CN105698041A - Optical semiconductor lighting equipment - Google Patents
Optical semiconductor lighting equipment Download PDFInfo
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- CN105698041A CN105698041A CN201410690008.5A CN201410690008A CN105698041A CN 105698041 A CN105698041 A CN 105698041A CN 201410690008 A CN201410690008 A CN 201410690008A CN 105698041 A CN105698041 A CN 105698041A
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- optical semiconductor
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- substrate
- luminaire according
- optical component
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Abstract
The invention provides optical semiconductor lighting equipment. The optical semiconductor lighting equipment comprises heat dissipation pieces, a light emitting module, optical components and steps. The light emitting module makes contact with the heat dissipation pieces and comprises linings, wherein each lining is provided with one or more optical semiconductor devices. The optical components are coupled to the heat dissipation pieces and cover the light emitting module. Each optical component comprises a lining locating groove. Each lining locating groove is in the shape corresponding to that of the periphery of the corresponding lining. Each step is in the shape corresponding to that of a cut groove in the periphery of the corresponding lining. By the adoption of the optical semiconductor lighting equipment, the optical semiconductor devices and a circuit component can be protected against pressure, pressure resistance is achieved, efficient and simple assembly and fastening are achieved, and the required light distribution is achieved.
Description
Technical field
The present invention relates to a kind of optical semiconductor luminaire; and or rather; relating to one can protect optical semiconductor device and circuit unit efficiently and simply to assemble and fastening from pressure, acquisition, and the photodistributed optical semiconductor luminaire that realization is required。
Background technology
Due to the advantage compared with electric filament lamp or fluorescent lamp with such as low-power consumption, long-life, high-durability and premium brightness, therefore optical semiconductor device is (such as, light emitting diode (lightemittingdiode, LED) or laser diode (laserdiode, LD)) receive more and more attention。
Being different from the fluorescent lamp or mercury lamp that manufacture by argon and poisonous hydrargyrum being ejected in glass tubing, optical semiconductor device does not use environmentally harmful material, thus provides the product to eco-friendly。
Specifically, the luminaire that optical semiconductor device is used as light source is recently used for outdoor scene illumination or safety and it is thus desirable to the Simple assembled of described luminaire and installation。
In addition, it is necessary to this type of luminaire that optical semiconductor device is used as light source carries out replacing or keeping in repair after breaking down and be malfunctioning with permission。
Summary of the invention
Technical problem
The present invention has conceived for solving problems of the prior art; and aim to provide a kind of optical semiconductor luminaire; described optical semiconductor luminaire can protect optical semiconductor device and circuit unit from pressure, obtain efficiently and simple assemble and fastening, and realize required light distribution。
Technical solution
According to an aspect of the present invention, optical semiconductor luminaire comprises: fin；Light emitting module, described light emitting module contacts described fin and comprises the substrate being provided with one or more optical semiconductor device on it；And optical component, described optical component is coupled to described fin and covers described light emitting module, and wherein said optical component comprises substrate locating slot, and described substrate locating slot has the shape corresponding with the circumference of described substrate；And rank (step), what described rank had a circumference place with described substrate cuts out the shape that groove is corresponding。
The circumference of substrate can be fixed to fin by described substrate locating slot。
Optical component can comprise further: has the planar section of writing board shape, and described planar section has predetermined thickness and towards fin；And sweep, described sweep extends to fin from the circumference of planar section and has the cross section being gradually increased towards fin。
Described sweep can have the thickness identical from described planar section or the thickness different with described planar section。
Optical component can comprise lid further, and described lid has the space for receiving substrate wherein；And flange, described flange extends from the circumference of described lid and is fixed to fin, and wherein substrate locating slot can be formed at the inner perimeter place of described flange。
Optical component can comprise further: has the planar section of writing board shape, and described planar section has predetermined thickness and towards fin；And sweep, described sweep extends to flange from the circumference of planar section and has the cross section being gradually increased towards described flange, and wherein substrate locating slot can be formed at sweep and the part place of flange joint。
Described sweep can have the thickness identical from described planar section or the thickness different with described planar section。
Optical semiconductor luminaire can comprise the multiple lateral projections on the inner surface being formed at optical component further, and wherein said rank can be formed at the end of lateral projections step by step。
Cutting out groove can with optical semiconductor device spaced a predetermined distance。
Lateral projections can be formed on the inner surface of optical component with constant interval。
Lateral projections can relative to the radially layout of optical component。
Each in lateral projections can comprise press surface, and described press surface forms the circumference on rank and serves as the end of lateral projections, and described press surface can with substrate contact。
Fin can be formed by metal material, and optical component, substrate locating slot and rank can by resin formation。
Optical component can comprise flange further, and described flange extends from the circumference of optical component and contacts with fin, and wherein said flange can be fixed on fin by the securing member being made up of metal material or resin。
Optical semiconductor luminaire can comprise the shell being formed at its lower end with Edison base further, and wherein fin can be arranged to the outer surface towards described shell。
Optical semiconductor luminaire can comprise further: through hole, and described through hole is formed in fin so that the cable of substrate through there through；Shell, described shell is formed at its lower end with Edison base；And multiple lead channels, the plurality of lead channels is arranged on the outer surface of shell with constant interval so that through the cable of the substrate of through hole through there through。
Optical semiconductor luminaire can comprise the shell being formed at its lower end with Edison base further, and plurality of fin can be arranged with constant interval with the outer surface towards described shell。
Optical semiconductor device can relative to the radially layout of substrate。
Multiple optical semiconductor devices can relative to substrate radially arrange and with the circumference of substrate and cut out the inner of groove spaced a predetermined distance。
Beneficial effect
Optical semiconductor luminaire has the following advantages according to an embodiment of the invention。
Substrate is indirectly secured on metal fin by substrate locating slot and rank; rather than it is directly fixed on it; thus protection optical semiconductor device and circuit unit from pressure, described rank be formed on optical component and have with substrate cut out the shape that groove is corresponding。
In the prior art, substrate is fixed on fin by independent securing member, and optical component is fixed on fin by another securing member subsequently, and in an embodiment of the present invention, when optical component is fixed on fin, substrate can also be fixed on fin by optical component, is derived from efficient and simple assembling and fastening。
It addition, based on the architectural feature of the optical cover comprising planar section and sweep, sweep can have uniform thickness or the thickness being gradually reduced or increasing, it is achieved in various required light distribution。
Accompanying drawing explanation
Fig. 1 is the partial exploded perspective view of optical semiconductor luminaire according to an embodiment of the invention。
Fig. 2 is the decomposition diagram illustrating the coupled relation between substrate, fin and optical component, and described substrate, described fin and described optical component are the primary clusterings of optical semiconductor luminaire according to an embodiment of the invention。
(a) and (b) of Fig. 3 is the sectional view of optical component, and described optical component is the primary clustering of optical semiconductor luminaire according to various embodiments of the present invention。
Fig. 4 is the plan view of the layout of the multiple optical semiconductor devices in illustrating fixed cell and being arranged in the light emitting module comprising substrate, and described fixed cell and the plurality of optical semiconductor device are the primary clusterings of optical semiconductor luminaire according to an embodiment of the invention。
Detailed description of the invention
Optimal mode
Above-mentioned and other aspects, feature and the advantage of the present invention will become apparent from being described below of the following example provided in conjunction with accompanying drawing。
It should be understood, however, that the invention is not restricted to following example and can be implemented by different modes。
Herein, it is provided that embodiment is to provide for the entire disclosure of the present invention and makes those skilled in the art thoroughly understand the present invention。
The scope of the present invention should only be limited by appended claims and equivalent thereof。
Therefore, the unclear explanation to avoid the present invention of the detailed description to the apparent details of those skilled in the art of art will be omitted。
It addition, same reference numerals will refer to same components in the description, and accompanying drawing is merely provided for describing the purpose of specific embodiment and being not limiting as the present invention with the term that reference is made to (use)。
As used herein, singulative " ", " one " and " described " is set also comprises plural form, unless the context clearly dictates otherwise。Will be further understood that, term " includes (comprises) " and/or indicates " including (comprising) " existence of described feature, assembly and/or operation, but is not excluded for existence or the interpolation of other features one or more, assembly and/or operation。
Unless otherwise defined, otherwise all terms used herein (comprising technology and scientific terminology) have the same meaning that those skilled in the art in the invention are generally understood that。
Should be further understood that, term (those terms defined in such as common dictionary) should be interpreted as having the implication consistent with the implication in its context in this specification and correlation technique, and should not make an explanation in idealization or too formal meaning, unless so explicitly defined in this article。
The exemplary embodiment of the present invention is described in detail hereinafter with reference to accompanying drawing。
Fig. 1 is the partial exploded perspective view of optical semiconductor luminaire according to an embodiment of the invention, and Fig. 2 is the decomposition diagram illustrating the coupled relation between substrate, fin and optical component, described substrate, described fin and described optical component are the primary clusterings of optical semiconductor luminaire according to an embodiment of the invention。
With reference to Fig. 1 and Fig. 2, optical semiconductor luminaire according to an embodiment of the invention comprises fin 100, optical component 200 and the light emitting module comprising substrate 300。
Each in fin 100 provides the region attached by optical component 200 and substrate 300。Fin 100 is formed by the metal material (such as, aluminum or aluminum alloy) with high-termal conductivity, with by cooling down substrate 300 from substrate 300 to the high efficiency and heat radiation of its circumference。
Each in light emitting module contacts with fin 100 and comprises the substrate 300 being provided with one or more optical semiconductor device 400 on it。
Optical component 200 is coupled to fin 100 and by changing the various required light distribution of path implement of the light sent from optical semiconductor device 400。
Optical component 200 is equipped with substrate locating slot 514, and described substrate locating slot 514 has the shape corresponding with the circumference of substrate 300；And rank 512, what described rank 512 had a circumference place with substrate 300 cuts out the shape that groove 522 is corresponding。
Substrate 300 is indirectly secured on metal fin 100 by substrate locating slot 514 and rank 512; rather than it is directly fixed on it; thus protection optical semiconductor device and circuit unit from pressure, described rank 512 have with substrate 300 cut out the shape that groove 522 is corresponding。
Should be understood that following various embodiment and above example can apply to the present invention。
Fin 100 is formed by metal material, and optical component 200, substrate locating slot 514 and rank 512 are by resin formation, and thus protection is arranged on each circuit unit on substrate 300 from pressure。
Optical component 200 comprises flange 200f, described flange 200f further and extends from the circumference of described optical component 200 and contact with fin 100。Flange 200f is fixed on fin 100 by the securing member 700 being made up of metal material or resin。
Optical component 200 can be fixed to any element on fin 100, for instance, metal bolts as shown in Figures 1 and 2 or rivet, or resin bonding coat can serve as securing member 700。
In other words, comprise the light emitting module of substrate 300 and fixed by rank 512 and substrate locating slot 514, and not contacting metal bolt or rivet, various circuit unit thus can be protected from pressure。
If Fig. 1 is to as shown in 3, optical component 200 comprises the planar section 210 with writing board shape, and described planar section 210 has predetermined thickness and towards fin 100；And sweep 220, described sweep 220 extends to fin 100 from the circumference of planar section 210 and has the cross section being gradually increased towards fin 100, and lateral projections 511 is formed on the inner surface of sweep 220。
Sweep 220 can have the thickness identical with planar section 210, as shown in (a) of Fig. 3, or the thickness different from planar section 210, as shown in (b) of Fig. 3, it is derived from forming different photodistributed optical component 200。
Optical component 200 comprises lid 200c and flange 200f, wherein lid 200c comprises the planar section 210 with writing board shape, described planar section 210 has predetermined thickness and towards fin 100, and lid 200c provides wherein for receiving the space of substrate 300, and flange 200f extends from the circumference of lid 200c and is fixed to fin 100。
It is to say, lid 200c comprises planar section 210 and sweep 220。
Referring back to Fig. 1 and Fig. 2, optical semiconductor luminaire can comprise the lateral projections 511 on the inner surface being formed at optical component 200 further according to an embodiment of the invention。
Lateral projections 511 be formed on the inner surface of optical component 200 with constant interval and relative to the radially layout of optical component 200 with accurately and uniformly in contact with fixing substrate 300。
Each in lateral projections 511 comprises press surface 513, and described press surface 513 forms the circumference on corresponding rank 512 and serves as the end of lateral projections 511, and press surface 513 contacts with substrate 300。
When the rank 512 of the end being formed at lateral projections 511 are received in the end face cutting out groove 522 and lateral projections 511, i.e. when press surface 513 presses substrate 300, substrate 300 is fixed。
Refer again to Fig. 1, the shell 600 being formed at its lower end with Edison base 601 can be comprised according to the optical semiconductor luminaire of the present invention further, and fin 100 is disposed to the outer surface towards shell 600。
Optical semiconductor luminaire according to the present invention can comprise through hole 101 further, and described through hole 101 is formed in fin 100 so that the cable (not shown) of substrate 300 through there through；And multiple lead channels 602, the plurality of lead channels 602 is spaced constant distance on the outer surface of shell 600 so that through the cable of the substrate 300 of through hole 101 through there through。
Optical semiconductor device 400 on substrate 300 is by being connected on external power source via socket coupling be electrically connected to the cable of the substrate 300 through through hole 101, corresponding lead passage 602 and Edison base 601 on external power source。
According to the present invention, optical semiconductor luminaire comprises the shell 600 being formed at its lower end with Edison base 601, and multiple fin 100 are arranged with constant interval with the outer surface towards shell 600, thus optical semiconductor luminaire can be luminous in all directions and can serve as landscape lighting apparatus。
Additionally, as shown in Figure 4, optical semiconductor device 400 relative to substrate 300 radially arrange and with the edge of substrate 300 and cut out the inner of groove 511 spaced a predetermined distance (d), thus minimize dark space and uniform and light distribution widely be provided simultaneously。
As it has been described above, according to the optical semiconductor luminaire of the present invention can protect optical semiconductor device and circuit unit from pressure, obtain efficiently and simple assemble and fastening, and realize required light distribution。
Although more already described herein embodiments, but those skilled in the art will appreciate that, these embodiments only provide by way of illustration, and without departing from the spirit and scope of the present invention, it is possible to carry out various amendment, change and change。
Claims (19)
1. an optical semiconductor luminaire, it is characterised in that including:
Fin；
Light emitting module, described light emitting module contacts with described fin and includes being provided with on it substrate of one or more optical semiconductor device；And
Optical component, described optical component is coupled to described fin and covers described light emitting module, and described optical component includes:
Substrate locating slot, described substrate locating slot has the shape corresponding with the circumference of described substrate；And
Rank, what described rank had a circumference place with described substrate cuts out the shape that groove is corresponding。
2. optical semiconductor luminaire according to claim 1, it is characterised in that the described circumference of described substrate is fixed on described fin by described substrate locating slot。
3. optical semiconductor luminaire according to claim 1, it is characterised in that described optical component farther includes:
Having the planar section of writing board shape, described planar section has predetermined thickness and towards described fin；And
Sweep, described sweep extends to described fin from the circumference of described planar section and has the cross section being gradually increased towards described fin。
4. optical semiconductor luminaire according to claim 3, it is characterised in that described sweep has the thickness identical from described planar section or the thickness different with described planar section。
5. optical semiconductor luminaire according to claim 1, it is characterised in that described optical component farther includes:
Lid, described lid has the space for receiving described substrate wherein；And
Flange, described flange extends from the circumference of described lid and is fixed to described fin,
Described substrate locating slot is formed at the inner perimeter place of described flange。
6. optical semiconductor luminaire according to claim 5, it is characterised in that described optical component farther includes:
Having the planar section of writing board shape, described planar section has predetermined thickness and towards described fin；And
Sweep, described sweep extends to described flange from the circumference of described planar section and has the cross section being gradually increased towards described flange,
Described substrate locating slot is formed at described sweep and the part place of described flange joint。
7. optical semiconductor luminaire according to claim 6, it is characterised in that described sweep has the thickness identical from described planar section or the thickness different with described planar section。
8. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Multiple lateral projections, the plurality of lateral projections is formed on the inner surface of described optical component,
Wherein said rank are formed at the end of described lateral projections step by step。
9. optical semiconductor luminaire according to claim 1, it is characterised in that described in cut out groove and described optical semiconductor device spaced a predetermined distance。
10. optical semiconductor luminaire according to claim 8, it is characterised in that described lateral projections is formed on the described inner surface of described optical component with constant interval。
11. optical semiconductor luminaire according to claim 8, it is characterised in that described lateral projections is relative to the radially layout of described optical component。
12. optical semiconductor luminaire according to claim 8, each that it is characterized in that in described lateral projections includes press surface, described press surface forms the circumference on described rank and serves as the end of described lateral projections, and described press surface and described substrate contact。
13. optical semiconductor luminaire according to claim 1, it is characterised in that described fin is formed by metal material, and described optical component, described substrate locating slot and described rank are by resin formation。
14. optical semiconductor luminaire according to claim 13, it is characterised in that described optical component farther includes:
Flange, described flange extends from the circumference of described optical component and contacts with described fin, and described flange is fixed on described fin by the securing member being made up of metal material or resin。
15. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Shell, described shell is formed at its lower end with Edison base,
Wherein said fin is arranged to the outer surface towards described shell。
16. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Through hole, described through hole is formed in described fin so that cable through there through；
Shell, described shell is formed at its lower end with Edison base；And
Multiple lead channels, the plurality of lead channels is arranged on the outer surface of described shell with constant interval so that through described through hole described cable through there through。
17. optical semiconductor luminaire according to claim 1, it is characterised in that farther include:
Shell, described shell is formed at its lower end with Edison base,
Plurality of fin is arranged with constant interval with the outer surface towards described shell。
18. optical semiconductor luminaire according to claim 1, it is characterised in that described optical semiconductor device is relative to the radially layout of described substrate。
19. optical semiconductor luminaire according to claim 1, it is characterised in that multiple optical semiconductor devices relative to described substrate radially arrange and with the described circumference of described substrate and described in cut out the inner of groove spaced a predetermined distance。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690008.5A CN105698041A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410690008.5A CN105698041A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105698041A true CN105698041A (en) | 2016-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410690008.5A Pending CN105698041A (en) | 2014-11-25 | 2014-11-25 | Optical semiconductor lighting equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201428965Y (en) * | 2009-06-18 | 2010-03-24 | 熊胜群 | High-power LED light source module |
| CN202392691U (en) * | 2011-12-09 | 2012-08-22 | 东莞钜升塑胶电子制品有限公司 | Condensing lens for 12-bead combined LED (Light-Emitting Diode) project lamp |
| CN102667333A (en) * | 2009-10-20 | 2012-09-12 | 科锐公司 | Heat sinks and lamp incorporating same |
| CN102818216A (en) * | 2012-06-05 | 2012-12-12 | 佛山市国星光电股份有限公司 | Large-angle lens and large-angle light-emergent LED (Light Emitting Diode) light source module |
| CN202884582U (en) * | 2012-10-19 | 2013-04-17 | 四川柏狮光电技术有限公司 | High-performance double-layer radiating fin-shaped light-emitting diode (LED) bulb lamp |
| CN103712135A (en) * | 2013-12-03 | 2014-04-09 | 海丰通航科技有限公司 | Embedded LED airport boundary lamp |
-
2014
- 2014-11-25 CN CN201410690008.5A patent/CN105698041A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201428965Y (en) * | 2009-06-18 | 2010-03-24 | 熊胜群 | High-power LED light source module |
| CN102667333A (en) * | 2009-10-20 | 2012-09-12 | 科锐公司 | Heat sinks and lamp incorporating same |
| CN202392691U (en) * | 2011-12-09 | 2012-08-22 | 东莞钜升塑胶电子制品有限公司 | Condensing lens for 12-bead combined LED (Light-Emitting Diode) project lamp |
| CN102818216A (en) * | 2012-06-05 | 2012-12-12 | 佛山市国星光电股份有限公司 | Large-angle lens and large-angle light-emergent LED (Light Emitting Diode) light source module |
| CN202884582U (en) * | 2012-10-19 | 2013-04-17 | 四川柏狮光电技术有限公司 | High-performance double-layer radiating fin-shaped light-emitting diode (LED) bulb lamp |
| CN103712135A (en) * | 2013-12-03 | 2014-04-09 | 海丰通航科技有限公司 | Embedded LED airport boundary lamp |
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Application publication date: 20160622 |
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