CN105657974A - Film pressing machine and control method and system thereof - Google Patents
Film pressing machine and control method and system thereof Download PDFInfo
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- CN105657974A CN105657974A CN201410728436.2A CN201410728436A CN105657974A CN 105657974 A CN105657974 A CN 105657974A CN 201410728436 A CN201410728436 A CN 201410728436A CN 105657974 A CN105657974 A CN 105657974A
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Abstract
The invention provides a film pressing machine and a control method and system thereof. The control method of the film pressing machine comprises that pressure sensors arranged on rollers of the film pressing machine are used to test the pressure value when a circuit board to be pressed makes contact with the rollers. According to the technical scheme of the invention, the pressure values when the circuit board to be pressed makes contact with the rollers are tested accurately, the film pressing process is timely paused in the circuit board whose surface is abnormal, alarming prompt is provided for film pressing technology with surface abnormity, production of batch of adverse film pressed boards is avoided, the discard cost is reduced, and the product quality and production efficiency of circuit boards are improved.
Description
Technical field
The present invention relates to film laminator technical field, in particular to the control system of a kind of film laminator, the control method of a kind of film laminator and a kind of film laminator.
Background technology
At present, circuit board is widely used in electronic communication product, such as high-density interconnected circuit board, printed circuit board etc. produce graph line at high-density interconnected circuit board and pass by journey, all need to carry out surface press mold process, wherein, figure circuit press mold technique is one of important step of surface press mold process, circuit board is carried out the pre-heat treatment by the encapsulated rumble that rolls mainly by film laminator, temperature is probably at about 100 DEG C (determining with specific reference to thickness of slab and heat dissipation design), make circuit board surface temperature reach press mold and produce temperature, dry film is affected by high temperature after attaching circuit board surface, fully release dry film mobility and stickiness, dry film is made better to play surface laminating and sealing of hole ability, so that circuit board being adhered to and sealing of hole. traditional film laminator is when carrying out dry film and overlaying, according to manufacturing parameter, the encapsulated rumble that rolls of film laminator is carried out pressure setting, to adapt to different thickness of slab and different structure board production condition, wherein, pressure parameter refers to that circuit board tow sides are by the encapsulated intensity of pressure rolling rumble, and the above-mentioned intensity of pressure is limited primarily by circuit board surface cleanliness factor and the impact of board body structure.
But in the related, production environment requires higher, no matter it is dust in air content, press mold quality all can be impacted by the factors such as liquid medicine residual and back segment rinsing residue, and currently used full-automatic film laminator is except carrying out alarm to clamp, to this press mold abnormal problem not instruction accordingly and operation, as abnormal in there is press mold, it also can normal operation, relevant issues section optical detection link just can only can find out abnormal factors after manufacture, press mold production problem investigation and quality improving are difficult to the indicative function played promptly and accurately, particularly film pressing roller rumble itself is encapsulated occurs puncturing, during the problems such as foreign body stickup, can not reflect that the type is abnormal in time, it is likely to cause bulk bad pressuring diaphragm to produce, and get rid of substandard products Producing reason and can waste substantial amounts of time and human resources, the production cost in turn resulting in circuit board raises.
Therefore, how in press mold process, to warn press mold abnormal problem timely and accurately, process the circuit board of bad press mold in time, to avoid bulk bad pressuring diaphragm output, become technical problem urgently to be resolved hurrily.
Summary of the invention
The present invention be based on above-mentioned technical problem at least one, propose the control program of a kind of new film laminator, by rumble being arranged pressure transducer rolling of film laminator, test the circuit board until press mold and the described force value rolled when rumble contacts, and carry out whether this force value of multilevel iudge is within the scope of scheduled pressure value, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, the final yields improving circuit board and production efficiency.
In view of this, the present invention proposes a kind of film laminator, including: there is the pressure transducer rolling on rumble being arranged in described film laminator, be used for testing the circuit board until press mold and the described force value rolled when rumble contacts.
In this technical scheme, by rumble arranging pressure transducer rolling of film laminator, can accurately judge the circuit board until press mold and the force value rolled when rumble contacts, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, finally improve yields and the production efficiency of circuit board.
According to a further aspect in the invention, it is also proposed that the control method of a kind of film laminator, it is used for controlling film laminator as above, including: receive described pressure transducer collection the force value sent; Judge whether the force value of pressure transducer collection is between the first scheduled pressure value and the second scheduled pressure value; And when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control described press mold process termination.
In this technical scheme, by judging whether the force value that pressure transducer records is in predetermined range of pressure values, when judging to be not within the scope of scheduled pressure value, control in time to terminate press mold technique, the generation of bad pressuring diaphragm can be prevented effectively from, improve yields and the production efficiency of circuit board further.
In technique scheme, it is preferable that before receiving the force value that pressure transducer sends, including: control described pressure transducer and carry out the collection of at least one pressure limit; At least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value.
In this technical scheme, by before receiving the force value that pressure transducer sends, control pressure transducer and gather at least one pressure limit, and any one in the higher limit of at least one pressure limit pretreated and lower limit is set as the first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value, can fast and effeciently obtain predetermined pressure range, and then improve whether the judgement circuit board until press mold is in the efficiency of this pressure limit with the described force value rolled when rumble contacts.
In technique scheme, it is preferable that when judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled press mold technique is sent to lithographic equipment.
In this technical scheme, when judging to be within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to lithographic equipment by having controlled the circuit board of press mold technique, to be automatically performed the photoetching process after press mold, it is effectively increased production efficiency and the yields of pressuring diaphragm.
In technique scheme, preferably, when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, including: the circuit board controlling described press mold process termination is sent to district to be detected.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to district to be detected by controlling the circuit board of press mold process termination, to avoid the generation of bad pressuring diaphragm, and then reduces production cost and defect rate.
In technique scheme, preferably, when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, also include: send alarm sounds, to remind user's press mold process termination, wherein, alarm sounds includes one or two the combination in any in acoustical alarm prompting and optics alarm.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, by controlling press mold process termination and sending alarm and point out, such as jingle bell warning, red alarm, so that press mold abnormal problem is known as early as possible and and is processed as early as possible, the production efficiency of raising press mold process.
According to the third aspect of the invention we, it is also proposed that the control system of a kind of film laminator, it is used for controlling film laminator as above, including: receive unit, for receiving described pressure transducer collection the force value sent; Judging unit, is used for judging whether described force value is between described first scheduled pressure value and described second scheduled pressure value; And control unit, for when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, controlling described press mold process termination.
In this technical scheme, by rumble arranging pressure transducer rolling of film laminator, can accurately judge the circuit board until press mold and the force value rolled when rumble contacts, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, finally improve yields and the production efficiency of circuit board.
In technique scheme, control unit is additionally operable to, and controls described pressure transducer and carries out the collection of at least one pressure limit; The control system of described film laminator, preferably, also include: pretreatment unit, at least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value.
In this technical scheme, by before receiving the force value that pressure transducer sends, control pressure transducer and gather at least one pressure limit, and any one in the higher limit of at least one pressure limit pretreated and lower limit is set as the first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value, can fast and effeciently obtain predetermined pressure range, and then improve whether the judgement circuit board until press mold is in the efficiency of this pressure limit with the described force value rolled when rumble contacts.
In technique scheme, described control unit is additionally operable to, and when judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled described press mold technique is sent to lithographic equipment.
In this technical scheme, when judging to be within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to lithographic equipment by having controlled the circuit board of press mold technique, to be automatically performed the photoetching process after press mold, it is effectively increased production efficiency and the yields of pressuring diaphragm.
In technique scheme, described control unit is additionally operable to, and the circuit board controlling described press mold process termination is sent to district to be detected.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to district to be detected by controlling the circuit board of press mold process termination, to avoid the generation of bad pressuring diaphragm, and then reduces production cost and defect rate.
In technique scheme, it is preferable that also include: alarm sounds unit, being used for sending alarm sounds, to remind user's press mold process termination, wherein, alarm sounds includes one or two the combination in any in acoustical alarm prompting and optics alarm.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, by controlling press mold process termination and sending alarm and point out, alarm sounds includes one or two combination in any in acoustical alarm prompting optics alarm, such as jingle bell warning, red alarm, so that press mold abnormal problem is known as early as possible and and is processed as early as possible, the production efficiency of raising press mold process.
By above technical scheme, by rumble being arranged pressure transducer rolling of film laminator, test the circuit board until press mold and the described force value rolled when rumble contacts, and carry out whether this force value of multilevel iudge is within the scope of scheduled pressure value, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, finally improve yields and the production efficiency of circuit board.
Accompanying drawing explanation
Fig. 1 illustrates the schematic flow diagram of the control method of film laminator according to an embodiment of the invention;
Fig. 2 illustrates the schematic block diagram of the control system of film laminator according to an embodiment of the invention;
Fig. 3 illustrates the schematic flow diagram of the press mold technique of film laminator according to an embodiment of the invention.
Detailed description of the invention
In order to be more clearly understood that the above-mentioned purpose of the present invention, feature and advantage, below in conjunction with the drawings and specific embodiments, the present invention is further described in detail. It should be noted that when not conflicting, embodiments herein and the feature in embodiment can be mutually combined.
Elaborate a lot of detail in the following description so that fully understanding the present invention; but; the present invention can also adopt other to be different from other modes described here to implement, and therefore, protection scope of the present invention is by the restriction of following public specific embodiment.
Fig. 1 illustrates the schematic flow diagram of the control method of film laminator according to an embodiment of the invention.
As it is shown in figure 1, the control method of film laminator according to an embodiment of the invention, including: step 102, receive described pressure transducer collection the force value sent;Step 104, it is judged that whether the force value of pressure transducer collection is between the first scheduled pressure value and the second scheduled pressure value; Step 106, and when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control described press mold process termination.
By judging whether the force value that pressure transducer records is in predetermined range of pressure values, when judging to be not within the scope of scheduled pressure value, control in time to terminate press mold technique, the generation of bad pressuring diaphragm can be prevented effectively from, improve yields and the production efficiency of circuit board further. In technique scheme, it is preferable that before receiving the force value that pressure transducer sends, including: control described pressure transducer and carry out the collection of at least one pressure limit; At least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value.
In this technical scheme, by before receiving the force value that pressure transducer sends, control pressure transducer and gather at least one pressure limit, and any one in the higher limit of at least one pressure limit pretreated and lower limit is set as the first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value, can fast and effeciently obtain predetermined pressure range, and then improve whether the judgement circuit board until press mold is in the efficiency of this pressure limit with the described force value rolled when rumble contacts.
In technique scheme, it is preferable that when judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled press mold technique is sent to lithographic equipment.
In this technical scheme, when judging to be within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to lithographic equipment by having controlled the circuit board of press mold technique, to be automatically performed the photoetching process after press mold, it is effectively increased production efficiency and the yields of pressuring diaphragm.
In technique scheme, preferably, when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, including: the circuit board controlling described press mold process termination is sent to district to be detected.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to district to be detected by controlling the circuit board of press mold process termination, to avoid the generation of bad pressuring diaphragm, and then reduces production cost and defect rate.
In technique scheme, preferably, when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, also include: send alarm sounds, to remind user's press mold process termination, wherein, alarm sounds includes one or two the combination in any in acoustical alarm prompting and optics alarm.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, by controlling press mold process termination and sending alarm and point out, such as jingle bell warning, red alarm, so that press mold abnormal problem is known as early as possible and and is processed as early as possible, the production efficiency of raising press mold process.
Fig. 2 illustrates the schematic block diagram of the control system of film laminator according to an embodiment of the invention.
As in figure 2 it is shown, the control system 200 of film laminator according to an embodiment of the invention, receive unit 202, for receiving described pressure transducer collection the force value sent; Judging unit 204, is used for judging whether described force value is between described first scheduled pressure value and described second scheduled pressure value; And control unit 206, for when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, controlling described press mold process termination.
In this technical scheme, by rumble arranging pressure transducer rolling of film laminator, can accurately judge the circuit board until press mold and the force value rolled when rumble contacts, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, finally improve yields and the production efficiency of circuit board. In technique scheme, control unit 206 is additionally operable to, and controls described pressure transducer and carries out the collection of at least one pressure limit; The control system of described film laminator, preferably, also include: pretreatment unit 208, at least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value.
In this technical scheme, by before receiving the force value that pressure transducer sends, control pressure transducer and gather at least one pressure limit, and any one in the higher limit of at least one pressure limit pretreated and lower limit is set as the first scheduled pressure value, and using another in the higher limit and lower limit of the described pressure limit of pretreatment as described second scheduled pressure value, can fast and effeciently obtain predetermined pressure range, and then improve whether the judgement circuit board until press mold is in the efficiency of this pressure limit with the described force value rolled when rumble contacts.
In technique scheme, described control unit 206 is additionally operable to, and when judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled described press mold technique is sent to lithographic equipment.
In this technical scheme, when judging to be within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to lithographic equipment by having controlled the circuit board of press mold technique, to be automatically performed the photoetching process after press mold, it is effectively increased production efficiency and the yields of pressuring diaphragm.
In technique scheme, described control unit 206 is additionally operable to, and the circuit board controlling described press mold process termination is sent to district to be detected.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, it is sent to district to be detected by controlling the circuit board of press mold process termination, to avoid the generation of bad pressuring diaphragm, and then reduces production cost and defect rate.
In technique scheme, it is preferable that also include: alarm sounds unit 210, being used for sending alarm sounds, to remind user's press mold process termination, wherein, alarm sounds includes one or two the combination in any in acoustical alarm prompting and optics alarm.
In this technical scheme, when judging to be not within the scope of scheduled pressure value with the described force value rolled when rumble contacts until the circuit board of press mold, by controlling press mold process termination and sending alarm and point out, alarm sounds includes one or two combination in any in acoustical alarm prompting optics alarm, such as jingle bell warning, red alarm, so that press mold abnormal problem is known as early as possible and and is processed as early as possible, the production efficiency of raising press mold process.
Below in conjunction with Fig. 3, the control process of detailed description film laminator is specifically described.
(1) film laminator encapsulated rolling, rumble arranges pressure sensitive device.
Specifically, before press mold produces, film laminator film pressing roller rumble need to be carried out the setting of pressure limit, one limits pressure limit during film laminator normal operation, film laminator work gets rid of the air of dry film in press mold process/between wet film and circuit board mainly by certain pressure, makes dry film/wet film adhere well to circuit board surface. The present invention by adding one or more pressure sensitive device in film pressing roller rumble, sense the pressure suffered by film pressing roller rumble surface in press mold process, its operation principle principle is: in press mold process, such as point without exception, then film pressing roller rumble surface each point pressure experienced is comparatively balanced, can change if any film pressing roller rumble surface pressure experienced in abnormity point (such as foreign body, copper granule, dust granules etc.) then press mold process, form single-point or multipoint pressure is abnormal, it is possible to use monitoring system is screened.
(2) utilize film laminator pressure monitor system that abnormal pressure point is screened.
Specifically, at film laminator in running, when pressure sensitive device occurs abnormal, current circuit board can be recorded and screen by pressure monitor system. Under normal circumstances, the N/R circuit board of press mold pressure monitoring can flow into next exposure manufacture process, and has undetermined inspection that abnormal meeting enters side to place region, waits that personnel process. If it occur that during successional abnormal plate, film laminator automatic alarm also quits work, enter state to be checked, wait artificial treatment.
(3) press mold pressure monitoring and handling process:
The first step: film laminator pressure monitor system is set, the pressure sensitive device normally-pressured neighbor in press mold situation without exception is drawn through long-term test, two critical points (the first scheduled pressure value and the second scheduled pressure value) using its bound as pressure sensitive device exception, and import in film laminator program;
Second step: in production when pressure sensing device senses pressure is between pressure bound, it currently will normally go to next processing procedure in making sheet. When pressure sensing device senses pressure < pressure sensitive lower limit or the induction pressure > pressure sensitive upper limit, its display lamp is shown as yellow, and is sent to inspection placement region undetermined by current in making sheet. As the situation that press mold is abnormal occurs in seriality, film laminator automatic alarm also stops press mold process, and display lamp is shown in red, enters state to be checked, and wait personnel check, waits to manually start and enters back into normal production status afterwards;
3rd step: after normal production status to be restored, repeats second step operation.
Operating procedure is as it is shown on figure 3, specifically include:
Step 302, pretreatment stage, circuit board processing section in the past is put into, carries out plate face microetch and surface cleaning;
Step 304, binding dust removes the stage, and circuit board first carries out binding dust process after entering dust-free workshop, removes plate face residue further;
Step 306, in the permutation stage, needs to carry out permutation after circuit board binding dust, makes circuit board traveling edges of boards and dry film limit flush;
Step 308, warm-up phase, after permutation, circuit board can roll rumble (roll rumble temperature and be usually set to 90 DEG C, can be adjusted according to type plates) by preheating, it is ensured that circuit board surface temperature reaches press mold requirement;
Step 310, in the press mold stage, after dry film touches circuit board surface, the encapsulated rumble that rolls of press mold can be passed through and carry out overlaying that (the encapsulated rumble temperature of rolling of press mold is at about 100 DEG C, give full play to mobility and the sealing of hole ability of dry film), get rid of air between dry film and circuit board.In overlaying process, film laminator pressure detecting system can roll rumble 3104 to press mold is encapsulated, and to indicate the generation of press mold abnormal problem in time, dry film length measured by dry film cutter 3102, and after cutting, it just meets the size of circuit board mask, completes pad pasting.
Technical scheme is described in detail above in association with accompanying drawing, consider in prior art, press mold process warns press mold abnormal problem timely and accurately, process the circuit board of bad press mold in time, to avoid the technical problem of bulk bad pressuring diaphragm output, the present invention proposes the control program of a kind of new film laminator, by rumble being arranged pressure transducer rolling of film laminator, test the circuit board until press mold and the described force value rolled when rumble contacts, and carry out whether this force value of multilevel iudge is within the scope of scheduled pressure value, thus the circuit board of surface abnormalities is suspended its press mold process in time, and the press mold technique of surface abnormalities is carried out alarm, and then avoid bulk bad pressuring diaphragm output, to reduce scrappage, the final yields improving circuit board and production efficiency.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations. All within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (11)
1. a film laminator, it is characterised in that including: have the pressure transducer rolling on rumble being arranged in described film laminator, is used for testing the circuit board until press mold and the described force value rolled when rumble contacts.
2. a control method for film laminator, is used for controlling film laminator as claimed in claim 1, it is characterised in that including:
Receive described pressure transducer collection the force value sent;
Judge whether the force value of pressure transducer collection is between the first scheduled pressure value and the second scheduled pressure value; And
When judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control described press mold process termination.
3. the control method of film laminator according to claim 2, it is characterised in that before receiving the force value that pressure transducer sends, including:
Control described pressure transducer and carry out the collection of at least one pressure limit;
At least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and
Using another in the higher limit of the described pressure limit of pretreatment and lower limit as described second scheduled pressure value.
4. the control method of the film laminator according to Claims 2 or 3, it is characterised in that also include:
When judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled press mold technique is sent to lithographic equipment.
5. the control method of the film laminator according to Claims 2 or 3, it is characterised in that when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, including:
The circuit board controlling described press mold process termination is sent to district to be detected.
6. the control method of the film laminator according to Claims 2 or 3, it is characterised in that when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, control the concrete steps of press mold process termination, also include:
Send alarm sounds, to remind user's press mold process termination,
Wherein, alarm sounds includes one or two combination in any in acoustical alarm prompting and optics alarm.
7. a control system for film laminator, is used for controlling film laminator as claimed in claim 1, it is characterised in that including:
Receive unit, for receiving described pressure transducer collection the force value sent;
Judging unit, is used for judging whether described force value is between described first scheduled pressure value and described second scheduled pressure value; And
Control unit, for when judging that described force value is not between described first scheduled pressure value and described second scheduled pressure value, controlling described press mold process termination.
8. the control system of film laminator according to claim 7, it is characterised in that control unit is additionally operable to, controls described pressure transducer and carries out the collection of at least one pressure limit;
The control system of described film laminator, also includes:
Pretreatment unit, at least one pressure limit described in pretreatment, and using any one in the higher limit and lower limit of the described pressure limit of pretreatment as described first scheduled pressure value, and
Using another in the higher limit of the described pressure limit of pretreatment and lower limit as described second scheduled pressure value.
9. the control system of the film laminator according to claim 7 or 8, it is characterized in that, described control unit is additionally operable to, when judging that described force value is between described first scheduled pressure value and described second scheduled pressure value, the circuit board having controlled described press mold technique is sent to lithographic equipment.
10. the control system of the film laminator according to claim 7 or 8, it is characterised in that described control unit is additionally operable to, the circuit board controlling described press mold process termination is sent to district to be detected.
11. the control system of the film laminator according to claim 7 or 8, it is characterised in that also include:
Alarm sounds unit, is used for sending alarm sounds, to remind user's press mold process termination,
Wherein, alarm sounds includes one or two the combination in any in acoustical alarm prompting and optics alarm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410728436.2A CN105657974A (en) | 2014-12-03 | 2014-12-03 | Film pressing machine and control method and system thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410728436.2A CN105657974A (en) | 2014-12-03 | 2014-12-03 | Film pressing machine and control method and system thereof |
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| CN105657974A true CN105657974A (en) | 2016-06-08 |
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| CN201410728436.2A Pending CN105657974A (en) | 2014-12-03 | 2014-12-03 | Film pressing machine and control method and system thereof |
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| CN106197769A (en) * | 2016-08-12 | 2016-12-07 | 京东方科技集团股份有限公司 | Excess pressure monitoring device, method and polaroid attaching device |
| CN106197769B (en) * | 2016-08-12 | 2019-08-09 | 京东方科技集团股份有限公司 | Excess pressure monitoring device, method and polaroid attaching device |
| CN108336250A (en) * | 2018-03-26 | 2018-07-27 | 京东方科技集团股份有限公司 | A kind of film sticking apparatus |
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