CN106056108A - 指纹模组及移动终端 - Google Patents
指纹模组及移动终端 Download PDFInfo
- Publication number
- CN106056108A CN106056108A CN201610605089.3A CN201610605089A CN106056108A CN 106056108 A CN106056108 A CN 106056108A CN 201610605089 A CN201610605089 A CN 201610605089A CN 106056108 A CN106056108 A CN 106056108A
- Authority
- CN
- China
- Prior art keywords
- pad
- foil layer
- copper foil
- fingerprint module
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
- G06F18/20—Analysing
- G06F18/21—Design or setup of recognition systems or techniques; Extraction of features in feature space; Blind source separation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- Data Mining & Analysis (AREA)
- General Physics & Mathematics (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Evolutionary Biology (AREA)
- Evolutionary Computation (AREA)
- Bioinformatics & Computational Biology (AREA)
- General Engineering & Computer Science (AREA)
- Artificial Intelligence (AREA)
- Life Sciences & Earth Sciences (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610605089.3A CN106056108A (zh) | 2016-07-28 | 2016-07-28 | 指纹模组及移动终端 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610605089.3A CN106056108A (zh) | 2016-07-28 | 2016-07-28 | 指纹模组及移动终端 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN106056108A true CN106056108A (zh) | 2016-10-26 |
Family
ID=57196415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610605089.3A Withdrawn CN106056108A (zh) | 2016-07-28 | 2016-07-28 | 指纹模组及移动终端 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN106056108A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106991383A (zh) * | 2017-03-13 | 2017-07-28 | 广东欧珀移动通信有限公司 | 指纹模组、显示屏和移动终端 |
WO2020042394A1 (zh) * | 2018-08-28 | 2020-03-05 | 武汉华星光电技术有限公司 | 指纹模组和显示设备 |
CN112560628A (zh) * | 2020-12-07 | 2021-03-26 | 东莞华贝电子科技有限公司 | 侧边指纹识别机构及移动终端 |
-
2016
- 2016-07-28 CN CN201610605089.3A patent/CN106056108A/zh not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106991383A (zh) * | 2017-03-13 | 2017-07-28 | 广东欧珀移动通信有限公司 | 指纹模组、显示屏和移动终端 |
CN106991383B (zh) * | 2017-03-13 | 2019-09-06 | Oppo广东移动通信有限公司 | 指纹模组、显示屏和移动终端 |
WO2020042394A1 (zh) * | 2018-08-28 | 2020-03-05 | 武汉华星光电技术有限公司 | 指纹模组和显示设备 |
CN112560628A (zh) * | 2020-12-07 | 2021-03-26 | 东莞华贝电子科技有限公司 | 侧边指纹识别机构及移动终端 |
CN112560628B (zh) * | 2020-12-07 | 2024-04-12 | 东莞华贝电子科技有限公司 | 侧边指纹识别机构及移动终端 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
CB02 | Change of applicant information | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161026 |
|
WW01 | Invention patent application withdrawn after publication |