CN106147669A - A kind of composite board adhesive of suppression formaldehyde capable of purifying air - Google Patents
A kind of composite board adhesive of suppression formaldehyde capable of purifying air Download PDFInfo
- Publication number
- CN106147669A CN106147669A CN201610764646.6A CN201610764646A CN106147669A CN 106147669 A CN106147669 A CN 106147669A CN 201610764646 A CN201610764646 A CN 201610764646A CN 106147669 A CN106147669 A CN 106147669A
- Authority
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- China
- Prior art keywords
- minute
- adhesive
- purifying air
- suppression
- distilled water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 title claims abstract description 36
- 239000000853 adhesive Substances 0.000 title claims abstract description 33
- 230000001070 adhesive Effects 0.000 title claims abstract description 33
- 239000002131 composite material Substances 0.000 title claims abstract description 13
- 230000001629 suppression Effects 0.000 title claims abstract description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 27
- ROOXNKNUYICQNP-UHFFFAOYSA-N Ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229940093612 Zein Drugs 0.000 claims abstract description 14
- 229920002494 Zein Polymers 0.000 claims abstract description 14
- 239000005019 zein Substances 0.000 claims abstract description 14
- 239000012153 distilled water Substances 0.000 claims abstract description 12
- DHMQDGOQFOQNFH-UHFFFAOYSA-N glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims abstract description 12
- XSQUKJJJFZCRTK-UHFFFAOYSA-N urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 10
- NTHWMYGWWRZVTN-UHFFFAOYSA-N Sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 235000019353 potassium silicate Nutrition 0.000 claims abstract description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N Maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229920000168 Microcrystalline cellulose Polymers 0.000 claims abstract description 8
- 239000004372 Polyvinyl alcohol Substances 0.000 claims abstract description 8
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229960000892 attapulgite Drugs 0.000 claims abstract description 8
- 235000019813 microcrystalline cellulose Nutrition 0.000 claims abstract description 8
- 239000008108 microcrystalline cellulose Substances 0.000 claims abstract description 8
- 229940016286 microcrystalline cellulose Drugs 0.000 claims abstract description 8
- 229910052625 palygorskite Inorganic materials 0.000 claims abstract description 8
- 229920002451 polyvinyl alcohol Polymers 0.000 claims abstract description 8
- HRPVXLWXLXDGHG-UHFFFAOYSA-N acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims abstract description 7
- 239000004202 carbamide Substances 0.000 claims abstract description 7
- 229960000539 carbamide Drugs 0.000 claims abstract description 7
- 235000013877 carbamide Nutrition 0.000 claims abstract description 7
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000004471 Glycine Substances 0.000 claims abstract description 6
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 claims abstract description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910000077 silane Inorganic materials 0.000 claims abstract description 6
- 238000003756 stirring Methods 0.000 claims description 12
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000000498 ball milling Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- -1 propylene Amide Chemical class 0.000 claims description 4
- 238000001354 calcination Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000047 product Substances 0.000 claims description 3
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N Sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 229910001948 sodium oxide Inorganic materials 0.000 claims 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N sulfonic acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 claims 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N Sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 230000003000 nontoxic Effects 0.000 abstract description 2
- 231100000252 nontoxic Toxicity 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 4
- 210000000582 Semen Anatomy 0.000 description 2
- 241000209149 Zea Species 0.000 description 2
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 235000005822 corn Nutrition 0.000 description 2
- 235000005824 corn Nutrition 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- BFNBIHQBYMNNAN-UHFFFAOYSA-N Ammonium sulfate Chemical compound N.N.OS(O)(=O)=O BFNBIHQBYMNNAN-UHFFFAOYSA-N 0.000 description 1
- QIVBCDIJIAJPQS-SECBINFHSA-N D-tryptophane Chemical compound C1=CC=C2C(C[C@@H](N)C(O)=O)=CNC2=C1 QIVBCDIJIAJPQS-SECBINFHSA-N 0.000 description 1
- 229960002449 Glycine Drugs 0.000 description 1
- 239000004472 Lysine Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 102000026947 Plant Proteins Human genes 0.000 description 1
- 108010064851 Plant Proteins Proteins 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 229910052921 ammonium sulfate Inorganic materials 0.000 description 1
- 235000011130 ammonium sulphate Nutrition 0.000 description 1
- 238000006065 biodegradation reaction Methods 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 235000014103 egg white Nutrition 0.000 description 1
- 210000000969 egg white Anatomy 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003797 essential amino acid Substances 0.000 description 1
- 235000020776 essential amino acid Nutrition 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 239000004459 forage Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 230000000050 nutritive Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 235000021118 plant-derived protein Nutrition 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 235000018102 proteins Nutrition 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 230000001105 regulatory Effects 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010025 steaming Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001960 triggered Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/04—Polymer mixtures characterised by other features containing interpenetrating networks
Abstract
The invention discloses the composite board adhesive of a kind of suppression formaldehyde capable of purifying air, be made up of the raw material of following weight portion: zein 100 110, acrylamide 89, maleic anhydride 2 2.5, Ammonium persulfate. 89, concentration are the Sodium hydroxide q. s of 40wt%, distilled water be appropriate, modulus is 2.8 waterglass 50 55, polyvinyl alcohol 9 10.5, tetraethyl orthosilicate 23, sulfamic acid 1.7 2, silane coupler kh550 1 1.2, microcrystalline Cellulose 34, attapulgite 9 10, carbamide 23, glycine 34, dimethoxydiphenylsilane 0.8 1.Adhesive excellent in stability of the present invention, cementing strength is high, and materials safety is nontoxic, and can adsorb the compositions such as the formaldehyde in air, plays the effect purifying air, has expanded the range of adhesive further.
Description
Technical field
The present invention relates to adhesive technical field, particularly relate to the composite board gluing of a kind of suppression formaldehyde capable of purifying air
Agent.
Background technology
Sheet material adhesive is that the surface glue of timber with timber or other objects is connected into the material being integrated.In the market
The most frequently used sheet material adhesive with Lauxite, phenolic resin, melamine resin as representative " three-aldehyde glue ", but
These three adhesive, all with formaldehyde as primary raw material, also exists free formaldehyde, and the cycle of polluting is long, has indoor environment necessarily
Harm.The requirement limited the quantity wood adhesive content of free aldehyde or artificial board formaldehyde burst size both at home and abroad is increasingly stricter, because of
This, artificial board enterprise has great demand to the environment-friendly type aldehyde-free cement of alternative " three aldehyde " glue.Zein is that a class can be again
Natural plant protein raw, biodegradable, has that low cost, processing and fabricating be convenient and the feature such as have no irritating odor.Due to
Zein is water insoluble and lacks the human body essential amino acid such as lysine, tryptophan, is of low nutritive value, is seldom used in food
In raw material, at present, in addition to minority is used as the sale of inferior forage protein, many factories do not make any utilization and directly arrange
Put, cause the significant wastage of resource, also environment is worked the mischief simultaneously.Now, people utilize zein in organizational project
Applied with medical science aspect, but the application that zein is in terms of adhesive is less, so exploitation this ring of zein
The adhesive market potential of guarantor's type is huge.
With composite modifying method in " preparation of acrylic amide modified zein composite adhesive " literary composition, i.e. use propylene
Amide and the combined modified zein of maleic anhydride, under initiator ammonium persulfate effect, acrylamide triggered double-bond polymerization is made
Composite modified corn-based adhesive, improves resistance to water and the bonding strength of Semen Maydis adhesive, and its woodwork gluedd joint is without having
Evil gas release, reaches international E0 level level.But the water resistance of corn-based adhesive is limited with cementing strength, this just needs
Further this is modified.
Summary of the invention
The object of the invention is contemplated to make up the defect of prior art, it is provided that being combined of a kind of suppression formaldehyde capable of purifying air
Sheet material adhesive.
The present invention is achieved by the following technical solutions:
The composite board adhesive of a kind of suppression formaldehyde capable of purifying air, is made up of the raw material of following weight portion: Semen Maydis egg
White 100-110, acrylamide 8-9, maleic anhydride 2-2.5, Ammonium persulfate. 8-9, concentration are the Sodium hydroxide q. s of 40wt%, steaming
Distilled water is appropriate, modulus is 2.8 waterglass 50-55, polyvinyl alcohol 9-10.5, tetraethyl orthosilicate 2-3, sulfamic acid 1.7-2, silicon
Alkane coupling agent kh550 1-1.2, microcrystalline Cellulose 3-4, attapulgite 9-10, carbamide 2-3, glycine 3-4, diphenyl dimethoxy
Base silane 0.8-1.
The composite board adhesive of described a kind of suppression formaldehyde capable of purifying air, is made up of step in detail below:
(1) polyvinyl alcohol adding the distilled water of 10-12 times amount, is heated to 80-90 DEG C, stirring, to being completely dissolved, forms solution
Stand-by；Being put in reactor by the waterglass that modulus is 2.8, be slowly added to above-mentioned solution, heating in water bath is to 60-70 DEG C, while stir
Mix limit dropping silane coupler kh550, control to drip in 30-40 minute complete, be subsequently adding tetraethyl orthosilicate, amino sulphur
Isothermal reaction 60-90 minute, discharging under acid, then nitrogen protection；
(2) sodium hydroxide that the distilled water of zein and 3-3.5 times amount, 0.25-0.28 times amount concentration are 40wt% is mixed,
Continuously adding Ammonium persulfate., the post-heating that stirs reacts 60-90 minute to 80-85 DEG C and constant temperature stirring, continuously adds propylene
Amide, isothermal reaction adds maleic anhydride after 60-80 minute, is cooled to 50-60 DEG C, and isothermal reaction used concentration after 90-120 minute
Sodium hydroxide regulation pH for 40wt% is 7-8, is cooled to room temperature discharging；
(3) the temperature calcination 2-3 with 500-550 DEG C is put in Muffle furnace after attapulgite is broken into the fritter of 1-2 millimeter little
Time, take out after cooling, pulverize, cross 200 mesh sieves stand-by；Mix with above-mentioned powder after melted for Urea, put in ball mill
Ball milling adds dimethoxydiphenylsilane after 20-30 minute, continue ball milling 30-40 minute, and discharging is stand-by；By microcrystalline Cellulose
Being dissolved in the distilled water of 6-8 times amount, add above-mentioned material and remaining residual components, dispersed with stirring is uniform；
(4) product mixing step (1) (2) (3) obtained, stirs and get final product.
The invention have the advantage that the present invention first passes through polyvinyl alcohol and crosslinks reaction with waterglass, make adhesive shape
Becoming relatively multiple hole, the size of hole also ratio originally became big, intermolecular existed a certain degree of bonding, formed obvious network interpenetrating
Structure, improves the compactness of adhesive, coordinates the interpolation of tetraethyl orthosilicate and sulfamic acid, it is possible to give adhesive heat-resisting,
Water-fast, the excellent properties of resistance to chemical attack, can improve adhesive ductility on adherend simultaneously, thus it is strong to improve splicing
Degree；Adhesive owing to waterglass is by being blended uniformly with zein adhesive after organically-modified process, after being blended
Having had both concurrently a little, had the resistance to water of excellence, glue-joint strength, viscosity is suitable, safety and environmental protection, formaldehydeless release.
The present invention adds the compositions such as attapulgite, microcrystalline Cellulose, glycine to sheet material glue by a series of technique
In the preparation of glutinous agent, it is uniformly dispersed and good with the adhesive compatibility, there is good efficacy of adsorption, and glycine and formaldehyde
Reaction, makes formaldehyde removing, can play the effect purifying air；Adhesive excellent in stability of the present invention, cementing strength is high, raw material
Safety non-toxic, and the compositions such as the formaldehyde in air can be adsorbed, play the effect purifying air, expand adhesive further
Range.
Detailed description of the invention
The composite board adhesive of a kind of suppression formaldehyde capable of purifying air, is prepared system by the raw material of following weight portion (kilogram)
Become: zein 100, acrylamide 8, maleic anhydride 2, Ammonium persulfate. 8, concentration are the Sodium hydroxide q. s of 40wt%, distilled water
In right amount, modulus be 2.8 waterglass 50, polyvinyl alcohol 9, tetraethyl orthosilicate 2, sulfamic acid 1.7, silane coupler kh550 1,
Microcrystalline Cellulose 3, attapulgite 9, carbamide 2, glycine 3, dimethoxydiphenylsilane 0.8.
The composite board adhesive of described a kind of suppression formaldehyde capable of purifying air, is made up of step in detail below:
(1) polyvinyl alcohol adding the distilled water of 10 times amount, is heated to 80 DEG C, stirring, to being completely dissolved, forms solution for later use；Will
Modulus be 2.8 waterglass put in reactor, be slowly added to above-mentioned solution, heating in water bath to 60 DEG C, drip silicon while stirring
Alkane coupling agent kh550, controls to drip in 30 minutes complete, is subsequently adding under tetraethyl orthosilicate, sulfamic acid, then nitrogen protection
Isothermal reaction 60 minutes, discharging；
(2) zein and the sodium hydroxide that the distilled water of 3 times amount, 0.25 times amount concentration are 40wt% are mixed, continuously added
Ammonium sulfate, the post-heating that stirs reacts 60 minutes to 80 DEG C and constant temperature stirring, continuously adds acrylamide, isothermal reaction 60 points
Adding maleic anhydride after clock, be cooled to 50 DEG C, it is 7 that isothermal reaction regulated pH with the sodium hydroxide that concentration is 40wt% after 90 minutes,
It is cooled to room temperature discharging；
(3) temperature calcination 2 hours with 500 DEG C in Muffle furnace is put into after attapulgite is broken into the fritter of 1 millimeter, after cooling
Take out, pulverize, cross 200 mesh sieves stand-by；Mix with above-mentioned powder after melted for Urea, put into ball milling 20 minutes in ball mill
Rear addition dimethoxydiphenylsilane, continues ball milling 30 minutes, and discharging is stand-by；Microcrystalline Cellulose is dissolved in the distillation of 6 times amount
In water, adding above-mentioned material and remaining residual components, dispersed with stirring is uniform；
(4) product mixing step (1) (2) (3) obtained, stirs and get final product.
The resistance to water and the bonding strength that utilize the artificial plywood that adhesive of the present invention makes all have reached national standard
GB/T9846 2,004 II class plywood requirement.
Claims (2)
1. the composite board adhesive of a suppression formaldehyde capable of purifying air, it is characterised in that by the raw material system of following weight portion
Prepare into: zein 100-110, acrylamide 8-9, maleic anhydride 2-2.5, Ammonium persulfate. 8-9, concentration are the hydrogen of 40wt%
Sodium oxide is appropriate, distilled water is appropriate, modulus is 2.8 waterglass 50-55, polyvinyl alcohol 9-10.5, tetraethyl orthosilicate 2-3, ammonia
Base sulfonic acid 1.7-2, silane coupler kh550 1-1.2, microcrystalline Cellulose 3-4, attapulgite 9-10, carbamide 2-3, glycine 3-
4, dimethoxydiphenylsilane 0.8-1.
A kind of composite board adhesive of suppression formaldehyde capable of purifying air, it is characterised in that by with
Lower concrete steps are made:
(1) polyvinyl alcohol adding the distilled water of 10-12 times amount, is heated to 80-90 DEG C, stirring, to being completely dissolved, forms solution
Stand-by；Being put in reactor by the waterglass that modulus is 2.8, be slowly added to above-mentioned solution, heating in water bath is to 60-70 DEG C, while stir
Mix limit dropping silane coupler kh550, control to drip in 30-40 minute complete, be subsequently adding tetraethyl orthosilicate, amino sulphur
Isothermal reaction 60-90 minute, discharging under acid, then nitrogen protection；
(2) sodium hydroxide that the distilled water of zein and 3-3.5 times amount, 0.25-0.28 times amount concentration are 40wt% is mixed,
Continuously adding Ammonium persulfate., the post-heating that stirs reacts 60-90 minute to 80-85 DEG C and constant temperature stirring, continuously adds propylene
Amide, isothermal reaction adds maleic anhydride after 60-80 minute, is cooled to 50-60 DEG C, and isothermal reaction used concentration after 90-120 minute
Sodium hydroxide regulation pH for 40wt% is 7-8, is cooled to room temperature discharging；
(3) the temperature calcination 2-3 with 500-550 DEG C is put in Muffle furnace after attapulgite is broken into the fritter of 1-2 millimeter little
Time, take out after cooling, pulverize, cross 200 mesh sieves stand-by；Mix with above-mentioned powder after melted for Urea, put in ball mill
Ball milling adds dimethoxydiphenylsilane after 20-30 minute, continue ball milling 30-40 minute, and discharging is stand-by；By microcrystalline Cellulose
Being dissolved in the distilled water of 6-8 times amount, add above-mentioned material and remaining residual components, dispersed with stirring is uniform；
(4) product mixing step (1) (2) (3) obtained, stirs and get final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610764646.6A CN106147669A (en) | 2016-08-31 | 2016-08-31 | A kind of composite board adhesive of suppression formaldehyde capable of purifying air |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610764646.6A CN106147669A (en) | 2016-08-31 | 2016-08-31 | A kind of composite board adhesive of suppression formaldehyde capable of purifying air |
Publications (1)
| Publication Number | Publication Date |
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| CN106147669A true CN106147669A (en) | 2016-11-23 |
Family
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| CN201610764646.6A Pending CN106147669A (en) | 2016-08-31 | 2016-08-31 | A kind of composite board adhesive of suppression formaldehyde capable of purifying air |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106582573A (en) * | 2016-12-30 | 2017-04-26 | 苏州律点信息科技有限公司 | Formaldehyde adsorption material |
| CN112847689A (en) * | 2021-01-06 | 2021-05-28 | 广东中晨电子科技有限公司 | High-end base plate and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102344765A (en) * | 2011-07-06 | 2012-02-08 | 河北工业大学 | Formaldehyde-inhibiting composite clay adhesive filler |
| CN104946174A (en) * | 2015-06-19 | 2015-09-30 | 苏州佑君环境科技有限公司 | Maleic anhydride graft-modified soy protein biological adhesive and preparation method thereof |
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2016
- 2016-08-31 CN CN201610764646.6A patent/CN106147669A/en active Pending
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