CN105517361A - Method for making copper blocks in copper block containing PCB - Google Patents
Method for making copper blocks in copper block containing PCB Download PDFInfo
- Publication number
- CN105517361A CN105517361A CN201510963521.1A CN201510963521A CN105517361A CN 105517361 A CN105517361 A CN 105517361A CN 201510963521 A CN201510963521 A CN 201510963521A CN 105517361 A CN105517361 A CN 105517361A
- Authority
- CN
- China
- Prior art keywords
- copper billet
- copper
- milling
- size
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
Abstract
The invention relates to a method for making copper blocks in a copper block containing PCB, comprising the following steps: (1) taking a large copper plate as a substrate according to a predetermined size, and attaching a photosensitive film to the surface of the substrate; (2) making a film according to the required copper block size, and printing a plurality of patterns which are arranged at intervals and fit the required copper block size on the photosensitive film through exposing and developing; (3) etching the patterns printed on the photosensitive film to the substrate, namely, outlining a plurality of copper block units of required size on the substrate; (4) removing the photosensitive film after etching; and (5) milling the copper block units of required size out of the substrate by use of a milling cutter according to the etched patterns on the substrate. By using the copper block making method, the required copper block size tolerance is ensured, copper blocks can be produced by the existing milling plate equipment and ordinary milling cutters, neither the cost of production nor the consumption of milling cutters is increased, copper block making is simple and easy, and the production efficiency is not affected.
Description
Technical field
The invention belongs to containing copper billet PCB production field, be specially a kind of manufacture method containing copper billet in copper billet pcb board.
Background technology
As the important auxiliary material containing copper billet pcb board, copper billet thickness is 1.40-1.50mm, copper billet is interior has following manufacture method without in location hole situation:
1. with gummed paper location, direct milling plate.This method need adopt metal substrate special-purpose milling cutter, and milling cutter cost is more than 2-3 times of plain cutter, and milling machine need have the functional facilities of water filling draining, and equipment cost is higher.Simultaneously gummed paper location milling plate cannot meet size in the margin of tolerance of ± 0.10mm.
2., with gummed paper location, adopt plain cutter by the degree of depth progressively milling plate.Although this method avoids price height metal substrate special-purpose milling cutter, by the degree of depth progressively milling plate be but more than 3 times of direct milling sheet metal forming milling journey, bring the problem that production efficiency is low, the many consumptions of milling cutter breaking are large.Simultaneously gummed paper location milling plate cannot meet size in the margin of tolerance of ± 0.10mm.
3. go out by the mode of mould punch press.This method both fast also can ensure size, but in view of the high cost of Mold Making and size stationarity, the method is only suitable for for producing in enormous quantities, makes for sample and small lot, be then not suitable for employing.
Above manufacture method all fails to meet the making requirement of copper billet on size quality, production cost, production efficiency, production chains.Therefore need to find a kind of new manufacture method to meet the making requirement of size quality, production cost, production efficiency, production chains.
Summary of the invention
For the deficiency of above-mentioned prior art, the invention provides a kind of copper billet manufacture method adopting Etching and milling to harden to close, to ensure the tolerance of required copper billet size, guarantee existing milling board device and use plain cutter to produce, do not increase production cost and milling cutter consumption, and make making operate letter easily, do not affect production efficiency.
Object of the present invention is achieved by the following technical programs:
Containing a manufacture method for copper billet in copper billet pcb board, comprise the steps:
(1) intercept a bulk of copper coin as base material by preliminary dimension, and attach light-sensitive surface at this substrate surface;
(2) make the film by required copper billet size, on described light-sensitive surface, print out some intervals by exposure imaging and arrange and the figure identical with required copper billet size;
(3) by Etching that light-sensitive surface is printed on described base material, namely sketch the contours of the copper billet unit of some required sizes on the substrate;
(4), after having etched, light-sensitive surface is removed;
(5) according to the figure milling cutter that described base material etches by the copper billet unit of each required size from milling base material out.
Further, before the copper billet unit of each required size of milling, bore location hole in described base material edge and each copper billet cell edges, and in each location hole placement positioning pin.
Further, the copper billet unit of the required size that described base material is sketched the contours of has at least two row and arranges more, and cutter under enough milling cutters of spacing between each copper billet unit and locating pin.
The present invention, containing the manufacture method of copper billet in copper billet pcb board, has following advantage compared with conventional method:
1. realize meeting copper billet size completely in the ± 0.10mm margin of tolerance;
2. to be etched to master, be equipped with milling sheet metal forming, milling cutter milling copper billet area is little, avoids milling cutter too much to consume, and adopts plain cutter to make simultaneously, can not produce too much production cost;
3. copper billet making can relate to pad pasting, exposure, etching, shaping making, but simple to operate, and production efficiency is high;
4. make copper billet with film exposure, can carry out the adjustment film according to customer requirement copper billet size, flexibility is strong.
Accompanying drawing explanation
Fig. 1 is the structural representation before the present invention etches.
Fig. 2 is the structural representation before the present invention etches rear milling plate.
Fig. 3 is the structural representation after milling plate of the present invention.
Embodiment
The embodiment provided below in conjunction with accompanying drawing is described in further detail the present invention.
As shown in Figure 1 to Figure 3, a kind of manufacture method containing copper billet in copper billet pcb board, comprises the steps: that (1) intercepts a bulk of copper coin as base material 1 by preliminary dimension, and attaches light-sensitive surface 2 on this base material 1 surface; (2) make the film by required copper billet size, on described light-sensitive surface 2, print out some intervals by exposure imaging and arrange and the figure 3 identical with required copper billet size; (3) figure 3 that light-sensitive surface 2 is printed is etched on described base material 1, on described base material 1, namely sketch the contours of the copper billet unit 4 of some required sizes; (4), after having etched, light-sensitive surface is removed; (5) according to the figure milling cutter that described base material 1 etches by the copper billet unit 4 of each required size from milling base material out.
Further, before the copper billet unit 4 of each required size of milling, bore location hole 11,41 in described base material 1 edge and each copper billet unit 4 edge, and in each location hole 11,41 placement positioning pin.
Further, the copper billet unit 4 of the required size that described base material 1 is sketched the contours of has at least two row and arranges more, and cutter under enough milling cutters of spacing between each copper billet unit 4 and locating pin.
As described above, be only preferred embodiment of the present invention, when not limiting scope of the invention process with this, the simple equivalence namely generally done according to the present patent application the scope of the claims and invention description content changes and modifies, and all still remains within the scope of the patent.
Claims (3)
1., containing a manufacture method for copper billet in copper billet pcb board, it is characterized in that, comprise the steps:
(1) intercept a bulk of copper coin as base material by preliminary dimension, and attach light-sensitive surface at this substrate surface;
(2) make the film by required copper billet size, on described light-sensitive surface, print out some intervals by exposure imaging and arrange and the figure identical with required copper billet size;
(3) by Etching that light-sensitive surface is printed on described base material, namely sketch the contours of the copper billet unit of some required sizes on the substrate;
(4), after having etched, light-sensitive surface is removed;
(5) according to the figure milling cutter that described base material etches by the copper billet unit of each required size from milling base material out.
2. a kind of manufacture method containing copper billet in copper billet pcb board according to claim 1, is characterized in that: before the copper billet unit of each required size of milling, bores location hole in described base material edge and each copper billet cell edges, and in each location hole placement positioning pin.
3. a kind of manufacture method containing copper billet in copper billet pcb board according to claim 1, it is characterized in that: the copper billet unit of the required size that described base material is sketched the contours of has at least two row and arranges more, and cutter under enough milling cutters of spacing between each copper billet unit and locating pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963521.1A CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510963521.1A CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105517361A true CN105517361A (en) | 2016-04-20 |
| CN105517361B CN105517361B (en) | 2019-03-12 |
Family
ID=55724883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510963521.1A Active CN105517361B (en) | 2015-12-18 | 2015-12-18 | The production method of copper billet in a kind of pcb board containing copper billet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105517361B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04174596A (en) * | 1990-11-07 | 1992-06-22 | Nec Corp | Manufacture of multilayered printed wiring board |
| JPH05299309A (en) * | 1992-03-31 | 1993-11-12 | Nippon Steel Corp | Manufacture of electrode for chip type solid electrolytic capacitor |
| CN1419624A (en) * | 2000-02-28 | 2003-05-21 | 詹姆斯哈迪研究有限公司 | Surface groove system for building sheets |
| JP2006157504A (en) * | 2004-11-30 | 2006-06-15 | Seiko Epson Corp | Piezoelectric device and method for manufacturing glass lid |
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
| US8129277B2 (en) * | 2007-06-28 | 2012-03-06 | Disco Corporation | Method of machining wafer |
| CN103619126A (en) * | 2013-11-28 | 2014-03-05 | 景旺电子科技(龙川)有限公司 | Method for manufacturing outer layer circuit of metal-based thick copper plate |
-
2015
- 2015-12-18 CN CN201510963521.1A patent/CN105517361B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04174596A (en) * | 1990-11-07 | 1992-06-22 | Nec Corp | Manufacture of multilayered printed wiring board |
| JPH05299309A (en) * | 1992-03-31 | 1993-11-12 | Nippon Steel Corp | Manufacture of electrode for chip type solid electrolytic capacitor |
| CN1419624A (en) * | 2000-02-28 | 2003-05-21 | 詹姆斯哈迪研究有限公司 | Surface groove system for building sheets |
| JP2006157504A (en) * | 2004-11-30 | 2006-06-15 | Seiko Epson Corp | Piezoelectric device and method for manufacturing glass lid |
| US8129277B2 (en) * | 2007-06-28 | 2012-03-06 | Disco Corporation | Method of machining wafer |
| CN101767281A (en) * | 2009-12-22 | 2010-07-07 | 中国航空工业集团公司第六三一研究所 | Method for producing heat dissipation plate |
| CN103619126A (en) * | 2013-11-28 | 2014-03-05 | 景旺电子科技(龙川)有限公司 | Method for manufacturing outer layer circuit of metal-based thick copper plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105517361B (en) | 2019-03-12 |
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