CN 201510369126A CN 106311908 B CN106311908 B CN 106311908B
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China
Prior art keywords
short
conducting sleeve
circuited conducting
free
bending
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CN201510369126.0A
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Chinese (zh)
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CN106311908A (en
Inventor
刘振德
张强
张云
熊春英
郭小军
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Shenzhen Horentop Technology Co Ltd
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Shenzhen Horentop Technology Co Ltd
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Priority to CN201510369126.0A priority Critical patent/CN106311908B/en
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Abstract

The present invention relates to a kind of short-circuited conducting sleeve device for assembling, for short-circuited conducting sleeve being assembled and is molded to chip portfolio, including upper mold, the lower die being correspondingly arranged with upper mold, and it is arranged on the bending punch pin in lower die, further include the floating roof with lower die elastic connection, and it is arranged on the stripper plate between upper mold and lower die, pre-bending inclined-plane is set on the stripper plate, floating roof is used for when upper mold is moved towards lower die, short-circuited conducting sleeve to be formed with two free ends is pressed into chip portfolio, the pre-bending inclined-plane of stripper plate is used for one of free end pre-bend of short-circuited conducting sleeve to be formed, bending punch pin is used to the free end bending forming of pre-bend form the short-circuited conducting sleeve of closure.The present invention sets pre-bending inclined-plane by setting floating roof and on stripper plate, so that the bending of short-circuited conducting sleeve graded, and then ensure the formed precision of short-circuited conducting sleeve, simultaneously because can complete repeatedly to bend deformation in one apparatus, multiple equipment is provided without the molding for short-circuited conducting sleeve, so as to reduce equipment cost.

Description

Short-circuited conducting sleeve device for assembling
Technical field
The present invention relates to a kind of decompressors, are used to assemble to related member short-circuited conducting sleeve progress punching press more particularly to one kind Device for assembling on part.
Background technology
Short-circuited conducting sleeve is the element applied in the equipment such as motor, available for reducing because drawing during the alternating flux that alternating current generates The vibration equipment of hair.Short-circuited conducting sleeve is generally by being in that the rod-shaped material of n shapes is interspersed on chip, then by device for assembling to rod-shaped material Two free end punching press bending deformations, so as to form ring-type and surround on chip.
A current punching press of device for assembling is difficult to make n shapes that annular be precisely formed, and the short-circuited conducting sleeve resulted in cannot be normal Realize its function.Device for assembling also is molded in two times, the first bending deformation n shape rod-shaped materials pre- on a device for assembling of the first step Two free ends, second step is in another set with making the n shape rod-shaped materials of pre-bending form annular on device, however this mode is grasped Make loaded down with trivial details, inefficiency, and need to provide two sets of device for assembling, cost is higher.
Invention content
Based on this, it is necessary to for short-circuited conducting sleeve assemble precision and it is inefficient the problem of, a kind of short-circuited conducting sleeve is provided and assembles dress It puts.
A kind of short-circuited conducting sleeve device for assembling, for assembling and being molded to chip portfolio by short-circuited conducting sleeve, including upper mold and upper mold The lower die being correspondingly arranged and the bending punch pin being arranged in lower die further include and the floating roof of lower die elastic connection and setting Stripper plate between upper mold and lower die, setting pre-bending inclined-plane on the stripper plate, the floating roof are used for when upper mold is towards lower die During movement, the short-circuited conducting sleeve to be formed with two free ends is pressed into chip portfolio, the pre-bending inclined-plane of the stripper plate is used to treat One of free end pre-bend of short-circuited conducting sleeve is molded, the bending punch pin is used for the free end bending forming of pre-bend with shape Into the short-circuited conducting sleeve of closure.
Above-mentioned short-circuited conducting sleeve device for assembling sets pre-bending inclined-plane by setting floating roof and on stripper plate so that short-circuited conducting sleeve can It bends by several times, and then ensures the formed precision of short-circuited conducting sleeve, simultaneously because can complete repeatedly to bend deformation in one apparatus, without Molding for short-circuited conducting sleeve provides multiple equipment, so as to reduce equipment cost, also improves the shaping efficiency of short-circuited conducting sleeve.
In one of the embodiments, the top surface of the floating roof be uncompressed anteposition in the top surface of upper mold and stripper plate it Between, when pre-bend free end is with the short-circuited conducting sleeve being closed is formed, the top surface of the floating roof is flushed with the top surface of stripper plate.
The impulse stroke of the stripper plate is less than the impulse stroke of floating roof in one of the embodiments,.
The floating roof is connect by spring with lower die in one of the embodiments, and is arranged between upper mold and lower die.
The top surface of the bending punch pin is plane in one of the embodiments,.
One is long and the other is short for two free ends of the short-circuited conducting sleeve to be formed in one of the embodiments, the free end of pre-bend For longer free end, it is detached from after the longer free end bending forming with the pre-bending inclined-plane.
The top on the pre-bending inclined-plane is less than the top surface of stripper plate in one of the embodiments,.
In one of the embodiments, the bottom end on the pre-bending inclined-plane and the bending punch pin in lower die or upper mold just It projects tangent.
Description of the drawings
Fig. 1-Fig. 3 be the short-circuited conducting sleeve device for assembling of an embodiment for assemble and be molded during short-circuited conducting sleeve short-circuited conducting sleeve and The structure diagram of the different conditions of chip portfolio;
Fig. 4-Fig. 6 be an embodiment short-circuited conducting sleeve device for assembling during short-circuited conducting sleeve is assembled the structure of different conditions show It is intended to.
Specific embodiment
Short-circuited conducting sleeve device for assembling provided by the invention is used to short-circuited conducting sleeve to be formed being assembled on chip portfolio simultaneously final Form the short-circuited conducting sleeve being closed.Chip portfolio can be the stack combinations of motor chip or other equipment such as relay Etc. chip portfolio using short-circuited conducting sleeve is needed in equipment.
For ease of clearly describing the assembling of the short-circuited conducting sleeve of the present invention and forming process, the process of assembling is divided into three phases.
First stage, as shown in fig. 1, short-circuited conducting sleeve 10 to be formed are pressed into chip portfolio 20.Wherein chip portfolio 20 have upper surface 21 and opposite lower surface 22.Short-circuited conducting sleeve 10 to be formed is in η shapes, has top 11 and by 11 both sides of top Two free ends 12,13 extended downwardly, one is long and the other is short for two of which free end 12,13, from the upper surface of chip portfolio 20 21 are pressed into across chip portfolio 20 and expose to the lower surface 22 of chip portfolio 20.Embodiment shown in figure is free end 12 than certainly By 13 length of end.Top 11 is contacted with the upper surface 21 of chip portfolio 20.
Second stage, as shown in Figure 2, the free end 12 of short-circuited conducting sleeve 10 to be formed is by pre-bend.The free end 12 Certain angle is bent towards free end 13 so that the spacing between free end 12 and free end 13 becomes smaller, and free end 12 has The trend of the lower surface 22 of contact chip combination 20.
Three phases, as shown in Figure 3, free end 12 are bent molding and form the short-circuited conducting sleeve 100 being closed.Wherein freely 12 bending of end overlaps to form the ring-type of closure, and free end 12 and the lower surface 22 of chip portfolio 20 connect with free end 13 It touches.
As shown in Figure 4, the short-circuited conducting sleeve device for assembling that one embodiment of the invention provides includes upper mold 30, corresponding with upper mold 30 The lower die 40 of setting.Upper mold 30 can be movable relatively with lower die 40, and in the present embodiment, upper mold 30 can be moved toward and away from lower die 40 It is dynamic.
Bending punch pin 50 is set in lower die 40.Bending punch pin 50 is for pre- in bending forming short-circuited conducting sleeve 10 to be formed The free end 12 of bending makes short-circuited conducting sleeve 10 to be formed form the short-circuited conducting sleeve 100 being closed, that is, is formed as shown in figs. 3 and 6 State.
A stripper plate 60 is additionally provided between upper mold 30 and lower die 40, pre-bending inclined-plane 601 is set on the stripper plate 60.De- material Plate 60 is assembled in short-circuited conducting sleeve and forming process is for coordinating upper mold 30 to press chip portfolio 20 together, and pre-bending inclined-plane 601 is then used for By 12 pre-bend of one of free end of short-circuited conducting sleeve to be formed, state as shown in figures 2 and 5, i.e. free end 12 are formed It is bent certain angle and towards free end 13.
Also one floating roof 70 of elastic connection, the floating roof 70 are used for when upper mold 30 is moved towards lower die 40 in lower die 40, will Short-circuited conducting sleeve to be formed 10 with two free ends 12,13 is pressed into chip portfolio 20, that is, forms state as shown in figs. 1 and 4.
The process for assembling short-circuited conducting sleeve of short-circuited conducting sleeve device for assembling provided by the invention is made in conjunction with Fig. 4-Fig. 6 below It is bright.First, chip portfolio 20 is placed between upper mold 30 and lower die 40, and by 701 holding of top surface of floating roof 70.Short circuit to be formed What ring 10 was placed in chip portfolio 20 treats pushed position.Then, upper mold 30 is moved towards lower die 40, and upper mold 30 is pressed in chip portfolio On 20 upper surface 21 so that the top 11 of short-circuited conducting sleeve 10 to be formed is contacted with the upper surface 21 of chip portfolio 20, free end 12, 13 both pass through and expose in the lower surface of chip portfolio 20 22.
As shown in Figure 5, further moving downward with upper mold 30, floating roof 70 is compressed, and free end 12 is by de- material The pre-bending inclined-plane 601 of plate 60 stops, and so that free end 12 is bent towards free end 13, until the top surface 602 of stripper plate 30 is pressed Hold the lower surface 22 of chip portfolio 20.
Then, upper mold 30 further moves downward, and presses chip portfolio 20 so that stripper plate 60 and floating roof 70 are further It is moved towards lower die 40, and finally as shown in Figure 6, the top surface 501 of bending punch pin 50 is made to support the free end 12 of pre-bend, is made The short-circuited conducting sleeve 100 of 12 bending forming of free end to form closure, free end 12 and free end 13, which overlap, at this time forms close ring, And free end 12 is contacted with the lower surface 22 of chip portfolio 20.
The present invention sets pre-bending inclined-plane by setting floating roof and on stripper plate so that and short-circuited conducting sleeve graded is bent, into And ensure the formed precision of short-circuited conducting sleeve, simultaneously because can complete repeatedly to bend deformation in one apparatus, without for short-circuited conducting sleeve Molding provides multiple equipment, so as to reduce equipment cost, also improves the shaping efficiency of short-circuited conducting sleeve.
As shown in Figure 4, the top surface 701 of the floating roof 70 is uncompressed anteposition in upper mold 30 and the top surface of stripper plate 60 Between 602, as shwon in Figures 5 and 6, when pre-bend free end 12 is with the short-circuited conducting sleeve 100 being closed is formed, the top of the floating roof 70 Face 701 is flushed with the top surface 602 of stripper plate 60.It is appreciated that since floating roof 70 moves before stripper plate 60, the stripper plate 60 impulse stroke is less than the impulse stroke of floating roof 70.
Further, the floating roof 70 is connect by spring 71 with lower die 40, and is arranged between upper mold 30 and lower die 40.
The top surface 501 of the bending punch pin 50 be plane, so as to make 12 bending forming of free end during stress more It is uniformly full, free end 12 is made preferably to be contacted with the lower surface of chip portfolio 20 22.
As shown in Figure 6, it is detached from after 12 bending forming of free end with the pre-bending inclined-plane 601.The top on pre-bending inclined-plane 601 Less than the top surface 602 of stripper plate 60.
Further, the bottom end on the pre-bending inclined-plane 601 and orthographic projection of the bending punch pin 50 in lower die or upper mold It is tangent, so set, making bending punch pin 50 can be at the free end 12 of bending forming pre-bend, with the free end 12 of pre-bend Contact area bigger, the precision for making the bending forming of free end 12 is more preferable, and molding yield is assembled with ensure short-circuited conducting sleeve.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (7)

1. a kind of short-circuited conducting sleeve device for assembling, for assembling and being molded to chip portfolio by short-circuited conducting sleeve, including upper mold and upper mold pair The lower die that should be set and the bending punch pin being arranged in lower die, it is characterised in that:It further includes floating with lower die elastic connection Top and the stripper plate that is arranged between upper mold and lower die, setting pre-bending inclined-plane on the stripper plate, the floating roof be used for when Mould towards lower die move when, by with two free ends short-circuited conducting sleeve to be formed be pressed into chip portfolio, the pre- curving of the stripper plate Face is used for one of free end pre-bend of short-circuited conducting sleeve to be formed, and the bending punch pin is used for the free end of pre-bend is curved For foldable type to form the short-circuited conducting sleeve of closure, the top surface of the floating roof is uncompressed anteposition between upper mold and the top surface of stripper plate, During the short-circuited conducting sleeve that pre-bend free end and formation are closed, the top surface of the floating roof is flushed with the top surface of stripper plate.
2. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that the impulse stroke of the stripper plate is less than floating The impulse stroke on top.
3. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that the floating roof is connected by spring and lower die It connects, and is arranged between upper mold and lower die.
4. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that the top surface of the bending punch pin is plane.
5. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that two free ends of the short-circuited conducting sleeve to be formed One is long and the other is short, and the free end of pre-bend is longer free end, after the longer free end bending forming with the pre- curving Emaciated face from.
6. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that the top on the pre-bending inclined-plane is less than de- material The top surface of plate.
7. short-circuited conducting sleeve device for assembling according to claim 1, which is characterized in that the bottom end on the pre-bending inclined-plane with it is described curved It is tangent to repulse or subdue the enemy orthographic projection of the head in lower die or upper mold.
CN201510369126.0A 2015-06-29 2015-06-29 Short-circuited conducting sleeve device for assembling Active CN106311908B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510369126.0A CN106311908B (en) 2015-06-29 2015-06-29 Short-circuited conducting sleeve device for assembling

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510369126.0A CN106311908B (en) 2015-06-29 2015-06-29 Short-circuited conducting sleeve device for assembling

Publications (2)

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CN106311908A CN106311908A (en) 2017-01-11
CN106311908B true CN106311908B (en) 2018-06-15

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933032A (en) * 1982-08-16 1984-02-22 Hitachi Ltd Metallic die for bending sheet
JPS60108115A (en) * 1983-11-16 1985-06-13 Fuji Electric Co Ltd Bending die for press forming
CN201088992Y (en) * 2007-06-28 2008-07-23 杭宜银 Double-bending combination die
CN201264057Y (en) * 2008-08-28 2009-07-01 比亚迪股份有限公司 Bent mold structure
CN201930993U (en) * 2010-12-07 2011-08-17 亿和精密工业(苏州)有限公司 Patting mechanism
CN104681355A (en) * 2015-02-16 2015-06-03 湖州美泰电气科技有限公司 Assembly device for iron core and short circuit ring in alternating current contactor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5933032A (en) * 1982-08-16 1984-02-22 Hitachi Ltd Metallic die for bending sheet
JPS60108115A (en) * 1983-11-16 1985-06-13 Fuji Electric Co Ltd Bending die for press forming
CN201088992Y (en) * 2007-06-28 2008-07-23 杭宜银 Double-bending combination die
CN201264057Y (en) * 2008-08-28 2009-07-01 比亚迪股份有限公司 Bent mold structure
CN201930993U (en) * 2010-12-07 2011-08-17 亿和精密工业(苏州)有限公司 Patting mechanism
CN104681355A (en) * 2015-02-16 2015-06-03 湖州美泰电气科技有限公司 Assembly device for iron core and short circuit ring in alternating current contactor

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