CN105873391A - Electronic product shell and manufacturing method thereof - Google Patents
Electronic product shell and manufacturing method thereof Download PDFInfo
- Publication number
- CN105873391A CN105873391A CN201610270370.6A CN201610270370A CN105873391A CN 105873391 A CN105873391 A CN 105873391A CN 201610270370 A CN201610270370 A CN 201610270370A CN 105873391 A CN105873391 A CN 105873391A
- Authority
- CN
- China
- Prior art keywords
- electronic product
- product casing
- sucker
- casing
- mould
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 241000252254 Catostomidae Species 0.000 claims description 80
- 239000000463 material Substances 0.000 claims description 34
- 210000003660 Reticulum Anatomy 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 10
- 239000007924 injection Substances 0.000 claims description 10
- 238000007493 shaping process Methods 0.000 claims description 8
- 238000007731 hot pressing Methods 0.000 claims description 7
- 229920002725 Thermoplastic elastomer Polymers 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 4
- AGGRGODMKWLSDE-UHFFFAOYSA-N 1-[2,4,6-tri(propan-2-yl)phenyl]sulfonylimidazole Chemical class CC(C)C1=CC(C(C)C)=CC(C(C)C)=C1S(=O)(=O)N1C=NC=C1 AGGRGODMKWLSDE-UHFFFAOYSA-N 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 abstract description 4
- 239000007779 soft material Substances 0.000 abstract description 3
- 238000000465 moulding Methods 0.000 abstract 1
- 230000000576 supplementary Effects 0.000 description 12
- 238000002360 preparation method Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000005611 electricity Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000005323 electroforming Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000010405 anode material Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012266 salt solution Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 101710031899 moon Proteins 0.000 description 1
- ODLMAHJVESYWTB-UHFFFAOYSA-N propylbenzene Chemical compound CCCC1=CC=CC=C1 ODLMAHJVESYWTB-UHFFFAOYSA-N 0.000 description 1
- 239000002965 rope Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
Abstract
The invention discloses an electronic product shell, which comprises a shell body, wherein the shell body is formed by a soft material; and dense suction cups with miniature structures are arranged on the outer surface of the shell body, so that the problem that an electronic product is relatively cumbersome to place since the electronic product needs to utilize an auxiliary structure and needs to search a proper position capable of fixing the auxiliary structure when placed on a slope is solved. When the electronic product is attached to a support, the shell is capable of preventing the electronic product from dropping off and is relatively convenient. The invention further discloses a manufacturing method of the electronic product shell. The electronic product shell is manufactured through an injection molding or hot press molding method, so that the manufacturing cost can be reduced.
Description
Technical field
The present invention relates to skinning technique field, particularly to a kind of electronic product casing and manufacture method thereof.
Background technology
Along with the development of electronic science and technology, the electronic product such as mobile phone, panel computer is in the routine work of people
In life more and more universal, conventional electronic product shell is all light face or laiu wire rope face, when being positioned over smooth table
Easily drop on face or inclined-plane and cause the damage of electronic product, bring unnecessary economic loss to user.
For avoiding dropping of electronic product, it is often necessary to use supplementary structure, such as fixed support etc., but also need
Find and there is the correct position that can fix this supplementary structure, cumbersome, reduce Consumer's Experience.
Summary of the invention
The embodiment of the invention discloses a kind of electronic product casing and manufacture method thereof, exist solving electronic product
Need when being positioned over inclined-plane use supplementary structure and find the correct position that can fix this supplementary structure, compare
Troublesome problem.
On the one hand, it is provided that a kind of electronic product casing, described electronic product casing includes outer cover body, institute
Stating outer cover body to be molded by flexible material, the outer surface of described outer cover body is provided with the suction of intensive micro-structure
Dish；When the outer surface of electronic product is placed with on a support, squeeze out the air in described sucker, and adsorb
On above support, prevent dropping of described electronic product.
In this implementation, by being provided with intensive small knot on the outer surface of electronic product casing body
The sucker of structure, when the outer surface of electronic product is placed with on a support, it is possible to squeeze out the air in sucker,
And adsorb on a support, need when being positioned over inclined-plane to use supplementary structure and seeking solving electronic product
Look for the correct position that can fix this supplementary structure, cumbersome problem.
In conjunction with first aspect, in the first possible implementation of first aspect, described outer cover body and
The overall structure that described sucker is formed in one.
In this implementation, the overall structure that outer cover body and sucker are formed in one, it is possible to prevent shell
On body, sucker comes off.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, a diameter of 1-5000 micron of described sucker.
In this implementation, sucker can be adsorbed on supporter, prevents dropping of electronic product.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, described sucker includes the recessed dish at outwardly Pan Bi and middle part.
In this implementation, sucker can be adsorbed on supporter, prevents dropping of electronic product.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, described electronic product casing is the bonnet of electronic product, containment vessel or after being covered in
The structure sheaf of lid.
In this implementation, electronic product casing can be the bonnet of electronic product, it is also possible to be to be sleeved on
Containment vessel on electronic product, it is also possible to be the structure sheaf covered on electronic product bonnet, this electronic product
The sucker suction that shell can pass through which is provided with, on supporter, prevents dropping of electronic product.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, described flexible material include TPUE, thermoplastic elastomer (TPE),
One or more combinations in 1-(2,4,6-tri-isopropyl benzene sulfonyl) imidazoles, rubber.
In this implementation, use TPUE, thermoplastic elastomer (TPE), (2,4,6-tri-is different for 1-
Propyl benzene sulfonyl) imidazoles or rubber can strengthen the absorption affinity of electronic product casing.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, described electronic product casing is passed through described flexible material by electronic product casing mould
Injection or hot pressing replicate shaping, and described electronic product casing mould includes fine sucker structure mold cores.
In this implementation, prepare electronic product casing by injection or hot-forming method, can drop
Low preparation cost.
In conjunction with first aspect, at the first possible implementation or the second of first aspect of first aspect
In possible implementation, described electronic product casing is phone housing.
In this implementation, electronic product casing can be provided with by phone housing as phone housing
Sucker suction, on supporter, prevents dropping of mobile phone.
On the other hand, it is provided that the manufacture method of a kind of electronic product casing, described method includes:
Prepare electronic product casing mould, described in state electronic product casing mould and include fine sucker structure mould
Core；
Utilize flexible material to replicate described electronic product casing mould, have intensive small obtaining outer surface
The electronic product casing of the sucker of structure.
In conjunction with second aspect, in the first possible implementation of second aspect, described utilize soft material
Material replicates described electronic product casing mould, including:
Flexible material injection or hot pressing is utilized to replicate described electronic product casing mould.
In this implementation, prepare electronic product casing by injection or hot-forming method, can drop
Low preparation cost.
Implement a kind of electronic product casing and manufacture method thereof that the embodiment of the present invention provides, have the most useful
Effect:
By being provided with the sucker of intensive micro-structure on the outer surface of electronic product casing body, to solve
Electronic product needs when being positioned over inclined-plane to use supplementary structure and searching can fix the suitable of this supplementary structure
Position, cumbersome problem, when electronic product is placed with on a support, this shell is possible to prevent electronics
Dropping of product, convenient.And, prepare electronic product casing by injection or hot-forming method,
Preparation cost can be reduced.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to enforcement
In example or description of the prior art, the required accompanying drawing used is briefly described, it should be apparent that, describe below
In accompanying drawing be only some embodiments of the present invention, for those of ordinary skill in the art, do not paying
On the premise of going out creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of a kind of electronic product casing that the embodiment of the present invention provides；
Fig. 2 is the stereogram of a kind of electronic product casing that the embodiment of the present invention provides；
Fig. 3 is the structural representation of the another kind of electronic product casing that the embodiment of the present invention provides；
Fig. 4 is the stereogram of a kind of electronic product casing that the embodiment of the present invention provides；
The structural representation of a kind of sucker that Fig. 5 provides for the embodiment of the present invention；
The cross section structure schematic diagram of a kind of electronic product casing mould that Fig. 6 provides for the embodiment of the present invention；
A kind of electronic product casing cross section structure schematic diagram that Fig. 7 provides for the embodiment of the present invention；
Fig. 8 is the schematic flow sheet of the manufacture method of a kind of electronic product casing that the embodiment of the present invention provides.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clearly
Chu, be fully described by, it is clear that described embodiment be only a part of embodiment of the present invention rather than
Whole embodiments.
It should be noted that the term used in embodiments of the present invention is only merely for describing specific embodiment
Purpose, and be not intended to be limiting the present invention.Used in the embodiment of the present invention and appended claims
" a kind of ", " described " and " being somebody's turn to do " of singulative is also intended to include most form, unless context clearly shows that
Other implications.It is also understood that term "and/or" used herein refers to and comprises one or more relevant
Any or all of the project of listing of connection may combination.
Refer to the structure that Fig. 1 and Fig. 2, Fig. 1 are a kind of electronic product casings that the embodiment of the present invention provides show
Being intended to, Fig. 2 is the stereogram of a kind of electronic product casing that the embodiment of the present invention provides.There is provided in FIG
The front view of electronic product casing, top view and right view, this electronic product casing includes outer cover body 11,
This outer cover body is molded by flexible material；Outer surface at outer cover body is provided with the sucker of intensive micro-structure
12；The inner surface depression of this outer cover body forms the sucker 12 of multiple micro-structure having and accommodating chamber.Fig. 1
It is hemispherical to shell body internal surface depression with the sucker of micro-structure in Fig. 2, and outside outer cover body
Surface becomes lattice arrangement.It should be noted that the arrangement of the sucker of micro-structure can be the arrangement of rule,
Can also be erratic random alignment, the present invention limit.
Refer to the structure that Fig. 3 and Fig. 4, Fig. 3 are the another kind of electronic product casings that the embodiment of the present invention provides
Schematic diagram, Fig. 4 is the stereogram of the another kind of electronic product casing that the embodiment of the present invention provides.In figure 3
Provide the front view of electronic product casing, top view, left view and right view, this electronic product casing
Including outer cover body 11, this outer cover body is molded by flexible material；Outer surface at outer cover body is provided with intensive
The sucker 12 of micro-structure；The inner surface depression of this outer cover body forms multiple small knot having and accommodating chamber
The sucker 12 of structure.In Fig. 3 and Fig. 4, the sucker of micro-structure includes recessed dish and the groove of bottom on top, its
The recessed dish of middle and upper part is bowl bodies, and its cross section is regular hexagon shape, and the groove of its underpart becomes hexagonal prism shape,
As it is shown in figure 5, the structural representation of a kind of sucker that Fig. 5 provides for the embodiment of the present invention.Fig. 5 is Fig. 3
With the longitudinal section of sucker in electronic product casing shown in Fig. 4.
Preferably, the overall structure that outer cover body 11 and sucker 12 are formed in one, it is possible to prevent shell originally
On body, sucker comes off.Specifically, outer cover body and sucker can be one-body molded during preparation, logical
Crossing, flexible material integral forming process is prepared.
Preferably, the micro-structure of this sucker a diameter of 1-5000 micron.This sucker can include the recessed of top
Dish and the groove of bottom, wherein, the recessed dish on top can be in bowl-shape, open column shape etc.；The groove of bottom can
With in open column shape, carbon fiber etc., the present invention is not restricted.
It should be noted that this electronic product casing can be the bonnet of electronic product；Can also be to be sleeved on
Containment vessel on electronic product bonnet；Can also is that the structure sheaf being covered in bonnet, as pad pasting, coating
Etc. being covered in electronic product bonnet, it is integrally forming with electronic product bonnet.
It should be noted that flexible material can be TPUE, heat in the embodiment of the present invention
One or more combinations in thermoplastic elastic, 1-(2,4,6-tri-isopropyl benzene sulfonyl) imidazoles, rubber etc., these
Electronic product casing prepared by material, its sucker has more by force can be with absorption affinity.This flexible material can be single
The material of the composition of, it is also possible to be the mixture of multiple material.
Preferably, electronic product casing is molded or hot pressing duplication by flexible material by electronic product casing mould
Shaping, wherein, electronic product casing mould includes fine sucker structure mold cores.By injection or hot pressing
The method of shaping prepares electronic product casing, can reduce preparation cost.
Specifically, a kind of electronic product casing mould that Fig. 6, Fig. 6 provide is referred to for the embodiment of the present invention
Cross section structure schematic diagram, this electronic product casing mould includes mold 61 and lower mold 62, wherein, upper mold
Die cavity 63 can be formed between tool 61 and lower mold 62；Mold 61 or lower mold 62 can include fine suction
Dish structure mold core 64, includes as a example by fine sucker structure mold cores 64 by mold 61 in Fig. 6；
This fine sucker structure mold cores 64 for forming intensive micro-structure when electronic product casing is molded
Sucker.This fine sucker structure mold cores 64 is to process by the way of electroforming, treated so that it assembles
In mold 61.The preparation method of fine sucker structure mold cores, including: prepare sucker structure grand master pattern,
This sucker structure grand master pattern comprises the sucker of intensive micro-structure；With sucker structure grand master pattern as negative electrode, electricity consumption
Casting material, as anode, is together put in the metal salt solution identical with anode material, is passed to direct current,
Under electrolysis, sucker structure master surface deposits electroformed layer, after reaching preset thickness, takes out and should
Electroformed layer separates with sucker structure grand master pattern, then the electroformed layer after separating is processed into sucker structure mold cores 64,
So that sucker structure mold cores 63 can be assembled in mold 61.
Then, utilize flexible material as test portion, utilize former, such as injection molding apparatus, be hot pressed into
Type equipment, replicates electronic product casing mould, has the sucker of intensive micro-structure obtaining outer surface
Electronic product casing.The technique of injection mo(u)lding is prepared this electronic product casing and is included: utilize injection molding apparatus
Die cavity 63 mesohigh at electronic product casing mould injects melted flexible material, cooling shaping, it is thus achieved that electricity
Sub-product casing.Hot-forming technique is prepared this electronic product casing and is included: utilize hot-press forming device heat
Molded injection flexible material powder or block in electronic product casing mould；Heating mould is with melted soft
Material powder or block, cooling shaping, it is thus achieved that electronic product casing, as it is shown in fig. 7, Fig. 7 is the present invention
A kind of electronic product casing cross section structure schematic diagram that embodiment provides, Fig. 7 is produced by the electronics shown in Fig. 6
The vertical section structure schematic diagram of the electronic product casing that product outer casing mold produces.
Preferably, this electronic product casing can be as phone housing, and the sucker being provided with by phone housing is inhaled
Invest on supporter, prevent dropping of mobile phone.Specifically, this electronic product casing can be as cell phone rear cover；
It can also be the containment vessel being sleeved on outer handset；Can also is that the structure sheaf being covered in cell phone rear cover, as incited somebody to action
The electronic product casing being molded by flexible material is covered in cell phone rear cover as pad pasting, coating etc., produces with electronics
Product bonnet becomes one structure.
It should be noted that the shape of the electronic product casing of embodiment of the present invention offer depends on that it is applied
Electronic product, the present invention does not limits.Applicable electronic product it may be that mobile phone, panel computer,
Flat panel TV etc..Such as, if electronic product casing is mobile phone battery cover, then according to the needs of mobile phone, design hand
Machine outer casing mold, preparation has the mobile phone battery cover of intensive small sucker structure；If electronic product casing is hand
Machine containment vessel, then according to structure and the size of mobile phone, design phone housing mould, and preparation has intensive small
The mobile phone protecting case of sucker structure；If phone housing is the structure sheaf being covered in cell phone rear cover, then comprise close
The structure sheaf collecting small sucker structure can be covered in cell phone rear cover as pad pasting, coating etc., produces with electronics
Product bonnet becomes one structure so that the outer surface of cell phone rear cover has one layer and comprises intensive small sucker knot
The structure sheaf of structure.
A kind of electronic product casing that implementing the embodiment of the present invention provides includes outer cover body, and outer cover body is by soft
Property material shaping, by being provided with the sucker of intensive micro-structure at the outer surface of outer cover body, to solve electricity
Sub-product needs when being positioned over inclined-plane use supplementary structure and find the suitable position that can fix this supplementary structure
Putting, cumbersome problem, this electronic product casing can realize propping up when the outer surface of electronic product is placed with
On support thing, squeeze out the air in sucker, and adsorb on a support, prevent dropping of electronic product.
Refer to the stream that Fig. 8, Fig. 8 are the manufacture methods of a kind of electronic product casing that the embodiment of the present invention provides
Journey schematic diagram.The method includes:
S801, prepares electronic product casing mould.
Specifically, this electronic product casing mould includes mold 61 and lower mold 62, wherein, mold
Die cavity 63 can be formed between 61 and lower mold 62；Mold 61 or lower mold 62 include fine sucker structure
Mold cores 64；This fine sucker structure mold cores 64 is intensive for being formed when electronic product casing is molded
The sucker of micro-structure.This fine sucker structure mold cores 64 is to process by the way of electroforming, through place
Reason is so that it is assembled in mold.
It should be noted that the preparation method of fine sucker structure mold cores 64, including: prepare sucker knot
Structure grand master pattern, this sucker structure grand master pattern comprises the sucker of intensive micro-structure；With sucker structure grand master pattern as the moon
Pole, with electroforming material as anode, together puts in the metal salt solution identical with anode material, passes to straight
Stream electricity, under electrolysis, sucker structure master surface deposits electroformed layer, after reaching preset thickness, takes
Go out and this electroformed layer is separated with sucker structure grand master pattern, then the electroformed layer after separating is processed into sucker structure mould
Tool core 64, so that sucker structure mold cores 64 can be assembled in mold.
S802, utilizes flexible material to replicate described electronic product casing mould, has intensive obtaining outer surface
The electronic product casing of sucker of micro-structure, in Fig. 7, the sucker structure of electronic product casing is in Fig. 5 institute
The sucker structure shown is consistent.
Specifically, utilize flexible material as test portion, utilize former, such as injection molding apparatus, hot pressing
Former, replicates electronic product casing mould, has the sucker of intensive micro-structure obtaining outer surface
Electronic product casing.
Preferably, this electronic product casing can be prepared by the technique of injection mo(u)lding.Specifically, note is utilized
Molded equipment injects melted flexible material at die cavity 63 mesohigh of electronic product casing mould, is cooled to
Type, it is thus achieved that electronic product casing.
Preferably, this electronic product casing can be prepared by hot-forming technique.Specifically, heat is utilized
Press forming device is hot-forming injects flexible material powder or block in the die cavity 63 of electronic product casing mould；
Heating mould is with melted flexible material powder or block, cooling shaping, it is thus achieved that electronic product casing.
The manufacture method of a kind of electronic product casing provided according to embodiments of the present invention, produces by preparing electronics
Product outer casing mold, and utilize flexible material to replicate electronic product casing mould, have intensive obtaining outer surface
The electronic product casing of sucker of micro-structure, need when being positioned over inclined-plane to use solving electronic product
Supplementary structure and searching can fix the correct position of this supplementary structure, cumbersome problem, it is possible to achieve
When the outer surface of electronic product is placed with on a support, squeeze out the air in sucker, and adsorb at supporter
On, prevent dropping of electronic product.
Above disclosed only one preferred embodiment of the present invention, can not limit this with this certainly
Bright interest field, one of ordinary skill in the art will appreciate that all or part of stream realizing above-described embodiment
Journey, and according to the equivalent variations that the claims in the present invention are made, still fall within the scope that invention is contained.
Claims (10)
1. an electronic product casing, it is characterised in that described electronic product casing includes outer cover body, institute
Stating outer cover body to be molded by flexible material, the outer surface of described outer cover body is provided with the suction of intensive micro-structure
Dish；When the outer surface of electronic product is placed with on a support, squeeze out the air in described sucker, and adsorb
On above support, prevent dropping of described electronic product.
Electronic product casing the most according to claim 1, it is characterised in that described outer cover body and institute
State the overall structure that sucker is formed in one.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described sucker straight
Footpath is 1-5000 micron.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described sucker includes
The recessed dish on top and the groove of bottom.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described electronic product
Shell is the bonnet of electronic product, containment vessel or the structure sheaf being covered in bonnet.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described flexible material
Including TPUE, thermoplastic elastomer (TPE), 1-(2,4,6-tri-isopropyl benzene sulfonyl) imidazoles, rubber
In one or more combination.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described electronic product
Shell is molded or hot pressing duplication shaping by described flexible material by electronic product casing mould, and described electronics produces
Product outer casing mold includes fine sucker structure mold cores.
Electronic product casing the most according to claim 1 and 2, it is characterised in that described electronic product
Shell is phone housing.
9. the manufacture method of an electronic product casing, it is characterised in that described method includes:
Prepare electronic product casing mould, described in state electronic product casing mould and include fine sucker structure mould
Core；
Utilize flexible material to replicate described electronic product casing mould, have intensive small obtaining outer surface
The electronic product casing of the sucker of structure.
Manufacture method the most according to claim 9, it is characterised in that described utilize flexible material multiple
Make described electronic product casing mould, including:
Flexible material injection or hot pressing is utilized to replicate described electronic product casing mould.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610270370.6A CN105873391A (en) | 2016-04-27 | 2016-04-27 | Electronic product shell and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610270370.6A CN105873391A (en) | 2016-04-27 | 2016-04-27 | Electronic product shell and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105873391A true CN105873391A (en) | 2016-08-17 |
Family
ID=56629384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610270370.6A Pending CN105873391A (en) | 2016-04-27 | 2016-04-27 | Electronic product shell and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105873391A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102485463A (en) * | 2010-12-02 | 2012-06-06 | 广达电脑股份有限公司 | Method of manufacturing sucker |
| CN204069268U (en) * | 2014-09-11 | 2014-12-31 | 深圳价之链科技有限公司 | Absorption type bluetooth earphone |
| CN204741303U (en) * | 2015-06-17 | 2015-11-04 | 深圳市瑞福来电子有限公司 | Wireless rechargeable cell -phone protective housing |
| CN105072230A (en) * | 2015-08-24 | 2015-11-18 | 联想(北京)有限公司 | Adsorbable electronic equipment |
-
2016
- 2016-04-27 CN CN201610270370.6A patent/CN105873391A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102485463A (en) * | 2010-12-02 | 2012-06-06 | 广达电脑股份有限公司 | Method of manufacturing sucker |
| CN204069268U (en) * | 2014-09-11 | 2014-12-31 | 深圳价之链科技有限公司 | Absorption type bluetooth earphone |
| CN204741303U (en) * | 2015-06-17 | 2015-11-04 | 深圳市瑞福来电子有限公司 | Wireless rechargeable cell -phone protective housing |
| CN105072230A (en) * | 2015-08-24 | 2015-11-18 | 联想(北京)有限公司 | Adsorbable electronic equipment |
Non-Patent Citations (1)
| Title |
|---|
| 深圳市龙华新区海华数码电子厂: "《1688》", 18 August 2015 * |
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Application publication date: 20160817 |
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