CN105643473B - A kind of lapping device of cylindrical work outer peripheral face - Google Patents
A kind of lapping device of cylindrical work outer peripheral face Download PDFInfo
- Publication number
- CN105643473B CN105643473B CN201511018491.3A CN201511018491A CN105643473B CN 105643473 B CN105643473 B CN 105643473B CN 201511018491 A CN201511018491 A CN 201511018491A CN 105643473 B CN105643473 B CN 105643473B
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- alignment pin
- lapping liquid
- lapping
- grinding chamber
- symmetry
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C3/00—Abrasive blasting machines or devices; Plants
- B24C3/32—Abrasive blasting machines or devices; Plants designed for abrasive blasting of particular work, e.g. the internal surfaces of cylinder blocks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C7/00—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts
- B24C7/0007—Equipment for feeding abrasive material; Controlling the flowability, constitution, or other physical characteristics of abrasive blasts the abrasive material being fed in a liquid carrier
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a kind of lapping device of cylindrical work outer peripheral face, the lapping device includes the grinding chamber for the cuboid being made up of case lid and casing；The both ends of the grinding chamber are respectively equipped with lapping liquid import and lapping liquid outlet；The location-plate parallel with case lid is provided with the grinding chamber, forms the space that lapping liquid flows through thereunder；Vertical and be equipped with one downwards and be vortexed post and the even number root workpiece alignment pin less than or equal to 6 occurs, each workpiece alignment pin upper end and the motor connection positioned at location-plate upper surface on described location-plate；Wherein, using the section by the location-plate length direction center line as the plane of symmetry, the axis that post occurs for described vortex passes through the described plane of symmetry, and is located at lapping liquid entrance；Described workpiece alignment pin equivalent is distributed in the both sides of the described plane of symmetry.Lapping device energy simultaneous grinding of the present invention polishes more than one piece workpiece, and processing efficiency significantly improves.
Description
Technical field
The present invention relates to the device for being ground or polishing, and in particular to the special purpose device of special grinding, the device
Workpiece is ground using Karman vortex street principle enhancing mobility abrasive material.
Background technology
It is a kind of new polishing processing method that polishing is ground to workpiece surface using the abrasive material of flowing, common method
There are two kinds, i.e. Jet Polishing and abrasive flow machining.
It is to utilize the polishing fluid for being mixed with tiny abrasive particle sprayed at a high speed by the aperture of nozzle to act on workpiece surface to penetrate polishing,
Microcosmic uneven material is removed by the high velocity impact shear action of abrasive particle, pressure, angle when being sprayed by controlling polishing fluid and
The technological parameters such as injecting time correct the polishing process of workpiece surface roughness to quantify.As application publication number is
A kind of " polisher with jetted ", the polisher with jetted pass through high pressure liquid pump respectively disclosed in CN103433857A application for a patent for invention
Base fluid will be carried with membrane pump and abrasive material is delivered to ejector, after turbulent fluctuation diffusion and blending occur in ejector for load base fluid and abrasive material
Nozzle through ejector sprays to form abrasive fluid jet, and abrasive fluid jet action can reach the purpose of polishing in workpiece surface.
Abrasive flow machining is also referred to as crush and grind, is that a kind of use has the viscoelastic material of mobility (by polymer support
Formed with abrasive particle) to the method for workpiece surface progress skin processing.It mainly forces viscoelastic material under pressure
The surface of part to be processed is flowed through, the abrasive particle for making to include inside it produces sliding on the surface of part to be processed, and then utilizes mill
The scraping action of grain removes the microcosmic uneven material on part to be processed surface, reaches the purpose of deburring and polishing.Such as disclosure
Number make for a kind of " abrasive-flow processing machine tool ", the abrasive-flow processing machine tool disclosed in CN101602182A application for a patent for invention
Used time, by the charging cylinder of hole link two polished on workpiece, pushes away workpiece clamping between upper charging cylinder and lower charging cylinder
Hydroabrasive is housed, two charging cylinders alternating pusher can force hydroabrasive extruding reciprocal in polished duct in material cylinder
Flowing, the purpose of polishing is reached with this.
But above two polishing processing method still suffers from following deficiency：
1st, Jet Polishing needs to use high pressure liquid pump to form high-speed jet, and cost is higher；High-speed jet is directly in nozzle
Middle formation, causes nozzle easily to wear；High-speed jet sputtering is severe, and abrasive material wastes serious.
2nd, abrasive flow machining usually requires complex hydraulic system to realize the action of the clamping of workpiece and charging cylinder,
Cost is high and certain potential safety hazard be present.
3rd, either Jet Polishing or abrasive flow machining, same equipment simultaneously can only be to some part of single workpiece
It is polished, processing efficiency is low.
The content of the invention
The technical problems to be solved by the invention are to provide a kind of lapping device of cylindrical work outer peripheral face, grinding dress
The outer peripheral face of energy simultaneous grinding polishing more than one piece workpiece is put, processing efficiency significantly improves.
The present invention solve above-mentioned technical problem technical scheme be：
A kind of lapping device of cylindrical work outer peripheral face, the lapping device include the cuboid being made up of case lid and casing
Grinding chamber, the both ends of the grinding chamber are respectively equipped with lapping liquid import and lapping liquid outlet；
The location-plate parallel with case lid is provided with the grinding chamber, forms the space that lapping liquid flows through thereunder；It is described
Location-plate on the import of self-grind liquid be equipped with to lapping liquid exit normal and downwards one and be vortexed post and less than or equal to 6 occurs
Even number root workpiece alignment pin, each workpiece alignment pin upper end and the motor connection positioned at location-plate upper surface；Wherein, with by institute
The section for stating location-plate length direction center line is the plane of symmetry, and the axis that post occurs for described vortex passes through the described plane of symmetry,
And it is located at lapping liquid entrance；Described workpiece alignment pin equivalent is distributed in the both sides of the described plane of symmetry, and when grinding liquid stream
It is 47~10 through the grinding chamber Reynolds number5When, the center of described workpiece alignment pin is vortexed after generation post positioned at described respectively
The middle part of one line vortex of caused biserial line vortex；Meanwhile post occurs for the grinding chamber and its vortex of inside and workpiece is determined
The structural parameters of position pin meet following requirements with position relationship：
dg≤0.6d (Ⅰ)
B/d=6~10 (II)
H=β d (IV)
In above formula (I)~(IV), the external diameter of post, d occur to be vortexed for dgFor the external diameter of the workpiece of processing, B is grinding chamber
Width, L are positioned at the distance between adjacent two workpiece alignment pin in described plane of symmetry the same side, and H is described in workpiece alignment pin leaves
The distance of the plane of symmetry, α is constant, and α=0.73~0.78, β is constant, and β=1.0~2.2, Sr are Strouhal number,
And Sr=0.21.
Above-mentioned lapping device can form grinding system, and the system includes infusion pump, electric control valve, the electromagnetism being sequentially connected in series
The lapping device of flowmeter and above-mentioned cylindrical work outer peripheral face.
The course of work of lapping device of the present invention is summarized as follows：
Part to be processed is sleeved on workpiece alignment pin, adjusts the flow velocity of lapping liquid, make reynolds number Re reach 47~
105, you can realize the polishing to workpiece.
The reynolds number Re of lapping liquid is obtained by below equation：
Wherein, v is the flow velocity of lapping liquid, and D is the hydraulic diameter of lapping liquid in grinding chamber, and μ is the dynamic viscosity of lapping liquid.
The present invention has the advantages that：
1st, it post both sides occur periodically can come off direction of rotation phase due to when lapping liquid flows through vortex, and post occurs, being vortexed
Instead, the biserial line vortex (i.e. toll bar be vortexed) of queueing discipline, and the workpiece alignment pin in scheme of the present invention be placed exactly in it is described
The middle part of " line vortex ", therefore more than one piece workpiece can be ground simultaneously, processing efficiency significantly improves.
2nd, lapping liquid flow through be vortexed occur energy after post entrained by it to it is square thereafter into vortex in assemble, therefore by
It is vortexed and carries abrasive particle high-speed impact workpiece surface to complete the polishing to workpiece, not only takes full advantage of the energy entrained by lapping liquid
Amount, effectively improves the efficiency of device, and also reduce abrasion of the lapping liquid to device part itself.
3rd, toll bar is vortexed and can formed under relatively low reynolds number Re, therefore the lift of the pump of conveying lapping liquid and flow are not required to
It is very big, the cost of device can be effectively reduced, improves the security of device.
Brief description of the drawings
Fig. 1~3 are the structural representation of a specific embodiment of lapping device of the present invention, and wherein Fig. 1 is main view
Scheme (section view), Fig. 2 is the A-A sectional views in Fig. 1, and Fig. 3 is left view；B in Fig. 2 is the width of grinding chamber, and L is positioned at described
The distance between adjacent two workpiece alignment pin in plane of symmetry the same side, H are the distance that workpiece alignment pin leaves the plane of symmetry.
Fig. 4 is the dimensional structure diagram of the illustrated embodiment of Fig. 1~3；Fig. 5 is the enlarged drawing of local M in Fig. 4.
Fig. 6 is the position relationship schematic diagram that post and workpiece alignment pin occur for the illustrated embodiment mesoscale eddies of Fig. 1~3.
Fig. 7 is that lapping liquid forms the principle schematic that Karman vortex street polishes workpiece in the illustrated embodiment of Fig. 1~3.
Fig. 8 is the VELOCITY DISTRIBUTION cloud atlas of lapping liquid in the illustrated embodiment of Fig. 1~3.
Post occurs for grinding chamber inside vortex in another specific embodiment of lapping device of the present invention by Fig. 9 and workpiece is determined
The position relationship schematic diagram of position pin.
Figure 10 is the VELOCITY DISTRIBUTION cloud atlas of lapping liquid in embodiment illustrated in fig. 9
Figure 11 is to form a kind of schematic diagram of grinding system using lapping device shown in Fig. 1~3.
Embodiment
Example 1
Referring to Fig. 1~5, the grinding chamber 5 of lapping device is a rectangular box, and its top gland has case lid 5-1, and grinds
Lapping liquid import 5-2 and lapping liquid outlet 5-3 are respectively equipped with the tank wall at the both ends of room 5.Close to case lid 5-1 position in grinding chamber 5
A location-plate 6 parallel with case lid 5-1 is installed, the support of location-plate 6 is on the convex shoulder being located on the inwall of grinding chamber 5；Positioning
The space of the lower section of plate 6 is the space that lapping liquid flows through, and the bulk is：Wide × high (grinding chamber bottom to location-plate downside
Distance)=600mm × 400mm (hydraulic diameter D is 480mm), length=1600mm.
Referring to Fig. 1~5 and Fig. 6 is combined, the lower section of location-plate 6 is provided with lapping liquid import 5-2 at a distance of 300mm position
Post 7 occurs for one vortex vertical with location-plate 6, and the external diameter that post 7 occurs for the vortex is 100mm, and is coaxially located in by one in it
The generation post alignment pin 7-1 in portion is fixed on location-plate 6；Using the vertical section of the center line through the length direction of location-plate 6 as pair
Title face, then described generation post alignment pin 7-1 axis be on the plane of symmetry；The rear that post 7 occurs that is vortexed is provided with two
Group is located at the workpiece alignment pin 8 of the plane of symmetry both sides respectively；Each group of workpiece alignment pin 8 passes through by the self-positioning top of plate 6
Three below to location-plate compositions, and each workpiece alignment pin 8 is connected with one positioned at the motor 9 of location-plate upper side, it is electric
Support is supported in case lid 5-1 downside to stationary positioned plate 6 in end of the machine 9 away from output shaft one；Case lid 5-1 is consolidated by screw
It is scheduled on the top of grinding chamber 5.
Referring to Fig. 6, two groups of workpiece alignment pins 8 are numbered respectively, it is I, II, III that three in one of which piece number respectively,
It is IV, V, VI that three in another group are numbered respectively；Lapping liquid import 5-2 distance is left as horizontal stroke using each workpiece alignment pin 8
Coordinate, the distance for leaving the described plane of symmetry is ordinate, then the position of two groups of workpiece alignment pins 8 can be used to lower coordinate representation：Ⅰ
(590,100), II (945,150), III (1300,130), IV (750, -150), V (1105, -170), VI (1460, -140),
Wherein, the negative value in ordinate and the not homonymy on the occasion of expression positioned at the plane of symmetry, coordinate value unit is mm.When grinding liquid stream
Through the Reynolds number of grinding chamber 5 be 90 when, by above-mentioned coordinate distribution workpiece alignment pin 8 center respectively positioned at be vortexed occur post
The middle part of a line vortex of caused biserial line vortex after 7.
Referring to Figure 11 and Fig. 4 is combined, is built using the combination liquid reserve tank 1 of lapping device 11 in this example and infusion pump 2 a set of
Grinding system, the import of the infusion pump 2 connect with the bottom of liquid reserve tank 1, outlet and the lapping liquid import 5-2 of lapping device 11
It is connected, the lapping liquid outlet 5-3 of lapping device 11 connects with liquid reserve tank 1.Ground with lapping device 11 the outlet of the infusion pump 2
Electric control valve 3 and electromagnetic flowmeter 4 are serially connected with pipeline between grinding fluid import 5-2, to adjust and monitor lapping liquid
Flow, to obtain suitable flow velocity.
The formula of lapping liquid is as follows in this example：
Brown alundum powder 30% (particle mean size is 18.6 μm), oiliness liquid (63% deionized water, 0.5% polyacrylic acid
Sodium, 7% sodium acid carbonate, 21% No. 46 mineral oil, 8.5% emulsifying agent Span 80) 70%, density 1620kg/m3, move
Power viscosity is 0.008Pa.s；Above percentage is mass percent.
Below in conjunction with the operation principle of Brief Description Of Drawings lapping device of the present invention：
Referring to Fig. 7, can be formed when the reynolds number Re of lapping liquid fluid reaches 50 at the generation post rear that is vortexed stable, more
The vortex (Karman vortex street phenomenon) that rarer rule, oppositely oriented, both sides alternating comes off；This vortex can be carried secretly in lapping liquid
Abrasive particle with the velocity collision workpiece 10 far above lapping liquid mean flow rate, realize the polishing to the surface of workpiece 10.
Lapping liquid fluid is analyzed using numerical simulation software Fluent16 below, dress is ground in this example to verify
The effect put：
Design conditions are：Stable state laminar model, the density of abrasive and dynamic viscosity are inputted, flow equation momentum term
Discrete using Second-order Up-wind form, pressure term is discrete using reference format, and using SIMPLE Algorithm for Solving, other are arranged to default
State.The external diameter for setting workpiece 10 is 40mm, and lapping liquid flows through vortex using 1.5m/s (now Re is 90) speed and post 7 occurs.
The mobility status of lapping liquid in grinding chamber in this example 5 is simulated using Fluent16 softwares, and exports grinding
The flowing velocity distribution cloud atlas of liquid (see Fig. 8).
Fig. 8 shows, being vortexed, the rear basin maximum speed of post 7 occurs is 2.94m/s, much larger than the entrance velocity of grinding chamber 5,
Obviously each workpiece surface average shear stress increase, polishing efficiency significantly improve.
Example 2
Referring to Fig. 9, this example flows through the Reynolds number of grinding chamber 5 as 60 designs, the position of two groups of workpiece alignment pins 8 by lapping liquid
Put and can be used to lower coordinate representation：I (570,130), II (920,190), III (1290,215), IV (740, -180), V (1110, -
200)、Ⅵ(1480,-210)；Implementation other than the above is same as Example 1 in this example.
Lapping liquid fluid is analyzed using numerical simulation software Fluent16 below, dress is ground in this example to verify
The effect put：
Design conditions are：Stable state laminar model, the density of abrasive and dynamic viscosity are inputted, flow equation momentum term
Discrete using Second-order Up-wind form, pressure term is discrete using reference format, and using SIMPLE Algorithm for Solving, other are arranged to default
State.The external diameter for setting workpiece 10 is 40mm, and lapping liquid flows through vortex using 1m/s (now Re is 60) speed and post 7 occurs.
The mobility status of lapping liquid in grinding chamber in this example 5 is simulated using Fluent16 softwares, and exports grinding
The flowing velocity distribution cloud atlas (Figure 10) of liquid.
Referring to Figure 10, the generation rear basin maximum speed of post 7 that is vortexed is 1.75m/s, much larger than the entrance speed of grinding chamber 5
Degree, it is clear that each workpiece surface average shear stress increase, polishing efficiency significantly improve.
Claims (2)
1. a kind of lapping device of cylindrical work outer peripheral face, the lapping device includes the cuboid being made up of case lid and casing
Grinding chamber, the both ends of the grinding chamber are respectively equipped with lapping liquid import and lapping liquid outlet；
The location-plate parallel with case lid is provided with the grinding chamber, forms the space that lapping liquid flows through thereunder；Described determines
The import of self-grind liquid is equipped with to lapping liquid exit normal and be downwards vortexed generation post and an even number less than or equal to 6 on the plate of position
Root workpiece alignment pin, each workpiece alignment pin upper end and the motor connection positioned at location-plate upper surface；Wherein, with by described fixed
The section of position plate length direction center line is the plane of symmetry, and the axis that post occurs for described vortex passes through the described plane of symmetry, and position
In lapping liquid entrance；Described workpiece alignment pin equivalent is distributed in the both sides of the described plane of symmetry, and when lapping liquid flows through institute
Grinding chamber Reynolds number is stated as 47~105When, the center of described workpiece alignment pin is produced positioned at described be vortexed after generation post respectively
The middle part of one line vortex of raw biserial line vortex；Meanwhile post and workpiece alignment pin occur for the grinding chamber and its vortex of inside
Structural parameters and position relationship meet following requirements：
dg≤0.6d (Ⅰ)
B/d=6~10 (II)
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<mi>d</mi>
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</mrow>
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<mi>I</mi>
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</mrow>
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H=β d (IV)
In above formula (I)~(IV), the external diameter of post, d occur to be vortexed for dgFor the external diameter of the workpiece of processing, B is the width of grinding chamber, L
For positioned at the distance between adjacent two workpiece alignment pin in described plane of symmetry the same side, H is that workpiece alignment pin leaves the plane of symmetry
Distance, α is constant, and α=0.73~0.78, β is constant, and β=1.0~2.2, Sr are Strouhal number, and Sr=
0.21。
2. a kind of grinding system, the system includes infusion pump, electric control valve, electromagnetic flowmeter and the claim being sequentially connected in series
The lapping device of cylindrical work outer peripheral face described in 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018491.3A CN105643473B (en) | 2015-12-28 | 2015-12-28 | A kind of lapping device of cylindrical work outer peripheral face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511018491.3A CN105643473B (en) | 2015-12-28 | 2015-12-28 | A kind of lapping device of cylindrical work outer peripheral face |
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| Publication Number | Publication Date |
|---|---|
| CN105643473A CN105643473A (en) | 2016-06-08 |
| CN105643473B true CN105643473B (en) | 2017-12-26 |
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| CN201511018491.3A Active CN105643473B (en) | 2015-12-28 | 2015-12-28 | A kind of lapping device of cylindrical work outer peripheral face |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118544210B (en) * | 2024-07-29 | 2024-09-17 | 珠海市隽达精密制造有限公司 | Gear deburring polishing equipment |
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|---|---|---|---|---|
| CN101602182A (en) * | 2009-07-25 | 2009-12-16 | 太原理工大学 | A kind of abrasive-flow processing machine tool |
| CN103433857A (en) * | 2013-09-05 | 2013-12-11 | 浙江大学台州研究院 | Jet polishing machine and jet polishing method |
| CN104608042A (en) * | 2015-01-23 | 2015-05-13 | 太原理工大学 | Forced turbulent flow hole surface finish machining technology |
| CN104972404A (en) * | 2015-02-03 | 2015-10-14 | 浙江工业大学 | Flow polishing device for manufacturing ultrasmooth surfaces by gas-liquid-solid abrasive flow |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3273394B2 (en) * | 1993-11-30 | 2002-04-08 | 株式会社リコー | Mechanical grinding equipment |
| JPH08299827A (en) * | 1995-05-12 | 1996-11-19 | Minolta Co Ltd | Mechanical grinder |
-
2015
- 2015-12-28 CN CN201511018491.3A patent/CN105643473B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101602182A (en) * | 2009-07-25 | 2009-12-16 | 太原理工大学 | A kind of abrasive-flow processing machine tool |
| CN103433857A (en) * | 2013-09-05 | 2013-12-11 | 浙江大学台州研究院 | Jet polishing machine and jet polishing method |
| CN104608042A (en) * | 2015-01-23 | 2015-05-13 | 太原理工大学 | Forced turbulent flow hole surface finish machining technology |
| CN104972404A (en) * | 2015-02-03 | 2015-10-14 | 浙江工业大学 | Flow polishing device for manufacturing ultrasmooth surfaces by gas-liquid-solid abrasive flow |
Non-Patent Citations (2)
| Title |
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| 低雷诺数时卡门涡街的重新排列;松井辰弥 等;《力学进展 》;19810401;293-300 * |
| 圆柱绕流流场结构的大涡模拟研究;郝鹏 等;《应用力学学报》;20120831;第29卷(第4期);437-445 * |
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Effective date of registration: 20210415 Address after: 214000 No.101, Xitu Road, Outang, Qianqiao street, Huishan District, Wuxi City, Jiangsu Province Patentee after: WUXI HONGYUAN SPECIAL STEEL PRODUCT Co.,Ltd. Address before: Unit 2414-2416, main building, no.371, Wushan Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: GUANGDONG GAOHANG INTELLECTUAL PROPERTY OPERATION Co.,Ltd. |