CN106298125A - Chip-R cutter sweep - Google Patents

Chip-R cutter sweep Download PDF

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Publication number
CN106298125A
CN106298125A CN201510234395.6A CN201510234395A CN106298125A CN 106298125 A CN106298125 A CN 106298125A CN 201510234395 A CN201510234395 A CN 201510234395A CN 106298125 A CN106298125 A CN 106298125A
Authority
CN
China
Prior art keywords
chip
locating platform
cutter sweep
slide way
cut
Prior art date
Application number
CN201510234395.6A
Other languages
Chinese (zh)
Inventor
李刚
何志峰
Original Assignee
昆山市和博电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 昆山市和博电子科技有限公司 filed Critical 昆山市和博电子科技有限公司
Priority to CN201510234395.6A priority Critical patent/CN106298125A/en
Publication of CN106298125A publication Critical patent/CN106298125A/en

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Abstract

The invention discloses the Chip-R cutter sweep of a kind of laser surface trimming, including locating platform, described locating platform side is provided with cross slide way, described cross slide way is provided with slidably mechanical arm, described locating platform is arranged over laser machine, described locating platform is provided with location induction installation, and described Chip-R cutter sweep connects automaton.This device achieves high efficiency and the cutting of high precision rate Chip-R of automatization, avoid manual grinding and cut the damage that product is brought, the stability of cut is high, highly versatile, one machine can detect the product of more than 20 kinds different models, and product quality report can be automatically generated, provide the most important data for research and development of products and production management.

Description

Chip-R cutter sweep

Technical field

The invention belongs to Chip-R device field, particularly relate to Chip-R cutter sweep.

Background technology

Along with electronic market quickly grows, electronics passive device such as Chip-R has evolved into high-quality, miniaturization, in Chip-R detection and cutting flow process, traditional outward appearance and defect of being detected Chip-R by original artificial microscope by naked eyes, but manual detection has many shortcomings, human eye can produce fatigue after long-time observation, thus causes Chip-R quality instability, production efficiency Chip-R low, tested outward appearance precision inadequate;If Chip-R has detection one bad product, then can together with when a permutation all abandon not, cause product to be wasted, artificial cutting mostly is manual grinding, has certain damage to product, and work efficiency is low, so, the accurately cutting of Chip-R is non-the normally off key.

Summary of the invention

In order to solve the problems referred to above, the invention provides the Chip-R cutter sweep of a kind of laser surface trimming.

According to an aspect of the present invention, a kind of Chip-R cutter sweep is provided, including locating platform, described locating platform side is provided with cross slide way, described cross slide way is provided with slidably mechanical arm, described locating platform is arranged over laser machine, and described Chip-R cutter sweep connects automaton.It provides the benefit that: this device achieves high efficiency and the cutting of high precision rate Chip-R of automatization, avoid manual grinding and cut the damage that product is brought, the stability of cut is high, highly versatile, one machine can detect the product of more than 20 kinds different models, and product quality report can be automatically generated, provide the most important data for research and development of products and production management.

In some embodiments, described locating platform is provided with location induction installation.It provides the benefit that: achieve the full-automation of cut, improves production efficiency and cutting accurate rate.

Accompanying drawing explanation

Fig. 1 is the Structure and Process schematic diagram of the present invention.

In figure: 1-locating platform, 2-cross slide way, 3-mechanical arm, 4-laser machine.

Detailed description of the invention

1 the present invention is further illustrated below in conjunction with the accompanying drawings.Accompanying drawing 1 schematically shows Chip-R cutter sweep of the present invention, including locating platform 1, described locating platform 1 side is provided with cross slide way 2, described cross slide way 2 is provided with slidably mechanical arm 3, described locating platform 1 is arranged over laser machine 4, and described Chip-R cutter sweep connects automaton.

Preferably, described locating platform 1 is provided with location induction installation.

During work, detect complete Chip-R information input automaton, mechanical arm 3 slides on cross slide way 2 and captures Chip-R complete for detection to locating platform 1, after location induction installation on locating platform 1 senses Chip-R, automaton is given by information, automaton is according to the detection information of Chip-R, bad Chip-R coordinate is accurately cut by instruction laser machine 4, and automaton automatically generates product quality report, achieve the full-automation of cut, improve production efficiency and cutting accurate rate.

Above-described is only some embodiments of the present invention, it is noted that for the person of ordinary skill of the art, on the premise of the creation without departing from the present invention is conceived, it is also possible to making other deformation and improve, these broadly fall into protection scope of the present invention.

Claims (2)

1. Chip-R cutter sweep, including locating platform (1), described locating platform (1) side is provided with cross slide way (2), described cross slide way (2) is provided with slidably mechanical arm (3), it is characterized in that, described locating platform (1) is arranged over laser machine (4), and described Chip-R cutter sweep connects automaton.
2. Chip-R cutter sweep as claimed in claim 1, it is characterised in that described locating platform (1) is provided with location induction installation.
CN201510234395.6A 2015-05-11 2015-05-11 Chip-R cutter sweep CN106298125A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510234395.6A CN106298125A (en) 2015-05-11 2015-05-11 Chip-R cutter sweep

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510234395.6A CN106298125A (en) 2015-05-11 2015-05-11 Chip-R cutter sweep

Publications (1)

Publication Number Publication Date
CN106298125A true CN106298125A (en) 2017-01-04

Family

ID=57630620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510234395.6A CN106298125A (en) 2015-05-11 2015-05-11 Chip-R cutter sweep

Country Status (1)

Country Link
CN (1) CN106298125A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201579539U (en) * 2009-10-28 2010-09-15 深圳市华德激光技术有限公司 PCB/FPC laser cutting machine
CN202622185U (en) * 2012-05-18 2012-12-26 苏州启成精密工业有限公司 Cutting machine
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip
WO2014185878A2 (en) * 2013-05-13 2014-11-20 Coşkunöz Metal Form Maki̇na Endüstri̇ Ve Ti̇c. A.Ş. A laser processing bench with a movement mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201579539U (en) * 2009-10-28 2010-09-15 深圳市华德激光技术有限公司 PCB/FPC laser cutting machine
CN202622185U (en) * 2012-05-18 2012-12-26 苏州启成精密工业有限公司 Cutting machine
WO2014185878A2 (en) * 2013-05-13 2014-11-20 Coşkunöz Metal Form Maki̇na Endüstri̇ Ve Ti̇c. A.Ş. A laser processing bench with a movement mechanism
CN104084697A (en) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 Laser cutting equipment for stainless steel chip

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Application publication date: 20170104