CN105517361B - The production method of copper billet in a kind of pcb board containing copper billet - Google Patents
The production method of copper billet in a kind of pcb board containing copper billet Download PDFInfo
- Publication number
- CN105517361B CN105517361B CN201510963521.1A CN201510963521A CN105517361B CN 105517361 B CN105517361 B CN 105517361B CN 201510963521 A CN201510963521 A CN 201510963521A CN 105517361 B CN105517361 B CN 105517361B
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- China
- Prior art keywords
- copper billet
- substrate
- size
- milling
- sensitive surface
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Abstract
The present invention relates to a kind of production method of copper billet in pcb board containing copper billet, include the following steps: that (1) intercepts a bulk of copper sheet as substrate by predetermined size, and attach light-sensitive surface in the substrate surface；(2) film is made by required copper billet size, prints out several figures interval setting and coincide with required copper billet size on the light-sensitive surface by exposure development；(3) the copper billet unit of several required sizes will on the Etching printed on light-sensitive surface to the substrate, i.e., be sketched the contours of on the substrate；(4) after the completion of etching, light-sensitive surface is removed；(5) according to the figure etched on the substrate, with milling cutter, by the copper billet unit of each required size, the milling from substrate is come out.Copper billet production method of the present invention, it not only can guarantee the tolerance of required copper billet size, but also could be used that existing milling plate equipment and plain cutter are produced, do not increase production cost and milling cutter consumption, it is easy to operate easy also to make to make simultaneously, does not influence production efficiency.
Description
Technical field
The invention belongs to the production field of PCB product containing copper billet, the production side of copper billet in specially a kind of pcb board containing copper billet
Method.
Background technique
As the important auxiliary material of the pcb board containing copper billet, copper billet with a thickness of in 1.40-1.50mm, copper billet without location hole feelings
There is following production method under condition:
1. being positioned with gummed paper, direct milling plate.This method need to use metal substrate special-purpose milling cutter, and milling cutter cost is conventional milling
2-3 times or more of knife, the functional facilities that milling machine need to have water filling to drain, equipment cost are higher.Gummed paper positioning milling plate can not expire simultaneously
Full size cun is in the margin of tolerance of ± 0.10mm.
2. positioning with gummed paper, depth gradually milling plate is pressed using plain cutter.Although this method avoids price high metal
Substrate special-purpose milling cutter, but gradually milling plate is 3 times or more of direct milling plate molding milling journey by depth, bring production efficiency it is low,
The big problem of the more consumptions of milling cutter breaking.Gummed paper positioning milling plate is unable to satisfy size in the margin of tolerance of ± 0.10mm simultaneously.
3. being gone out with the mode of mold punching machine.This method is both quick or can guarantee size, but in view of the height of Mold Making
Cost and size stationarity, the method are only applicable in for producing in enormous quantities, sample and small lot are made, then are not suitable for
Using.
The above production method fails to meet copper billet on size quality, production cost, production efficiency, production chains
Production requires.Therefore the new production method of one kind need to be found to meet size quality, production cost, production efficiency, production flexibly
Property production requirement.
Summary of the invention
For the deficiency of the above-mentioned prior art, the present invention provides a kind of copper billet production using Etching in conjunction with milling plate
Method, with the tolerance of copper billet size needed for guaranteeing, it is ensured that existing milling plate equipment and can be produced, not increased using plain cutter
Add production cost and milling cutter to consume, and production operation letter is easy, does not influence production efficiency.
The purpose of the present invention is achieved by the following technical programs:
The production method of copper billet, includes the following steps: in a kind of pcb board containing copper billet
(1) a bulk of copper sheet is intercepted as substrate by predetermined size, and attach light-sensitive surface in the substrate surface；
(2) film is made by required copper billet size, prints out several intervals on the light-sensitive surface by exposure development and sets
The figure set and coincide with required copper billet size；
(3) it on the Etching printed on light-sensitive surface to the substrate, i.e., will sketch the contours of on the substrate several required
The copper billet unit of size；
(4) after the completion of etching, light-sensitive surface is removed；
(5) according to the figure milling cutter etched on the substrate, by the copper billet unit of each required size, the milling from substrate goes out
Come.
Further, before the copper billet unit of each required size of milling, Yu Suoshu material edge and each copper billet cell edges
Location hole is bored, and in each positioning hole placement positioning pin.
Further, the copper billet unit for the required size sketched the contours of on the substrate has at least two column and multiple rows of and each
The enough milling cutters of spacing between copper billet unit are cut with locating pin.
The production method of copper billet, has the advantage that compared with conventional method in present invention pcb board containing copper billet
1. realization fully meets copper billet size in the ± 0.10mm margin of tolerance；
2. being equipped with milling plate molding based on etching, milling cutter milling copper billet area is small, avoids milling cutter from excessively consuming, uses simultaneously
Plain cutter production, will not generate excessive production cost；
3. copper billet production can be related to pad pasting, exposure, etching, molding making, but easy to operate, high production efficiency；
4. exposing production copper billet with the film, the film, strong flexibility can be adjusted according to customer requirement copper billet size.
Detailed description of the invention
Fig. 1 is the structural schematic diagram before present invention etching.
Fig. 2 is the structural schematic diagram after the present invention etches before milling plate.
Fig. 3 is the structural schematic diagram after milling plate of the present invention.
Specific embodiment
Invention is further described in detail for the embodiment provided with reference to the accompanying drawing.
As shown in Figure 1 to Figure 3, in a kind of pcb board containing copper billet copper billet production method, include the following steps: (1) by predetermined
The a bulk of copper sheet of size cut attaches light-sensitive surface 2 as substrate 1, and on 1 surface of substrate；(2) it is made by required copper billet size
The film prints out several figures interval setting and coincide with required copper billet size by exposure development on the light-sensitive surface 2
3；(3) figure 3 printed on light-sensitive surface 2 is etched on the substrate 1, i.e., sketches the contours of several required rulers on the substrate 1
Very little copper billet unit 4；(4) after the completion of etching, light-sensitive surface is removed；It (5) will be each according to the figure milling cutter etched on the substrate 1
The milling from substrate of the copper billet unit 4 of required size comes out.
Further, before the copper billet unit 4 of each required size of milling, 1 edge of Yu Suoshu substrate and each 4 side of copper billet unit
Edge bores location hole 11,41, and in placement positioning pin in each location hole 11,41.
Further, the copper billet unit 4 for the required size sketched the contours of on the substrate 1 have at least two column and it is multiple rows of, and
The enough milling cutters of spacing between each copper billet unit 4 are cut with locating pin.
As described above, only presently preferred embodiments of the present invention, when cannot be limited the scope of implementation of the present invention with this,
All still belong to this hair according to simple equivalent changes and modifications made by scope of the present invention patent and invention description content generally
In the range of bright patent covers.
Claims (1)
1. the production method of copper billet in a kind of pcb board containing copper billet, which comprises the steps of:
(1) a bulk of copper sheet is intercepted as substrate by predetermined size, and attach light-sensitive surface in the substrate surface；
(2) film is made by required copper billet size, prints out several interval settings on the light-sensitive surface by exposure development simultaneously
The figure coincideing with required copper billet size；
(3) several required sizes will on the Etching printed on light-sensitive surface to the substrate, i.e., be sketched the contours of on the substrate
Copper billet unit；
(4) after the completion of etching, light-sensitive surface is removed；
(5) according to the figure etched on the substrate, with milling cutter, by the copper billet unit of each required size, the milling from substrate is come out；
Before the copper billet unit of each required size of milling, Yu Suoshu material edge and each copper billet cell edges brill location hole, and in
Each positioning hole placement positioning pin；
The copper billet unit for the required size sketched the contours of on the substrate have at least two column and it is multiple rows of, and between each copper billet unit between
It is cut away from enough milling cutters with locating pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963521.1A CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963521.1A CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517361A CN105517361A (en) | 2016-04-20 |
| CN105517361B true CN105517361B (en) | 2019-03-12 |
Family
ID=55724883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510963521.1A Active CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517361B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
| US8129277B2 (en) * | 2007-06-28 | 2012-03-06 | Disco Corporation | Method of machining wafer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2874330B2 (en) * | 1990-11-07 | 1999-03-24 | 日本電気株式会社 | Method for manufacturing multilayer printed wiring board |
| JPH05299309A (en) * | 1992-03-31 | 1993-11-12 | Nippon Steel Corp | Manufacture of electrode for chip type solid electrolytic capacitor |
| US6539643B1 (en) * | 2000-02-28 | 2003-04-01 | James Hardie Research Pty Limited | Surface groove system for building sheets |
| JP2006157504A (en) * | 2004-11-30 | 2006-06-15 | Seiko Epson Corp | Piezoelectric device and method for manufacturing glass lid |
| CN103619126B (en) * | 2013-11-28 | 2016-08-24 | 景旺电子科技(龙川)有限公司 | A kind of manufacture method of the outer-layer circuit of Metal Substrate thickness copper coin |
-
2015
- 2015-12-18 CN CN201510963521.1A patent/CN105517361B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8129277B2 (en) * | 2007-06-28 | 2012-03-06 | Disco Corporation | Method of machining wafer |
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517361A (en) | 2016-04-20 |
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