CN105696033A - 一种电镀锡添加剂及其制备方法和使用方法 - Google Patents
一种电镀锡添加剂及其制备方法和使用方法 Download PDFInfo
- Publication number
- CN105696033A CN105696033A CN201610123989.4A CN201610123989A CN105696033A CN 105696033 A CN105696033 A CN 105696033A CN 201610123989 A CN201610123989 A CN 201610123989A CN 105696033 A CN105696033 A CN 105696033A
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- CN
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- Prior art keywords
- stirring
- electrotinning
- electrotinning additive
- proportioning
- add
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- Granted
Links
- 239000000654 additive Substances 0.000 title claims abstract description 30
- 230000000996 additive effect Effects 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 claims abstract description 24
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 claims abstract description 18
- OQOGEOLRYAOSKO-UHFFFAOYSA-N 1,1-dichloro-1-nitroethane Chemical compound CC(Cl)(Cl)[N+]([O-])=O OQOGEOLRYAOSKO-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229950011260 betanaphthol Drugs 0.000 claims abstract description 12
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 12
- 229920000056 polyoxyethylene ether Polymers 0.000 claims abstract description 12
- YODZTKMDCQEPHD-UHFFFAOYSA-N thiodiglycol Chemical compound OCCSCCO YODZTKMDCQEPHD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229950006389 thiodiglycol Drugs 0.000 claims abstract description 12
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000008367 deionised water Substances 0.000 claims abstract description 9
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000003756 stirring Methods 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 239000002736 nonionic surfactant Substances 0.000 claims description 11
- 239000000470 constituent Substances 0.000 claims description 3
- 230000003020 moisturizing effect Effects 0.000 claims description 3
- 238000009713 electroplating Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005265 energy consumption Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- -1 alkyl glycoside Chemical class 0.000 abstract 1
- 229930182470 glycoside Natural products 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201610123989.4A CN105696033B (zh) | 2016-03-04 | 2016-03-04 | 一种电镀锡添加剂及其制备方法和使用方法 |
Applications Claiming Priority (1)
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CN201610123989.4A CN105696033B (zh) | 2016-03-04 | 2016-03-04 | 一种电镀锡添加剂及其制备方法和使用方法 |
Publications (2)
Publication Number | Publication Date |
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CN105696033A true CN105696033A (zh) | 2016-06-22 |
CN105696033B CN105696033B (zh) | 2018-03-02 |
Family
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Family Applications (1)
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CN201610123989.4A Active CN105696033B (zh) | 2016-03-04 | 2016-03-04 | 一种电镀锡添加剂及其制备方法和使用方法 |
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CN (1) | CN105696033B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106835208A (zh) * | 2016-12-15 | 2017-06-13 | 中国航空工业集团公司北京航空材料研究院 | 一种高效环保的无氰硫酸盐镀锌溶液 |
CN107881546A (zh) * | 2017-10-20 | 2018-04-06 | 江西鑫力华数码科技有限公司 | 一种柔性线路板的电镀方法 |
CN109898105A (zh) * | 2019-03-29 | 2019-06-18 | 江苏艾森半导体材料股份有限公司 | 一种超高速纯锡电镀添加剂 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311483A (ja) * | 1991-12-24 | 1993-11-22 | Nikko Kinzoku Kk | 錫またははんだめっき浴 |
JPH09176889A (ja) * | 1995-12-22 | 1997-07-08 | Toyo Kohan Co Ltd | 錫めっき浴および錫めっき方法 |
CN102776496A (zh) * | 2012-04-20 | 2012-11-14 | 昆山艾森半导体材料有限公司 | 高温回流用锡层防变色剂及其制备方法和使用方法 |
CN102808202A (zh) * | 2011-05-30 | 2012-12-05 | 宝山钢铁股份有限公司 | 用于大塑性变形加工的镀锡板电涂工艺制造方法 |
CN104562100A (zh) * | 2014-12-31 | 2015-04-29 | 苏州禾川化学技术服务有限公司 | 一种多功能半白亮镀锡添加剂 |
-
2016
- 2016-03-04 CN CN201610123989.4A patent/CN105696033B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05311483A (ja) * | 1991-12-24 | 1993-11-22 | Nikko Kinzoku Kk | 錫またははんだめっき浴 |
JPH09176889A (ja) * | 1995-12-22 | 1997-07-08 | Toyo Kohan Co Ltd | 錫めっき浴および錫めっき方法 |
CN102808202A (zh) * | 2011-05-30 | 2012-12-05 | 宝山钢铁股份有限公司 | 用于大塑性变形加工的镀锡板电涂工艺制造方法 |
CN102776496A (zh) * | 2012-04-20 | 2012-11-14 | 昆山艾森半导体材料有限公司 | 高温回流用锡层防变色剂及其制备方法和使用方法 |
CN104562100A (zh) * | 2014-12-31 | 2015-04-29 | 苏州禾川化学技术服务有限公司 | 一种多功能半白亮镀锡添加剂 |
Non-Patent Citations (1)
Title |
---|
伏广好等: "添加剂对锡-银-铜共沉积的影响", 《电镀与涂饰》 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106835208A (zh) * | 2016-12-15 | 2017-06-13 | 中国航空工业集团公司北京航空材料研究院 | 一种高效环保的无氰硫酸盐镀锌溶液 |
CN107881546A (zh) * | 2017-10-20 | 2018-04-06 | 江西鑫力华数码科技有限公司 | 一种柔性线路板的电镀方法 |
CN107881546B (zh) * | 2017-10-20 | 2019-06-14 | 江西鑫力华数码科技有限公司 | 一种柔性线路板的电镀方法 |
CN109898105A (zh) * | 2019-03-29 | 2019-06-18 | 江苏艾森半导体材料股份有限公司 | 一种超高速纯锡电镀添加剂 |
WO2020199643A1 (zh) * | 2019-03-29 | 2020-10-08 | 江苏艾森半导体材料股份有限公司 | 一种超高速纯锡电镀添加剂 |
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CN105696033B (zh) | 2018-03-02 |
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Address after: 215000 1647 Huangpu Road, Qian Deng Town, Kunshan City, Suzhou, Jiangsu Patentee after: JIANGSU AISEN SEMICONDUCTOR MATERIAL Co.,Ltd. Address before: 215000 1647 Huangpu Road, Qian Deng Town, Kunshan City, Suzhou, Jiangsu Patentee before: ASEM (SUZHOU) ELECTRONIC MATERIAL Co.,Ltd. |
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Effective date of registration: 20231107 Address after: 226000 room 12217, building 21 (22), No. 1692, Xinghu Avenue, development zone, Nantong City, Jiangsu Province Patentee after: Essen semiconductor materials (Nantong) Co.,Ltd. Address before: 215000 1647 Huangpu Road, Qian Deng Town, Kunshan City, Suzhou, Jiangsu Patentee before: JIANGSU AISEN SEMICONDUCTOR MATERIAL Co.,Ltd. |
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