CN106141899A - A kind of wafer grinding processing unit (plant) - Google Patents

A kind of wafer grinding processing unit (plant) Download PDF

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Publication number
CN106141899A
CN106141899A CN201610637861.XA CN201610637861A CN106141899A CN 106141899 A CN106141899 A CN 106141899A CN 201610637861 A CN201610637861 A CN 201610637861A CN 106141899 A CN106141899 A CN 106141899A
Authority
CN
China
Prior art keywords
loading disc
wafer
guide rod
clamp assemblies
abrasive disk
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610637861.XA
Other languages
Chinese (zh)
Inventor
齐欢
朱海军
王扬渝
程金强
杨杰
郑杭峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiang University Of Technology
Original Assignee
Jiang University Of Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiang University Of Technology filed Critical Jiang University Of Technology
Priority to CN201610637861.XA priority Critical patent/CN106141899A/en
Publication of CN106141899A publication Critical patent/CN106141899A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00Other grinding machines or devices
    • B24B27/0076Other grinding machines or devices grinding machines comprising two or more grinding tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/28Work carriers for double side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition

Abstract

A kind of wafer grinding processing unit (plant), including frame, abrasive working appts also includes magnetic load wafer clamp assemblies and lower abrasive disk, lower abrasive disk is installed in rotation in frame, magnetic load wafer clamp assemblies is arranged on the lower end of load bar, load bar drives the output shaft of motor to be connected with top lap, and magnetic load wafer clamp assemblies can slide up and down to be arranged in frame, and magnetic load wafer clamp assemblies is positioned at the top of described lower abrasive disk;Magnetic load wafer clamp assemblies includes housing, load bar, upper loading disc, guide rod, middle loading disc and lower loading disc, guide rod sequentially passes through loading disc and middle loading disc, opposite face between opposite face between upper loading disc and middle loading disc, middle loading disc and lower loading disc is respectively equipped with opposite polarity a pair and loads magnet steel, capping is installed on the top of guide rod, and the bottom of guide rod is arranged in described lower loading disc.The present invention realizes reducing vibration, improves material removal efficiency, is not likely to produce too deep cut.

Description

A kind of wafer grinding processing unit (plant)
Technical field
The present invention relates to attrition process field, in particular, relate to a kind of wafer grinding processing and device thereof.
Background technology
Developing rapidly of new technology, improves constantly to the quality requirement of wafer, and grinding technique is as preparing great surface quality The most important means of wafer, of increased attention in today.Tradition is ground few to surface damage, wafer after processing Completely, surface figure accuracy is higher, but the thinning work of wafer is not only measured greatly, and working (machining) efficiency is often extremely difficult to require.For example, change Learn machinery polishing system, can be while ensureing material removal efficiency, it is thus achieved that more perfect surface, the flatness obtaining ratio is single Pure use both grinds 1-2 the order of magnitude to be exceeded, and can realize that nanoscale arrives the surface roughness of atom level, it is achieved The grinding of wafer is thinning.But the load modes using complexity in existing lapping device, the vibration producing in its running will more Having a strong impact on surface quality, working (machining) efficiency is low, and waste paper rate is high, and surface quality is also difficult to be effectively ensured, greatly constrains The working (machining) efficiency of ultra thin wafer and quality.
Content of the invention
In order to the working (machining) efficiency overcoming existing wafer grinding processing mode is low, waste paper rate high, crudy is relatively low not Foot, the present invention provides a kind of wafer grinding processing unit (plant), and traditional contact cmp technology is improved by this, real The noncontact of existing grinding pressure loads, thus improves working (machining) efficiency, improves the surface quality after processing.
The present invention is achieved through the following technical solutions above-mentioned purpose:
A kind of wafer grinding processing unit (plant), including frame, described abrasive working appts also includes magnetic load wafer clamping group Part and lower abrasive disk, described lower abrasive disk is installed in rotation in frame, and described magnetic load wafer clamp assemblies is arranged on and adds Carrying the lower end of bar, described load bar drives the output shaft of motor to be connected with top lap, and described magnetic load wafer clamp assemblies can Sliding up and down to be arranged in frame, described magnetic load wafer clamp assemblies is positioned at the top of described lower abrasive disk;Described magnetic adds Carry wafer holder assembly to include housing, load bar, upper loading disc, load magnet steel, guide rod, middle loading disc and to be added for pasting The lower loading disc of work wafer, guide rod sequentially passes through loading disc and middle loading disc, between upper loading disc and middle loading disc Opposite face between opposite face, middle loading disc and lower loading disc is respectively equipped with opposite polarity a pair and loads magnet steel, described leads Capping is installed on the top of bar, and the bottom of described guide rod is arranged in described lower loading disc.
The loading magnet steel by two opposed polarities for the present invention, the repulsion between them provides pressure, thus realizes grinding Noncontact load.
Further, described guide rod passes through described upper loading disc and the endoporus of middle loading disc is respectively mounted sliding bearing, described The junction of the bottom of guide rod and lower loading disc is fixed by pressing plate.
Further, described loading motor is arranged on grinding table, and described upper grinding table is fixedly connected with a slide block, described Slide block can be arranged on slide unit up or down, and described slide unit is arranged in frame, and described upper grinding table grinds with on driving The lift drive mechanism that mill platform moves up and down connects.
Described lift drive mechanism includes loading motor, leading screw and nut seat, the output shaft of described loading motor and leading screw Upper end connect, described leading screw is set with described nut seat, described nut seat links with described top lap.
Described lower abrasive disk is arranged on lower abrasive disk main shaft, and described lower abrasive disk main shaft couples with the wheel shaft of big belt wheel, Described big belt wheel is in transmission connection with small pulley by belt, and the wheel shaft of described small pulley is power shaft, and described power shaft is by connection Axial organ is connected with the output shaft of lower grinding disk-drive motor.
In the present invention, on the upper surface of upper loading disc bottom surface and middle loading disc and middle loading disc lower surface and under The upper surface of loading disc is by repulsion each other, it is achieved the noncontact of grinding pressure loads, thus improves working (machining) efficiency, Improve the surface quality after processing.
The beneficial effects of the present invention is: the present invention use magnetic load Ginding process simply easily realize, transmission efficiency and Working (machining) efficiency is high, and platform stabilization is good, and shock resistance is strong, more effectively reduces the impact of motor oscillating;Reduce vibration, improve material Removal efficiency, is not likely to produce too deep cut.
Brief description
Fig. 1 is the axonometric drawing of a kind of wafer polishing apparatus of the present invention.
Fig. 2 is the front view of abrasive disk driven Design under a kind of device of the present invention.
Fig. 3 is the front view of a kind of clamping device of the present invention.
In figure, under 1-, abrasive disk, the upper grinding table of 2-, 3-ball screw, 4-slide unit, 5-loading motor, 6-top lap drive Abrasive disk main shaft, 9-belt, the big belt wheel of 10-, 11-regulating wheel, 12-small pulley, 13-input under dynamic motor, 7-clamping device, 8- Disk-drive motor, loading disc under 16-, loading disc, the upper loading disc of 18-, 19-shell in the middle of 17-is ground under axle, 14-shaft coupling, 15- Body, 20-load bar, 21-guide rod, 22-sliding bearing, 23-load magnet steel, 24-pressing plate.
Detailed description of the invention
The invention will be further described below in conjunction with the accompanying drawings:
With reference to Fig. 1~Fig. 3, a kind of wafer grinding processing unit (plant), including the 7th, lower abrasive disk 1 and of magnetic load wafer clamp assemblies Upper grinding table 2, is provided with lower loading disc the 16th, middle loading disc the 17th, upper loading disc 18 etc. in magnetic load wafer clamp assemblies 7.Add Carrying motor 5 and top lap driving the major impetus source that motor 6 is upper part, loading motor 5 drives on ball-screw 3 device Lower rectilinear movement, loading motor 5 is installed on integral-rack, is connected with ball-screw 4 device by shaft coupling, ball wire Thick stick 3 is to be installed on integral-rack by bearing block by two bearings up and down coordinating with it;Slide rest device passes through slide block Being connected with upper lapping device fixed plate, described ball-screw 3 device is fixed by the feed screw nut seat on it and upper lapping device Plate connects, and loading motor 5 drives ball-screw 3 to rotate, and whole upper lapping device does along slide unit and moves linearly up and down.Upper grinding Disk-drive motor 6 drives magnetic load wafer clamp assemblies 7 to rotate, and wafer is attached to the lower loading disc of magnetic load wafer clamp assemblies 7 16;When described lower abrasive disk 1 rotates, the mechanical friction effect of motion abrasive particle is utilized to remove excess stock, it is achieved the grinding of wafer Thinning.
As in figure 2 it is shown, described lower grinding disk-drive motor 15 carries driven input shaft 13 to rotate by shaft coupling 14, and then drive Small pulley 12 rotates, and is reached the rotating speed of lower abrasive disk 1 by big belt wheel 10 and small pulley 12.
As it is shown on figure 3, magnetic load wafer clamp assemblies 7 includes that the 18th, housing the 19th, load bar the 20th, upper loading disc loads magnet steel 23rd, guide rod the 21st, middle loading disc the 17th, sliding bearing the 22nd, pressing plate 24 and lower loading disc 18 etc., upper loading disc 18 and middle loading disc Opposite face between opposite face between 17, middle loading disc 17 and lower loading disc 18 is respectively equipped with opposite polarity a pair loading Magnet steel guide rod 21 passes through upper loading disc 18 and middle loading disc 17, and the top of guide rod 21 is provided with capping, the bottom peace of guide rod 21 In being contained in lower loading disc 18 and fixed by pressing plate 24.Further, guide rod 21 passes through the interior of middle loading disc 17 and upper loading disc 18 Hole is provided with sliding bearing 22.
Above-described embodiment is presently preferred embodiments of the present invention, is not the restriction to technical solution of the present invention, as long as The technical scheme that can realize on the basis of above-described embodiment without creative work, is regarded as falling into patent of the present invention Rights protection in the range of.

Claims (5)

1. a wafer grinding processing unit (plant), including frame, it is characterised in that: described abrasive working appts also includes that magnetic loads crystalline substance Piece clamp assemblies and lower abrasive disk, described lower abrasive disk is installed in rotation in frame, described magnetic load wafer clamp assemblies Being arranged on the lower end of load bar, described load bar drives the output shaft of motor to be connected with top lap, and described magnetic load wafer is pressed from both sides Holding assembly can slide up and down to be arranged in frame, described magnetic load wafer clamp assemblies is positioned at the top of described lower abrasive disk; Described magnetic load wafer clamp assemblies includes housing, load bar, upper loading disc, guide rod, middle loading disc and to be added for pasting The lower loading disc of work wafer, guide rod sequentially passes through loading disc and middle loading disc, between upper loading disc and middle loading disc Opposite face between opposite face, middle loading disc and lower loading disc is respectively equipped with opposite polarity a pair and loads magnet steel, described leads Capping is installed on the top of bar, and the bottom of described guide rod is arranged in described lower loading disc.
2. a kind of wafer grinding processing unit (plant) as claimed in claim 1, it is characterised in that: described guide rod passes through described upper loading The endoporus of dish and middle loading disc is respectively mounted sliding bearing, and the bottom of described guide rod is solid by pressing plate with the junction of lower loading disc Fixed.
3. a kind of wafer grinding processing unit (plant) as claimed in claim 1 or 2, it is characterised in that: described loading motor is arranged on On upper grinding table, described upper grinding table is fixedly connected with a slide block, and described slide block can be arranged on slide unit up or down, described cunning Platform is arranged in frame, and described upper grinding table is connected with the lift drive mechanism for driving upper grinding table to move up and down.
4. a kind of wafer grinding processing unit (plant) as claimed in claim 3, it is characterised in that: described lift drive mechanism includes adding Carrying motor, ball screw and nut seat, the output shaft of described loading motor is connected with the upper end of ball screw, described ball screw The described nut seat of upper suit, described nut seat links with described top lap.
5. a kind of wafer grinding processing unit (plant) as claimed in claim 1 or 2, it is characterised in that: described lower abrasive disk is arranged on On lower abrasive disk main shaft, described lower abrasive disk main shaft couples with the wheel shaft of big belt wheel, and described big belt wheel passes through belt and small pulley Being in transmission connection, the wheel shaft of described small pulley is power shaft, and described power shaft grinds the defeated of disk-drive motor by shaft coupling with lower Shaft connects.
CN201610637861.XA 2016-08-03 2016-08-03 A kind of wafer grinding processing unit (plant) Pending CN106141899A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610637861.XA CN106141899A (en) 2016-08-03 2016-08-03 A kind of wafer grinding processing unit (plant)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610637861.XA CN106141899A (en) 2016-08-03 2016-08-03 A kind of wafer grinding processing unit (plant)

Publications (1)

Publication Number Publication Date
CN106141899A true CN106141899A (en) 2016-11-23

Family

ID=57328213

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610637861.XA Pending CN106141899A (en) 2016-08-03 2016-08-03 A kind of wafer grinding processing unit (plant)

Country Status (1)

Country Link
CN (1) CN106141899A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060189259A1 (en) * 2003-01-10 2006-08-24 Samsung Electronics Co., Ltd. Polishing apparatus and related polishing methods
CN202207953U (en) * 2011-07-07 2012-05-02 深圳市方达研磨技术有限公司 Sapphire grinding machine
CN103252713A (en) * 2013-05-08 2013-08-21 浙江工业大学 Magnetic loaded wafer grinding method and magnetic loaded wafer grinding device
CN103252712A (en) * 2013-05-08 2013-08-21 浙江工业大学 Wafer polishing magnetic loading clamping device
CN103317422A (en) * 2013-06-18 2013-09-25 浙江工业大学 Hydrodynamic-type polishing device
CN206185678U (en) * 2016-08-03 2017-05-24 浙江工业大学 Wafer grinds processingequipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060189259A1 (en) * 2003-01-10 2006-08-24 Samsung Electronics Co., Ltd. Polishing apparatus and related polishing methods
CN202207953U (en) * 2011-07-07 2012-05-02 深圳市方达研磨技术有限公司 Sapphire grinding machine
CN103252713A (en) * 2013-05-08 2013-08-21 浙江工业大学 Magnetic loaded wafer grinding method and magnetic loaded wafer grinding device
CN103252712A (en) * 2013-05-08 2013-08-21 浙江工业大学 Wafer polishing magnetic loading clamping device
CN103317422A (en) * 2013-06-18 2013-09-25 浙江工业大学 Hydrodynamic-type polishing device
CN206185678U (en) * 2016-08-03 2017-05-24 浙江工业大学 Wafer grinds processingequipment

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Application publication date: 20161123

RJ01 Rejection of invention patent application after publication