CN105652790B - A kind of micro environment control system - Google Patents
A kind of micro environment control system Download PDFInfo
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- CN105652790B CN105652790B CN201410714413.6A CN201410714413A CN105652790B CN 105652790 B CN105652790 B CN 105652790B CN 201410714413 A CN201410714413 A CN 201410714413A CN 105652790 B CN105652790 B CN 105652790B
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- wafer
- transport unit
- cowling panel
- wind
- control system
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Abstract
The present invention relates to wafer manufacture fields,It is specifically a kind of that equipment internal gas flow is made to flow to stable micro environment control system in wafer production,Including wind turbine,Cowling panel,Fan and wind pressure sensor,Wherein wind turbine is set to the top of wafer transport unit,The bottom surface of wafer transport unit is equipped with cowling panel,Ventilation hole is evenly equipped on cowling panel,Fan is equipped in cowling panel,For detecting wafer transport unit internal pressure and the wind pressure sensor for making control system adjust wind turbine and rotation speed of the fan in real time is mounted on the delivery platform of equipment transport mechanism,Laminar flow zone and regions of turbulent flow are divided by cowling panel inside wafer transport unit,It is wherein regions of turbulent flow inside cowling panel,The baffle surface of wafer transport unit surrounding forms vacuum layer during wind flows from above to below,Wafer inlet and outlet on partition board for wafer disengaging are equipped with the door-plate for preventing air-flow from flowing backwards.The present invention keeps the air flow direction inside wafer processing steady, meets wafer production requirement.
Description
Technical field
The present invention relates to wafer manufacture fields, specifically a kind of to make equipment internal gas flow flow direction flat in wafer production
Steady micro environment control system.
Background technology
Wafer processing generally includes wafer transport unit, gluing and developing cell and hot plate unit, the wafer
Transport mechanism is equipped in supply unit, wafer is sent by the transport mechanism in the modules of gluing and developing cell, or
Person is sent into hot plate unit.Wafer is in production and processing, the air flow direction of environment and the air-flow of discharge in wafer processing
Size can all influence each technical module of wafer production, if the air-flow of the air flow direction disorder and discharge in equipment is not permanent
It is fixed, the particle in equipment in environment can be caused exceeded, if particle is fallen in crystal column surface, subsequent technique will be had an impact,
The product qualified rate of extreme influence wafer.
Invention content
The purpose of the present invention is to provide a kind of micro environment control systems, in wafer production by controlling air inlet and air draft
Keep equipment internal gas flow flow direction steady, while turbulent layer being limited in the region inside cowling panel, meets wafer production requirement.
The purpose of the present invention is achieved through the following technical solutions：
A kind of micro environment control system applied on wafer processing, the wafer processing include wafer conveying
Unit, gluing and developing cell and hot plate unit, each unit are separated by partition, and are equipped with and are passed in the wafer transport unit
Mechanism, wafer is sent to act on each mould through wafer inlet and outlet disengaging gluing and developing cell on partition board by the transport mechanism
In block or in hot plate unit, it is characterised in that：Including wind turbine, cowling panel, fan and wind pressure sensor, wherein wind turbine is set to
The top of wafer transport unit is equipped with cowling panel on the bottom surface of the wafer transport unit, is evenly equipped on the cowling panel more
A ventilation hole, the interior fan for being equipped with multiple air drafts of the cowling panel, for detecting wafer transport unit internal pressure and making control
System processed adjusts wind turbine in real time and the wind pressure sensor of rotation speed of the fan is mounted on the delivery platform of the transport mechanism.
The wafer transport unit inner space is divided into laminar flow zone and regions of turbulent flow by the cowling panel, wherein described
It is laminar flow zone on the outside of cowling panel, is regions of turbulent flow inside the cowling panel.
Side of the wafer inlet and outlet far from the wafer transport unit is equipped with the door-plate for preventing air-flow from flowing backwards.
The door-plate is pushed by cylinder and is opened, and sliding rail, the door-plate both sides are equipped on the partition board of the door-plate both sides
Equipped with the sliding block coordinated with the sliding rail, the door-plate is moved by the sliding block along the sliding rail.
The baffle surface of the wafer transport unit surrounding forms vacuum layer during wind flows from above to below.
It is set on the downside of wafer processing there are one air draft region, wind is discharged into the air draft region by fan effect
In.
High efficiency particulate air is equipped with below the wind turbine.
Advantages of the present invention is with good effect：
1, the present invention keeps the air flow direction of environment in equipment steady in wafer production by controlling air inlet and air draft, and leads to
It crosses the real-time senses change in pressure of wind pressure sensor moved up and down with transport mechanism and adjusts wind turbine and rotation speed of the fan in real time, ensure
Turbulent flow does not occur in wafer transport unit.
2, the present invention is equipped with cowling panel in wafer transport unit bottom, and the turbulent layer that wind is discharged into the generation of air draft region is limited in
In the cowling panel, it is further ensured that in wafer transport unit and turbulent flow does not occur.
3, the runner that upper entering and lower leaving is constituted in wafer transport unit of the invention, during wind flows from above to below,
Wafer transport unit surrounding baffle surface forms vacuum layer and is conducive to gluing and the air-flow in developing cell modules and hot plate
Air-flow in unit flows into wafer transport unit.
4, the present invention is equipped with openable door-plate in wafer inlet and outlet, avoids the air-flow in air draft region from flowing backwards and enters gluing
And in developing cell modules and in hot plate unit.
5, the present invention is equipped with high efficiency particulate air below wind turbine, avoids the impurity in air from entering in equipment and causes secondary dirt
Dye.
Description of the drawings
Fig. 1 is wafer processing vertical view,
Fig. 2 is the A-A sectional views of wafer processing in Fig. 1,
Fig. 3 is the B-B sectional views of wafer processing in Fig. 1.
Wherein, 1 is wafer transport unit, and 2 be gluing and developing cell, and 3 be hot plate unit, and 4 be air draft region, and 5 be wind
Machine, 6 be high efficiency particulate air, and 7 be frame body, and 8 import and export for wafer, and 9 be door-plate, and 10 be cowling panel, and 11 be fan, and 12 pass for wind pressure
Sensor, 13 be transport mechanism, and 14 be delivery platform, and 15 be holder, and 16 be ventilation hole, and 17 be partition board.
Specific implementation mode
The invention will be further described below in conjunction with the accompanying drawings.
As shown in Figures 1 to 3, wafer processing includes wafer transport unit 1, gluing and developing cell 2 and hot plate unit
3, the wafer transport unit 1 is set in the middle part of equipment, and it is single that gluing and developing cell 2 and hot plate unit 3 are located on wafer conveying
Around member 1, separated by partition board 17 between the wafer transport unit 1, gluing and developing cell 2 and hot plate unit 3.It is described
Gluing and developing cell 2 include multiple modular units, and the modular unit is stacked along device height direction, and partition board 17 is equipped with crystalline substance
Circle inlet and outlet 8, are equipped with transport mechanism 13, wafer is by the transport mechanism 13 along device height side in wafer transport unit 1
To lifting and be sent into the module of corresponding gluing and developing cell 2, or it is sent into hot plate unit 3, the transport mechanism 13
Including a delivery platform 14, wafer is placed on the delivery platform 14, and the transport mechanism 13 is known in the art skill
Art.
The present invention includes wind turbine 5, high efficiency particulate air 6, door-plate 9, cowling panel 10, fan 11 and wind pressure sensor 12, wherein
Wind turbine 5 is set to the surface of wafer transport unit 1, and the wind turbine 5 into wafer transport unit 1 for drying, in the wind
5 lower section of machine is equipped with high efficiency particulate air 6 to prevent the impurity in air from entering in wafer transport unit 1, and the high efficiency particulate air 6 is pacified
On the frame 7 of equipment, the high efficiency particulate air 6 is the product of market purchase, in the present embodiment, the high efficiency particulate air 6
Model 0515-07, manufacturer FLONCHEMICAL.Cowling panel is equipped on the bottom surface of the wafer transport unit 1
10, as shown in Fig. 2, be evenly equipped with multiple ventilation holes 16 on the cowling panel 10, the cowling panel 10 is by the wafer transport unit 1
Inner space is divided into laminar flow zone and regions of turbulent flow, wherein the outside of the cowling panel 10 is laminar flow zone, the cowling panel 10
Inside is regions of turbulent flow, and the cowling panel 10 is internally provided with the fan 11 of multiple air drafts, and it is defeated that the fan 11 is mounted on wafer
On the bottom surface for sending unit 1, set on the downside of wafer processing there are one air draft region 4, wind is discharged into described by the fan 11
It in air draft region 4, and is expelled to outside equipment through the air draft region 4, the wind turbine 5 and fan 11 are controlled by control system
Rotating speed, the wind turbine 5 and fan 11 are known in the art technology.Wind turbine 5 throws wind into equipment, again by wind after the rectified plate of wind 10
11 discharge of fan, to constitute the runner of upper entering and lower leaving, in 1 surrounding partition board of wafer transport unit during wind flows from above to below
17 surfaces can form vacuum layer conducive to the air-flow in 2 modules of gluing and developing cell and the air-flow stream in hot plate unit 3
Into wafer transport unit 1.
Wind pressure sensor 12 there are one being set on the delivery platform 14 of the transport mechanism 13, as shown in Fig. 2, the wind pressure
Sensor 12 is set to above wafer, and the wind pressure sensor 12 is mounted on by a holder 15 on the delivery platform 14,
The wind pressure sensor 12 is moved up and down with the delivery platform 14, to the pressure condition in real-time sensing apparatus, works as wind pressure
When sensor 12 senses that the pressure in wafer transport unit 1 changes, control system can be sent a signal to, control system is made
Adjust the rotating speed of wind turbine 5 and fan 11.In the present embodiment, the model E8F2-A01C of the wind pressure sensor 12, manufacturer
For omron (Omron).
8 sides far from the wafer transport unit 1, which are imported and exported, in the wafer is equipped with openable door-plate 9, the door
Plate 9 is pushed by cylinder and is opened, and on partition board 17, is equipped with sliding rail in 9 both sides of the door-plate, 9 both sides of the door-plate are equipped with and institute
The sliding block of sliding rail cooperation is stated, the door-plate 9 is moved by the sliding block along the sliding rail, and the cylinder is controlled by control system
Flexible, this is known in the art technology.
The operation principle of the present invention is that：
Before equipment carries out flow process, door-plate 9 is closed, and is avoided the air-flow refluence in air draft region 4 from entering and is set
It is standby interior, the interior environment of gluing and developing cell 2 and hot plate unit 3 is influenced, wind turbine 5 and fan 11 are in normal work shape at this time
State.When the normal flow of equipment starts, corresponding door-plate 9 open, transport mechanism 13 run at high speed and by wafer inlet and outlet 8 to
Piece is fetched and delivered in the corresponding module of gluing and developing cell 2 or in hot plate unit 3, the transmission parts when transport mechanism 13 runs at high speed
Friction will produce a large amount of dusts, and wind turbine 5 and fan 11 make the air-flow that upper entering and lower leaving is formed in wafer transport unit 1, and dust is in crystalline substance
Air-flow smooth flow is followed in circle supply unit 1, and rectified plate 10 enters regions of turbulent flow, is finally arranged under the drive of fan 11
Go out.In this process, the delivery platform 14 in transport mechanism 13 can move up and down, and the wind pressure being set on delivery platform 14 passes
Sensor 12 can also move up and down therewith.When wind pressure sensor 12 detects that pressure changes, pressure value is fed back into control
System, control system can constantly be adjusted wind turbine 5 and 11 rotating speed of fan.
Wind turbine 5 throws wind into equipment, then is discharged by fan 11, constitutes upper entering and lower leaving runner, was flowed from above to below in wind
Vacuum layer can be formed conducive in 2 modules of gluing and developing cell on 17 surface of partition board of 1 surrounding of wafer transport unit in journey
Air-flow and hot plate unit 3 in air-flow flow into wafer transport unit 1.
Claims (5)
1. a kind of micro environment control system applied on wafer processing, the wafer processing includes that wafer conveying is single
Member, gluing and developing cell and hot plate unit, each unit are separated by partition, and transmission is equipped in the wafer transport unit
Mechanism, the gluing and developing cell include multiple modular units and each modular unit is stacked along device height direction, and wafer is logical
It crosses in modules of the transport mechanism effect through wafer inlet and outlet disengaging gluing and developing cell on partition board or hot plate
In unit, it is characterised in that：Including wind turbine (5), cowling panel (10), fan (11) and wind pressure sensor (12), wherein wind turbine (5)
It is set to the top of wafer transport unit (1), cowling panel (10) is equipped on the bottom surface of the wafer transport unit (1), it is described
It is evenly equipped with multiple ventilation holes (16) on cowling panel (10), the fan (11) of multiple air drafts is equipped in the cowling panel (10), is used
In detection wafer transport unit (1) internal pressure and control system is made to adjust the wind pressure of wind turbine (5) and fan (11) rotating speed in real time
Sensor (12) is mounted on the delivery platform (14) of the transport mechanism (13)；
The side of the wafer inlet and outlet (8) far from the wafer transport unit (1) is equipped with the door-plate (9) for preventing air-flow from flowing backwards；
Partition board (17) surface of wafer transport unit (1) surrounding forms vacuum layer during wind flows from above to below.
2. micro environment control system according to claim 1, it is characterised in that：The wafer transport unit (1) is internal empty
Between laminar flow zone and regions of turbulent flow be divided by the cowling panel (10), wherein be laminar flow zone on the outside of the cowling panel (10),
It is regions of turbulent flow inside the cowling panel (10).
3. micro environment control system according to claim 1, it is characterised in that：The door-plate (9) is beaten by cylinder promotion
It opens, sliding rail is equipped on the partition board (17) of the door-plate (9) both sides, door-plate (9) both sides are equipped with to be coordinated with the sliding rail
Sliding block, the door-plate (9) are moved by the sliding block along the sliding rail.
4. micro environment control system according to claim 1, it is characterised in that：Row there are one being set on the downside of wafer processing
Wind region (4), wind are discharged by the fan (11) effect in the air draft region (4).
5. micro environment control system according to claim 1, it is characterised in that：Efficient mistake is equipped with below the wind turbine (5)
Strainer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714413.6A CN105652790B (en) | 2014-11-30 | 2014-11-30 | A kind of micro environment control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410714413.6A CN105652790B (en) | 2014-11-30 | 2014-11-30 | A kind of micro environment control system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105652790A CN105652790A (en) | 2016-06-08 |
| CN105652790B true CN105652790B (en) | 2018-08-07 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410714413.6A Active CN105652790B (en) | 2014-11-30 | 2014-11-30 | A kind of micro environment control system |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110103134A (en) * | 2019-05-14 | 2019-08-09 | 应达利电子股份有限公司 | Wafer processing method |
| CN112748639A (en) * | 2019-10-31 | 2021-05-04 | 沈阳芯源微电子设备股份有限公司 | FFU rectifying plate with airflow partition regulation and control function and glue coating process for adjusting glue shape |
| CN112713108B (en) * | 2020-12-18 | 2023-12-08 | 钟兴进 | Airflow stabilizing system for wafer processing |
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| CN105652790A (en) | 2016-06-08 |
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Address after: 110168 No. 16 Feiyun Road, Hunnan District, Shenyang City, Liaoning Province Patentee after: Shenyang Core Source Microelectronic Equipment Co., Ltd. Address before: 110168 No. 16 Feiyun Road, Hunnan New District, Shenyang City, Liaoning Province Patentee before: Shenyang Siayuan Electronic Equipment Co., Ltd. |