CN105828516A - Flexible plate for protecting bare copper layer, and production method thereof - Google Patents
Flexible plate for protecting bare copper layer, and production method thereof Download PDFInfo
- Publication number
- CN105828516A CN105828516A CN201610302111.7A CN201610302111A CN105828516A CN 105828516 A CN105828516 A CN 105828516A CN 201610302111 A CN201610302111 A CN 201610302111A CN 105828516 A CN105828516 A CN 105828516A
- Authority
- CN
- China
- Prior art keywords
- copper
- layer
- protective layer
- layers
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
Abstract
The invention discloses a flexible plate for protecting a bare copper layer, and a production method thereof. The flexible plate includes a first insulating layer , wherein the upper surface of the first insulating layer is provided with an inner layer of copper layer; the upper surface of the inner layer of copper layer is provided with a bonding layer; the upper surface of the bonding layer is provided with a second insulating layer; the upper surface of the second insulating layer is provided with an outer layer of copper layer, a bare copper layer and a protective layer for protecting the bare copper layer; the bare copper layer and the inner layer of copper layer are an integrated structure; and the second insulating layer can form the protective layer by means of certain depth of cutting. The flexible plate for protecting a bare copper layer, and the production method thereof utilize the protective layer to protect the bare copper layer without the demand for manually pasting adhesive tapes to protect the bare copper, so that the production technology of a traditional flexible plate is effectively improved; the manual operation and the production time are greatly reduced; and the production efficiency and the product yield rate are improved.
Description
Technical field
The present invention relates to a kind of soft board and production method, a kind of soft board protecting exposed layers of copper and production method thereof.
Background technology
In current soft board production technology, needing exposed situation for internal layer layers of copper, be usually and in advance the base material of outer layer dug up, ectonexine base material is the most exposed out by internal layer layers of copper after adhesives pressing.This kind of production method is electroplated at follow-up heavy copper, outer-layer circuit etching time, protection of need to manually taping, add cost of labor and adhesive tape cost, and production efficiency be extremely low；The copper sheet that adhesive tape adheres at heavy copper electroplating process is insecure, and de-falling behind in forms pollution in heavy copper electroplating liquid medicine.
Summary of the invention
For solving the problems referred to above, it is an object of the invention to provide a kind of soft board protecting exposed layers of copper and production method thereof.
The present invention solves its problem and be the technical scheme is that a kind of soft board protecting exposed layers of copper; including the first insulating barrier; described first insulating barrier upper surface is provided with internal layer layers of copper; internal layer layers of copper upper surface is provided with adhesive linkage; adhesive linkage upper surface is provided with the second insulating barrier; second insulating barrier upper surface is provided with external copper layer, is provided with exposed layers of copper and for protecting the protective layer of exposed layers of copper.
Further, described exposed layers of copper is structure as a whole with internal layer layers of copper.
Further, being provided with bond pad, described protective layer is fixed together by bond pad and the first insulating barrier.
Further, described bond pad is arranged at one end of protective layer and is connected with one end of the first insulating barrier.
Further, the 3rd space it is provided with between described bond pad and exposed layers of copper.
Further, the end face of described external copper layer, the end face of protective layer, the end face of bond pad and the first insulating barrier end face.
Further, described protective layer is arranged at the lower section of external copper layer.
Further, the first space it is provided with between described protective layer and the second insulating barrier.
Further, it is provided with Second gap between described protective layer and exposed layers of copper.
Further, described protective layer is arranged at the top of exposed layers of copper.
The cutting of late protection layer is easy in the setting in the present invention the first space, is conducive to saving man power and material；Second gap of the present invention and arranging of the 3rd space can save material, reduce cost.
The production method of a kind of soft board protecting exposed layers of copper, forms protective layer including the cutting that the second insulating barrier does certain depth.
Further, the slit cuts that the second insulating barrier does certain depth forms protective layer.
Further, the degree of depth in the first space that the second insulating barrier cutting is formed is less than or equal to the thickness of the second insulating barrier.
Further, the width in the first space that the second insulating barrier cutting is formed is more than or equal to 20um.
Further, the cutting using laser beam that the second insulating barrier does certain depth forms protective layer.
Further, described laser beam is that wavelength is the Ultra-Violet Laser of 355nm or wavelength is the iraser of 9400nm.
Further, the cutting that the second insulating barrier does certain depth in advance forms protective layer.Cut in advance and be not only easy to cutting, and it is bonding to be easy to pressing.
Further, after forming protective layer, the protective layer of formation is linked together by bond pad and the first insulating barrier.
Further, described protective layer links together with the first insulating barrier by the way of pressing.
Further, including removing protective layer, exposed layers of copper is exposed.
Further, remove protective layer in etching outer copper foil circuit flow process and any stage exposed layers of copper carried out between the copper surface protection flow process such as immersion Ni/Au, electrogilding, expose exposed layers of copper.
Further, utilize the mode of laser, mould or machining, protective layer is got rid of, expose the layers of copper that needs are exposed.
The invention has the beneficial effects as follows: a kind of soft board protecting exposed layers of copper that the present invention is and production method thereof; the present invention protects exposed layers of copper by arranging protective layer; without the exposed layers of copper of protection of manually taping; effectively improve the production technology of tradition soft board; greatly reduce manual operation and shorten the production time, improve production efficiency and product yield.
Accompanying drawing explanation
The invention will be further described with example below in conjunction with the accompanying drawings.
Fig. 1 is the product structure figure of the present invention.
Detailed description of the invention
Fig. 1 is the product structure figure of the present invention; as shown in Figure 1; a kind of soft board protecting exposed layers of copper; including the first insulating barrier 1; described first insulating barrier 1 upper surface is provided with internal layer layers of copper 2, and internal layer layers of copper 2 upper surface is provided with adhesive linkage 3, and adhesive linkage 3 upper surface is provided with the second insulating barrier 4; second insulating barrier 4 upper surface is provided with external copper layer 5, is provided with exposed layers of copper 6 and for protecting the protective layer 7 of exposed layers of copper 6.The exposed layers of copper 6 of the present invention is structure as a whole with internal layer layers of copper 2.The present invention is provided with bond pad 8, and described protective layer 7 is fixed together with the first insulating barrier 1 by bond pad 8.The bond pad 8 of the present invention is arranged at one end of protective layer 7 and is connected with one end of the first insulating barrier 1.
It is provided with the 3rd space 9 between bond pad 8 and the exposed layers of copper 6 of the present invention.The end face of external copper layer 5 of the present invention, the end face of protective layer 7, the end face of bond pad 8 and the first insulating barrier 1 end face.The protective layer 7 of the present invention is arranged at the lower section of external copper layer 5.It is provided with the first space 10 between protective layer 7 and second insulating barrier 4 of the present invention.It is provided with Second gap 11 between protective layer 7 and the exposed layers of copper 6 of the present invention.The protective layer 7 of the present invention is arranged at the top of exposed layers of copper 6.The cutting of late protection layer 7 is easy in the setting in the present invention the first space 10, is conducive to saving man power and material；Second gap 11 of the present invention and arranging of the 3rd space 9 can save material, reduce cost.
The production method of a kind of soft board protecting exposed layers of copper, forms protective layer 7 including the cutting that the second insulating barrier 4 does certain depth.
Specifically, the present invention forms protective layer 7 by the slit cuts that the second insulating barrier 4 does certain depth in advance.The degree of depth in the present invention the first space 10 is more than or equal to 20um less than or equal to the thickness of the second insulating barrier 4, width.Second insulating barrier 4 is done the cutting of certain depth and forms protective layer 7 by Ultra-Violet Laser that the present invention uses wavelength to be 355nm or the iraser that wavelength is 9400nm in advance.The present invention cuts in advance is not only easy to cutting, and it is bonding to be easy to pressing.The protective layer 7 of formation, after forming protective layer 7, is linked together by the way of bond pad 8 uses pressing by the present invention with the first insulating barrier 1.The present invention is in etching outer copper foil circuit flow process and exposed layers of copper 6 is carried out any stage between the copper surface protection flow process such as immersion Ni/Au, electrogilding utilize the mode of laser, mould or machining to remove protective layer 7, exposes exposed layers of copper 6.
The present invention relates to soft board, also known as flexible board or a kind of processing method of flex plate.During this type of soft board finished product, the need such as internal layer layers of copper 2 such as finger, pad etc. at certain region are exposed out.This processing method utilizes laser beam that the second insulating barrier 4 of outer layer is carried out certain depth slit cuts; the second insulating barrier 4 pressing that will be cut through by adhesives afterwards; and finally needing exposed layers of copper to protect internal layer, described adhesives includes adhesive linkage 3 and bond pad 8；After completing some row processing, recycling laser, mould or other machining mode, protective layer 7 is got rid of, exposes the layers of copper that internal layer needs are exposed.The present invention improves the production technology of this type of soft board, greatly reduces manual operation and shortens the production time, improves production efficiency and product yield.
The above, simply presently preferred embodiments of the present invention, the invention is not limited in above-mentioned embodiment, as long as it reaches the technique effect of the present invention with identical means, all should belong to protection scope of the present invention.
Claims (10)
1. the soft board protecting exposed layers of copper, including the first insulating barrier (1), described first insulating barrier (1) upper surface is provided with internal layer layers of copper (2), internal layer layers of copper (2) upper surface is provided with adhesive linkage (3), adhesive linkage (3) upper surface is provided with the second insulating barrier (4), second insulating barrier (4) upper surface is provided with external copper layer (5), it is characterized in that: be provided with exposed layers of copper (6) and be used for protecting the protective layer (7) of exposed layers of copper (6), described exposed layers of copper (6) is structure as a whole with internal layer layers of copper (2), second insulating barrier (4) does the cutting of certain depth and forms described protective layer (7).
A kind of soft board protecting exposed layers of copper the most according to claim 1, it is characterised in that: described protective layer (7) is arranged at the top of exposed layers of copper (6).
A kind of soft board protecting exposed layers of copper the most according to claim 1, it is characterised in that: being provided with bond pad (8), described protective layer (7) is fixed together with the first insulating barrier (1) by bond pad (8).
4. the production method of the soft board protecting exposed layers of copper, it is characterised in that: include that the cutting that the second insulating barrier (4) does certain depth forms protective layer (7).
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 4, it is characterised in that: the cutting using laser beam that the second insulating barrier (4) does certain depth forms protective layer (7).
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 5, it is characterised in that: described laser beam is that wavelength is the Ultra-Violet Laser of 355nm or wavelength is the iraser of 9400nm.
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 4, it is characterised in that: described protective layer (7) links together with the first insulating barrier (1) by the way of pressing.
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 4, it is characterised in that: include removing protective layer (7), expose exposed layers of copper (6).
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 8; it is characterized in that: remove protective layer (7) in etching outer copper foil circuit flow process and any stage carrying out between the copper surface protection flow process such as immersion Ni/Au, electrogilding to exposed layers of copper (6), expose exposed layers of copper (6).
The production method of a kind of soft board protecting exposed layers of copper the most according to claim 8, it is characterised in that: utilize the mode of laser, mould or machining, protective layer (7) is got rid of, exposes the layers of copper that needs are exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610302111.7A CN105828516A (en) | 2016-05-06 | 2016-05-06 | Flexible plate for protecting bare copper layer, and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610302111.7A CN105828516A (en) | 2016-05-06 | 2016-05-06 | Flexible plate for protecting bare copper layer, and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105828516A true CN105828516A (en) | 2016-08-03 |
Family
ID=56528504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610302111.7A Pending CN105828516A (en) | 2016-05-06 | 2016-05-06 | Flexible plate for protecting bare copper layer, and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105828516A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN205611050U (en) * | 2016-05-06 | 2016-09-28 | 鹤山市中富兴业电路有限公司 | Soft board on exposed copper layer of protection |
-
2016
- 2016-05-06 CN CN201610302111.7A patent/CN105828516A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4993148A (en) * | 1987-05-19 | 1991-02-19 | Mitsubishi Denki Kabushiki Kaisha | Method of manufacturing a circuit board |
| CN102281725A (en) * | 2010-06-10 | 2011-12-14 | 富葵精密组件(深圳)有限公司 | Manufacturing method for circuit board |
| CN103929884A (en) * | 2013-01-16 | 2014-07-16 | 深圳市牧泰莱电路技术有限公司 | Method for manufacturing printed circuit board with step slotted hole |
| CN205611050U (en) * | 2016-05-06 | 2016-09-28 | 鹤山市中富兴业电路有限公司 | Soft board on exposed copper layer of protection |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20160803 |