CN105988293B - Detect the method and its system of egative film error - Google Patents

Detect the method and its system of egative film error Download PDF

Info

Publication number
CN105988293B
CN105988293B CN201510040461.6A CN201510040461A CN105988293B CN 105988293 B CN105988293 B CN 105988293B CN 201510040461 A CN201510040461 A CN 201510040461A CN 105988293 B CN105988293 B CN 105988293B
Authority
CN
China
Prior art keywords
bit
egative film
transparent substrates
line
sprocket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201510040461.6A
Other languages
Chinese (zh)
Other versions
CN105988293A (en
Inventor
徐嘉伟
王啓毓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHISHENG INDUSTRY Co Ltd
Original Assignee
ZHISHENG INDUSTRY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHISHENG INDUSTRY Co Ltd filed Critical ZHISHENG INDUSTRY Co Ltd
Priority to CN201510040461.6A priority Critical patent/CN105988293B/en
Publication of CN105988293A publication Critical patent/CN105988293A/en
Application granted granted Critical
Publication of CN105988293B publication Critical patent/CN105988293B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

A method of detection egative film error, it includes:One provides step, a configuration step and a detecting step.The offer step provides one layer of transparent substrates and one layer of egative film to bit sign at least four corresponding sprocket bits for being set on an exposure device and having at least four sprocket bits.The egative film is set on the transparent substrates by the configuration step.The detecting step measures the sprocket bit and the offset to bit sign, obtains the error amount of the egative film.The present invention also provides the systems for executing the above method.

Description

Detect the method and its system of egative film error
Technical field
The present invention relates to a kind of method and its system of detection egative film error, more particularly to a kind of for exposure device Immediately the method and its system of detection egative film error.
Background technology
The generation type of line pattern on existing printed circuit board, it is mainly pre- prior to being formed on the egative film of a light-permeable First designed line pattern, then with exposure imaging technology in the line map for developing on the egative film on a glass fibre basal plate Case, then following process processing procedure is carried out so that the printed circuit board is made.Wherein, before being exposed development step, it is necessary to which utilizing should The contraposition target of egative film is accurately aligned with the glass fibre basal plate registration holes, could make the line pattern essence on the egative film Accurate is formed on the precalculated position of the substrate.
In general, after the completion of the line pattern on the egative film can be prior to designing in egative film room, then take processing procedure scene dress To carry out contraposition and subsequent exposure imaging processing procedure with the glass fibre basal plate on exposure bench.However, when the egative film with When the glass fibre basal plate can not align successfully, and can not interpretation immediately be the error of egative film or glass fibre basal plate, and make At alignment issues.It is typically to disassemble the egative film at present, sends egative film room back to and carry out size confirmation, determination is the ruler of the egative film It is very little be deformed after, can just eliminate and change the egative film, however, during dismantling egative film, often have and be easy because dismounting causes bottom The deformation of piece further influences the result judged.
Invention content
The purpose of the present invention is to provide a kind of methods that can detect egative film error immediately.
The present invention detect egative film error method include:One provides step, a configuration step and a detecting step.
The offer step provides the transparent substrates and an egative film for being installed in an exposure device, which has extremely Few four positions are opposite to each other and with the sprocket bit of default spacing, circuit of the egative film with one one-tenth scheduled circuit pattern Area and at least four formed in same processing procedure with the scheduled circuit pattern, and outside the line areas to bit sign, the light transmission Substrate and the egative film respectively have a loci, and the position to bit sign is corresponding with the sprocket bit.
The configuration step is aligned using the loci of the transparent substrates and the egative film, which is positioned at the transparent substrates On, and enable the sprocket bit with it is described respectively corresponding to bit sign.
The detecting step is to measure the sprocket bit and the offset to bit sign, obtains the error of the egative film Value.
The loci of the method for the detection egative film error of the present invention, the transparent substrates and the egative film is to be selected from wherein at least one A corresponding sprocket bit and to bit sign.
The method of the detection egative film error of the present invention, the egative film is generally rectangular, and the egative film also has one to surround the circuit Four of the dead space in area, the egative film are four diagonal positions being correspondingly formed in the dead space to bit sign.
The method of the detection egative film error of the present invention, the offer step also provide four detecing elements, which is Each sprocket bit and corresponding this each offset to the central point of bit sign are calculated through the detecing element Amount, obtains the error amount of the egative film.
The present invention detection egative film error method, the offer step also further to the transparent substrates define two that This interval is simultaneously spaced and along the first position line of first direction extension and two along the second of a vertical first direction The second position line that direction extends, and a pair of bit lines and two articles of edges that two articles extend along the first direction are defined to the egative film Second pair of bit line that the second direction extends, wherein the intersection point of first position line and second position line is respectively should The intersection point of the central point of four sprocket bits, described a pair of bit lines and second pair of bit line is respectively this four to bit sign Central point, which is wherein one progress of wherein one by described to bit line and the corresponding position line Contraposition, which is positioned on the transparent substrates, which measures the position line and the offset to bit line, Obtain the error amount of the egative film.
The present invention detection egative film error method, the offer step also further to the transparent substrates define two at Angle and respectively by two be located at diagonal sprocket bit central point third position line, and to the egative film define two at Angle and be located at the diagonal central point to bit sign by two respectively third to bit line.
The method of the detection egative film error of the present invention, the sprocket bit are to be formed in this with milling cutter processing or mode of printing Transparent substrates.
Another object of the present invention is to provide it is a kind of detection egative film error system, the system include an exposure device and At least four detecing elements.
The exposure device includes that a pair of of bit platform and one are located at this to the transparent substrates on bit platform, which is set to On the transparent substrates and positioned at this between bit platform and the transparent substrates, which has at least four and the contraposition The corresponding sprocket bit in position of symbol.
The detecting unit is located on the transparent substrates, measures and calculates each sprocket bit and corresponding this is each The offset of a central point to bit sign, obtains the error amount of the egative film.
The system of the detection egative film error of the present invention, the position of the sprocket bit of the transparent substrates is to the projection of the egative film Outside the line areas, and the position of the sprocket bit is opposite to each other and with default spacing.
The system of the detection egative film error of the present invention, the detecting unit have being electrically coupled for multiple correspondences sprocket bit Element.
The beneficial effects of the present invention are:The sprocket bit is formed in the transparent substrates of exposure device, and in the egative film Line areas outside form the described to bit sign of the corresponding sprocket bit, and the egative film is positioned on the transparent substrates, The sprocket bit and the offset to bit sign are measured, and the error amount of the egative film can be detected immediately.
Description of the drawings
Fig. 1 is a stereogram exploded view, illustrates the system of present invention detection egative film error;
Fig. 2 is a flow chart, illustrates the flow chart of the method for present invention detection egative film error;
Fig. 3 is the vertical view of four detecing elements of omission, illustrates the one first of the method for present invention detection egative film error Embodiment;
Fig. 4 is a stereogram exploded view, illustrates a second embodiment of the method for present invention detection egative film error;
Fig. 5 is the vertical view of the omission detecing element, aids in illustrating the second embodiment of Fig. 4;
Fig. 6 is the vertical view of the omission detecing element, illustrates a third of the method for present invention detection egative film error Embodiment.
Specific implementation mode
The following describes the present invention in detail with reference to the accompanying drawings and embodiments.
Refering to fig. 1, the present invention detects an embodiment of the system of egative film error, is suitable for detecting an egative film 31 to be exposed Error amount.Wherein, which has including one surrounds the line areas at the line areas 311, one of scheduled circuit pattern 300 311 dead space 312 and at least four be located at outside the line areas 311 to bit sign 313.
The embodiment of the system includes an exposure device 2 and a detecting unit 20.
The exposure device 2 is the automatic exposure machine for manufacturing semiconductor integrated circuit, the exposure that Fig. 1 is shown in current industry Electro-optical device 2 is the schematic diagram of automatic exposure machine, is explained with disclosing main element related to the present invention.The exposure device 2 wraps It includes a pair of of bit platform 200 and one and is located at this to the transparent substrates 22 on bit platform 200.
Specifically, this is for carrying a piece of exposure base 21 to bit platform 200, which has one to be formed The exposure region 211 and one of line pattern surrounds the non-exposed area 212 of the exposure region 211.The exposure base 21 of the present embodiment is just To be existing to by integrated circuit printed circuit board formed thereon (printed circuit board, PCB).
The transparent substrates 22 are positioned apart from the exposure base 21, and are the materials penetrated for exposure light by one It is constituted, the transparent substrates 22 of this example are explained by taking the glass substrate that glass material is constituted as an example.It is noted that this The transparent substrates 22 of example are at least four opposite to each other and with the sprocket bit 221 of default spacing.
Preferably, the transparent substrates 22 of this example are to have, there are four explained for sprocket bit 221.The sprocket bit 221 are separately formed at four diagonal positions of the transparent substrates 22.More preferably, the sprocket bit 221 is located at four diagonally Position and it is general rectangular, it is the length and width according to this rectangle therefore, possessed by the sprocket bit 221 in this example to preset spacing Size and accordingly change, and the sprocket bit 221 is located at four diagonal positions of the transparent substrates 22 to the exposure base 21 projection is that four of the non-exposed area 212 for being located at the exposure base 21 are diagonal.
The detecting unit 20 is located on the transparent substrates 22, to measure and calculate each sprocket bit 221 and phase Corresponding this each offset to the central point of bit sign 313, to obtain the error amount of the egative film 31.It is noted that The detecting unit 20 can regard operation and design requirement and only have one or two detecing element 231, and be detectd using mobile this Survey element 231 mode measure respectively corresponding each sprocket bit 221 with it is corresponding this each to bit sign 313 Central point offset, or can have it is multiple correspond to the detecing element 231 that bit sign 313 is arranged respectively, without The detecing element 231 must be moved during measuring.In this present embodiment, which is that there are four correspondence is described fixed for tool The detecing element 231 that bit sign 221 is arranged, and be so that image signal can be changed into the charge coupled device (charge- of digital signal Coupled device, CCD) for explain.
Referring to Fig.2, illustrating that the present invention implements one using the system of aforementioned detection egative film error and detects the egative film immediately below The method of 31 errors.
It in general, can be first on the egative film 31 when forming scheduled integrated circuit patterns on the exposure base 21 Line areas 311 in form scheduled circuit pattern 300, then the egative film 31 with scheduled circuit pattern 300 is set to the light transmission Between substrate 22 and the exposure base 21, then, the egative film 31 and the exposure base 21 are aligned, subsequently exposed with profit Photodevelopment processing procedure, to which scheduled circuit pattern 300 develop in the exposure region 211 being formed on the exposure base 21.
And the present invention is mainly to pass through the light transmission using before executing contraposition of the above-mentioned egative film 31 with the exposure base 21 The sprocket bit 221 of substrate 22 and the auxiliary to bit sign 313 of the egative film 31, and penetrate the detecing element 231 detection, and can detect 31 size of egative film caused by being formed in scheduled circuit pattern 300 or installing process immediately Size harmomegathus situation.When detecting the harmomegathus size of the egative film 31 beyond error amount allowed by processing procedure, can directly into Row, which is eliminated, to be changed, this mode is avoided that in existing processing procedure, when the egative film 31 can not be aligned with the exposure base 21, just dismantles the bottom Piece 31 and the complicated step for measuring 31 size of egative film again.The emphasis of the technology non-present invention of above-mentioned formation integrated circuit, and Well known to those skilled in the art, therefore, it is not repeated here in this.
In more detail, ordinatedly refering to fig. 1 with Fig. 3, the present invention detect egative film error method a first embodiment Including:One provides step 41, a configuration step 42 and a detecting step 43.
The offer step 41 is first to provide to be installed in the exposure device 2 and tool is there are four being located at four diagonal positions The transparent substrates 22 of sprocket bit 221.Then, it provides general rectangular and is accorded with scheduled circuit pattern 300 and four contrapositions Numbers 313 egative film 31.It is noted that the mode for forming the sprocket bit 221 can select milling cutter processing or printing etc. Mode, there is no particular restriction, as long as can be formed on the transparent substrates 22 and be positioned for follow-up, this example is added with milling cutter Work mode explains for being formed in the surface of the transparent substrates 22.And four of the egative film 31 are and this then to bit sign 313 Scheduled circuit pattern 300 is formed together in same processing procedure, that is to say, that forms the preset lines in the line areas of the egative film 31 311 While road pattern 300, it can be formed together in the dead space 312 outside the line areas 311 described to bit sign 313 and described right The position of bit sign 313 is correspondingly located at four diagonal positions of the dead space 312 with the sprocket bit 221.
In addition it is noted that the sprocket bit 221 is with the shape to bit sign 313, there is no particular restriction, and For quantity also without being confined to four, visual actual demand increases the sprocket bit 221 and the quantity to bit sign 313, only The dead space 312 for being located at the egative film 31 to bit sign 313 is wanted, and described to bit sign 313 and the sprocket bit 221 Position is corresponding.The sprocket bit 221 of this example with it is described to bit sign 313 be respectively with the rectangular of geometric figure with It is explained for cross.
The configuration step 42 is the egative film 31 to be set in the exposure device 2 and positioned at the transparent substrates 22 in contrast to institute On the surface for stating detecing element 231.Specifically, the surface that the egative film 31 is configured at the transparent substrates 22 is gone forward, can first divide A loci is not defined in the transparent substrates 22 place corresponding with the position of the egative film 31, and by by pair of the egative film 31 The loci of the site alignment transparent substrates 22 is aligned, to enable the sprocket bit 221 with it is described each to bit sign 313 From correspondence.
In detail, in the first embodiment of the detection method of the present invention, pair of the transparent substrates 22 and the egative film 31 Site is selected from the corresponding sprocket bit 221 of at least one of which and to bit sign 313, preferably, this example is with corresponding The central point 222 of sprocket bit 221 be used as respective loci with to the central point 314 of bit sign 313.It is noted that The position for defining loci also can be optionally additional markers at the center of such as transparent substrates 22 and the egative film 31 or its His position, and there is no particular restriction for the quantity of loci is that can more accurately carry out pair when defining more than one loci Position is with sharp subsequent detecting step 43.
The detecting step 43 be by the detecing element 231 measure the sprocket bit 221 with it is described to bit sign 313 Offset, to obtain the error amount of the egative film 31.
Specifically, the configuration step 42 completes contraposition after so that the egative film 31 is configured at the transparent substrates 22, then pass through The detecing element 231 detects the central point 222 of the wherein the other three sprocket bit 221 of non-loci and wherein the other three aligns The overlapping cases of the central point 314 of symbol 313, and can learn the error amount of the egative film 31.
Herein it is noted that in exposure imaging technology, the ultraviolet light of tool high-energy is typically used as exposure Light, thus in exposure device 2 for exposure light by transparent substrates 22 be easy generate rising-heat contracting-cold because of high-energy, lead Size is caused increasingly to make a variation.Therefore, the transparent substrates 22 that this example uses are by with low thermal coefficient of expansion (coefficient of Thermal expansion) glass material constituted, so when exposure light penetrates the transparent substrates 22, the light transmission base Deformation and displacement of the still characteristic with low harmomegathus of plate 22 without influencing the sprocket bit 221.
Accordingly, there is the characteristic for being not easy harmomegathus, therefore the relative position of the sprocket bit 221 by the transparent substrates 22 It can be considered and immobilize.That is, detecting the central point 222 of the sprocket bit 221 respectively by the detecing element 231 To obtain the reference position of the sprocket bit 221, then in the contraposition for detecting the egative film 31 with the detecing element 231 The central point 314 of symbol 313 just can with being further compared with the position of the central point of the sprocket bit 221 222 Learn the error amount of the egative film 31.
As shown in the above description, detection method of the invention can before the exposure base 21 and the egative film 31 are aligned, The sprocket bit 221 on the transparent substrates 22 and being examined immediately to bit sign 313 on the egative film 31 can be penetrated Measure the harmomegathus situation of the egative film 31.
Refering to Fig. 4 and Fig. 5, the present invention detect the method for 31 error of egative film second embodiment be approximately identical to this first Embodiment, difference are in this example also further defines two to the transparent substrates 22 and is spaced and along a first direction X The first position line 201 extended and two the second position lines 202 extended along the second direction Y of a vertical first direction X, And two articles are defined along a pair of bit lines 301 of first direction X extensions and two articles along second direction extension to the egative film 31 Second pair of bit line 302.Wherein, the intersection point of first position line 201 and second position line 202 is respectively this four positioning The intersection point of the central point 222 of symbol 221, described a pair of bit lines 301 and second pair of bit line 302 is respectively this four contrapositions The central point 314 of symbol 313.Therefore, in this example, which changed with first position line 201 and described the Wherein one article of two position lines 202 is aligned for corresponding described a pair of bit lines 301 or second pair of bit line 302.With First position line 201 and second position line 202 is detected respectively afterwards with the detecing element 231 to align with described first Offset between line 301 and second pair of bit line 302, the error amount of the egative film 31 is calculated.It carries out by this method It measures, can more accurately learn the deformation situation of each length of side of the egative film 31.
Refering to Fig. 6, the 3rd embodiment that the present invention detects the method for 31 error of egative film is approximately identical to second implementation Example, difference are in this example is also further angled and non-adjacent by two respectively to the transparent substrates 22 definition two The third position line 203 of the central point 222 of sprocket bit 221, and to the egative film 31 define two it is angled and pass through two respectively The third of a non-adjacent central point 314 to bit sign 313 is to bit line 303.That is, the third position line 203 is just Two diagonal lines in the rectangle that first position line 201 is constituted with second position line 202;The third is to bit line 303 and the rectangle that is made of described a pair of bit lines 301 and second pair of bit line 302 in two diagonal lines.By described Third position line 203 can explicitly learn the auxiliary of bit line 303 with the third in the whole harmomegathus direction of the egative film 31, into And more rapidly and the error amount of the egative film 31 is accurately calculated.
In conclusion the present invention detects the method and its system of egative film error, through the transparent substrates 22 in exposure device 2 It is upper to form the sprocket bit 221, and form the described right of the corresponding sprocket bit 221 in the dead space of the egative film 31 312 Bit sign 313, and the egative film 31 is configured on the transparent substrates 22, it is accorded with the contraposition with measuring the sprocket bit 221 Numbers 313 offset, and described the can further be defined to bit sign 313 with described by the sprocket bit 221 One position line 201, second position line 202, with the third position line 203 and described a pair of bit lines 301, described Two pairs of bit lines 302, with the third to bit line 303, to more precisely quickly detect the harmomegathus value of the egative film 31, institute immediately The purpose of the present invention can be reached really.

Claims (10)

1. a kind of method of detection egative film error, it is characterised in that:Including one provides step, a configuration step and a detection step Suddenly, which is to provide the transparent substrates and an egative film that one is installed in an exposure device, which has at least four A position is relative to each other and has the sprocket bit of default spacing, which has the line areas of one one-tenth scheduled circuit pattern, and At least four form with the scheduled circuit pattern in same processing procedure, and outside the line areas to bit sign, the transparent substrates And the egative film respectively has a loci, and the position to bit sign is corresponding with the sprocket bit;The configuration step It is to be aligned using the loci of the transparent substrates and the egative film, which is positioned on the transparent substrates, and enable the positioning Symbol with it is described respectively corresponding to bit sign;The detecting step is to measure the sprocket bit and the offset to bit sign Amount, obtains the error amount of the egative film.
2. the method for detection egative film error according to claim 1, it is characterised in that:Pair of the transparent substrates and the egative film Site is selected from the corresponding sprocket bit of wherein at least one and to bit sign.
3. the method for detection egative film error according to claim 1, it is characterised in that:The egative film is generally rectangular, and the bottom The dead space that piece also surrounds the line areas with one, four of the egative film to bit sign are correspondingly formed in four of the dead space Diagonal position.
4. the method for detection egative film error according to claim 1, it is characterised in that:The offer step also provides four and detects Element is surveyed, which is to calculate each sprocket bit and corresponding each contraposition through the detecing element The offset of the central point of symbol obtains the error amount of the egative film.
5. the method for detection egative film error according to claim 1, it is characterised in that:The offer step is also further right The transparent substrates define two and are spaced and the first position line extended along a first direction and two are spaced and along one The second position line that the second direction of the vertical first direction extends, and two are defined to the egative film and is extended along the first direction A pair of bit lines and two articles of second pair of bit lines extended along the second direction, wherein first position line is fixed with described second The intersection point of bit line is respectively the central point of four sprocket bits, the intersection point point of described a pair of bit lines and second pair of bit line Not Wei four central points to bit sign, the configuration step be wherein one by described to bit line with it is corresponding described fixed Wherein one of bit line is aligned, which is positioned on the transparent substrates, the detecting step measure the position line with The offset to bit line obtains the error amount of the egative film.
6. the method for detection egative film error according to claim 5, it is characterised in that:The offer step is also further right The transparent substrates define the third position line of two central points that are angled and being located at diagonal sprocket bit by two respectively, And two thirds that are angled and being located at the diagonal central point to bit sign by two respectively are defined to bit line to the egative film.
7. the method for detection egative film error according to claim 6, it is characterised in that:The sprocket bit is added with milling cutter Work or mode of printing are formed in the transparent substrates.
8. a kind of system of detection egative film error, the egative film have one one-tenth scheduled circuit pattern line areas and at least four In including to bit sign, the system outside the line areas:One exposure device and a detecting unit, it is characterised in that:The exposure Electro-optical device includes that a pair of of bit platform and one are located at this to the transparent substrates on bit platform, which is set on the transparent substrates And positioned at this between bit platform and the transparent substrates, which has at least four and the position phase to bit sign Corresponding sprocket bit;The detecting unit is located on the transparent substrates, measure and calculate each sprocket bit with it is corresponding This each offset to the central point of bit sign, obtain the error amount of the egative film.
9. the system of detection egative film error according to claim 8, it is characterised in that:The sprocket bit of the transparent substrates Position is to be located at outside the line areas, and the position of the sprocket bit is opposite to each other and between default to the projection of the egative film Away from.
10. the system of detection egative film error according to claim 8, it is characterised in that:It is multiple right that the detecting unit has Answer the charge coupled device of the sprocket bit.
CN201510040461.6A 2015-01-27 2015-01-27 Detect the method and its system of egative film error Active CN105988293B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510040461.6A CN105988293B (en) 2015-01-27 2015-01-27 Detect the method and its system of egative film error

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510040461.6A CN105988293B (en) 2015-01-27 2015-01-27 Detect the method and its system of egative film error

Publications (2)

Publication Number Publication Date
CN105988293A CN105988293A (en) 2016-10-05
CN105988293B true CN105988293B (en) 2018-09-21

Family

ID=57034105

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510040461.6A Active CN105988293B (en) 2015-01-27 2015-01-27 Detect the method and its system of egative film error

Country Status (1)

Country Link
CN (1) CN105988293B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109141237B (en) * 2018-08-20 2020-10-13 武汉华星光电半导体显示技术有限公司 Method and device for misdetection judgment of detection device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020060793A1 (en) * 2000-11-22 2002-05-23 Nikon Corporation Optical positional displacement measuring apparatus and adjustment method thereof
CN101167019A (en) * 2005-04-20 2008-04-23 富士胶片株式会社 Convey error measuring method, calibration method, plotting method, exposure plotting method, plotting device, and exposure plotting device
CN101526753A (en) * 2009-01-13 2009-09-09 上海微电子装备有限公司 Parameter measuring method of worktable coordinate system
CN104216234A (en) * 2013-06-05 2014-12-17 中芯国际集成电路制造(上海)有限公司 Method for detecting light source symmetry of lithography system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020060793A1 (en) * 2000-11-22 2002-05-23 Nikon Corporation Optical positional displacement measuring apparatus and adjustment method thereof
CN101167019A (en) * 2005-04-20 2008-04-23 富士胶片株式会社 Convey error measuring method, calibration method, plotting method, exposure plotting method, plotting device, and exposure plotting device
CN101526753A (en) * 2009-01-13 2009-09-09 上海微电子装备有限公司 Parameter measuring method of worktable coordinate system
CN104216234A (en) * 2013-06-05 2014-12-17 中芯国际集成电路制造(上海)有限公司 Method for detecting light source symmetry of lithography system

Also Published As

Publication number Publication date
CN105988293A (en) 2016-10-05

Similar Documents

Publication Publication Date Title
CN102866576B (en) Mask plate group and method for determining alignment precision range by using mask plate group
CN106773525B (en) Mask plate, alignment method, display panel, display device and alignment method thereof
CN101398630B (en) Aligning and stacking marker, mask structure and using method thereof
CN103307983B (en) The detection method of wafer edge exposure technique
CN101568891A (en) Method for calibrating the x-y positioning of a positioning tool, and apparatus with such a positioning tool
CN108845480A (en) A kind of position alignment of inner layer plates accuracy measurement method
CN105988293B (en) Detect the method and its system of egative film error
CN107587103B (en) Alignment mark detection method, alignment method and evaporation method
US20180130845A1 (en) Flat panel array with the alignment marks in active area
CN101789386B (en) Method for chip alignment
CN105511235B (en) Alignment key mark, the method for forming alignment key calibration method and measurement alignment precision
TWI547918B (en) Panel device and detecting method thereof
CN107561875B (en) Overlay error measurement and problem assessment method
CN103713471B (en) A kind of means for correcting of key size measuring and method
CN109073991A (en) The method of the position of mask clamp is detected on measurement table
CN106154768A (en) A kind of ic substrate re-expose method based on mask plate
CN106353971A (en) Exposure apparatus, exposure method, and device manufacturing method
KR20190094447A (en) Flatness measurement method and pin-height adjustment method
CN105136818A (en) Printing substrate image detecting method
CN105509643A (en) Sub-pixel unit CD measuring method and device
CN108132558B (en) Alignment detection method and display device
WO2018076591A1 (en) Method for device, and method and system for manufacturing mask or display substrate
CN105867066B (en) Mask plate, manufacturing method of display substrate, display substrate and display device
CN102569113A (en) Edging width detection method
CN103646885A (en) A method for reducing errors in the observation of wafers by an electron microscope

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant