CN106298125A - Chip-R cutter sweep - Google Patents
Chip-R cutter sweep Download PDFInfo
- Publication number
- CN106298125A CN106298125A CN201510234395.6A CN201510234395A CN106298125A CN 106298125 A CN106298125 A CN 106298125A CN 201510234395 A CN201510234395 A CN 201510234395A CN 106298125 A CN106298125 A CN 106298125A
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- CN
- China
- Prior art keywords
- chip
- locating platform
- cutter sweep
- described locating
- slide way
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
The invention discloses the Chip-R cutter sweep of a kind of laser surface trimming, including locating platform, described locating platform side is provided with cross slide way, described cross slide way is provided with slidably mechanical arm, described locating platform is arranged over laser machine, described locating platform is provided with location induction installation, and described Chip-R cutter sweep connects automaton.This device achieves high efficiency and the cutting of high precision rate Chip-R of automatization, avoid manual grinding and cut the damage that product is brought, the stability of cut is high, highly versatile, one machine can detect the product of more than 20 kinds different models, and product quality report can be automatically generated, provide the most important data for research and development of products and production management.
Description
Technical field
The invention belongs to Chip-R device field, particularly relate to Chip-R cutter sweep.
Background technology
Along with electronic market quickly grows, electronics passive device such as Chip-R has evolved into high-quality, miniaturization, in Chip-R detection and cutting flow process, traditional outward appearance and defect of being detected Chip-R by original artificial microscope by naked eyes, but manual detection has many shortcomings, human eye can produce fatigue after long-time observation, thus causes Chip-R quality instability, production efficiency Chip-R low, tested outward appearance precision inadequate；If Chip-R has detection one bad product, then can together with when a permutation all abandon not, cause product to be wasted, artificial cutting mostly is manual grinding, has certain damage to product, and work efficiency is low, so, the accurately cutting of Chip-R is non-the normally off key.
Summary of the invention
In order to solve the problems referred to above, the invention provides the Chip-R cutter sweep of a kind of laser surface trimming.
According to an aspect of the present invention, a kind of Chip-R cutter sweep is provided, including locating platform, described locating platform side is provided with cross slide way, described cross slide way is provided with slidably mechanical arm, described locating platform is arranged over laser machine, and described Chip-R cutter sweep connects automaton.It provides the benefit that: this device achieves high efficiency and the cutting of high precision rate Chip-R of automatization, avoid manual grinding and cut the damage that product is brought, the stability of cut is high, highly versatile, one machine can detect the product of more than 20 kinds different models, and product quality report can be automatically generated, provide the most important data for research and development of products and production management.
In some embodiments, described locating platform is provided with location induction installation.It provides the benefit that: achieve the full-automation of cut, improves production efficiency and cutting accurate rate.
Accompanying drawing explanation
Fig. 1 is the Structure and Process schematic diagram of the present invention.
In figure: 1-locating platform, 2-cross slide way, 3-mechanical arm, 4-laser machine.
Detailed description of the invention
1 the present invention is further illustrated below in conjunction with the accompanying drawings.Accompanying drawing 1 schematically shows Chip-R cutter sweep of the present invention, including locating platform 1, described locating platform 1 side is provided with cross slide way 2, described cross slide way 2 is provided with slidably mechanical arm 3, described locating platform 1 is arranged over laser machine 4, and described Chip-R cutter sweep connects automaton.
Preferably, described locating platform 1 is provided with location induction installation.
During work, detect complete Chip-R information input automaton, mechanical arm 3 slides on cross slide way 2 and captures Chip-R complete for detection to locating platform 1, after location induction installation on locating platform 1 senses Chip-R, automaton is given by information, automaton is according to the detection information of Chip-R, bad Chip-R coordinate is accurately cut by instruction laser machine 4, and automaton automatically generates product quality report, achieve the full-automation of cut, improve production efficiency and cutting accurate rate.
Above-described is only some embodiments of the present invention, it is noted that for the person of ordinary skill of the art, on the premise of the creation without departing from the present invention is conceived, it is also possible to making other deformation and improve, these broadly fall into protection scope of the present invention.
Claims (2)
1. Chip-R cutter sweep, including locating platform (1), described locating platform (1) side is provided with cross slide way (2), described cross slide way (2) is provided with slidably mechanical arm (3), it is characterized in that, described locating platform (1) is arranged over laser machine (4), and described Chip-R cutter sweep connects automaton.
2. Chip-R cutter sweep as claimed in claim 1, it is characterised in that described locating platform (1) is provided with location induction installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510234395.6A CN106298125A (en) | 2015-05-11 | 2015-05-11 | Chip-R cutter sweep |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510234395.6A CN106298125A (en) | 2015-05-11 | 2015-05-11 | Chip-R cutter sweep |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106298125A true CN106298125A (en) | 2017-01-04 |
Family
ID=57630620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510234395.6A Pending CN106298125A (en) | 2015-05-11 | 2015-05-11 | Chip-R cutter sweep |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106298125A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021259120A1 (en) * | 2020-06-22 | 2021-12-30 | 长鑫存储技术有限公司 | Automatic operation method and system for laser platform |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201579539U (en) * | 2009-10-28 | 2010-09-15 | 深圳市华德激光技术有限公司 | PCB/FPC laser cutting machine |
| CN202622185U (en) * | 2012-05-18 | 2012-12-26 | 苏州启成精密工业有限公司 | Cutting machine |
| CN104084697A (en) * | 2014-06-26 | 2014-10-08 | 长春光华微电子设备工程中心有限公司 | Laser cutting equipment for stainless steel chip |
| WO2014185878A2 (en) * | 2013-05-13 | 2014-11-20 | Coşkunöz Metal Form Maki̇na Endüstri̇ Ve Ti̇c. A.Ş. | A laser processing bench with a movement mechanism |
-
2015
- 2015-05-11 CN CN201510234395.6A patent/CN106298125A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201579539U (en) * | 2009-10-28 | 2010-09-15 | 深圳市华德激光技术有限公司 | PCB/FPC laser cutting machine |
| CN202622185U (en) * | 2012-05-18 | 2012-12-26 | 苏州启成精密工业有限公司 | Cutting machine |
| WO2014185878A2 (en) * | 2013-05-13 | 2014-11-20 | Coşkunöz Metal Form Maki̇na Endüstri̇ Ve Ti̇c. A.Ş. | A laser processing bench with a movement mechanism |
| CN104084697A (en) * | 2014-06-26 | 2014-10-08 | 长春光华微电子设备工程中心有限公司 | Laser cutting equipment for stainless steel chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021259120A1 (en) * | 2020-06-22 | 2021-12-30 | 长鑫存储技术有限公司 | Automatic operation method and system for laser platform |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |