CN105849897B - 散热屏蔽结构及通信产品 - Google Patents

散热屏蔽结构及通信产品 Download PDF

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CN105849897B
CN105849897B CN201480069545.6A CN201480069545A CN105849897B CN 105849897 B CN105849897 B CN 105849897B CN 201480069545 A CN201480069545 A CN 201480069545A CN 105849897 B CN105849897 B CN 105849897B
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shielding
radiator
heat dissipation
shielding case
aperture
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CN105849897A (zh
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李晓庆
蒋进京
张治国
王彬
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华为技术有限公司
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    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/002Casings with localised screening
    • H05K9/0022Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024Shield cases mounted on a PCB, e.g. cans, caps, conformal shields
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    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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    • H05K2201/07Electric details
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    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10371Shields or metal cases

Abstract

本发明公开一种散热屏蔽结构,包括屏蔽罩、导热垫及散热器,所述屏蔽罩的底部连接至用于承载发热元件的电路板,所述散热器设于所述屏蔽罩的顶部,所述屏蔽罩的顶部设有开孔,所述导热垫穿过所述开孔,且所述导热垫的底面贴附至所述发热元件,所述导热垫的顶面贴附至所述散热器,所述散热屏蔽结构还包括金属弹片,所述金属弹片位于所述开孔的周边且包围所述开孔,所述金属弹片弹性连接于所述屏蔽罩与所述散热器之间,使得所述散热器与所述屏蔽罩共同形成一个包围所述发热元件的屏蔽体。本发明公开的散热屏蔽结构具有良好的散热屏蔽功能。

Description

散热屏蔽结构及通信产品

技术领域

本发明涉及电磁屏蔽结构,尤其涉及一种散热屏蔽结构。

背景技术

通信终端产品中包括一些发热量较大的芯片,例如:功放(PA)等,发热量较大的芯片通常需要电磁屏蔽及散热。

例如机顶盒和网关等产品,这些产品所用到的CPU功耗较大,数字噪声辐射较大。当前解决散热和噪声屏蔽方案主要是CPU上方加导热垫再加屏蔽罩,屏蔽罩上面加导热垫再加散热器,共五个器件叠加设置,这种方案虽然可以解决屏蔽问题,但是散热片和CPU之间有三层物质导致散热效果打了折扣,在一些小尺寸设备中散热无法满足要求,也不利于产品轻薄化的设计。

发明内容

本发明所要解决的技术问题在于提供一种散热屏蔽结构,具有良好的散热屏蔽功能,同时有利于产品轻薄化设计。

为了实现上述目的,本发明实施方式提供如下技术方案:

本发明供了一种散热屏蔽结构,包括屏蔽罩、导热垫及散热器,所述屏蔽罩用于遮罩发热元件,所述屏蔽罩的底部连接至用于承载所述发热元件的电路板,所述散热器设于所述屏蔽罩的顶部,所述屏蔽罩的顶部设有开孔,所述导热垫穿过所述开孔,且所述导热垫的底面贴附至所述发热元件,所述导热垫的顶面贴附至所述散热器,所述散热屏蔽结构还包括金属弹片,所述金属弹片位于所述开孔的周边且包围所述开孔,所述金属弹片弹性连接于所述屏蔽罩与所述散热器之间,使得所述散热器与所述屏蔽罩共同形成一个包围所述发热元件的屏蔽体。

其中,所述散热屏蔽结构还包括导电双面胶或者导电泡棉,所述导电双面胶或者所述导电泡棉设于所述金属弹片的外围,所述导电双面胶或者所述导电泡棉通过备胶粘贴的方式将所述散热器固定连接至所述屏蔽罩的顶部。

其中,所述导电双面胶或者所述导电泡棉呈封闭的中空结构。

其中,所述金属弹片与所述屏蔽罩一体成型。

其中,所述金属弹片包括多个片状体,所述多个片状体彼此间隔分布在所述开孔的周围,所述片状体的一端一体成型连接至所述屏蔽罩的顶部,所述片状体的另一端为自由端,所述自由端邻接所述开孔,每个所述自由端均设有朝向所述散热器的方向突出的凸包,所述凸包用于顶持所述散热器。

其中,所述多个片状体的所述自由端共同包围成方形空间,所述开孔呈方形,所述凸包均呈半球形。

其中,所述多个片状体相互平行,相邻的所述片状体之间形成直线形缝隙或曲线形缝隙。

其中,所述相邻的所述片状体之间的垂直距离的尺寸范围在波长的十分之一至波长的二十分之一之间,所述波长为所述被发热元件干扰的无线系统的电磁波的波长。

本发明还提供一种通信产品,包括上述任意一项所述的散热屏蔽结构。

本发明提供的散热屏蔽结构通过在屏蔽罩顶设开孔,将导热垫穿过开孔,且所述导热垫的底面贴附至所述发热元件,所述导热垫的顶面贴附至所述散热器,再通过金属弹片弹性连接于所述屏蔽罩与所述散热器之间,使得所述散热器与所述屏蔽罩共同形成一个包围所述发热元件的屏蔽体,能够提高散热效率,同时能保证屏蔽效果,由于只通过一个导热垫穿过屏蔽罩将发热元件的热传导到散热器,使得整体结构简单,有利于产品轻薄化的设计。

附图说明

为了更清楚地说明本发明实施例中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。

图1是本发明一种实施方式提供的散热屏蔽结构截面示意图。

图2是本发明一种实施方式提供的散热屏蔽结构的立体分解示意图。

图3是本发明一种实施方式提供的散热屏蔽结构屏蔽罩的部分放大示意图。

具体实施方式

下面将结合本发明实施方式中的附图,对本发明实施方式中的技术方案进行清楚地描述。

本发明供了一种散热屏蔽结构及包括所述散热屏蔽结构的通信产品,所述通信产品可以为机顶盒、网关、固定台、移动终端等。

请参阅图1和图2,散热屏蔽结构100包括屏蔽罩30、导热垫40及散热器50。发热元件10设置于所述电路板20上,本实施方式中,发热元件10为CPU。所述屏蔽罩30用于遮罩所述发热元件10,所述屏蔽罩30的底部连接至用于承载发热元件10的所述电路板20,所述散热器50设于所述屏蔽罩30的顶部。所述屏蔽罩30的顶部设有开孔32。本实施方式中,屏蔽罩30包括屏蔽框体31和盖板33,屏蔽框体31固定连接至电路板20,可以通过焊接或SMT的方式将屏蔽框体31固定到电路板20上。盖板33和屏蔽框体31配合形成收容发热元件10的屏蔽空间。通过盖板33的侧边与屏蔽框体31之间凹凸配合实现二者之间的连接,例如在盖板33的侧边设凸点,屏蔽框体的外表面设凹坑,通过凸点与凹坑一对一的配合实现屏蔽框体31与盖板33之间的固定。相邻的凸点之间的距离在波长的十分之一至波长的二十分之一之间,所述波长为所述发热元件10干扰的无线系统的电磁波的波长。这样的距离能够保证电磁波无法泄露。使得所述散热屏蔽结构100具有好的屏蔽效果。

所述导热垫40穿过所述开孔32,且所述导热垫40的底面贴附至所述发热元件10,所述导热垫40的顶面贴附至所述散热器50,所述散热屏蔽结构100还包括金属弹片60,所述金属弹片60位于所述开孔32的周边且包围所述开孔32,所述金属弹片60弹性连接于所述屏蔽罩30与所述散热器50之间,使得所述散热器50与所述屏蔽罩30共同形成一个包围所述发热元件10的屏蔽体。

本发明提供的散热屏蔽结构100通过在屏蔽罩30顶设开孔32,将导热垫40穿过开孔32,且所述导热垫40的底面贴附至所述发热元件10,所述导热垫40的顶面贴附至所述散热器50,再通过金属弹片60弹性连接于所述屏蔽罩30与所述散热器50之间,使得所述散热器50与所述屏蔽罩30共同形成一个包围所述发热元件10的屏蔽体,能够提高散热效率,同时能保证屏蔽效果,由于只通过一个导热垫40穿过屏蔽罩30将发热元件10的热传导到散热器50,使得整体结构简单,有利于产品轻薄化的设计。

本实施方式中,所述散热屏蔽结构100还包括导电双面胶或导电泡棉70,所述导电双面胶或导电泡棉70设于所述金属弹片60的外围,所述导电双面胶或导电泡棉70通过备胶粘贴的方式将所述散热器50固定连接至所述屏蔽罩30的顶部。导电双面胶通过其本身所带的胶体来固定屏蔽罩30和散热器50。导电泡棉的两面无胶,侧需要另外涂覆胶体在导电泡棉的两面,以将导电泡棉粘贴在散热器50和屏蔽罩30之间。通过导电双面胶或导电泡棉70将散热器50固定至屏蔽罩30,同时也使得金属弹片60产生充分的弹性变形,稳定地抵接于散热器50与屏蔽罩30之间,能够保障散热屏蔽结构100的屏蔽效果,而且导电双面胶或导电泡棉70能够充当屏蔽材料,包围在金属弹片60的周围,进一步提升了屏蔽效果。本实施方式中,所述导电双面胶或者所述导电泡棉70呈封闭的中空结构。

本实施方式中,所述金属弹片60与所述屏蔽罩30一体成型。其它实施方式中,也可以将金属弹片60设置成单独的一个元件,夹设在屏蔽罩30与散热器50之间。一体成型的结构使得本发明散热屏蔽结构100简化,有利于产品轻薄化发展,也方便组装。

具体而言,所述金属弹片60包括多个片状体62,所述多个片状体62彼此间隔分布在所述开孔32的周围,所述片状体62的一端一体成型连接至所述屏蔽罩30的顶部,所述片状体62的另一端为自由端,所述自由端邻接所述开孔32,每个所述自由端均设有朝向所述散热器50的方向突出的凸包64,所述凸包64用于顶持所述散热器50。

本实施方式中,所述多个片状体62的所述自由端共同包围成方形空间,所述开孔32呈方形,凸包64均呈半球形。

本实施方式中,所述多个片状体62相互平行,相邻的所述片状体62之间形成直线形缝隙或曲线形缝隙。所述相邻的所述片状体62之间的垂直距离D的尺寸范围在波长的十分之一至波长的二十分之一之间,所述波长为所述发热元件10干扰的无线系统的电磁波的波长。这样的距离能够保证电磁波无法泄露。使得所述散热屏蔽结构100具有好的屏蔽效果。

以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。

Claims (7)

1.一种散热屏蔽结构,包括屏蔽罩、导热垫及散热器,所述屏蔽罩用于遮罩发热元件,所述屏蔽罩的底部连接至用于承载所述发热元件的电路板,所述散热器设于所述屏蔽罩的顶部,其特征在于,所述屏蔽罩的顶部设有开孔,所述导热垫穿过所述开孔,且所述导热垫的底面贴附至所述发热元件,所述导热垫的顶面贴附至所述散热器,所述散热屏蔽结构还包括金属弹片,所述金属弹片位于所述开孔的周边且包围所述开孔,所述金属弹片弹性连接于所述屏蔽罩与所述散热器之间,使得所述散热器与所述屏蔽罩共同形成一个包围所述发热元件的屏蔽体,所述金属弹片包括多个片状体,所述多个片状体彼此间隔分布在所述开孔的周围,所述片状体的一端一体成型连接至所述屏蔽罩的顶部,且所述片状体与所述屏蔽罩的顶部位于同一平面,所述片状体的另一端为自由端,所述自由端邻接所述开孔,每个所述自由端均设有朝向所述散热器的方向突出的凸包,所述凸包用于顶持所述散热器;相邻的所述片状体之间的垂直距离的尺寸范围在波长的十分之一至波长的二十分之一之间,所述波长为被所述发热元件干扰的无线系统的电磁波的波长。
2.如权利要求1所述的散热屏蔽结构,其特征在于,所述散热屏蔽结构还包括导电双面胶或者导电泡棉,所述导电双面胶或者所述导电泡棉设于所述金属弹片的外围,所述导电双面胶或者所述导电泡棉通过备胶粘贴的方式将所述散热器固定连接至所述屏蔽罩的顶部。
3.如权利要求2所述的散热屏蔽结构,其特征在于,所述导电双面胶或者所述导电泡棉呈封闭的中空结构。
4.如权利要求1权利要求所述的散热屏蔽结构,其特征在于,所述金属弹片与所述屏蔽罩一体成型。
5.如权利要求4所述的散热屏蔽结构,其特征在于,所述多个片状体的所述自由端共同包围成方形空间,所述开孔呈方形,所述凸包均呈半球形。
6.如权利要求4所述的散热屏蔽结构,其特征在于,所述多个片状体相互平行,相邻的所述片状体之间形成直线形缝隙或曲线形缝隙。
7.一种通信产品,其特征在于,所述通信产品包括如权利要求1-6任意一项所述的散热屏蔽结构。
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Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10602603B2 (en) * 2015-06-04 2020-03-24 Huawei Technologies Co., Ltd. Mobile terminal and heat dissipation and shielding structure
US10624245B2 (en) * 2016-06-23 2020-04-14 Laird Technologies, Inc. Laser weldable brackets for attachment of heat sinks to board level shields
CN106850883B (zh) 2016-12-20 2020-03-24 Oppo广东移动通信有限公司 支架组件、功能模组及移动终端
CN108808291B (zh) * 2018-05-16 2020-10-27 昆山杰顺通精密组件有限公司 双面接触组件
CN110707056A (zh) * 2019-09-27 2020-01-17 矽力杰半导体技术(杭州)有限公司 封装组件及其制造方法、以及降压型变换器的封装组件

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6639800B1 (en) * 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly
CN201853688U (zh) * 2010-10-19 2011-06-01 鸿富锦精密工业(深圳)有限公司 散热结构
CN203722975U (zh) * 2013-11-19 2014-07-16 中兴通讯股份有限公司 一种移动终端散热装置和屏蔽罩架

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6208516B1 (en) * 1999-05-11 2001-03-27 Apple Computer, Inc. Electromagnetic interference shield and gap filler for a circuit board
US6219239B1 (en) * 1999-05-26 2001-04-17 Hewlett-Packard Company EMI reduction device and assembly
US6188577B1 (en) * 1999-11-18 2001-02-13 Yen-Wen Liu Protective device for central processing unit
US6346672B1 (en) * 2000-07-03 2002-02-12 Chin Fu Horng Structure for preventing electromagnetic interference of central processing unit
US20040052064A1 (en) * 2001-11-15 2004-03-18 Oliver Michael J. Electromagnetic shielding and cooling device for printed circuit board
US6343017B1 (en) * 2000-12-29 2002-01-29 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly
US6445583B1 (en) * 2001-01-26 2002-09-03 Laird Technologies, Inc. Snap in heat sink shielding lid
US6949706B2 (en) * 2001-09-28 2005-09-27 Siemens Information And Communication Mobile, Llc Radio frequency shield for electronic equipment
CN2790116Y (zh) * 2005-03-29 2006-06-21 华为技术有限公司 散热及屏蔽结构
CN2790120Y (zh) * 2005-04-15 2006-06-21 华为技术有限公司 一种屏蔽盒
CN1953646A (zh) * 2005-10-18 2007-04-25 鸿富锦精密工业(深圳)有限公司 能防电磁干扰的散热装置
US7463496B2 (en) * 2006-03-09 2008-12-09 Laird Technologies, Inc. Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith
CN201104378Y (zh) 2007-04-04 2008-08-20 华为技术有限公司 屏蔽和散热装置
US7638717B1 (en) * 2008-08-06 2009-12-29 Apple Inc. Can spring housing contact
CN201336790Y (zh) * 2008-12-05 2009-10-28 鸿富锦精密工业(深圳)有限公司 散热装置
TWI370722B (en) * 2008-12-22 2012-08-11 Unihan Corp Electromagnetic shielding device with heat dissipating
WO2013063748A1 (en) * 2011-10-31 2013-05-10 Thomson Licensing Shielding structure for electronic device
US9351395B2 (en) * 2012-01-18 2016-05-24 Covidien Lp Printed circuit boards including strip-line circuitry and methods of manufacturing same
US9048124B2 (en) * 2012-09-20 2015-06-02 Apple Inc. Heat sinking and electromagnetic shielding structures
CN108370656B (zh) * 2015-12-18 2020-01-14 大陆汽车系统公司 滑动热屏障

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US6639800B1 (en) * 2002-04-30 2003-10-28 Advanced Micro Devices, Inc. Heat sink subassembly
CN201853688U (zh) * 2010-10-19 2011-06-01 鸿富锦精密工业(深圳)有限公司 散热结构
CN203722975U (zh) * 2013-11-19 2014-07-16 中兴通讯股份有限公司 一种移动终端散热装置和屏蔽罩架

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