CN105823198A - Heat exchange device and semiconductor air conditioner comprising same - Google Patents
Heat exchange device and semiconductor air conditioner comprising same Download PDFInfo
- Publication number
- CN105823198A CN105823198A CN201610322331.6A CN201610322331A CN105823198A CN 105823198 A CN105823198 A CN 105823198A CN 201610322331 A CN201610322331 A CN 201610322331A CN 105823198 A CN105823198 A CN 105823198A
- Authority
- CN
- China
- Prior art keywords
- heat exchanger
- heat
- exchanger
- conditioner
- rig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 239000006260 foam Substances 0.000 claims description 8
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 230000004308 accommodation Effects 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 230000000712 assembly Effects 0.000 abstract 1
- 238000000429 assembly Methods 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 9
- 238000001816 cooling Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Other Air-Conditioning Systems (AREA)
Abstract
The invention relates to a heat exchange device and a semiconductor air conditioner comprising the same. The heat exchange device comprises a first heat exchanger, a second heat exchanger and connecting parts. The connecting parts are connected with the first heat exchanger and the second heat exchanger correspondingly so as to assemble and fix the first heat exchanger and the second heat exchanger. A semiconductor chip is fixed between the first heat exchanger and the second heat exchanger in a sandwiched mode. The second heat exchanger is a form-relieved tooth heat exchanger. The technical scheme aims at solving the technical problem that semiconductor air conditioner heat exchange assemblies are low in radiating efficiency.
Description
Technical field
The present invention relates to air conditioner technical field, particularly to a kind of heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig.
Background technology
When semiconductor chip is operated in refrigeration mode, by consuming electric energy, produce temperature difference at the two ends of chip, i.e. one end heat absorption, one end heat release, if the heat that hot junction produces can effectively be taken away, the heat of the coldest end is with regard to the sustainable hot junction that is transported to, thus produces refrigeration.Although thus the size of semiconductor chip own is less, but in order to make chip be in good working order, hot junction is it is generally required to heat exchanger assembly.And existing heat exchanger assembly, use condenser and the vaporizer of aluminium section bar, limit the effective area of dissipation under unit volume, and then constrain the refrigeration of air-conditioning.
Summary of the invention
It is an object of the invention to provide a kind of heat-exchanger rig and there is the semiconductor air-conditioner of this heat-exchanger rig, it is intended to solving the technical problem that semiconductor air conditioner heat exchanger assembly radiating efficiency is low.
In order to solve the problems referred to above, by the following technical solutions, this heat-exchanger rig includes the first heat exchanger, the second heat exchanger and connection member to the present invention；Described connection member is connected with described first heat exchanger and described second heat exchanger respectively, to assemble fixing described first heat exchanger and described second heat exchanger；Clamping between described first heat exchanger and the second heat exchanger have semiconductor chip, and described second heat exchanger is teeth heat exchanger.
Preferably, described first heat exchanger is teeth heat exchanger.
Preferably, described teeth heat exchanger is rectangle structure.
Preferably, described teeth heat exchanger includes some intervals specific range interconnective rectangle laminated structure.
Preferably, described first heat exchanger and the second heat exchanger are equipped with and coordinate fixing hole with described connection member.
Preferably, described connection member is screw.
The present invention also provides for a kind of semiconductor air-conditioner, and it includes heat-exchanger rig as above.
Preferably, also including that housing and outer housing, described housing are Stainless Steel Shell, described outer housing is rustless steel outer housing.
Preferably, described housing forms receiving space, is provided with eps foam part in described housing, and described accommodation space is divided into the first gas channel and the second gas channel by described eps foam part.
Preferably, described first heat exchanger is located in described first gas channel, and described second heat exchanger is located in described second gas channel.
Beneficial effect: the embodiment of the present invention is by being designed as including the first heat exchanger, the second heat exchanger and connection member by heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig；Described connection member is connected with described first heat exchanger and described second heat exchanger respectively, to assemble fixing described first heat exchanger and described second heat exchanger；Clamping between described first heat exchanger and the second heat exchanger have semiconductor chip, and described second heat exchanger is teeth heat exchanger.Because the second heat exchanger of heat-exchanger rig is teeth structure, it is possible to realize obtaining under less volume big cooling area, thus improve the refrigeration of semiconductor air-conditioner.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, in describing embodiment below, the required accompanying drawing used is briefly introduced, obviously, accompanying drawing in describing below is only some embodiments of the present invention, from the point of view of those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of one embodiment of the invention heat-exchanger rig；
Fig. 2 is the decomposing schematic representation of heat-exchanger rig in Fig. 1；
Fig. 3 is the structural representation in heat-exchanger rig is arranged on eps foam part in Fig. 1；
Fig. 4 is to be provided with the decomposing schematic representation of the semiconductor air-conditioner of heat-exchanger rig in Fig. 1；
Fig. 5 is the overall structure schematic diagram of semiconductor air-conditioner in Fig. 4.
Drawing reference numeral illustrates:
| 1 | First heat exchanger | 2 | Second heat exchanger |
| 3 | Connection member | 4 | Semiconductor chip |
| 5 | Housing | 6 | Eps foam part |
| 7 | First cooling fan | 8 | Second cooling fan |
| 9 | Outer housing |
The realization of the object of the invention, functional characteristics and advantage will in conjunction with the embodiments, are described further referring to the drawings.
Detailed description of the invention
In order to make the purpose of the present invention, technical scheme and advantage clearer, with detailed description of the invention, the present invention is described in further detail below in conjunction with the accompanying drawings.
As shown in Figure 1 to Figure 2, embodiments providing a kind of heat-exchanger rig and have the semiconductor air-conditioner of this heat-exchanger rig, this heat-exchanger rig includes the first heat exchanger the 1, second heat exchanger 2 and connection member 3；Described connection member 3 is connected with described first heat exchanger 1 and described second heat exchanger 2 respectively, to assemble fixing described first heat exchanger 1 and described second heat exchanger 2；Clamping between described first heat exchanger 1 and described second heat exchanger 2 have semiconductor chip 4, and described second heat exchanger 2 is teeth heat exchanger.
The embodiment of the present invention is by being designed as including the first heat exchanger the 1, second heat exchanger 2 and connection member 3 by heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig；Described connection member 3 is connected with described first heat exchanger 1 and described second heat exchanger 2 respectively, to assemble fixing described first heat exchanger 1 and described second heat exchanger 2；Clamping between described first heat exchanger 1 and described second heat exchanger 2 have semiconductor chip 4, and described first heat exchanger 1 is teeth heat exchanger.When semiconductor chip 4 is operated in refrigeration mode, by consuming electric energy, temperature difference is produced at the two ends of semiconductor chip 4, i.e. one end heat absorption, one end heat release, because the second heat exchanger 2 of heat-exchanger rig is teeth structure, it is capable of under less volume obtaining big cooling area, the heat that semiconductor chip 4 hot junction produces effectively is taken away, and the heat of the cold end of semiconductor chip 4 is with regard to the sustainable hot junction that is transported to, thus improves the refrigeration of semiconductor air-conditioner.
Preferably, described first heat exchanger 1 is teeth heat exchanger, obtains big cooling area to be further implemented under less volume, improves the refrigeration of heat-exchanger rig further.
Preferably, described teeth heat exchanger is rectangle structure.
Preferably, described teeth heat exchanger includes some intervals specific range interconnective rectangle laminated structure, to increase area of dissipation.
Preferably, described first heat exchanger 1 is provided with and coordinates fixing hole with described connection member 3；Described second heat exchanger 2 is provided with and coordinates fixing hole with described connection member 3.In an embodiment of the present invention, described semiconductor chip 4 is provided with the fixing hole corresponding with described fixing hole, to realize the first heat exchanger 1, the fixing connection of semiconductor chip the 4, second heat exchanger 2.
Further, described connection member 3 is screw.In an embodiment of the present invention, the first heat exchanger 1, semiconductor chip the 4, second heat exchanger 2 are fixedly secured to one another through corresponding fixing hole by screw.
As shown in Figures 3 to 5, the embodiment of the present invention also provides for a kind of semiconductor air-conditioner, and it includes heat-exchanger rig as above.
Preferably, this semiconductor air-conditioner also includes housing 5 and outer housing 9, and described housing 5 is Stainless Steel Shell, and described outer housing 9 is rustless steel outer housing, and this structure can be that this semiconductor air-conditioner has rainwater safeguard function, and the most affected by humidity.
Preferably, described housing 5 forms receiving space, is provided with eps foam part 6 in described housing 5, and described accommodation space is divided into the first gas channel and the second gas channel by described eps foam part 6.
Preferably, described first heat exchanger is located in described first gas channel, and described second heat exchanger is located in described second gas channel.In order to increase the radiating effect of heat radiation further, the first heat exchanger in the first gas channel is placed around the first cooling fan 7；The second heat exchanger in second gas channel is placed around the second cooling fan 8.The heat that semiconductor chip 4 produces just can be put in air by so heat-exchanger rig continuously by radiator.
In an embodiment of the present invention, when air-conditioner needs refrigeration, by controlling the polarity of semiconductor chip 4 electric current, it produces cold with the first heat exchanger 1 contact surface, heat is produced with the second heat exchanger 2 contact surface, indoor temperature thus can be made to reduce, and the heat that semiconductor chip 4 contact surface contacted with the second heat exchanger 2 produces is transmitted to outside air through the second heat exchanger 2.When air-conditioner needs to heat, by changing the polarity of semiconductor chip 4 electric current, semiconductor chip 4 and the first heat exchanger 1 contact surface produce heat, produce cold with the second heat exchanger 2 contact surface, indoor temperature thus can be made to raise, and cold the transmission to outside air through the second heat exchanger 2 of the semiconductor chip 4 contact surface generation contacted with the second heat exchanger 2, and then realize good heat radiation and conduction cooling effect, improve heat exchange and the refrigeration of semiconductor air-conditioner.Owing to this heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig have employed whole technical schemes of above-mentioned all embodiments, having all beneficial effects that the technical scheme of above-described embodiment is brought the most equally, this is no longer going to repeat them.
It will be apparent to those skilled in the art that can technical scheme as described above and design, make other various corresponding changes and deformation, and within all these changes and deformation all should belong to the protection domain of the claims in the present invention.
Claims (10)
1. a heat-exchanger rig, it is characterised in that include the first heat exchanger, the second heat exchanger and connection member；Described connection member is connected with described first heat exchanger and described second heat exchanger respectively, to assemble fixing described first heat exchanger and described second heat exchanger；Clamping between described first heat exchanger and the second heat exchanger have semiconductor chip, and described second heat exchanger is teeth heat exchanger.
2. heat-exchanger rig as claimed in claim 1, it is characterised in that described first heat exchanger is teeth heat exchanger.
3. heat-exchanger rig as claimed in claim 1, it is characterised in that described teeth heat exchanger is rectangle structure.
4. heat-exchanger rig as claimed in claim 3, it is characterised in that described teeth heat exchanger includes some intervals specific range interconnective rectangle laminated structure.
5. heat-exchanger rig as claimed in claim 4, it is characterised in that described first heat exchanger and the second heat exchanger are equipped with and coordinate fixing hole with described connection member.
6. heat-exchanger rig as claimed in claim 5, it is characterised in that described connection member is screw.
7. a semiconductor air-conditioner, it is characterised in that include the heat-exchanger rig as described in claim 1-6 is arbitrary.
8. semiconductor air-conditioner as claimed in claim 7, it is characterised in that also including that housing and outer housing, described housing are Stainless Steel Shell, described outer housing is rustless steel outer housing.
9. semiconductor air-conditioner as claimed in claim 8, it is characterised in that described housing forms receiving space, is provided with eps foam part in described housing, and described accommodation space is divided into the first gas channel and the second gas channel by described eps foam part.
10. semiconductor air-conditioner as claimed in claim 9, it is characterised in that described first heat exchanger is located in described first gas channel, and described second heat exchanger is located in described second gas channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610322331.6A CN105823198A (en) | 2016-05-12 | 2016-05-12 | Heat exchange device and semiconductor air conditioner comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610322331.6A CN105823198A (en) | 2016-05-12 | 2016-05-12 | Heat exchange device and semiconductor air conditioner comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105823198A true CN105823198A (en) | 2016-08-03 |
Family
ID=56529895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610322331.6A Pending CN105823198A (en) | 2016-05-12 | 2016-05-12 | Heat exchange device and semiconductor air conditioner comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105823198A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN101806478A (en) * | 2010-04-06 | 2010-08-18 | 侴乔力 | Cross air flue semiconductor thermoelectric refrigeration air-conditioner |
| CN102387620A (en) * | 2010-08-30 | 2012-03-21 | 常熟市永祥机电有限公司 | Thermistor-heating-type heating device |
| CN203444409U (en) * | 2013-08-13 | 2014-02-19 | 章万春 | heat sink |
| CN104251527A (en) * | 2014-09-11 | 2014-12-31 | 青岛海尔空调器有限总公司 | Heat exchanger and desktop air conditioner with same |
| CN104266281A (en) * | 2014-02-28 | 2015-01-07 | 海尔集团公司 | Desktop air conditioner |
| JP2015175594A (en) * | 2014-03-17 | 2015-10-05 | 稲葉 昭康 | Peltier device cooling and heating apparatus with semiconductor element of one of thermionic element as energy source |
| CN205678858U (en) * | 2016-05-12 | 2016-11-09 | 广州市雷子克电气机械有限公司 | A kind of heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig |
-
2016
- 2016-05-12 CN CN201610322331.6A patent/CN105823198A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN101806478A (en) * | 2010-04-06 | 2010-08-18 | 侴乔力 | Cross air flue semiconductor thermoelectric refrigeration air-conditioner |
| CN102387620A (en) * | 2010-08-30 | 2012-03-21 | 常熟市永祥机电有限公司 | Thermistor-heating-type heating device |
| CN203444409U (en) * | 2013-08-13 | 2014-02-19 | 章万春 | heat sink |
| CN104266281A (en) * | 2014-02-28 | 2015-01-07 | 海尔集团公司 | Desktop air conditioner |
| JP2015175594A (en) * | 2014-03-17 | 2015-10-05 | 稲葉 昭康 | Peltier device cooling and heating apparatus with semiconductor element of one of thermionic element as energy source |
| CN104251527A (en) * | 2014-09-11 | 2014-12-31 | 青岛海尔空调器有限总公司 | Heat exchanger and desktop air conditioner with same |
| CN205678858U (en) * | 2016-05-12 | 2016-11-09 | 广州市雷子克电气机械有限公司 | A kind of heat-exchanger rig and the semiconductor air-conditioner with this heat-exchanger rig |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160803 |