CN105568285B - Etaching device - Google Patents
Etaching device Download PDFInfo
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- CN105568285B CN105568285B CN201511020202.3A CN201511020202A CN105568285B CN 105568285 B CN105568285 B CN 105568285B CN 201511020202 A CN201511020202 A CN 201511020202A CN 105568285 B CN105568285 B CN 105568285B
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- etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
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- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
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- Mechanical Engineering (AREA)
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- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
The present invention relates to electronics industry, discloses the Etaching device in a kind of electronics industry, which includes：Multiple etching grooves, the plurality of etching groove allow article to be etched to pass through successively and be able to etching process；With chemicals feeding mechanism, which includes：First tank, first tank receive brand-new chemicals and to last etching groove supplying chemical product；With the second tank, which receives the chemicals after etching process in all etching grooves in addition to the first etching groove, and at least supplies the chemicals after etching process to all etching grooves in addition to last etching groove.Etaching device provided by the present invention can obtain the etch effect of preferable uniformity or uniformity.
Description
Technical field
The present invention relates to electronics industry, and in particular, to a kind of Etaching device for etching process.
Background technology
In the electronics industry, such as printed wiring board field, etching are a kind of common processes.Its common operation
For：The film is laid with substrate surface, then the film is exposed according to figure set in advance；Then again by the base after exposure
Plate, which is immersed in the usually chemicals of liquid, to be etched, the area irradiated and reacted including obtaining light due to the film
Domain and other regions for not obtaining light irradiation, so as to selectively etch the film corresponding to above-mentioned figure in etching
Fall.
In etching process, the use of chemicals is essential.In order to be adapted to continuous industrial production, in etch process
In usually require multiple etching grooves, the predetermined chemicals of injection in each etching groove, and make product to be etched successively each
Pass through etching process in etching groove, finally washed again to remove the residual chemical on product to be etched, so that final complete
Into whole etch process step.
Such as in LCD fields, as shown in Figure 1 to etch photoresist during manufacture colored filter when chemicals circulation industrial
Skill process.As shown in Figure 1, Etaching device includes the multiple etching grooves (being etching groove 1-3 in figure) continuously set and a washing
Groove.When being etched, article to be etched is contacted in etching groove with chemicals successively in sequence, will be needed
The photoresist that etching removes is got rid of, and is finally rinsed chemicals well by rinsing bowl 5, consequently facilitating the progress of subsequent technique.
In the scheme of Fig. 1, chemical cycle process is as described below：New chemicals initially enters 6 He of first circulation tank
Second circulation tank 7, the first circulation tank 6 and second circulation tank 7 are respectively communicated in etching groove, and etching groove and article to be etched
Chemicals after contacting and reacting is flow back into first circulation tank 6 and second circulation tank 7 again, so as to recycle.Meanwhile the
Unnecessary chemicals is according to circumstances discharged to outside as waste liquid 15 in one circulating tank 6 and second circulation tank 7.
However, being detected by prolonged product quality, found after analysis statisticaling data, utilize the technical side shown in Fig. 1
Case, it is larger for the etch effect difference of article to be etched, and then influence the quality consistency of final products (such as color film).
Therefore, the uniformity or uniformity of etch effect in etch process how are improved, becoming this area needs what is solved
Technical problem.
The content of the invention
The object of the present invention is to provide a kind of etching effect that more high uniformity or uniformity can be obtained after etching process
The technical solution of fruit.
To achieve these goals, the present invention provides a kind of Etaching device, which includes：Multiple etching grooves, should
Multiple etching grooves allow article to be etched to pass through successively and be able to etching process；With chemicals feeding mechanism, chemicals supply
Device includes：First tank, first tank receive brand-new chemicals and to last etching groove supplying chemical product；With second
Tank, second tank receive the chemicals after etching process in all etching grooves in addition to the first etching groove, and at least to
All etching grooves in addition to last etching groove supply the chemicals after etching process.
Preferably, in the multiple etching groove, the chemicals of last etching groove is dense with highest effective ingredient
Degree, the chemicals of first etching groove have minimum effective ingredient concentration.
It is further preferred that from first etching groove to a last etching groove, the chemicals of each etching groove is supplied in
Effective ingredient concentration do not successively decrease.
Preferably, the Etaching device further includes temp controlling tank, and the brand-new chemicals passes through the temp controlling tank
And it is communicated in first tank.
Preferably, the multiple etching groove includes the first etching groove to the 3rd etching groove, and first tank is to the described 3rd
Etching groove supplying chemical product, second tank receive the change after etching process in second etching groove and the 3rd etching groove
Product, second tank are interior by erosion to first etching groove to the 3rd etching groove supplying chemical product, first etching groove
Chemicals after quarter processing is discharged as waste liquid, the part work of the chemicals in second etching groove after etching process
Discharged for waste liquid.
Preferably, the multiple etching groove includes the first etching groove to the 4th etching groove, and first tank is to the described 4th
Etching groove supplying chemical product, second tank are received in second etching groove, the 3rd etching groove and the 4th etching groove by erosion
Chemicals after quarter processing, second tank lose to first etching groove to the 3rd etching groove supplying chemical product, described first
Chemicals in cutting after etching process is discharged as waste liquid, the chemistry in second etching groove after etching process
A part for product is discharged as waste liquid.
Preferably, second tank receives brand-new chemicals, each etching groove selectively receive first tank or
The chemicals of second tank, the chemicals in each etching groove after etching process are selectively back to first tank or the
A part for two tanks, first tank and the chemicals in the second tank is discharged as waste liquid.
Preferably, the multiple etching groove includes the first etching groove to the 4th etching groove, wherein：First tank is to described
4th etching groove supplying chemical product, second tank receives to pass through in second etching groove, the 3rd etching groove and the 4th etching groove
Chemicals after overetch processing, second tank is to first etching groove to the 3rd etching groove supplying chemical product, and described the
Chemicals in one etching groove after etching process is discharged as waste liquid, in second etching groove after etching process
A part for chemicals is discharged as waste liquid；And first etching groove to the 4th etching groove selectively receives described
The chemicals of one tank or the second tank, in each etching groove in first etching groove to the 4th etching groove after etching process
Chemicals be selectively back to first tank or the second tank.
Preferably, the Etaching device further includes the auxiliary piping for being connected to first tank and the second tank, the auxiliary tube
Road is used to aid in brand-new chemicals to first tank and/or the supply of the second tank, and the brand-new chemicals of the auxiliary has having for higher
Imitate components and concentration.
Preferably, the Etaching device further includes：Detector, the detector are used to operationally detect in real time each described
The concentration of the effective ingredient of chemicals in etching groove；And controller, the controller are electrically connected with the detector, are represented with receiving
The information of the concentration of chemicals effective ingredient in each etching groove, and according to the supply process of information control chemicals.
As described above, when being etched, article to be etched passes through multiple etching grooves successively, so as to complete final
Etch public good.Inventors herein have recognized that：In etching process, the etchable property of article to be etched is different.It is specific next
Say, when article to be etched enters first etching groove, can relatively easily be etched, but the erosion in subsequent etch groove
Difficulty is carved to be gradually increased.Therefore, because do not notice in etching process in the past etchable property can changed rule, passing
The chemicals of identical effective ingredient concentration is often sprayed in different etching grooves in system technique, so as to cause the inequality of etch effect
Even property is larger.
The understanding to above-mentioned rule is based on, present inventor proposes technical scheme.According to this
The technical solution of invention, in multiple etching grooves that etching article is etched are treated successively, brand-new chemicals is at least
Last etching groove is supplied to, and etching groove above then recycles the chemicals after etching process, therefore can
Make the chemicals in follow-up etching groove (especially last etching groove) with higher effective ingredient concentration, be adapted to can
The above-mentioned changing rule of etching, so as to obtain the etch effect of preferable uniformity or uniformity.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Brief description of the drawings
Attached drawing is for providing a further understanding of the present invention, and a part for constitution instruction, with following tool
Body embodiment is used to explain the present invention together, but is not construed as limiting the invention.In the accompanying drawings：
Fig. 1 is the schematic diagram of traditional Etaching device；
Fig. 2 and Fig. 3 is respectively a kind of schematic diagram of the Etaching device of embodiment according to the present invention；
Fig. 4 is the schematic diagram according to the Etaching device of the preferred embodiment for the present invention.
Embodiment
The embodiment of the present invention is described in detail below in conjunction with attached drawing.It should be appreciated that this place is retouched
The embodiment stated is merely to illustrate and explain the present invention, and is not intended to limit the invention.
As shown in Fig. 2, Etaching device provided by the invention includes：Multiple etching grooves, the plurality of etching groove allow to be etched
Article passes through and is able to etching process successively；With chemicals feeding mechanism, which includes：First tank 11, should
First tank 11 receives brand-new chemicals and to last etching groove supplying chemical product (as shown in arrow 10)；With the second tank
12, which receives the chemicals after etching process in all etching grooves in addition to the first etching groove, and at least
The chemicals (as shown in arrow 10) after etching process is supplied to all etching grooves in addition to last etching groove.
Etching groove can have multiple, can there is three or four as shown in drawings., can be with but the application is not limited to this
There are more, such as 5 or 6.Chemicals is usually sprayed at by way of spray on the article to be etched in etching groove, when treating
Article is etched in sequence successively in multiple etching grooves respectively after spray after a while, completes whole etching process.
In the inventive solutions, the structure to etching groove and its course of work do not do significant improvement, therefore may be referred to pass
The Etaching device of system.Relative to traditional Etaching device, technical scheme is mainly the distribution or supply to chemicals
Mode is improved, so that distribution of the chemicals in each etching groove accords with the etching rule of article to be etched, from
And obtain the etch effect of preferable uniformity or uniformity.
Specifically, in the inventive solutions, the first tank 11 receives brand-new chemicals and is lost to last
Cutting supplying chemical product, therefore the effective ingredient concentration of chemicals brand-new in last etching groove is with respect to higher；Meanwhile the
Two tanks 12 receive the chemicals after etching process in all etching grooves in addition to the first etching groove, and at least to except last
All etching grooves outside one etching groove supply the chemicals after etching process, therefore positioned at final etch groove forefront
Etching groove utilizes the chemicals of circulation substantially, so as to make to have in follow-up etching groove (especially last etching groove)
The chemicals of higher effective ingredient concentration, to be adapted to the etchable property rule of article to be etched.
Second tank 12 can be supplied after etching process to all etching grooves in addition to last etching groove
Chemicals, can also supply the chemicals after etching process to all etching grooves.Since last etching groove can receive
Brand-new chemicals, therefore can relatively easily obtain the effective ingredient concentration of higher.
As described above, etchable property of the article to be etched in whole etching process is different, phase etching in the backward is difficult
Degree is bigger.Therefore, it is designed as in the inventive solutions：In the multiple etching groove, the change of last etching groove
Product have highest effective ingredient concentration, and the chemicals of first etching groove has minimum effective ingredient concentration, so that sharp
With the relatively low chemicals of effective ingredient concentration be used for preferable first etching groove of etchable property etching process, and will effectively into
The higher chemicals of part concentration is used for the etching process of last relatively low etching groove of etchable property, to obtain uniformity or one
The more preferable etch effect of cause property.
Preferably, it is dense from first etching groove to a last etching groove, the effective ingredient of the chemicals of each etching groove
Degree does not successively decrease.For example, in two adjacent etching grooves, the effective ingredient concentration of the chemicals of latter etching groove can be equal to
Or the effective ingredient concentration of the chemicals more than previous etching groove, but not occur less than previous etching groove chemicals effectively into
The situation of part concentration.
In order to preferably be etched, as shown in Figure 2, Figure 3 and Figure 4, the Etaching device further includes temperature control
Tank 10, brand-new chemicals are communicated in the first tank 11 by the temp controlling tank 10.By the temp controlling tank 10, can make
Chemicals into etching groove has suitable temperature, etching process is carried out under suitable temperature environment, to promote to etch
Reaction is fully quick to be occurred.
Fig. 2 show a kind of preferred embodiment.As shown in Fig. 2, Etaching device loses including the first etching groove 1, second
2 and the 3rd etching groove 3 of cutting, the first tank 11 receive 2 He of the second etching groove to 3 supplying chemical product of the 3rd etching groove, the second tank 12
Chemicals in 3rd etching groove 3 after etching process, the second tank 12 is to the first etching groove to the 3rd etching groove supplying chemical
Product, the chemicals in the first etching groove 1 after etching process are discharged as waste liquid 15, the second etching groove 2 it is interior through overetch at
A part for chemicals after reason is discharged as waste liquid 15.
In article to be etched successively by etching groove and after completing etching process, washing process is carried out in rinsing bowl 5, with
Remaining chemicals is removed, is prepared to enter into subsequent processing.It is similar with the embodiment shown in Fig. 4 for Fig. 3, no longer describe.
Fig. 3 show another preferred embodiment.As shown in figure 3, Etaching device loses including the first etching groove 1, second
Cutting 2, the 3rd etching groove 3 and the 4th etching groove 4, for the first tank 11 to 4 supplying chemical product of the 4th etching groove, the second tank 12 receives the
Chemicals in two etching grooves 2, the 3rd etching groove 3 and the 4th etching groove 4 after etching process, the second tank 12 are etched to first
Groove to the 3rd etching groove supplying chemical product, the 1 interior chemicals after etching process of the first etching groove is discharged as waste liquid 15, the
A part for chemicals in two etching grooves 2 after etching process is discharged as waste liquid 15.
In order to further improve the service efficiency of chemicals, the usage amount of chemicals on single-piece article to be etched is reduced, it is excellent
Selection of land, the second tank 12 also receive brand-new chemicals, so that having brand-new chemicals in the first tank 11 and the second tank 12, often
A etching groove selectively receives the chemicals of the first tank 11 or the second tank 12, the interior change after etching process of each etching groove
Product are selectively back to the first tank 11 or the second tank 12, a part of conduct of the first tank 11 and the chemicals in the second tank 12
Waste liquid 15 is discharged.
According to the preferable technical solution, the first tank 11 and the second tank 12 can not simultaneously work, such as in the first tank 11
During to each etching groove supplying chemical product, the second tank 12 can rest and reorganize it is spare, receive brand-new chemicals or discharge waste liquid；It is on the contrary
It is as the same.Similarly, the chemicals in each etching groove after reaction can as needed or operating mode is discharged into the first tank 11 or the
Two tanks 12.
Due to the alternation pattern of the first tank 11 and the second tank 12, so that being evenly distributed to each article to be etched
On chemical cost amount reduce.
As shown in figure 4, the Etaching device includes the first etching groove 1, the second etching groove 2, the 3rd etching groove 3 and the 4th erosion
Cutting 4, wherein：For first tank 11 to 4 supplying chemical product (as shown in arrow 10) of the 4th etching groove, the second tank 12 receives the second etching
Chemicals in groove 2, the 3rd etching groove 3 and the 4th etching groove 4 after etching process, the second tank 12 is to the first etching groove to
Three etching groove supplying chemical product (as shown in arrow 10), the 1 interior chemicals after etching process of the first etching groove is as waste liquid
15 discharges, a part for the 2 interior chemicals after etching process of the second etching groove are discharged as waste liquid 15；And the first etching
Groove to the 4th etching groove selectively receives the chemicals (as shown in arrow 10) of the first tank 11 or the second tank 12, the first etching
Chemicals in each etching groove in groove to the 4th etching groove after etching process be selectively back to the first tank 11 or
Second tank 12.
By comparing the embodiment shown in Fig. 4 and the embodiment shown in Fig. 1, Fig. 2 and Fig. 3, shown in Fig. 4
Embodiment is that two kinds of embodiments combine, the advantages of so as to inherit the two：Preferable uniformity can either be obtained
Or the etch effect of uniformity, it can also improve the service efficiency of chemicals.
Moreover it is preferred that as shown in figure 4, Etaching device further includes the auxiliary tube for being connected to the first tank 11 and the second tank 12
Road 24, the auxiliary piping 24 are used to aid in brand-new chemicals to the first tank 11 and/or the supply of the second tank 12, and the auxiliary is completely newly chemical
Product have the effective ingredient concentration than foregoing brand-new chemicals higher, so if finding once the first tank 11 and/or the second tank
Effective ingredient concentration in 12 has reduction, can be improved rapidly by supplementing the brand-new chemicals of the auxiliary, to ensure to etch
Technique is normally carried out.
It is further preferred that in order to obtain the chemicals method of salary distribution of automation, which further includes：Detector,
The detector is used for the concentration for operationally detecting the effective ingredient of chemicals in each etching groove in real time；And controller,
The controller is electrically connected with the detector, to receive the information for representing the concentration of chemicals effective ingredient in each etching groove,
And the supply process of chemicals is controlled according to the information.
Detector can be real time implementation sensor, dense for monitoring the effective ingredient of chemicals of each etching groove in real time
Degree, and send that information to controller.And controller then can be according to the concentration of chemicals effective ingredient in each etching groove
Information, is adjusted the supply process of chemicals.For example it is transported to the flow of the brand-new chemicals of the first tank 11, Huo Zhecong
First tank 11 is transported to the flow of the chemicals of last etching groove.When above-mentioned engineering parameter may also include the conveying of chemicals
Between etc..
For example, when detection finds that the effective ingredient concentration of last etching groove 4 is insufficient, or when detection finds first
, then can be by controlling the supply process of chemicals to make the first tank 11 and/or when the effective ingredient concentration of a etching groove 1 is too low
The effective ingredient concentration of chemicals in two tanks 12 makes the change of adaptation.
The preferred embodiment of the present invention is described in detail above in association with attached drawing, still, the present invention is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the present invention, a variety of letters can be carried out to technical scheme
Monotropic type, these simple variants belong to protection scope of the present invention.It is further to note that in above-mentioned embodiment
Described in each particular technique feature, in the case of reconcilable, can be combined by any suitable means.For
Unnecessary repetition is avoided, the present invention no longer separately illustrates various combinations of possible ways.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. Etaching device, which includes：
Multiple etching grooves, the plurality of etching groove allow article to be etched to pass through successively and be able to etching process；With
Chemicals feeding mechanism, the chemicals feeding mechanism include：
First tank (11), first tank (11) receive brand-new chemicals and to last etching groove supplying chemical product；With
Second tank (12), second tank (12) reception is in all etching grooves in addition to the first etching groove after etching process
Chemicals, and at least the chemicals after etching process is supplied to all etching grooves in addition to last etching groove.
2. Etaching device according to claim 1, it is characterised in that in the multiple etching groove, last etching
The chemicals of groove has highest effective ingredient concentration, and the chemicals of first etching groove has minimum effective ingredient concentration.
3. Etaching device according to claim 2, it is characterised in that from first etching groove to a last etching groove,
The effective ingredient concentration for being supplied in the chemicals of each etching groove is not successively decreased.
4. Etaching device according to claim 1, it is characterised in that the Etaching device further includes temp controlling tank
(10), the brand-new chemicals is communicated in first tank (11) by the temp controlling tank (10).
5. according to the Etaching device described in any one in claim 1-4, it is characterised in that the multiple etching groove includes the
One etching groove to the 3rd etching groove, first tank (11) is to the 3rd etching groove (3) the supplying chemical product, second tank
(12) chemicals in second etching groove (2) and the 3rd etching groove (3) after etching process, second tank are received
(12) it is interior after etching process to first etching groove to the 3rd etching groove supplying chemical product, first etching groove (1)
Chemicals discharged as waste liquid (15), the part work of the chemicals in second etching groove (2) after etching process
Discharged for waste liquid (15).
6. according to the Etaching device described in any one in claim 1-4, it is characterised in that the multiple etching groove includes the
One etching groove to the 4th etching groove, first tank (11) is to the 4th etching groove (4) the supplying chemical product, second tank
(12) chemistry in second etching groove (2), the 3rd etching groove (3) and the 4th etching groove (4) after etching process is received
Product, to first etching groove to the 3rd etching groove supplying chemical product, first etching groove (1) is interior to pass through second tank (12)
Chemicals after overetch processing is discharged as waste liquid (15), the chemistry in second etching groove (2) after etching process
A part for product is discharged as waste liquid (15).
7. according to the Etaching device described in any one in claim 1-4, it is characterised in that second tank (12) receives complete
New chemicals, each etching groove selectively receive the chemicals of first tank (11) or the second tank (12), each etching
Chemicals in groove after etching process is selectively back to first tank (11) or the second tank (12), first tank
(11) part for the chemicals and in the second tank (12) is discharged as waste liquid (15).
8. Etaching device according to claim 7, it is characterised in that the multiple etching groove includes the first etching groove to the
Four etching grooves, wherein：
For first tank (11) to the 4th etching groove (4) the supplying chemical product, second tank (12) receives second erosion
Chemicals in cutting (2), the 3rd etching groove (3) and the 4th etching groove (4) after etching process, second tank (12) to
First etching groove is to the 3rd etching groove supplying chemical product, the chemistry in first etching groove (1) after etching process
Product are discharged as waste liquid (15), and a part for the chemicals in second etching groove (2) after etching process is as waste liquid
(15) discharge；And
First etching groove to the 4th etching groove selectively receives the chemistry of first tank (11) or the second tank (12)
Product, the chemicals in each etching groove in first etching groove to the 4th etching groove after etching process selectively return
It flow to first tank (11) or the second tank (12).
9. Etaching device according to claim 7, it is characterised in that the Etaching device, which further includes, is connected to described first
The auxiliary piping (24) of tank (11) and the second tank (12), the auxiliary piping (24) are used for first tank (11) and/or second
Tank (12) supply aids in brand-new chemicals, and the brand-new chemicals of the auxiliary has the effective ingredient concentration of higher.
10. according to the Etaching device described in any one in claim 1-3, it is characterised in that the Etaching device further includes：
Detector, the detector are used to operationally detect the dense of the effective ingredient of chemicals in each etching groove in real time
Degree；With
Controller, the controller are electrically connected with the detector, with receive represent in each etching groove chemicals effectively into
The information of the concentration of part, and according to the supply process of information control chemicals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511020202.3A CN105568285B (en) | 2015-12-31 | 2015-12-31 | Etaching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511020202.3A CN105568285B (en) | 2015-12-31 | 2015-12-31 | Etaching device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105568285A CN105568285A (en) | 2016-05-11 |
| CN105568285B true CN105568285B (en) | 2018-04-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201511020202.3A Active CN105568285B (en) | 2015-12-31 | 2015-12-31 | Etaching device |
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| Country | Link |
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| CN (1) | CN105568285B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1495865A (en) * | 2002-09-17 | 2004-05-12 | m.FSI��ʽ���� | Regeneration method of etching solution, etching method and etching system |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN203382821U (en) * | 2013-05-31 | 2014-01-08 | 天津普林电路股份有限公司 | Liquid medicine circulation device for etching cabins of high-density interconnection circuit board DES (developing, etching and stripping) line body |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05129756A (en) * | 1991-10-31 | 1993-05-25 | Hitachi Chem Co Ltd | Etching device |
-
2015
- 2015-12-31 CN CN201511020202.3A patent/CN105568285B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1495865A (en) * | 2002-09-17 | 2004-05-12 | m.FSI��ʽ���� | Regeneration method of etching solution, etching method and etching system |
| CN101170063A (en) * | 2006-10-26 | 2008-04-30 | 株式会社平间理化研究所 | Etching liquid management device |
| CN203382821U (en) * | 2013-05-31 | 2014-01-08 | 天津普林电路股份有限公司 | Liquid medicine circulation device for etching cabins of high-density interconnection circuit board DES (developing, etching and stripping) line body |
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| Publication number | Publication date |
|---|---|
| CN105568285A (en) | 2016-05-11 |
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