CN106161885A - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN106161885A CN106161885A CN201510162449.2A CN201510162449A CN106161885A CN 106161885 A CN106161885 A CN 106161885A CN 201510162449 A CN201510162449 A CN 201510162449A CN 106161885 A CN106161885 A CN 106161885A
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- Prior art keywords
- dual
- image sensor
- side image
- camera module
- circuit board
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Abstract
A kind of camera module, this camera module includes circuit board, lens assembly and dual-side image sensor, the quantity of this lens assembly is two, this two lens assemblies electrical connection is on the board and the dead in line of this two lens assemblies, through on this circuit board offer through hole, this dual-side image sensor includes two photosurfaces being oppositely arranged, this dual-side image sensor is installed in this through hole and is positioned between this two lens assemblies, so that this two lens assemblies are respectively facing this corresponding photosurface of dual-side image sensor.The camera module of the present invention, two lens assemblies share a dual-side image sensor and circuit board, have only to be connected a circuit board with mainboard, not only increase production efficiency, also a saving production cost during assembling.
Description
Technical field
The present invention relates to field of photography, particularly relate to a kind of camera module.
Background technology
The electronic installation such as mobile phone, panel computer is provided with front camera module and rear camera module now, during assembling, is generally respectively assembled in the circuit board of front camera module and rear camera module on the mainboard of mobile phone.But, being respectively assembled in the circuit board of two camera modules on the mainboard of mobile phone can waste man-hour, reduces production efficiency.Additionally, the front camera of traditional electronic devices and rear camera module are required to a circuit board and dual-side image sensor, add the production cost of electronic installation.
Content of the invention
In view of foregoing, it is necessary to provide a kind of camera module can saved and assemble man-hour and save production cost.
A kind of camera module, this camera module includes circuit board, lens assembly and dual-side image sensor, the quantity of this lens assembly is two, this two lens assemblies are electrically connected this circuit board and the dead in line of this two lens assemblies, through on this circuit board offer through hole, this dual-side image sensor includes two photosurfaces being oppositely arranged, this dual-side image sensor is installed in this through hole and is positioned between this two lens assemblies, so that this two lens assemblies are respectively facing this corresponding photosurface of dual-side image sensor.
A kind of camera module, this camera module includes circuit board, lens assembly and dual-side image sensor, this dual-side image sensor is located at the side of this circuit board, this dual-side image sensor includes two photosurfaces being oppositely arranged, the quantity of this lens assembly is two, this two lens assemblies are electrically connected this circuit board and the dead in line of this two lens assemblies, and this dual-side image sensor is positioned between this two lens assemblies so that this two lens assemblies are respectively facing this corresponding photosurface of dual-side image sensor.
The camera module of the present invention, by two lens assemblies are shared a circuit board and dual-side image sensor, can reduce while having saved production cost and assemble man-hour.
Brief description
Fig. 1 is the schematic perspective view of the electronic installation that the embodiment of the present invention provides.
Fig. 2 is the schematic perspective view of the camera module of the electronic installation of first embodiment of the invention.
Fig. 3 is the perspective exploded view of camera module shown in Fig. 2.
Fig. 4 is the decomposing schematic representation of the camera module of second embodiment of the invention.
Fig. 5 is the decomposing schematic representation of the camera module of third embodiment of the invention.
Main element symbol description
Electronic installation 100
Housing 10
Camera module the 30th, the 50th, 70
Circuit board the 32nd, the 52nd, 72
First surface 322
Second surface 324
Through hole the 326th, 726
Lens assembly the 34th, the 54th, 74
Camera lens 342
Pedestal 344
Connector the 37th, the 57th, 77
Dual-side image sensor the 36th, the 56th, 76
Photosurface the 362nd, the 562nd, 762
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
Referring to Fig. 1, embodiment of the present invention provides a kind of electronic installation 100, and it includes housing 10 and the camera module 30 housing and being installed in housing 10.In the present embodiment, electronic installation 100 is mobile phone, it will be understood that electronic installation 100 also can be other electronic installations, such as panel computer.
Please refer to Fig. 2 to Fig. 3, first embodiment of the invention provides a kind of camera module 30, and it includes that the 32nd, circuit board is electrically connected with lens assembly the 34th, dual-side image sensor 36 over the circuit board 32 and connector 37.Circuit board 32 is connected in order to the mainboard (not shown) with electronic installation 100.The quantity of lens assembly 34 is two, and two lens assemblies 34 are electrically connected circuit board 32, respectively as front camera and the rear camera of electronic installation 100.Dual-side image sensor 36 connects over the circuit board 32 and is positioned between two lens assemblies 34, allows it to sense the light being entered by two lens assemblies 34 and produces digital signal.Connector 37 connects over the circuit board 32 and arranges with lens assembly 34 interval.Connector 37 is electrically connected with dual-side image sensor 36, to process the digital signal producing on dual-side image sensor 36 transmission to the processor (not shown) on electronic installation 100 mainboard.
In the present embodiment, circuit board 32 is flexible PCB.Circuit board 32 includes relative first surface 322 and second surface 324.The through first surface of circuit board 32 322 and second surface 324 form through hole 326.Two lens assemblies 34 are connected on first surface 322 and second surface 324 and the dead in line of two lens assemblies 34.In the present embodiment, each lens assembly 34 includes camera lens 342 and pedestal 344.Pedestal 344 is connected with circuit board 32.Camera lens 342 and pedestal 344 are provided with the screw thread matching, and camera lens 342 is housed by screw thread and is installed in pedestal 344.Dual-side image sensor 36 includes two photosurfaces being oppositely arranged 362.Dual-side image sensor 36 is installed at through hole 326 and is positioned between two lens assemblies 34, so that two lens assemblies 54 are respectively facing the corresponding photosurface of dual-side image sensor 36 362, so that all can be radiated on dual-side image sensor 36 by the light of two camera lenses 342 incidence to produce digital signal.In the present embodiment, dual-side image sensor 36 is installed on the first surface 322 of circuit board 32 and covers and sets through hole 326.It is appreciated that dual-side image sensor 36 also can be arranged on the second surface 324 of circuit board 32.Connector 37 is installed on first surface 322 and is electrically connected with dual-side image sensor 36.The processor that the digital signal that two lens assemblies 34 produce on dual-side image sensor 36 is all transmitted to electronic installation 100 mainboard by connector 37 is processed.
Referring to Fig. 4, the camera module 50 that second embodiment of the invention provides, its structure is roughly the same with the camera module 30 of first embodiment, all includes circuit board the 52nd, lens assembly the 54th, dual-side image sensor 56 and connector 57.Dual-side image sensor 56 includes two photosurfaces 562 being oppositely arranged.The quantity of lens assembly 54 is two, and two lens assemblies 54 are electrically connected the dead in line of circuit board 52 and two lens assemblies 54.Dual-side image sensor 56 is positioned between two lens assemblies 54 so that two lens assemblies 54 are respectively facing the corresponding photosurface of dual-side image sensor 56 562.Connector 37 connects over the circuit board 32 and is electrically connected with dual-side image sensor 36.Difference is, the dual-side image sensor 56 of camera module 50 is located on the side of circuit board 52.
Referring to Fig. 5, the camera module 70 that third embodiment of the invention provides, its structure is roughly the same with the camera module 30 of first embodiment, all includes circuit board the 72nd, lens assembly the 74th, dual-side image sensor 76 and connector 77.The quantity of lens assembly 74 is two, and two lens assemblies 74 are electrically connected the dead in line of circuit board 72 and two lens assemblies 74.Dual-side image sensor 76 includes two photosurfaces 762 being oppositely arranged.Dual-side image sensor 56 is positioned between two lens assemblies 74 so that two lens assemblies 74 are respectively facing the corresponding photosurface of dual-side image sensor 76 762.Connector 77 is connected on circuit board 72 and is electrically connected with dual-side image sensor 76.Difference is, the dual-side image sensor 76 of camera module 70 is embedded in the through hole 726 of circuit board 72.
During assembling, first, dual-side image sensor 36 and connector 37 are spaced connection to be electrically connected with connector 37 over the circuit board 32 and by dual-side image sensor 36.Then, two pedestals 344 are connected to be coaxially disposed on relative two surfaces of circuit board 32 and with dual-side image sensor 36.Secondly, two camera lenses 342 are housed respectively and are installed in corresponding pedestal 344.Finally, the mainboard of circuit board 32 and electronic installation 100 is connected.
The camera module 30 of the present invention, two lens assemblies 34 are installed on a circuit board 32 by it, when being therefore assembled in two lens assemblies 34 on the mainboard of electronic installation 100, it is only necessary to be connected a circuit board 32 with mainboard, not only increase production efficiency, also a saving production cost.Two lens assemblies 34 dead in line of the present invention, dual-side image sensor 36 is positioned between two lens assemblies 34, this kind of design makes two lens assemblies 34 can share a dual-side image sensor 36, save the production cost of camera module 30 further, and the height of camera module 30 can be reduced, so that use the electronic installation 100 of this camera module more lightening.In addition, two lens assemblies 34 are shared a connector 37 by the camera module 30 of the present invention, the production cost of camera module 30 can be saved further.
Being appreciated that lens assembly 34 can also include optical filter, this optical filter can be installed in the end near circuit board 32 for the pedestal 344.This optical filter can be infrared fileter.
It is appreciated that on camera lens 342 the protected film that is also sticked.
It is appreciated that connector 37 could alternatively be golden finger.It is appreciated that the camera lens of two lens assemblies 34 can be the camera lens of same type or different types of camera lens.
In addition, those skilled in the art also can do other changes, certainly, these changes done according to present invention spirit in present invention spirit, all should be included in scope of the present invention.
Claims (10)
1. a camera module, this camera module includes circuit board, lens assembly and dual-side image sensor, it is characterized in that: the quantity of this lens assembly is two, this two lens assemblies are electrically connected this circuit board and the dead in line of this two lens assemblies, through on this circuit board offer through hole, this dual-side image sensor includes two photosurfaces being oppositely arranged, this dual-side image sensor is installed in this through hole and is positioned between this two lens assemblies, so that this two lens assemblies are respectively facing this corresponding photosurface of dual-side image sensor.
2. camera module as claimed in claim 1, it is characterised in that: this dual-side image sensor is connected to this circuit board towards on one of them surface of this lens assembly.
3. camera module as claimed in claim 1, it is characterised in that: this dual-side image sensor is embedded in this through hole.
4. camera module as claimed in claim 1, it is characterised in that: this camera module also includes connector, and this connector connects on the board and is electrically connected with this dual-side image sensor.
5. camera module as claimed in claim 1, it is characterised in that: each lens assembly includes camera lens and pedestal, and pedestal is connected with this circuit board, and this camera lens and this pedestal are provided with the screw thread matching, and this camera lens and this pedestal are threaded connection.
6. camera module as claimed in claim 5, it is characterised in that: each lens assembly also includes optical filter, and the installing of this optical filter is on the base and near this circuit board.
7. a camera module, this camera module includes circuit board, lens assembly and dual-side image sensor, it is characterized in that: this dual-side image sensor is located at the side of this circuit board, this dual-side image sensor includes two photosurfaces being oppositely arranged, the quantity of this lens assembly is two, this two lens assemblies are electrically connected this circuit board and the dead in line of this two lens assemblies, and this dual-side image sensor is positioned between this two lens assemblies so that this two lens assemblies are respectively facing this corresponding photosurface of dual-side image sensor.
8. camera module as claimed in claim 7, it is characterised in that: this camera module also includes connector, and this connector connects on the board and is electrically connected with this dual-side image sensor.
9. camera module as claimed in claim 7, it is characterised in that: each lens assembly includes camera lens and pedestal, and this pedestal connects on the board, and this camera lens and this pedestal are provided with the screw thread matching, and this camera lens and this pedestal are threaded connection.
10. camera module as claimed in claim 9, it is characterised in that: each lens assembly also includes optical filter, and the installing of this optical filter is on the base and near this circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510162449.2A CN106161885A (en) | 2015-04-08 | 2015-04-08 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510162449.2A CN106161885A (en) | 2015-04-08 | 2015-04-08 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106161885A true CN106161885A (en) | 2016-11-23 |
Family
ID=57335557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510162449.2A Pending CN106161885A (en) | 2015-04-08 | 2015-04-08 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106161885A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108111732A (en) * | 2017-12-27 | 2018-06-01 | 信利光电股份有限公司 | A kind of camera module |
| CN108391038A (en) * | 2018-04-24 | 2018-08-10 | Oppo广东移动通信有限公司 | Electronic device and its CCD camera assembly |
| CN108495010A (en) * | 2018-05-28 | 2018-09-04 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| CN108632412A (en) * | 2018-05-15 | 2018-10-09 | 维沃移动通信有限公司 | A kind of photographic device and mobile terminal |
| CN109167911A (en) * | 2018-09-03 | 2019-01-08 | 歌尔股份有限公司 | Image acquiring device, method and apparatus |
| CN112995447A (en) * | 2019-12-16 | 2021-06-18 | 三赢科技（深圳）有限公司 | Lens module and electronic device |
| CN112995438A (en) * | 2019-12-02 | 2021-06-18 | 北京小米移动软件有限公司 | Camera module, terminal equipment and control method of camera module |
| CN113965688A (en) * | 2021-11-30 | 2022-01-21 | 维沃移动通信有限公司 | Image sensor, camera module, camera device and control method |
| CN114040080A (en) * | 2021-11-30 | 2022-02-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115580672A (en) * | 2022-09-30 | 2023-01-06 | 维沃移动通信有限公司 | Electronic device |
| CN116841032A (en) * | 2023-05-31 | 2023-10-03 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image acquisition method |
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| CN101075074A (en) * | 2006-05-17 | 2007-11-21 | 特拉森有限公司 | Camera module and its manufacture |
| US20070269205A1 (en) * | 2006-05-17 | 2007-11-22 | Jong Hyun Lee | Camera module and manufacturing method thereof |
| JP2009044541A (en) * | 2007-08-09 | 2009-02-26 | Citizen Electronics Co Ltd | Dust countermeasure structure for camera module |
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| CN103839951A (en) * | 2012-11-21 | 2014-06-04 | 台湾积体电路制造股份有限公司 | Dual-Side Illumination Image Sensor Chips and Methods for Forming Same |
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| CN101075074A (en) * | 2006-05-17 | 2007-11-21 | 特拉森有限公司 | Camera module and its manufacture |
| US20070269205A1 (en) * | 2006-05-17 | 2007-11-22 | Jong Hyun Lee | Camera module and manufacturing method thereof |
| JP2009044541A (en) * | 2007-08-09 | 2009-02-26 | Citizen Electronics Co Ltd | Dust countermeasure structure for camera module |
| CN101566460A (en) * | 2008-04-24 | 2009-10-28 | 鸿富锦精密工业（深圳）有限公司 | Substrate detection system for double-sided circuit board, detection method and detection carrier therefor |
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Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108111732A (en) * | 2017-12-27 | 2018-06-01 | 信利光电股份有限公司 | A kind of camera module |
| CN108391038A (en) * | 2018-04-24 | 2018-08-10 | Oppo广东移动通信有限公司 | Electronic device and its CCD camera assembly |
| CN108391038B (en) * | 2018-04-24 | 2019-06-04 | Oppo广东移动通信有限公司 | Electronic device and its CCD camera assembly |
| US10785392B2 (en) | 2018-04-24 | 2020-09-22 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Electronic device and camera assembly thereof |
| US11006025B2 (en) | 2018-04-24 | 2021-05-11 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic device and camera assembly having ambient light sensor disposed on lens holder |
| EP3796636A4 (en) * | 2018-05-15 | 2021-06-02 | Vivo Mobile Communication Co., Ltd. | Camera device and mobile terminal |
| CN108632412A (en) * | 2018-05-15 | 2018-10-09 | 维沃移动通信有限公司 | A kind of photographic device and mobile terminal |
| US11563879B2 (en) | 2018-05-15 | 2023-01-24 | Vivo Mobile Communication Co., Ltd. | Image shooting apparatus and mobile terminal |
| WO2019218922A1 (en) * | 2018-05-15 | 2019-11-21 | 维沃移动通信有限公司 | Camera device and mobile terminal |
| CN108632412B (en) * | 2018-05-15 | 2020-01-21 | 维沃移动通信有限公司 | Camera device and mobile terminal |
| CN108495010A (en) * | 2018-05-28 | 2018-09-04 | 维沃移动通信有限公司 | A kind of camera module and mobile terminal |
| WO2019228126A1 (en) * | 2018-05-28 | 2019-12-05 | 维沃移动通信有限公司 | Camera module and mobile terminal |
| CN109167911B (en) * | 2018-09-03 | 2020-12-04 | 歌尔光学科技有限公司 | Image acquisition device, method and equipment |
| CN109167911A (en) * | 2018-09-03 | 2019-01-08 | 歌尔股份有限公司 | Image acquiring device, method and apparatus |
| CN112995438A (en) * | 2019-12-02 | 2021-06-18 | 北京小米移动软件有限公司 | Camera module, terminal equipment and control method of camera module |
| CN112995447A (en) * | 2019-12-16 | 2021-06-18 | 三赢科技（深圳）有限公司 | Lens module and electronic device |
| CN113965688A (en) * | 2021-11-30 | 2022-01-21 | 维沃移动通信有限公司 | Image sensor, camera module, camera device and control method |
| CN114040080A (en) * | 2021-11-30 | 2022-02-11 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN115580672A (en) * | 2022-09-30 | 2023-01-06 | 维沃移动通信有限公司 | Electronic device |
| CN116841032A (en) * | 2023-05-31 | 2023-10-03 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image acquisition method |
| CN116841032B (en) * | 2023-05-31 | 2024-06-04 | 极限人工智能有限公司 | Endoscope lens, electronic endoscope and image acquisition method |
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Application publication date: 20161123 |